Datasheet TDA3664AT-N1, TDA3664-N1, TDA3664T-N1 Datasheet (Philips)

DATA SH EET

Preliminary specification
Supersedes data of 1999 Aug 11
File under Integrated Circuits, IC01

1999 Sep 01

INTEGRATED CIRCUITS

TDA3664

Very low dropout voltage/quiescent
current 5 V voltage regulator

1999 Sep 01 2

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

FEATURES
General

• Fixed 5 V, 100 mA regulator

• Supply voltage range up to +33 V (45 V)

• Very low quiescent current (typically 15 µA)

• Very low dropout voltage

• High ripple rejection

• Very high stability

– Electrolytic capacitors: ESR (Equivalent Series

resistance) < 38 Ω at I

REG

≤ 25 mA

– Other capacitors: 100 nFat 200 µA ≤ I

REG

≤ 100 mA

see Fig.5 and Fig.6

• Pin compatible family TDA3662 up to TDA3666.

Protections

• Reverse polarity safe (down to −25 V without high
reverse current)

• Negative transient of 50 V (RS=10Ω, t < 100 ms)

• Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)

• ESD protection on all pins

• DC short-circuit safe to ground and VP of regulator

output

• Temperature protection (Tj> 150 °C).

GENERAL DESCRIPTION

TheTDA3664 is a fixed 5 V voltage regulator with very low
dropout voltage/quiescent current, which operates over a
wide supply voltage range.

The regulator is available as:

• TDA3664T: SO8 package (non-automotive)

• TDA3664AT: SO8 package (automotive)

• TDA3664: SOT223 package (automotive).

Automotive: VP≤ 50P V, −40 °C ≤ T

amb

≤ +125 °C.

Non-automotive: VP≤ 22V, −40 °C ≤ T

amb

≤ +85 °C.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage

TDA3664 regulator on 3 14.4 45 V
TDA3664AT regulator on 3 14.4 45 V
TDA3664T regulator on 3 14.4 33 V

I

q(tot)

total quiescent supply current
(all versions)

VP= 14.4 V; no load − 15 30 µA

Voltage regulator

V

REG

regulator output voltage

TDA3664T 8 V ≤ V

P

≤ 22 V 4.8 5.0 5.2 V

TDA3664 and TDA3664AT 6 V ≤ V

P

≤ 45 V 4.75 5.0 5.25 V

I

REG

regulator output current 0.5 mA ≤ I

REG

≤ 100 mA 4.75 5.0 5.25 V

V

REG(drop)

dropout voltage I

REG

=50mA − 0.18 0.3 V

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA3664 − plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
TDA3664T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA3664AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

1999 Sep 01 3

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

BLOCK DIAGRAM

PINNING

SYMBOL

PIN

DESCRIPTION

SOT223 SO8

V

P

1 8 supply voltage
GND 2 and 4 3 ground
REG 3 1 regulator output
n.c. − 2, 4, 5, 6 and 7 not connected

handbook, halfpage

MGL809

REGULATOR

2, 4 (3)

3 (1)

GND

1 (8)

REG

V

P

BANDGAP

TDA3664

THERMAL

PROTECTION

Fig.1 Block diagram for SOT223.

Pins between brackets are for the SO8 version.

handbook, halfpage

132

4

GND

MGL810

GND

V

P

REG

Fig.2 Pin configuration of SOT223. Fig.3 Pin configuration of SO8.

handbook, halfpage

TDA3664

MDA959

1

REG

V

P

n.c. n.c.

GND n.c.

n.c. n.c.

2
3
4

8
7
6
5

1999 Sep 01 4

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

FUNCTIONAL DESCRIPTION

The TDA3664 is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
SO8 and SOT223 packages. The regulator is intended for
portable, mains, telephone and automotive applications.
To increase the lifetime of batteries, a specially built-in
clamp circuit keeps the quiescent current of this regulator
very low, also in dropout and full load conditions.

Theregulatorremainsoperationaldown to very low supply
voltages, below which it switches off.

A temperature protection is included, which switches the
regulator output off at IC temperatures above 150 °C.

A new output structure guarantees the stability of the
regulator with an ESR up to 38 Ω. This is very attractive as
the ESR of an electrolytic capacitor increases strongly at
low temperatures (no expensive tantalum capacitor
required).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

. The number of the quality specification can be found in the

“Quality Reference

Handbook”

.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage

TDA3664T − 22 V
TDA3664 − 45 V
TDA3664AT − 45 V

V

P(rp)

reverse polarity supply voltage non-operating −−25 V

P

tot

total power dissipation T

amb

=25°C
SO8 − 0.8 W
SOT223 − 5W

T

stg

storage temperature non-operating −55 +150 °C

T

amb

ambient temperature range operating

TDA3664T −40 +85 °C
TDA3664 −40 +125 °C
TDA3664AT −40 +125 °C

T

j

junction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air, soldered in

SO8 155 K/W
SOT223 100 K/W

R

th(j-c)

thermal resistance from junction to case (SOT223) in free air 25 K/W

1999 Sep 01 5

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

CHARACTERISTICS

VP= 14.4 V; T

amb

=25°C; see Fig.4; unless otherwise specified.

Notes

1. The regulator output will follow V

P

if VP<V

REG+VREG(drop)

2. TDA3664T: VP≤ 22 V; −40 °C ≤ T

amb

≤ 85 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage

V

P

supply voltage

TDA3664 regulator operating; note 1 3 14.4 45 V
TDA3664AT regulator operating; note 1 3 14.4 45 V
TDA3664T regulator operating; note 1 3 14.4 33 V

I

q

quiescent current VP= 4.5 V; I

REG

=0 − 10 −µA

V

P

= 14.4 V; I

REG

=0 − 15 30 µA

6V≤V

P

≤22 V; I

REG

=10mA − 0.2 0.5 mA

6V≤V

P

≤22 V; I

REG

=50mA − 1.4 2.5 mA

Regulator output: on pin REG (I

REG

= 0.5 mA), −40 °C ≤ T

amb

≤ 125 °C; note 2

V

REG

regulated output voltage I

REG

= 0.5 mA, 4.8 5.0 5.2 V

8V≤V

P

≤22 V, T

amb

=25°C

I

REG

= 0.5 mA, 8 V ≤ VP≤ 22 V 4.75 5.0 5.25 V

0.5 mA ≤ I

REG

≤ 100 mA 4.75 5.0 5.25 V

6V≤V

P

≤45 V; note 2 4.75 5.0 5.25 V

∆V

REG(line)

line regulation voltage 8 V ≤ VP≤ 16 V, T

amb

=25°C − 110mV

7V≤V

P

≤22 V, T

amb

=25°C − 130mV

7V≤V

P

≤45 V; note 2 − 150mV

∆V

REG(load)

load regulation voltage 0.5 mA ≤ I

REG

≤ 50 mA − 10 50 mV

SVRR supply voltage ripple rejection f

i

= 120 Hz; V

ripple

=1V

rms

50 60 − dB

V

REG(drop)

dropout voltage I

REG

= 50 mA; VP= 4.5 V;

T

amb

≤ 85 °C

− 0.18 0.3 V

I

REG(crl)

current limit V

REG

> 4.5 V 0.17 0.25 − A

V

REG(stab)

long-term stability − 20 − mV/1000 h

I

LO(rp)

output leakage current with reverse polarity input

VP= −15 V, V

REG

≤ 0.3 V

− 1 500 µA

1999 Sep 01 6

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

TEST AND APPLICATION INFORMATION
Test information

Application information

NOISE
The output noise is determined by the value of the output

capacitor, see Table 1.

Table 1 Noise figures

Note

1. Measured at a bandwidth of 10 Hz to 100 kHz.

STABILITY
Theregulatorisstabilizedwithan external capacitor on the

output. The value of this capacitor can be selected using
the diagrams shown in Fig.5 and Fig.6. The four examples
onthenextpageshowtheeffectsof the stabilization circuit
using different values for the output capacitor.

Fig.4 Test circuit (SOT223).

handbook, halfpage

MDA960

V

P

13

2, 4

REG

(3)

C1

(1)

1 µF

C2

(2)

TDA3664

(1) C1 is optional (to minimize supply noise only).
(2) C2 = 10 µF.
(3) V

REG

=5V.

OUTPUT

CURRENT

IO(mA)

NOISE FIGURE (µV)

(1)

CO=10µFCO=47µFCO= 100 µF

0.5 550 320 300
50 650 400 400

Fig.5 Curve for selecting the value of the output

capacitor.

(1) Maximum ESR (Equivalent Series resistance)

at 200 µA ≤ I

REG

≤ 100 mA.

(2) Minimum ESR only when I

REG

≤ 200 µA.

handbook, halfpage

MDA961

ESR

(Ω)

C2 (µF)

10

2

10

1

10

−1

10

−1

11010

2

stable region

(2)

(1)

Fig.6 ESR dependency due to I

REG

for selecting

the right type of output capacitor.

handbook, halfpage

MDA962

ESR

(Ω)

I

REG

(mA)

10

3

10

2

10

22

1

10

−1

110 10

3

10

2

stable region

1999 Sep 01 7

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

Example 1

The regulator is stabilized with an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω). At −40 °C, the capacitor
value is decreased to 22 µF and the ESR is increased to

3.5 Ω. The regulator will remain stable at a temperature of

−40 °C.

Example 2

The regulator is stabilized with an electrolytic output
capacitor of 10 µF (ESR = 3.3 Ω). At −40 °C, the capacitor
value is decreased to 3 µF and the ESR is increased to
20 Ω. The regulator will remain stable at a temperature of

−40 °C.

Example 3

The regulator is stabilized with a 100 nF MKT capacitor on
the output. Full stability is guaranteed when the output
current is over 200 µA.

Because the thermal influence on this capacitor value is
almost zero, the regulator will remain stable at a
temperature of −40 °C.

Example 4

The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10 µF on the output.

The regulator is now stable under all conditions and
independent of:

• The ESR of the electrolytic capacitor

• The value of the electrolytic capacitor

• The output current.

APPLICATION CIRCUITS
The maximum output current of the regulator equals:

When T

amb

=21°C, the maximum output current equals

140 mA at VP=14 V.

I

o max()

150 T

amb

–

R

th(j-a)

VPV

REG

–()×

------------------------------------------------------

150 T

amb

–

100 V

P

5–()×

-------------------------------------

(mA)==

The total thermal resistance of the TDA3664 (SOT223
package) can be decreased to lower values when pin 4
and body of the package are soldered to the printed-circuit
board.

Application circuit with backup function

Sometimes, a backup function is needed to supply, for
example, a microprocessor for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).

ThisfunctioncanbeeasilybuiltwiththeTDA3664 by using
a large output capacitor. When the supply voltage is 0 V
(or −1 V), no large current will flow into the output pin out
of this large output capacitor (only a few µA).

The application circuit is given in Fig.7.

Fig.7 Application circuit with backup functionality

(SOT223 version).

handbook, halfpage

MDA960

V

P

13

2, 4

REG

(3)

C1

(1)

1 µF

C2

(2)

TDA3664

(1) C1 is optional (to minimize supply noise only).
(2) C2 ≤ 4700 µF.
(3) V

REG

=5V.

1999 Sep 01 8

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

ADDITIONAL APPLICATION INFORMATION

This section gives typical curves for various parameters measured on the TDA3664AT. Standard test conditions are:
VP= 14.4 V; T

amb

=25°C.

Fig.8 Quiescent current as a function of supply

voltage (no load).

handbook, halfpage

010

V

P

(V)

I

q

(µA)

20 30

25

0

20

15

10

5

MDA947

Fig.9 Quiescent current increase at high supply

voltage.

handbook, halfpage

010 50

4

3

1

0

2

20 30

VP (V)

I

q

(mA)

40

MDA949

Fig.10 Quiescent current as a function of

temperature.

handbook, halfpage

−40 0

(1)

(2)

160

2

1.5

0.5

0

1

40 80

Tj (°C)

I

q

(mA)

120

MDA951

(1) Iq at 50 mA load.
(2) Iq at 10 mA load.

Fig.11 Quiescent current as a function of supply

voltage (IO= 10 mA).

handbook, halfpage

5

0.36

0.40

0.44

0.48

10 15

VP (V)

I

q

(mA)

2520

MDA948

1999 Sep 01 9

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

Fig.12 Quiescent current as a function of supply

voltage (IO= 50 mA).

handbook, halfpage

5

1.4

1.6

1.8

2

10 15

VP (V)

I

q

(mA)

2520

MDA950

Fig.13 Quiescent current as a function of load

current.

handbook, halfpage

0 20 100

4

3

1

0

2

40 60

I

REG

(mA)

I

q

(mA)

80

MDA952

Fig.14 Output voltage as a function of temperature

(no load).

handbook, halfpage

−50 200

5.10

4.95

5.00

5.05

050

T

j

(°C)

V

REG

(V)

100 150

MDA953

Fig.15 Output voltage thermal protection

behaviour (no load).

handbook, halfpage

−50 200

6

0

2

4

050

T

j

(°C)

V

REG
(V)

100 150

MDA955

1999 Sep 01 10

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

Fig.16 Dropout voltage as a function of load

current

handbook, halfpage

040

I

REG

(mA)

V

REG(drop)

(V)

80 120

500

400

200

100

300

MDA957

Fig.17 Foldback protection mode measured at

VP= 8 V with pulsed load.

handbook, halfpage

0

6

4

2

0

100

V

REG

(V)

I

REG

(mA)

200 300

MDA954

Fig.18 SVRR as a function of frequency at several

load conditions (CO=10µF).

handbook, halfpage

−70

−60

−50

−40

−30

MDA956

10

SVRR

(dB)

f (Hz)

10

2

10

3

10

4

10

5

(1)

(1)

(2)

(2)

(3)

(3)

(1) SVRR at RL=10kΩ.
(2) SVRR at RL = 500 Ω.
(3) SVRR at RL = 100 Ω.

1999 Sep 01 11

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

PACKAGE OUTLINES

UNIT A1b

p

cD

E

e1HELpQywv

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.10

0.01

1.8

1.5

0.80

0.60

b

1

3.1

2.9

0.32

0.22

6.7

6.3

3.7

3.3

2.3

e

4.6

7.3

6.7

1.1

0.7

0.95

0.85

0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223

96-11-11
97-02-28

w M

b

p

D

b

1

e

1

e

A

A

1

L

p

Q

detail X

H

E

E

v M

A

AB

B

c

y

0 2 4 mm

scale

A

X

132

4

Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223

1999 Sep 01 12

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

UNIT

A

max.

A

1

A2A3b

p

cD

(1)E(2)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

4

5

pin 1 index

1

8

y

076E03S MS-012AA

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15

0.050

0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

95-02-04
97-05-22

1999 Sep 01 13

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardby screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfour sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Sep 01 14

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1999 Sep 01 15

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent
current 5 V voltage regulator

TDA3664

NOTES

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

67

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

Printed in The Netherlands 545002/02/pp16 Date of release: 1999 Sep 01 Document order number: 9397 750 06347