Datasheet TDA3663T, TDA3663 Datasheet (Philips)

DATA SH EET

Preliminary specification
File under Integrated Circuits, IC01

1999 Sep 29

INTEGRATED CIRCUITS

TDA3663

Very low dropout voltage/quiescent
current 3.3 V voltage regulator

1999 Sep 29 2

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

FEATURES

• Fixed 3.3 V, 100 mA regulator

• Supply voltage range up to 33 V (45 V)

• Very low quiescent current of 15 µA (typical value)

• Very low dropout voltage

• High ripple rejection

• Very high stability:

– Electrolytic capacitors:Equivalent Series Resistance

(ESR) < 30 Ω at I

REG

≤ 25 mA

– Other capacitors: 100 nFat 200 µA ≤ I

REG

≤ 100 mA.

• Pin compatible family TDA3662 to TDA3666

• Protections:

– Reverse polarity safe (down to −25 V without high

reverse current)
– Negative transient of 50 V (RS=10Ω, t < 100 ms)
– Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)

– ESD protection on all pins
– DC short-circuit safe to ground and VP of the

regulator output

– Temperature protection (at Tj> 150 °C).

GENERAL DESCRIPTION

The TDA3663is afixed 3.3 V voltage regulator with a very
lowdropoutvoltage and quiescent current, which operates
over a wide supply voltage range.

The IC is available as:

• TDA3663: VP≤ 45 V, −40 °C ≤ T

amb

≤ +125 °C and

SOT4 package (automotive)

• TDA3663T: VP≤ 33 V, −40 °C ≤ T

amb

≤ +85 °C and

SO8 package (non-automotive)

• TDA3663AT: VP≤ 45 V, −40 °C ≤ T

amb

≤ +125 °C and

SO8 package (automotive).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

input supply voltage regulator on

TDA3663 3 14.4 45 V
TDA3663T 3 14.4 33 V
TDA3663AT 3 14.4 45 V

I

q

quiescent supply current VP= 14.4 V; I

REG

=0mA − 15 30 µA

Voltage regulator

V

REG

output voltage 8 V ≤ VP≤ 22 V; I

REG

= 0.5 mA 3.16 3.3 3.44 V

6V≤V

P

≤45 V; I

REG

= 0.5 mA; 3.13 3.3 3.47 V

0.5 mA ≤ I

REG

≤ 100 mA;

VP= 14.4 V

3.13 3.3 3.47 V

V

REG(drop)

dropout voltage I

REG

= 50 mA; T

amb

≤ 85 °C − 0.18 0.3 V

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA3663 SO4 plastic surface mounted package; collector pad for good heat

transfer; 4 leads

SOT223

TDA3663T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TDA3663AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

1999 Sep 29 3

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

BLOCK DIAGRAM

handbook, halfpage

MGS584

REGULATOR

2, 4 (2, 3, 6, 7)

3 (1)

GND

1 (8)

REG

V

P

BAND GAP

TDA3663

THERMAL

PROTECTION

Fig.1 Block diagram.

Pins between brackets are for the SO8 version.

PINNING

Note

1. For the SO8 package all GND pins are connected to the lead frame and can also be used to reduce the total thermal
resistance R

th(j-a)

by soldering these pins to a ground plane. The ground plane on the top side of the PCB acts like a

heat spreader.

SYMBOL

PIN

DESCRIPTION

SO4 SO8

V

P

1 8 supply voltage
GND 2 and 4 2, 3, 6 and 7 ground; note 1
REG 3 1 regulator output
n.c. − 4 and 5 not connected

1999 Sep 29 4

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

FUNCTIONAL DESCRIPTION

The TDA3663 is a fixed 3.3 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
SO8 and SO4 packages. The regulator is intended for
portable, mains, telephone and automotive applications.
To increase the lifetime of batteries, a specially built-in
clamp circuit keeps the quiescent current of this regulator
very low, also in dropout and full load conditions.

The device remains operational down to very low supply
voltages and below this voltage it switches off.

Atemperatureprotection circuit is included which switches
off the regulator output at a junction temperature
above 150 °C.

A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up to
38 Ω. This is very attractive as the ESR of an electrolytic
capacitor increases strongly at low temperatures (no
expensive tantalum capacitor is required).

handbook, halfpage

132

4

GND

MGL810

GND

V

P

REG

Fig.2 Pin configuration of SO4.

handbook, halfpage

1
2
3
4

8
7
6
5

MGS585

TDA3663

V

P

GNDGND
GND
n.c.

n.c.

GND

REG

Fig.3 Pin configuration of SO8.

1999 Sep 29 5

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage

TDA3663 − 45 V
TDA3663T − 33 V
TDA3663AT − 45 V

V

P(rp)

reverse polarity supply voltage non-operating −−25 V

P

tot

total power dissipation

SO8 temperature of copper area

is 25 °C

− 4.1 W

SO4 T

amb

=25°C − 5W

T

stg

storage temperature non-operating −55 +150 °C

T

amb

ambient temperature operating

TDA3663 −40 +125 °C
TDA3663T −40 +85 °C
TDA3663AT −40 +125 °C

T

j

junction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient

SO8 in free air; soldered in 125 K/W
SO4 in free air; soldered in 100 K/W

R

th(j-c)

thermal resistance from junction to case

SO8 to centre pins; soldered 30 K/W
SO4 in free air 25 K/W

1999 Sep 29 6

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

CHARACTERISTICS

VP= 14.4 V; T

amb

=25°C; measured with test circuit of Fig.4; unless otherwise specified.

Notes

1. The regulator output will follow V

P

if VP<V

REG+VREG(drop)

.

2. Limiting values as applicable for device type:
a) TDA3663: VP≤ 45 V and −40 °C ≤ T

amb

≤ +125 °C.

b) TDA3663T: VP≤ 33 V and −40 °C ≤ T

amb

≤ +85 °C.

c) TDA3663AT: VP≤ 45 V and −40 °C ≤ T

amb

≤ +125 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage: pin V

P

V

P

supply voltage regulator operating; note 1

TDA3663 3 14.4 45 V
TDA3663T 3 14.4 33 V
TDA3663AT 3 14.4 45 V

I

q

quiescent supply current VP= 4.5 V; I

REG

=0mA − 10 −µA

V

P

= 14.4 V; I

REG

=0mA − 15 30 µA

6V≤V

P

≤22 V; I

REG

=10mA − 0.2 0.5 mA

6V≤V

P

≤22 V; I

REG

=50mA − 1.4 2.5 mA
Regulator output: pin REG; note 2
V

REG

output voltage 8 V ≤ VP≤ 22 V; I

REG

= 0.5 mA 3.16 3.3 3.44 V

0.5 mA ≤ I

REG

≤ 100 mA 3.13 3.3 3.47 V

6V≤V

P

≤45 V; I

REG

= 0.5 mA 3.13 3.3 3.47 V
V

REG(drop)

dropout voltage VP= 3.1 V; T

amb

≤ 85 °C;

I

REG

=50mA

− 0.18 0.3 V

V

REG(stab)

output voltage long-term stability − 20 − mV/1000 h

∆V

REG(line)

line input regulation voltage 7 V ≤ VP≤ 22 V; I

REG

= 0.5 mA − 130mV

7V≤V

P

≤45 V; I

REG

= 0.5 mA − 150mV
∆V

REG(load)

load output regulation voltage 0.5 mA ≤ I

REG

≤ 50 mA − 10 50 mV

SVRR supply voltage ripple rejection f

i

= 120 Hz;

V

i(ripple)

= 1 V (RMS);

I

REG

= 0.5 mA

50 60 − dB

I

REG(crl)

output current limit V

REG

> 2.8 V 0.17 0.25 − A

I

LO(rp)

output leakage current at
reverse polarity

VP= −15 V; V

REG

≤ 0.3 V − 1 500 µA

1999 Sep 29 7

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

TEST AND APPLICATION INFORMATION

dbook, halfpage

MGS586

V

P

13

2, 4

C2

TDA3663

10 µF

C1

(1)

1 µF

V

REG

= 3.3 V

Fig.4 Test circuit (SO4).

(1) C1 is optional (to minimize supply noise only).

handbook, halfpage

MDA961

ESR

(Ω)

C2 (µF)

10

2

10

1

10

−1

10

−1

11010

2

stable region

(2)

(1)

Fig.5 Graph for selecting the value of the output

capacitor.

(1) Maximum ESR at 200 µA ≤ I

REG

≤ 100 mA.

(2) Minimum ESR only when I

REG

≤ 200 µA.

Noise

The output noise is determined by the value of the output
capacitor The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).

Table 1 Noise figures

Stability

The regulator is stabilized with an external capacitor
connectedto the output. The value of this capacitor can be
selected using the diagrams shown in Figs 5 and 6.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.

OUTPUT

CURRENT

I

REG

(mA)

NOISE FIGURE (µV)

C2 = 10 µFC2=47µF C2 = 100 µF

0.5 550 320 300
50 650 400 400

handbook, halfpage

MDA962

ESR

(Ω)

I

REG

(mA)

10

3

10

2

10

22

1

10

−1

110 10

3

10

2

stable region

Fig.6 ESR as a function of I

REG

for selecting the

value of the output capacitor.

1999 Sep 29 8

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

EXAMPLE 1
The regulator is stabilized with an electrolytic capacitor of

68 µF (ESR = 0.5 Ω). At T

amb

= −40 °C, the capacitor
value is decreased to 22 µF and the ESR is increased
to 3.5 Ω. The regulator will remain stable at a temperature
of T

amb

= −40 °C.

EXAMPLE 2
The regulator is stabilized with an electrolytic capacitor of

10 µF (ESR = 3.3 Ω). At T

amb

= −40 °C, the capacitor
value is decreased to 3 µF and the ESR is increased to
20 Ω. The regulator will remain stable at a temperature of
T

amb

= −40 °C.

EXAMPLE 3
The regulator is stabilized with a 100 nF MKT capacitor

connected to the output. When the output current is over
200 µA full stability is guaranteed. Because the thermal
influence on the capacitor value is almost zero, the
regulator will remain stable at a temperature of
T

amb

= −40 °C.

EXAMPLE 4
The regulator is stabilized with a 100 nF capacitor in

parallelwith an electrolytic capacitor of 10 µFconnectedto
the output.

The regulator is now stable under all conditions and
independent of:

• The ESR of the electrolytic capacitor

• The value of the electrolytic capacitor

• The output current.

Application circuits

The maximum output current of the regulator equals:

When T

amb

=21°C and VP= 14 V the maximum output

current equals 116 mA.
The total thermal resistance of the TDA3663 can be

decreased from 120 K/W to 50 K/W for the SO8 version.
For the SO4 version it can be decreased from
100 to 40 K/Wwhen GND pins 2 and 4 of the package are
soldered to the printed-circuit board.

APPLICATION CIRCUIT WITH BACKUP FUNCTION
Sometimes a backup function is needed to supply, for

example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).

Thisfunction can easily be built with the TDA3663byusing
an output capacitor with a large value. When the supply
voltage is 0 V (or −1 V), only a small current will flow into
pin REG from this output capacitor (a few µA).

The application circuit is given in Fig.7.

I

REG max()

150 T

amb

–

R

th(j-a)VPVREG

–()×

-------------------------------------------------------

=

150 T

amb

–

100 V

P

3.3–()×

------------------------------------------

= (mA)

dbook, halfpage

MGS587

V

P

13

2, 4

C2

(2)

TDA3663

C1

(1)

1 µF

V

REG

= 3.3 V

Fig.7 Application circuit with backup function

(SO4 version).

(1) C1 is optional (to minimize supply noise only).
(2) C2 ≤ 4700 µF.

1999 Sep 29 9

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

Additional application information

This section gives typical curves for various parameters measured on the TDA3663AT. Standard test conditions are:
VP= 14.4 V; T

amb

=25°C.

handbook, halfpage

010

V

P

(V)

I

q

(µA)

20 30

25

0

20

15

10

5

MDA947

Fig.8 Quiescent current as a function of the

supply voltage.

I

REG

= 0 mA.

handbook, halfpage

010 50

4

3

1

0

2

20 30

VP (V)

I

q

(mA)

40

MDA949

Fig.9 Quiescent current increase as a function of

high supply voltage.

handbook, halfpage

−40 0

(1)

(2)

160

2

1.5

0.5

0

1

40 80

Tj (°C)

I

q

(mA)

120

MDA951

Fig.10 Quiescent current as a function of the

junction temperature.

(1) Iqat 50 mA load.
(2) Iqat 10 mA load.

handbook, halfpage

5

0.36

0.40

0.44

0.48

10 15

VP (V)

I

q

(mA)

2520

MDA948

Fig.11 Quiescent current as a function of the

supply voltage.

I

REG

= 10 mA.

1999 Sep 29 10

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

handbook, halfpage

5

1.4

1.6

1.8

2

10 15

VP (V)

I

q

(mA)

2520

MDA950

Fig.12 Quiescent current as a function of the

supply voltage.

I

REG

= 50 mA.

handbook, halfpage

0 20 100

4

3

1

0

2

40 60

I

REG

(mA)

I

q

(mA)

80

MDA952

Fig.13 Quiescent current as a function of the

output current.

handbook, halfpage

−50 200

3.40

3.25

3.30

3.35

050

T

j

(

°C)

V

REG
(V)

100 150

MGS694

Fig.14 Output voltage as a function of the junction

temperature.

I

REG

= 0 mA.

handbook, halfpage

−50 200

4

0

1

3

2

050

T

j

(

°C)

V

REG

(V)

100 150

MGS695

Fig.15 Output voltage thermal protection as a

function of the junction temperature.

I

REG

= 0 mA.

1999 Sep 29 11

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

handbook, halfpage

040

I

REG

(mA)

V

REG(drop)

(V)

80 120

500

400

200

100

300

MDA957

Fig.16 Dropout voltage as a function of the output

current.

handbook, halfpage

0

4

3

2

1

0

100

V

REG

(V)

I

REG

(mA)

200 300

MGS696

Fig.17 Fold back protection mode.

VP= 8 V and pulsed load.

handbook, halfpage

−70

−60

−50

−40

−30

MDA956

10

SVRR

(dB)

f (Hz)

10

2

10

3

10

4

10

5

(1)

(1)

(2)

(2)

(3)

(3)

I

REG

= 10 mA; C2 = 10 µF.
(1) SVRR at RL= 100 Ω.
(2) SVRR at RL= 500 Ω.
(3) SVRR at RL=10kΩ.

Fig.18 SVRR as a function of the ripple frequency.

1999 Sep 29 12

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

PACKAGE OUTLINES

UNIT A1b

p

cD

E

e1HELpQywv

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.10

0.01

1.8

1.5

0.80

0.60

b

1

3.1

2.9

0.32

0.22

6.7

6.3

3.7

3.3

2.3

e

4.6

7.3

6.7

1.1

0.7

0.95

0.85

0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223 SC-73

97-02-28
99-09-13

w M

b

p

D

b

1

e

1

e

A

A

1

L

p

Q

detail X

H

E

E

v M

A

AB

B

c

y

0 2 4 mm

scale

A

X

132

4

Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223

1999 Sep 29 13

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(2)

(1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

4

5

pin 1 index

1

8

y

076E03S MS-012AA

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15

0.050

0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

95-02-04
97-05-22

1999 Sep 29 14

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a very brief insight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardby screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) or printed-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on four sides,thefootprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Sep 29 15

Philips Semiconductors Preliminary specification

Very low dropout voltage/quiescent current

3.3 V voltage regulator

TDA3663

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO not recommended

(5)

suitable

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

68

Philips Semiconductors – a w orldwide compan y

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips DevelopmentCorporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

Printed in The Netherlands 545002/01/pp16 Date of release: 1999 Sep 29 Document order number: 9397 750 06068