Datasheet TDA3661AT Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3661

Very low dropout voltage/quiescent
current adjustable voltage regulator

Product specification
Supersedes data of 2000 Dec 08
File under Integrated Circuits, IC01

2000 Dec 13

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3661

adjustable voltage regulator

FEATURES

• Output adjustable from 1.5 V to VP, 100 mA regulator

• Supply voltage range up to 45 V

• Very low quiescent current of 15 µA (typical value)

• Very low dropout voltage

• High ripple rejection

• Very high stability:

– Electrolytic capacitors: Equivalent Series

Resistance (ESR) < 22 Ω at worst-case condition

– Other capacitors: 100 nFat 200 µA ≤ I

REG

≤ 100 mA.

• Pin compatible family TDA3662 to TDA3666

• Protections:

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

– Reverse polarity safe (down to −25 V without high

reverse current)
– Negative transient of 50 V (RS=10Ω, t < 100 ms)
– Able to withstand voltages up to 18 V at the output

(supply line may be short-circuited)
– ESD protection on all pins
– DC short-circuit safe to ground and VP of the

regulator output
– Temperature protection (at Tj> 150 °C).

GENERAL DESCRIPTION

The TDA3661 is an adjustable voltage regulator with very
lowdropout voltage andquiescentcurrent, which operates
over a wide supply voltage range.

Supply

V

P

I

q

supply voltage regulator on 3 14.4 45 V
quiescent supply current VP= 14.4 V; I

=0mA − 15 30 µA

REG

Regulator; k = 4.01929 (note 1)
V

REG

V

ref

V

REG(drop)

output voltage 8 V ≤ VP≤ 22 V; I

6V≤V
V

P

0.5 mA ≤ I

≤45 V; I

P

= 14.4 V;

REG

≤ 100 mA
reference voltage VP= 14.4 V 1.181 1.244 1.306 V
dropout voltage VP= 4.5 V; I

T

amb

REG

≤ 85 °C

= 0.5 mA 4.8 5.0 5.2 V

REG

= 0.5 mA 4.75 5.0 5.25 V

REG

4.75 5.0 5.25 V

= 50 mA;

− 0.18 0.3 V

Note

1.

V

REG

V

k×=

ref

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA3661AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

2000 Dec 13 2

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

BLOCK DIAGRAM

handbook, halfpage

8

V

P

REGULATOR

BAND GAP

TDA3661

PROTECTION

2, 3, 6, 7

GND

THERMAL

MGS579

TDA3661

1

REG

5

ADJ

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

REG 1 regulator output
GND 2, 3, 6 and 7 ground; note 1
n.c. 4 not connected
ADJ 5 feedback input
V

P

8 supply voltage

Note

1. All GND pins are connected to thelead frameand can
also be used to reduce the total thermal resistance

by soldering these pins to a ground plane.

R

th(j-a)

The ground plane on the top side of the PCB acts like
a heat spreader.

handbook, halfpage

REG

1
2

TDA3661

3

GND

4

n.c.

MGS580

Fig.2 Pin configuration.

V

8

P

GNDGND

7

GND

6

ADJ

5

2000 Dec 13 3

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3661

adjustable voltage regulator

FUNCTIONAL DESCRIPTION

The TDA3661 is an adjustable voltage regulator with an
output voltage that can be fixed by means of an external
resistor divider. The regulator can deliver output currents
up to 100 mA. The regulator is available in an SO8
package. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, aspecially built-in clamp circuit keeps
the quiescent current of this regulator very low, in dropout
and full load conditions.

The device remains operational down to very low supply
voltages (typical 2 V) and belowthis voltageit switchesoff.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
P

T
T
T

P
P(rp)
tot

stg
amb
j

supply voltage − 45 V
reverse polarity supply voltage non-operating −−25 V
total power dissipation temperature of copper area

storage temperature non-operating −55 +150 °C
ambient temperature operating −40 +125 °C
junction temperature operating −40 +150 °C

Atemperatureprotection is includedwhich switchesoff the
regulator output at a junction temperature above 150 °C.

A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR
(worst-case) up to22 Ω, seeFigs 4 and 5. If only a 100 nF
capacitor is used, the regulator is fully stable when
I

> 200 µA. This is very attractive as the ESR of an

REG

electrolytic capacitor increases strongly at low
temperatures (no expensive tantalum capacitor is
required).

− 4.1 W

is 25 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R
R

th(j-c)
th(j-a)

thermal resistance from junction to case to centre pins; soldered 30 K/W
thermal resistance from junction to ambient in free air; soldered 125 K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

.

2000 Dec 13 4

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3661

adjustable voltage regulator

CHARACTERISTICS

VP= 14.4 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply voltage: pin V

V

P

I

q

Regulator output: pin REG

V

REG

V

REG(drop)

V

REG(stab)

V

REG(adj)

∆V

REG(line)

∆V

REG(load)

SVRR supply voltage ripple rejection f

V

ref

I

REG(crl)

I

LO(rp)

=25°C; k = 4.01929 (note 1); measured with test circuit of Fig.3; unless otherwise specified.

amb

P

supply voltage regulator operating; note 2 3 14.4 45 V
quiescent supply current VP= 4.5 V; I

V

= 14.4 V; I

P

6V≤V
6V≤V

≤24 V; I

P

≤24 V; I

P

output voltage 8 V ≤ VP≤ 22 V; I

0.5 mA ≤ I
6V≤V

≤45 V; I

P

dropout voltage VP= 4.5 V; T

I

=50mA

REG

=0mA − 10 30 µA

REG

=0mA − 15 30 µA

REG

=10mA − 0.2 0.5 mA

REG

=50mA − 1.4 2.5 mA

REG

= 0.5 mA 4.8 5.0 5.2 V

REG

≤ 100 mA 4.75 5.0 5.25 V

REG

= 0.5 mA 4.75 5.0 5.25 V

REG

amb

≤ 85 °C;

− 0.18 0.3 V

output voltage long-term stability − 20 − mV/1000 h
output voltage adjust range 1.5 − V
line input regulation voltage 7 V ≤ VP≤ 22 V; I

7V≤V

load output regulation voltage 0.5 mA ≤ I

= 120 Hz;

i

V

i(ripple)

I

REG

≤45 V; I

P

REG

= 1 V (RMS);

= 0.5 mA

≤ 50 mA − 10 50 mV

= 0.5 mA − 130mV

REG

= 0.5 mA − 150mV

REG

50 60 − dB

V

P

reference voltage VP= 14.4 V 1.181 1.244 1.306 V
output current limit V
output leakage currentat reverse

> 4 V 0.17 0.3 − A

REG

VP= −15 V; V

= ≤ 0.3 V − 1 500 µA

REG

polarity

Notes

1. The output voltage can be calculated using the following formula: where and

V

REG

V

ref

k×= k

R1 R2+

=

---------------------­R2

R1 + R2 ≤ 100 kΩ.

2. The regulator output will follow V

if VP<V

P

REG+VREG(drop)

.

2000 Dec 13 5

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

TEST AND APPLICATION INFORMATION

andbook, halfpage

V

P

(1)

C1
1 µF

(1) C1 is optional (to minimize supply noise only).

81

5

MGS581

R1

75.1 kΩ

R2

24.9 kΩ

TDA3661

2, 3, 6, 7

Fig.3 Test circuit.

C2

10 µF

V

REG

= 5 V

TDA3661

2

10

handbook, halfpage

ESR

(Ω)

10

1

−1

10

−1

10

(1) Maximum ESR at 200 µA ≤ I
(2) Minimum ESR only when I

(1)

stable region

(2)

11010

≤ 100 mA.

REG

≤ 200 µA.

REG

Fig.4 Graph for selecting the value of the output

capacitor.

MDA961

C2 (µF)

2

Noise

The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).

Table 1 Noise figures

OUTPUT

NOISE FIGURE (µV)

CURRENT

I

REG

(mA)

C2 = 10 µFC2=47µF C2 = 100 µF

0.5 550 320 300
50 650 400 400

Stability

The regulator is stabilized with an external capacitor
connectedto theoutput. The valueof this capacitorcan be
selected using the diagrams shown in Figs 4 and 5.
The following three examples show the effects of the
stabilization circuit using different values for the output
capacitor.

3

10

handbook, halfpage

ESR

(Ω)

2

10

22

10

1

−1

10

110 10

stable region

Fig.5 ESR as a function of I

value of the output capacitor.

MDA962

2

10

I

(mA)

REG

for selecting the

REG

3

2000 Dec 13 6

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

EXAMPLE 1
The regulator is stabilized with an electrolytic capacitor of

68 µF (ESR = 0.5 Ω). At T
value is decreased to 22 µF and the ESR is increased
to 3.5 Ω. The regulator will remain stable at a temperature
of T

amb

= −40 °C.

EXAMPLE 2
The regulator is stabilized with a 100 nF MKT capacitor

connected to the output. When the output current is larger
then 200 µA full stability is guaranteed. Because the
thermalinfluence on the capacitorvalueis almost zero, the
regulator will remain stable at a temperature of
T

= −40 °C.

amb

EXAMPLE 3
The regulator is stabilized with a 100 nF capacitor in

parallelwith an electrolytic capacitorof10 µF connected to
the output.

= −40 °C, the capacitor

amb

TDA3661

For successful operation of the IC (maximum output
current capability) special attention has to be given to the
copper area required as heatsink (connected to all
GND pins), the thermal capacity of the heatsink and its
ability to transfer heat to the external environment. It is
possible to reduce the total thermal resistance from
120 to 50 K/W.

APPLICATION CIRCUIT WITH BACKUP FUNCTION
Sometimes, a backup function is needed to supply, for

example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even −1 V).

Thisfunction can easily bebuiltwith the TDA3661byusing
an output capacitor with a large value. When the supply
voltage is 0 V (or −1 V), only a small current will flow into
pin REG from this output capacitor (a few µA).

The application circuit is given in Fig.6.

The regulator is now stable under all conditions and
independant of:

• The ESR of the electrolytic capacitor

• The value of the electrolytic capacitor

• The output current.

Application circuits

The maximum output current of the regulator equals:

150 T

–

I

REG max()

= (mA)

------------------------------------­100 V

When T

–

150 T

amb

=

----------------------------------------------------------­R

th j a–()

amb

5–()×

P

=21°C, VP= 14 V and V

amb

VPV

–()×

REG

REG

=5V

(k = 4.01929) the maximumoutput current equals 140 mA.

ndbook, halfpage

V

P

(1)

C1

1 µF

(1) C1 is optional (to minimize supply noiseonly).
(2) C2 ≤ 4700 µF.

81

TDA3661

5

2, 3, 6, 7

MGS582

R1

75.1 kΩ

R2

24.9 kΩ

Fig.6 Application circuit with backup function.

C2

V

REG

= 5 V

(2)

2000 Dec 13 7

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

APPLICATION CIRCUIT WITH ENABLE FUNCTION
Anenable function caneasilybe built withthe TDA3661 by

connecting a diode to pin ADJ. When the voltage on
pin ADJ is forced above 1.3 V, the output will switch off.
Thestandby current is equaltothe quiescent currentofthe
TDA3661.

The application circuit is given in Fig.7.

ndbook, halfpage

V

P

(1)

C1

1 µF

(1) C1 is optional (to minimize supply noiseonly).

81

TDA3661

5

2, 3, 6, 7

MGS583

R1

75.1 kΩ

R2

24.9 kΩ

Fig.7 Application circuit with enable function.

TDA3661

V
= 5 V

C2

10 µF

enable

D1

REG

Additional application information

This section gives typical curves for various parameters measured on the TDA3661AT. Standard test conditions are:
VP= 14.4 V, T

25

handbook, halfpage

I

q

(µA)

20

15

10

5

0

010

=25°C and k = 4.01929.

amb

MDA947

20 30

V

(V)

P

handbook, halfpage

4

I

q

(mA)

3

2

1

0

010 50

20 30

40

MDA949

VP (V)

I

= 0 mA.

REG

Fig.8 Quiescent current as a function of the

supply voltage.

2000 Dec 13 8

Fig.9 Quiescent current increase as a function of

high supply voltage.

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

120

MDA951

160

Tj (°C)

handbook, halfpage

2

I

q

(mA)

1.5

1

0.5

0

−40 0

(1) Iq at 50 mA load.
(2) Iq at 10 mA load.

(1)

(2)

40 80

0.48

handbook, halfpage

I

q

(mA)

0.44

0.40

0.36
5

I

= 10 mA.

REG

10 15

TDA3661

MDA948

2520

VP (V)

Fig.10 Quiescent current as a function of the

junction temperature.

I

q

(mA)

1.8

1.6

1.4

2

5

10 15

handbook, halfpage

MDA950

VP (V)

Fig.11 Quiescent current as a function of the

supply voltage.

80

I

REG

MDA952

(mA)

handbook, halfpage

2520

4

I

q

(mA)

3

2

1

0

0 20 100

40 60

I

= 50 mA.

REG

Fig.12 Quiescent current as a function of the

supply voltage.

2000 Dec 13 9

Fig.13 Quiescent current as a function of the

output current.

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

5.10

handbook, halfpage

V

REG

(V)

5.05

5.00

4.95

−50 200

050

100 150

MDA953

T

(°C)

j

handbook, halfpage

6

V

REG

(V)

4

2

0

−50 200

050

100 150

TDA3661

MDA955

T

(°C)

j

I

= 0 mA.

REG

Fig.14 Output voltage as a function of the junction

temperature.

500

handbook, halfpage

V

REG(drop)

(mV)

400

300

200

100

040

80 120

MDA957

I

(mA)

REG

I

= 0 mA.

REG

Fig.15 Output voltage thermal protection as a

function of the junction temperature.

V

REG
(V)

6

4

2

0

0

100

200 300

I

(mA)

REG

handbook, halfpage

MDA954

Fig.16 Dropout voltage as a function of the output

current.

2000 Dec 13 10

VP= 8 V and pulsed load.

Fig.17 Fold back protection mode.

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

−30

handbook, halfpage

SVRR

(dB)

−40

−50

(1)

−60

(2)

(3)

−70
10

I

= 10 mA; C2 = 10 µF.

REG

(1) SVRR at RL= 100 Ω.
(2) SVRR at RL= 500 Ω.
(3) SVRR at RL=10kΩ.

2

10

3

10

MDA956

(1)

(2)

(3)

4

10

f (Hz)

5

10

TDA3661

Fig.18 SVRR as a function of the ripple frequency.

2000 Dec 13 11

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm

D

c

y

Z

8

5

TDA3661

SOT96-1

E

H

E

A

X

v M

A

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

4

w M

b

p

0 2.5 5 mm

scale

(1)E(2)

cD

5.0

4.8

0.20

0.19

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

2

A

6.2

5.8

0.244

0.228

Q

3

A

θ

0.25 0.10.25

0.010.010.041 0.004

(1)

0.7

0.3

0.028

0.012

o

8

o

0

L

p

L

0.7

0.6

0.028

0.024

(A )

1

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE

VERSION

SOT96-1

IEC JEDEC EIAJ

076E03 MS-012

REFERENCES

2000 Dec 13 12

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current
adjustable voltage regulator

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a verybriefinsight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurface mount ICs, butitis not suitable forfinepitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardby screen printing,stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

TDA3661

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads onfoursides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering,the packagemust
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Dec 13 13

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3661

adjustable voltage regulator

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable forSSOP and TSSOP packages with a pitch (e) equalto or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

SOLDERING METHOD

WAVE REFLOW

(2)

(3)(4)
(5)

suitable

suitable
suitable

(1)

.

2000 Dec 13 14

Philips Semiconductors Product specification

Very low dropout voltage/quiescent current

TDA3661

adjustable voltage regulator

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given arein
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atany otherconditionsabove those giveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty that suchapplicationswillbe
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto result in personal injury.Philips
Semiconductorscustomersusing or selling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of any ofthese products,conveysno licence or title
under any patent, copyright, or mask work right to these
products,and makes norepresentationsor warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Dec 13 15

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

70

Printed in The Netherlands 753503/04/pp16 Date of release: 2000 Dec 13 Document order number: 9397 750 07864