Datasheet TDA3653B Specification

INTEGRATED CIRCUITS

DATA SH EET

TDA3653B
TDA3653C

Vertical deflection and guard circuit
(90˚)

Product specification
File under Integrated Circuits, IC02

March 1991

Philips Semiconductors Product specification

Vertical deflection and guard circuit
(90˚)

GENERAL DESCRIPTION

The TDA3653B/C is a vertical deflection output circuit for drive of various deflection systems with currents up to

1.5 A peak-to-peak.

Features

• Driver

• Output stage

• Thermal protection and output stage protection

• Flyback generator

• Voltage stabilizer

• Guard circuit

QUICK REFERENCE DATA

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

Supply (note 1)

Supply voltage range

pin 9 V

pin 6 V
Output (pin 5)
Peak output voltage during flyback V

Output current I
Operating junction temperature range T
Thermal resistance junction to mounting base

(SOT110B) R

(SOT131) R

= V

P
6-4

5-4M

5(p-p)

j

th j-mb
th j-mb

9-4

10 − 40 V

−−60 V

−−60 V

− 1.2 1.5 A

−25 −+150 °C

− 10 − K/W

− 3.5 − K/W

TDA3653B
TDA3653C

Note to the quick reference data

1. The maximum supply voltage should be chosen such that during flyback the voltage at pin 5 does not exceed 60 V.

PACKAGE OUTLINES

TDA3653B: 9-lead SIL; plastic (SOT110B); SOT110-1; 1996 November 25.
TDA3653C: 9-lead SIL; plastic power (SOT131); SOT131-2 November 25.

March 1991 2

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

TDA3653B

TDA3653C

Fig.1 Block diagram.

March 1991 3

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

TDA3653B

TDA3653C

FUNCTIONAL DESCRIPTION
Output stage and protection circuit

Pin 5 is the output pin. The supply for the output stage is fed to pin 6 and the output stage ground is connected to pin 4.
The output transistors of the class-B output stage can each deliver 0.75 A maximum.
The maximum voltage for pin 5 and 6 is 60 V.

The output power transistors are protected such that their operation remains within the SOAR area. This is achieved by
the co-operation of the thermal protection circuit, the current-voltage detector, the short-circuit protection and the special
measures in the internal circuit layout.

Driver and switching circuit

Pin 1 is the input for the driver of the output stage. The signal at pin 1 is also applied via external resistors to pin 3 which
is the input of a switching circuit. When the flyback starts, this switching circuit rapidly turns off the lower output stage
and so limits the turn-off dissipation. It also allows a quick start of the flyback generator.

External connection of pin 1 to pin 3 allows for applications in which the pins are driven separately.

Flyback generator

During scan the capacitor connected between pins 6 and 8 is charged to a level which is dependent on the value of the
resistor at pin 8 (see Fig.1).
When the flyback starts and the voltage at the output pin (pin 5) exceeds the supply voltage, the flyback generator is
activated.
The supply voltage is then connected in series, via pin 8, with the voltage across the capacitor during the flyback period.
This implies that during scan the supply voltage can be reduced to the required scan voltage plus saturation voltage of
the output transistors.
The amplitude of the flyback voltage can be chosen by changing the value of the external resistor at pin 8.
It should be noted that the application is chosen such that the lowest voltage at pin 8 is > 2.5 V, during normal operation.

Guard circuit

When there is no deflection current and the flyback generator is not activated, the voltage at pin 8 reduces to less than

1.8 V. The guard circuit will then produce a DC voltage at pin 7, which can be used to blank the picture tube and thus
prevent screen damage.

Voltage stabilizer

The internal voltage stabilizer provides a stabilized supply of 6 V to drive the output stage, which prevents the drive
current of the output stage being affected by supply voltage variations.

March 1991 4

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134);
pins 4 and 2 externally connected to ground.

PARAMETER SYMBOL MIN. MAX. UNIT

Supply voltage (pin 9) V
Supply voltage output stage (pin 6) V
Output voltage (pin 5) V
Input voltage (pins 1 and 3) V
External voltage at pin 7 V
Peak output current (pin 5)

repetitive ± I

non-repetitive ± I
Peak output current (pin 8)

repetitive I

non-repetitive ± I
Total power dissipation P
Storage temperature range T
Operating ambient temperature range T
Operating junction temperature range T

P
6-4
5-4
1; 3-2
7-2

8RM

tot
stg
amb
j

= V

5RM
5SM

8SM

9-4

− 40 V

− 60 V

− 60 V

− V

− 5.8 V

− 0.75 A

− 1.5 A

0.85 0.75 A

− 1.5 A

−55 +150 °C

−25 +150 °C

see Fig.2

see Fig.2

TDA3653B

TDA3653C

P

V

(1)

(1)

Note

1. Non-repetitive duty factor maximum 3.3%.

Fig.2 Power derating curves (for SOT110B).

March 1991 5

Fig.3 Quiescent current I4 as a function of supply

voltage V

P.

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

CHARACTERISTICS

= V

V

P

= 26 V; T

9-4

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply

Supply voltage (pin 9) note 1 V
Supply voltage (pin 6) note 1 V
Total supply current

(pin 6 and pin 9) note 2 IP = I6+ I
Quiescent current (pin 4) see Fig.3 I
Variation of quiescent current

with temperature ∆I

Output current

Output current (pin 5)

(peak-to-peak value) I
Output current flyback generator

(pin 8) −I
Output current flyback generator

(pin 8) I

Output voltage

Peak voltage during flyback V
Saturation voltage to supply

at −I5 = 0.75 A V

at I

= 0.75 A note 3 V

5

= 0.60 A V

at −I

5

at I

= 0.60 A note 3 V

5

Saturation voltage to ground

at I5 = 0.75 A V

at I

= 0.60 A V

5

Flyback generator

Saturation voltage

at −I

= 0.85 A V

8

at I

= 0.75 A note 3 V

8

at −I

= 0.70 A V

8

at I

= 0.60 A note 3 V

8

Flyback generator active if: V
Leakage current at pin 8 −I

Input

Input current (pin 1) I
Input voltage during scan (pin 1) I
Input voltage during scan (pin 3)

pins 1 and 3 not connected V

= 25 °C; pins 2 and 4 externally connected to ground; unless otherwise specified

amb

4

5(p-p)

8

= 0.75 A I

5

= 0.75 A V

5

1

= V

P
6-4

4

8

5-4M

6-5sat
5-6sat
6-5sat
5-6sat

5-4sat
5-4sat

9-8sat
8-9sat
9-8sat
8-9sat
5-9

8

1-2

3-2

9-4

TDA3653B

TDA3653C

10 − 40 V

−−60 V

9

34 50 85 mA
25 40 65 mA

−−0.04 − mA/K

− 1.2 1.5 A

− 0.7 0.85 A

− 0.6 0.75 A

−−60 V

− 2.5 3.0 V

− 2.5 3.0 V

− 2.2 2.7 V

− 2.3 2.8 V

− 2.3 2.7 V

− 2.1 2.4 V

− 1.6 2.1 V

− 2.3 2.8 V

− 1.4 1.9 V

− 2.2 2.7 V

4.0 −−V

− 5.0 100 µA

− 0.33 0.55 mA

− 1.5 2.4 V

0.8 − V

P

V

March 1991 6

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

TDA3653B

TDA3653C

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Input current during scan (pin 3)

pins 1 and 3 not connected I

pins 1 and 3 connected I
Input resistance (pin 3) R
Input voltage during flyback (pin 1) V
Input voltage during flyback (pin 3) V

3
3

3
1-2
3-2

Guard circuit

Output voltage (pin 7) note 4

loaded with 100 kΩ V

loaded with 0.5 mA V
Internal series resistance of pin 7 R

7-2
7-2
i7

Guard circuit active if

V

is lower than note 5 V

8-2

8-2

General data

Thermal protection becomes active

if junction temperature exceeds T

j

Thermal resistance junction

to mounting base R
Open loop gain at 1 kHz note 6 G

th j-mb
oI

Frequency response (−3 dB) note 7 f − 40 − kHz

0.03 −−mA

−−0.21 mA

3.9 5.3 6.7 kΩ

−−250 mV

−−250 mV

4.4 5.1 5.8 V

3.6 4.4 5.3 V

0.95 1.35 1.7 kΩ

−−1.8 V

158 175 192 °C

− 10 12 K/W

− 42 − dB

Notes to the characteristics

1. The maximum supply voltage should be chosen such that during flyback the voltage at pin 5 does not exceed 60 V.

2. When V

= 13 V and no load at pin 5.

5-4

3. Duty factor maximum 3.3%.

4. Guard circuit is active.

5. During normal operation the voltage V

6. R

load

= 8 Ω; I

load(rms)

= 125 mA.

may not be lower than 2.5 V.

8-2

7. With 220 pF between pins 1 and 5.

March 1991 7

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

APPLICATION INFORMATION

TDA3653B

TDA3653C

Note to deflection coils AT1236/20: L = 29 mH, R = 13.6Ω; deflection current without overscan is 0.82 A peak-to-peak and EHT voltage is 25kV.

Fig.4 Typical application circuit diagram of the TDA3653B/C (vertical output), when used in combination with

the TDA2578A (see Fig.5).

March 1991 8

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

TDA3653B

TDA3653C

Fig.5 Typical application circuit diagram; for combination of the TDA2578A with the TDA3653B/C (see Fig.4).

March 1991 9

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

TDA3653B

TDA3653C

March 1991 10

Fig.6 Application circuit diagram for combination with TDA2579A for 90° picture tube.

(1) Dependent on PCB layout.

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

PACKAGE OUTLINES

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

D

D

1

q

P

P

1

q

2

q

1

TDA3653B

TDA3653C

SOT110-1

A

2

A

3

pin 1 index

seating plane

19

Z

b

DIMENSIONS (mm are the original dimensions)

A

UNIT

18.5

mm

17.8

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2

A

8.7

8.0

A

3

4

15.8

15.4

A

max.

3.7

e

2

b

0.67

0.50

b

1

2

1.40

0.48

1.14

0.38

bcD

1.40

1.14

b

b

1

0 5 10 mm

scale

(1)

D

1

21.8

21.4

21.4

20.7

w M

(1)

E

eLPP

6.48

6.20

2.54

3.9

3.4

A

A

4

L

Q

q1q

q

Q

1

3.4

3.2

1.75

1.55

15.1

14.9

4.4

4.2

2.75

2.50

c

5.9

5.7

E

2

w

0.25

(1)

Z

max.

1.0

OUTLINE
VERSION

SOT110-1

IEC JEDEC EIAJ

REFERENCES

March 1991 11

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-25

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

SIL9P: plastic single in-line power package; 9 leads

D

d

j

non-concave

x

E

h

view B: mounting base side

A

B

D

h

2

E

TDA3653B

TDA3653C

SOT131-2

seating plane

b

19

Z

DIMENSIONS (mm are the original dimensions)

A

UNIT A

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1

max.

2.0

OUTLINE

VERSION

SOT131-2

4.6

4.2

e

b

b

cD

max.

1.1

p2

0.75

0.48

0.60

0.38

IEC JEDEC EIAJ

b

p

(1)

24.0

23.6

REFERENCES

w M

0 5 10 mm

scale

deD

h

20.0

10 2.54

19.6

E

12.2

11.8

A

1

L

c

Q

(1)

E

h

6

3.4

3.1

Lj

Q

17.2

2.1

16.5

1.8

EUROPEAN

PROJECTION

0.25w0.03

ISSUE DATE

92-11-17
95-03-11

(1)

Z

x

2.00

1.45

March 1991 12

Philips Semiconductors Product specification

Vertical deflection and guard circuit (90˚)

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

(order code 9398 652 90011).

TDA3653B

TDA3653C

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

March 1991 13