Datasheet TDA3616T, TDA3616SF Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA3616

Multiple voltage regulator with
battery detection

Product specification
Supersedes data of 2000 Jan 14
File under Integrated Circuits, IC01

2001 Feb 02

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

FEATURES
General

• One VP-state controlled regulator

• Battery detection circuit

• Regulator,resetandbatteryoutputsoperateduringload

dump

• Supply voltage range from −18 to +50 V

• Low quiescent current (battery detection switched off)

• High ripple rejection

• Dual reset output

• Backup circuit

• Adjustable reset delay timer.

Protections

• Reverse polarity safe (down to −18 V without high
reverse current)

• Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)

• ESD protected on all pins

• Load dump protection

• Foldback current limit protection for regulator

• TheregulatoroutputisDCshort-circuitedsafetoground

and VP.

TDA3616

GENERAL DESCRIPTION

The TDA3616 is a low power voltage regulator. It contains
the following:

• One fixed voltage regulator with a foldback current
protection, intended to supply a microprocessor, that
also operates during load dump

• Aprovision for use of a reserve supply capacitor that will
hold enough energy for the regulator to allow a
microcontroller to prepare for loss of supply voltage

• Reset signals which can be used to interface with the
microprocessor

• A supply pin that can withstand load dump pulses and
negative supply voltages

• Definedstart-upbehaviour;regulatorwillbeswitchedon
at a supply voltage higher than 7.5 V and off when the
output voltage of the regulator drops below 2.4 V.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage

operating regulator on 5.6 14.4 25 V
jump start t ≤ 10 minutes −−30 V
load dump protection t ≤ 50 ms; t

I

q

quiescent supply current standby mode − 95 125 µA

standby mode; T

≥ 2.5 ms −−50 V

r

=25°C − 95 120 µA

amb

Regulator

V

o

output voltage 0.5 mA ≤ I

7V≤VP≤18 V; T

0.5 mA ≤ I

REG

REG

≤ 150 mA;

=25°C

amb

≤ 150 mA;

4.8 5.0 5.2 V

4.75 5.0 5.25 V

7V≤VP≤18 V
I

REG

= 30 mA;

4.75 5.0 5.25 V

18 V ≤ VP≤ 50 V; load dump

V

drop

drop-out voltage I

= 150 mA; VP=5V;

REG

T

=25°C

amb

− 0.6 1.0 V

2001 Feb 02 2

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TDA3616T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
TDA3616SF SIL9MP plastic single in-line medium power package with fin; 9 leads SOT110-1

BLOCK DIAGRAM

handbook, full pagewidth

V

(14.4 V)

P

17 (4)

BACKUP SWITCH

PACKAGE

(5) 18

BU

V

n.c.

i.c.

V

I(bat)

3.1
kΩ

3.1
kΩ

(3) 16

(1) 14

(2) 15

(7) 54 (6)

MGL933

REG

RES2

RES1

V

O(bat)

LOAD DUMP

PROTECTION

REFERENCE

2, 3, 8, 9,
12, 13, 19

7

1, 10,
11, 20

4

6 (8)

C

47 kΩ

TDA3616T

7 (9)

GND

REG

BATTERY

BUFFER

REGULATOR

&

The pin numbers given in parenthesis refer to the TDA3616SF version.

Fig.1 Block diagram.

2001 Feb 02 3

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

PINNING

SYMBOL

SOT163-1 SOT110-1

i.c. 1, 10, 11, and 20 − interconnected; heat spreader; note 1
n.c. 2, 3, 8, 9, 12, 13

and 19

V

I(bat)

V

O(bat)

V

C

4 6 battery input voltage
5 7 battery detection output voltage

6 8 reset delay capacitor
GND 7 9 ground (0 V)
RES2 14 1 reset 2 output
RES1 15 2 reset 1 output
REG 16 3 regulator output
V

P

17 4 supply voltage

BU 18 5 backup

Note

1. The i.c. pins are connected to each other by the leadframe and can be kept floating or can be connected to ground.

PIN

DESCRIPTION

− not connected; heat spreader

handbook, halfpage

The i.c. and n.c. pins can be connected to a heat spreader.

V

V

O(bat)

i.c.
n.c.
n.c.

I(bat)

V

GND

n.c.
n.c.

i.c.

C

1
2
3
4
5

TDA3616T

6
7
8
9

10

MGR093

i.c.

20
19

n.c.

18

BU
V

17

P

16

REG
RES1

15

RES2

14

n.c.

13

n.c.

12

i.c.

11

Fig.2 Pin configuration (SOT163-1).

handbook, halfpage

Fig.3 Pin configuration (SOT110-1).

RES2
RES1

V

V

O(bat)

REG

V

BU

I(bat)

V

GND

1
2
3
4

P

5
6
7
8

C

9

TDA3616SF

MGL930

2001 Feb 02 4

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

FUNCTIONAL DESCRIPTION

The TDA3616 (see Fig.1) is a voltage regulator intended
to supply a microprocessor (e.g. in car radio applications).
Because of low-voltage operation of the application, a
low-voltage drop regulator is used.

This regulator will switch-on when the backup voltage
(see Section “Backup circuit”) exceeds 7.5 V for the first
time and will switch-off again when the output voltage of
the regulator drops below 2.4 V. When the regulator is
switched on, the RES1 and RES2 outputs (RES2 can only
be HIGH when RES1 is HIGH) will go HIGH after a fixed
delay time (fixed by an external delay capacitor) to
generate a reset to the microprocessor.

Pin RES1 will go HIGH via an internal pull-up resistor of

3.1 kΩ, and is used to initialize the microprocessor.
Pin RES2 is used to indicate that the regulator output
voltage is within its voltage range. This start-up feature is
built-in to secure a smooth start-up of the microprocessor
at first connection, without uncontrolled switching of the
regulator during the start-up sequence.

TDA3616

The charge of the backup capacitor can be used to supply
the regulator and logic circuits for a short period of time
whenthesupplyfallsto0 V (the time depends on the value
of the storage capacitor). The regulator is switched off at a
backup voltage of approximately 2.7 V. From this time
onwards, the backup charge will only be used for
maintaining reset functions. Due to this, the reset outputs
willremainLOWuntiltheoutputoftheregulatoris dropped
to 0 V.

All output pins are fully protected. The regulator is
protected against load dump and short-circuit (foldback
current protection). At load dump, the battery detection
circuit will remain operating.

Interfacing with the microprocessor can be accomplished
by means of a battery Schmitt trigger and output buffer
(simple full/semi on/off logic applications). The battery
output will go HIGH when the battery input voltage
exceeds the high threshold level.

The timing diagrams are shown in Fig.4.

handbook, full pagewidth

reset delay

battery input

battery output

V

V

BU

regulator

reset 2

reset 1

capacitor

P

18 V

4.75 V

2.4 V

2 V2 V

2.05 V

1.95 V

MGR095

Fig.4 Timing diagrams.

2001 Feb 02 5

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

rp

V

I(bat)p

V

I(bat)n

P

tot

T

stg

T

amb

T

j

THERMAL CHARACTERISTICS

supply voltage

operating regulator on − 25 V
jump start t ≤ 10 minutes − 30 V
load dump protection t ≤ 50 ms; t

≥ 2.5 ms − 50 V

r

reverse polarity voltage non-operating −−18 V
positive pulse voltage at battery input VP= 14.4 V; RI=5kΩ− 50 V
negative pulse voltage at battery input VP= 14.4 V; RI=10kΩ;

−−100 V

Cl=1nF
total power dissipation VP= 12.4 V − 2.5 W
storage temperature non-operating −55 +150 °C
ambient temperature operating −40 +105 °C
junction temperature operating −40 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-p)

thermal resistance from junction to pin/tab

TDA3616T 20 K/W
TDA3616SF 12 K/W

R

th(j-a)

thermal resistance from junction to ambient

TDA3616T 10 cm

2

2-sided copper

50 K/W

area connected to pins

TDA3616SF in free air 50 K/W

QUALITY SPECIFICATION

Quality specification in accordance with

“SNW-FQ-611E”

.

2001 Feb 02 6

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

CHARACTERISTICS

VP= 14.4 V; I
specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q

Schmitt trigger for regulator and reset 1

V

th(r)

V

th(f)

V

hys

Schmitt trigger for battery detection

V

th(r)

V

th(f)

V

hys

Schmitt trigger for reset 2

V

th(r)

V

th(f)

V

hys

∆V

track

Reset 1 and reset 2 buffers

I

sink(L)

R

pu(int)

Reset delay

R

pu(int)

V

th(r)

t

d

Battery buffer

V

OL

V

OH

I

OL

I

OH

= 0.5 mA; −40 °C<T

REG

< +105 °C; measurements taken in test circuit of Fig.7; unless otherwise

amb

supply voltage

operating regulator on; note 1 5.6 14.4 25 V
jump start t ≤ 10 minutes −−30 V
load dump protection t ≤ 50 ms; tr≥ 2.5 ms −−50 V

quiescent supply current VP= 12.4 V; T

=25°C; note 2 − 95 120 µA

amb

VP= 12.4 V; note 2 − 95 125 µA
VP= 14.4 V; note 2 − 100 −µA

= 50 V; load dump − 520mA

V

P

rising threshold voltage R
falling threshold voltage I

REG

I

REG

=1kΩ 6.2 7.5 8.1 V

L(REG)

= 5 mA 2.1 2.4 2.7 V
=30mA − 2.25 − V

hysteresis voltage − 5.1 − V

rising threshold voltage T

=25°C 2.0 2.1 2.2 V

amb

2.0 2.1 2.25 V

falling threshold voltage T

=25°C 1.9 2.0 2.1 V

amb

1.9 2.0 2.15 V

hysteresis voltage − 0.1 − V

rising threshold voltage note 3 4.55 4.8 5.05 V
falling threshold voltage note 3 4.5 4.75 5.0 V
hysteresis voltage − 0.05 − V
voltage tracking with V

REG

LOW-level sink current V
internal pull-up resistance T

I

= 0 mA; note 4 −65 0 +65 mV

sink

≤ 0.5 V; note 3 2 15 − mA

RES

=25°C 2.2 3.1 4.0 kΩ

amb

1.9 3.1 4.6 kΩ

internal pull-up resistance T

=25°C; note 5 − 47 − kΩ

amb

rising threshold voltage 1.4 2.0 2.8 V
delay time Cd= 100 nF; note 6; see Fig.9 − 2.6 − ms

LOW-level output voltage II= 0 mA 0 0.05 0.5 V
HIGH-level output voltage Io=5µA; note 7 − 5.0 5.2 V
LOW-level output current VOL≤ 0.5 V 0.2 0.5 − mA
HIGH-level output current VOH≥ 4 V; see Fig.6 1 12 − mA

2001 Feb 02 7

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Regulator (I

V

o

I

o

∆V

LN

∆V

L

SVRR supply voltage ripple rejection fi= 200 Hz; Vi= 2 V (p-p); Io= 5 mA 55 60 − dB
V

drop

I

l

I

sc

Backup switch

I

DC

I

r

Notes

1. Minimum operating voltage, only if VP has exceeded 7.5 V.

2. The quiescent current is measured in standby mode. Therefore, the battery input is connected to a low voltage
source and R

3. The voltage of the regulator sinks as a result of a supply voltage drop.

4. Only one band gap circuit is used as a reference for both regulator and Schmitt trigger for reset. Due to this a tracking
exists between the reset Schmitt trigger levels and the output voltage of the regulator.

5. The temperature coefficient of the internal resistor is 0.2%/K.

= 5 mA; unless otherwise specified)

REG

output voltage 0.5 mA ≤ I

7V≤V

P

0.5 mA ≤ I

≤ 150 mA;

REG

≤18 V; T

≤ 150 mA;

REG

amb

=25°C

4.8 5.0 5.2 V

4.75 5.0 5.25 V

7V≤VP≤18 V
I

= 30 mA; 18 V ≤ VP≤ 50 V;

REG

4.75 5.0 5.25 V

load dump
output current VP> 25 V; load dump −−100 mA
line voltage regulation 7 V ≤ VP≤ 18 V − 350mV
load voltage regulation 0.5 mA ≤ I

T

=25°C

amb

0.5 mA ≤ I

drop-out voltage I

current limit V
short-circuit current R

= 150 mA; VP=5V;

REG

T

=25°C; note 8

amb

I

= 150 mA; VP= 5.5 V; note 8 − 0.9 1.2 V

REG

> 4.5 V; VP> 10 V; note 9 0.25 0.6 1 A

REG
L(REG)

≤ 150 mA;

REG

≤ 150 mA −−85 mV

REG

−−70 mV

− 0.6 1.0 V

≤ 0.5 Ω; T

amb

=25°C;

40 80 − mA

note 10

DC continuous current VBU> 5 V; note 11 0.1 0.2 − A
reverse current VP=0V; VBU= 12.4 V −−200 µA

= ∞.

L(REG)

V

REG

6. The delay time can be calculated with the following formula:

tdR

×

pu int()Cd



ln×=

-----------------------------------



V

–()

REGVthr

7. The battery output voltage will be equal or less than the output voltage of the regulator.

8. The drop-out voltage of the regulator is measured between VP and V

REG

.

9. At current limit, Il is held constant (behaviour according to dashed line in Fig.5).

10. The foldback current protection limits the dissipated power at short-circuit (see Fig.5).

11. The backup switch can deliver an additional current of 100 mA, guaranteed when the regulator is loaded with nominal
loads (I

≤ 150 mA).

REG

2001 Feb 02 8

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

handbook, halfpage

5.0 V

V

REG

1 V

I

sc

≥50 mA

I

REG

MGL434

TDA3616

I

l

16

handbook, halfpage

I

O(bat)

(mA)

12

8

4

0

3.25 3.75 4.25 5.25

Fig.5 Foldback current protection.

MGL932

4.75
V

O(bat)

(V)

T

=27°C.

amb

Fig.6 Battery buffer HIGH-level output current as a function of V

2001 Feb 02 9

O(bat)

.

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

TEST AND APPLICATION INFORMATION
Test information

handbook, full pagewidth

V

V

I(bat)

C

P

R

10 kΩ

P

10 µF

battery input voltage

I

C

I

1 nF

back-up capacitor

(1)

C

BU

≥150 nF

V

V

P

C

17

6

TDA3616T

4

18

7
GND

regulator output

16

reset 1 output

15

reset 2 output

14

battery output voltage

5

MGR097

C

L

10 µF

TDA3616

R

L(REG)

(2)

10 kΩ

R

L(RES1)

1 kΩ

(1) Capacitor not required for stability.
(2) R

= 0.5 Ω at short-circuit.

L(REG)

Fig.7 Test circuit for TDA3616T.

2001 Feb 02 10

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

Application information

NOISE
The noise at the output of the regulator depends on the

bandwidth of the regulator, which can be adjusted by the
output capacitor CL. Table 1 shows the noise figures.

The noise on the supply line depends on the value of the
supply capacitor CPand is caused by a current noise (the
output noise of the regulator is translated into a current
noise by the output capacitor). When a high frequency
capacitor of 220 nF (with an electrolytic capacitor of
100 µF connected in parallel) is connected directly
between pins VPand GND the noise is minimized.

Table 1 Noise figures

IO(mA)

NOISE FIGURE (µV)

CL=10µFCL=47µFCL= 100 µF

0.5 58 50 45
50 250 200 180

Note

1. Measured at a bandwidth of 10 Hz to 100 kHz.

(1)

TDA3616

STABILITY
The regulator is stabilized by the output capacitor CL.

The value of the output capacitor can be selected using
the diagram shown in Fig.8. The following two examples
show the effects of the stabilization circuit using different
values for the output capacitor.

Remark: The behaviour of ESR as a function of the
temperature must be known.

Example 1

The regulator is stabilized using an electrolytic output
capacitor of 68 µF (ESR = 0.5 Ω). At T
capacitor value is decreased to 22 µF and the ESR is
increased to 3.5 Ω. The regulator will remain stable at a
temperature of T

amb

= −40 °C.

Example 2

The regulator is stabilized using an electrolytic output
capacitor of 10 µF (ESR = 3.3 Ω). At T
capacitor value is decreased to 3 µF and the ESR is
increased to 23.1 Ω. The regulator will be unstable at a
temperatureofT

= −40 °C.Thiscanbesolvedbyusing

amb

a tantalum capacitor of 10 µF.

= −40 °C the

amb

= −40 °C the

amb

handbook, full pagewidth

(1) Maximum Equivalent Series Resistance (ESR).
(2) Minimum ESR.

ESR

(Ω)

8

6

4

2

0

0.68

1

(1)

stable region

(2)

10

Fig.8 Curve for selecting the value of the output capacitor.

2001 Feb 02 11

MBK118

100 1000

output capacitor (µF)

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

APPLICATION CIRCUIT
In Fig.9 the total quiescent current equals Iq+I

The specified quiescent current equals Iq. When the
supply voltage is connected, the regulator will switch-on
when the supply voltage exceeds 7.5 V. With a timing
capacitor connected to pin VC the reset can be delayed
(the timer starts at the same moment as the regulator is
switched on).

Forced reset can be accomplished by short-circuiting the
timer capacitor by using the push-button switch. When the
push-button is released again, the timer restarts (only
when the regulator is on) causing a second reset on both
RES1 and RES2.

The maximum output current of the regulator equals:

I

O max()

When T

–

------------------------------------------------------­R

th(j-a)

=85°C and VP= 16 V, the maximum output

amb

amb

VPV

–()×

REG

–

150 T

---------------------------------­50 V

amb

P

150 T

current equals 118 mA. At lower ambient temperature
(T

< 0) the maximum output current equals 250 mA.

amb

For successful operation of the IC (maximum output
current capability), special attention has to be paid to the
copper area required as heatsink (connected to
pins 1, 10, 11 and 20), the thermal capacity of the
heatsink and its ability to transfer heat to the external
environment.

Rdivider

5–()×

.

[mA]==

TDA3616

It is possible to reduce the total thermal resistance from
120 K/W to 50 K/W).

Backup circuit

The backup function is used for supplying the regulator
and logic circuits (reset 1 and 2) when the supply voltage
is disconnected. For stability a minimum capacitor value
of 150 nF is needed.

With a supply voltage of 14.4 V the backup capacitor will
befullychargeduntilapproximately 14.2 V. At the moment
the supply voltage is lower than the voltage on pin BU the
backup switch will be opened (this backup switch acts like
an ideal diode) and the charge of the backup capacitor is
used for supplying the regulator and the logic circuits.
The backup capacitor is mainly discharged by the load of
the regulator. After a certain period of time the regulator
output will be disabled and the backup capacitor will only
be discharged by the quiescent current of the IC itself.

In combination with the battery detection Schmitt trigger,
an early warning can be given to the microprocessor to
indicate that the battery voltage has dropped down to an
unacceptable low value, causing the microcontrollerto run
on backup charge. The early warning level can be
programmed with resistors R1 and R2; see Fig.9.

handbook, full pagewidth

The pin numbers given in parenthesis refer to the TDA3616SF version.

choke

coil

2200

µF

forced reset

on/off
(closed = on)

8 V detector

R1
360 kΩ

R2
100 kΩ

V

I(bat)

V

C

d

C

4 (6)

TDA3616T

6 (8)

Fig.9 Typical application.

2001 Feb 02 12

17
(4)

7 (9)

V

P

18

(5)

(3) 16

(2) 15

(1) 14

(7) 5

BU

REG

RES1

RES2

V

O(bat)

MGL931

C

BU

1000 µF

(minimum value of 150 nF

needed for stability)

C

L

10 µF

used for
8 V detector

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

PACKAGE OUTLINES

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

11

TDA3616

SOT163-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

0.49

0.36

p

cD

0.32

0.23

0.013

0.009

3

0.019

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

10

w M

b

p

scale

(1)E(1) (1)

13.0

12.6

0.51

0.49

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

10.65

10.00

0.419

0.394

Q

A

2

0.055

A

1

detail X

1.1

1.1

1.4

0.4

0.043

0.016

1.0

0.043

0.039

(A )

L

p

L

0.25

0.01

A

3

θ

0.25 0.1

0.01

ywv θ

Z

0.9

0.4

8

0.004

0.035

0.016

0

o
o

OUTLINE
VERSION

SOT163-1

IEC JEDEC EIAJ

075E04 MS-013

REFERENCES

2001 Feb 02 13

EUROPEAN

PROJECTION

ISSUE DATE

97-05-22
99-12-27

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

D

D

1

q

P

P

1

q

2

q

1

TDA3616

SOT110-1

A

2

A

3

pin 1 index

seating plane

19

Z

b

DIMENSIONS (mm are the original dimensions)

A

A

18.5

17.8

max.

3.7

2

A

A

3

4

8.7

15.8

8.0

15.4

UNIT

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

e

2

b

0.67

0.50

b

1

2

1.40

0.48

1.14

0.38

bcD

1.40

1.14

b

b

1

0 5 10 mm

scale

(1)

D

1

21.8

21.4

21.4

20.7

w M

(1)

E

eLPP

6.48

6.20

2.54

3.9

3.4

A

A

4

L

Q

q1q

q

Q

1

3.4

3.2

1.75

1.55

15.1

14.9

4.4

4.2

2.75

2.50

c

5.9

5.7

E

2

w

0.25

(1)

Z

max.

1.0

OUTLINE

VERSION

SOT110-1

IEC JEDEC EIAJ

REFERENCES

2001 Feb 02 14

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-25

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

SOLDERING
Introduction

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponentsaremixedon
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardby screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

stg(max)

). If the

TDA3616

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswith leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.

2001 Feb 02 15

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable
Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

, SO, SOJ suitable suitable −

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

not suitable

SOLDERING METHOD

WAVE REFLOW

(2)

(3)

− suitable

suitable −

(4)(5)

suitable −

(6)

suitable −

(1)

DIPPING

.

2001 Feb 02 16

Philips Semiconductors Product specification

Multiple voltage regulator with battery

TDA3616

detection

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabove those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty that such applications willbe
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusing or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseof any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2001 Feb 02 17

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

NOTES

TDA3616

2001 Feb 02 18

Philips Semiconductors Product specification

Multiple voltage regulator with battery
detection

NOTES

TDA3616

2001 Feb 02 19

Philips Semiconductors – a w orldwide compan y

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Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
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Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
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The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2001

Internet: http://www.semiconductors.philips.com

71

Printed in The Netherlands 753503/03/pp20 Date of release: 2001 Feb 02 Document order number: 9397 750 08035