TC4626EPA8-Pin PDIP0°C to +70°C
TC4626MJA8-Pin CERDIP0°C to +70°C
TC4627COE 16-Pin SOIC (Wide)-55°C to +125°C
TC4627CPA8-PinPDIP-40°C to +85°C
TC4627EOE 16-Pin SOIC (Wide)-40°C to +85°C
TC4627EPA8-Pin PDIP0°C to +70°C
TC4627MJA8-Pin CERDIP0°C to +70°C
PackageTemp. Range
Package Type
8-Pin PDIP/CERDIP
–
C1
C1
GND
1
+
2
TC4626
C2
3
TC4627
4
V
8
DD
7
IN
6
V
BOOST
5
OUT
16-Pin SOIC (Wide)
C1
NC
C1
NC
C2
NC
NC
GND
–
1
2
+
3
4
TC4626
5
TC4627
6
7
8
V
16
DD
NC
15
14
NC
IN
13
12
NC
V
11
BOOST
NC
10
OUT
9
General Description
The TC4626/TC4627 are single CMOS high speed
drivers with an on-board voltage boost circuit. These
partswork with an input supply voltagefrom4to6volts.
The internal voltage booster will produce a V
potential up to 12 volts above VIN.ThisV
regulated, so i ts voltage is dependent on the input V
voltage and output drive loading requirements. An
internalundervoltage lockoutcircuitkeepsthe outputin
a low state whenV
is enabled when V
dropsbelow 7.8 volts. Output
BOOST
is above 11.3 volts.
BOOST
BOOST
BOOST
is not
DD
Functional Block Diagram
EXT
C
1
+
EXT
C
2
NOTE: Pin numbers correspond to 8-pin package.
2002 Microchip TechnologyInc.DS21426B-page 1
C1-
C2
V
GND
DD
In
1
3
V = 2 x V
8
7
4
Voltage
Booster
DD
Clock
2
C1+
+
V
BOOST
Noninverting
TC4627
Inverting
TC4626
(Unregulated 3 x VDD)
UV LOCK
6
EXT
+
C
3
5
Output
TC4626/TC4627
1.0ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affectdevice reliability.
The voltage booster is an unregulated voltage tripler
circuit. The tripler consists of three sets of internal
switches and three external capacitors. S1a and S1b
chargecapacitorC1 to V
FIGURE 3-3:VOLTAGE BOOSTER
potential.S2aand S2b add
DD
3 x VDD, V
S1a
S1b
C3
C2
C1
+
+
(4 to 6V)
V
DD
+
6
3
8
2
1
2 x V
BOOST
DD
C1 potential to V
input to charge C2 to 2 x VDD.S3a
DD
and S3b add C1 potential to C2 to charge C3 to 3 x
V
. The position of the switches is controlled by the
DD
internal 4 phase clock.
6
S3a
S2a
S2b
S3b
GND
4
FIGURE 3-4:POSITION OF SWITCHES
Pin 1 & 2 Waveforms
DD
DD
V
DD
DD
V
DD
0
On
Off
Pin 2
Voltage
Pin 1
Voltage
3 x V
2 x V
2 x V
S1
DS21426B-page 6
On
S2
Off
On
S3
Off
2002 Microchip TechnologyInc.
TC4626/TC4627
4.0TYPICAL CHARACTERISTICS
Note:The graphs and tables provided following this note are a statisticalsummary based on a limited number of
samplesandareprovidedforinformationalpurposesonly. The performancecharacteristicslistedherein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range ( e.g., outside specified power supply range) and therefore outside the warranted range.
16
14
12
10
8
HI (Volts)
6
OUT
V
4
2
0
5
14
12
10
8
HI (Volts)
6
OUT
V
4
2
0
5
TC4626 VOH vs. Frequency
470pF
2200pF
500 1,000 1,500 2,000 2,500 3,000 3,500
1000pF
FREQUENCY (kHz)
VS = 5V
= -55
T
A
°C
TC4626 VOH vs. Frequency
VS = 5V
= 125
T
A
470pF
2200pF
1000pF
500 1,000 1,500 2,000 2,500 3,000 3,500
FREQUENCY (kHz)
TC4626 VOH vs. Frequency
14
12
10
8
HI (Volts)
6
OUT
V
4
2
0
10
470pF
2200pF
500 1,000 1,500 2,000 2,500 3,000 3,500
1000pF
FREQUENCY (kHz)
VS = 5V
= 25
T
A
°C
Delay Time vs. Temperature
100
Input = 0-5V;
& TF <10nsec;
T
°C
Time (nsec)
R
@ <20kHz
80
t
D2
60
t
D1
40
t
RISE
20
0
-40 -20020
t
FALL
TEMPERATURE (°C)
VS = 4V
C
LOAD
4060 80
= 1000pF
100 120
Delay Time vs. Temperature
60
VS = 5V
= 1000pF
C
50
LOAD
40
t
D2
t
30
Time (nsec)
20
10
0
2002 Microchip TechnologyInc.DS21426B-page 7
D1
t
FALL
-40 -20020
t
TEMPERATURE (°C)
RISE
Input = 0-5V;
T
& TF <10nsec;
R
@ <20kHz
40 60 80
100
120
50
40
30
20
Time (nsec)
10
Delay Time vs. Temperature
VS = 6V
= 1000pF
C
LOAD
t
D2
t
D1
t
t
FALL
0
-40 -20020
RISE
TEMPERATURE (°C)
Input = 0-5V;
TR & TF <10nsec;
@ <20kHz
40 60 80
100
120
TC4626/TC4627
TYPICAL CHARACTERISTICS (CONTINUED)
16
15
14
13
12
HI (Volts)
11
OUT
V
10
9
8
16
15
14
13
12
HI (Volts)
11
OUT
V
10
9
8
TC4626 VOH vs. Frequency
VS = 5V
= 25
T
°C
A
1234567
FREQUENCY x 100 kHz
TC4626 VOH vs. Frequency
VS = 5V
= 125
T
°C
A
2,200pF
1
34
2
FREQUENCY x 100 kHz
567
1,000pF
2,200pF
8
470pF
1,000pF
8
470pF
9 100
9
TC4626 VOH vs. Frequency
16
VS = 5V
15
14
13
12
HI (Volts)
11
OUT
V
10
100
= -55
T
°C
A
9
8
1234567
FREQUENCY x 100 kHz
470pF
1,000pF
2,200pF
8
100
9
DS21426B-page 8
2002 Microchip TechnologyInc.
5.0PACKAGING INFORMATION
3
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Package marking data not available at this time.
5.1Package Dimensions
8-Pin Plastic DIP
TC4626/TC4627
.260 (6.60
.240 (6.10
.045 (1.14
.030 (0.76
.200 (5.08
.140 (3.56
.150 (3.81
.115 (2.92
8-Pin CDIP (Narrow
.400 (10.16
.348 (8.84
.110 (2.79
.090 (2.29
.022 (0.56
.015 (0.38
.110 (2.79
.090 (2.29
.070 (1.78
.040 (1.02
.040 (1.02
.020 (0.51
.300 (7.62
.230 (5.84
.310 (7.87
.290 (7.37
.015 (0.38
.008 (0.20
.400 (10.16
310 (7.87
Dimensions: inches (mm)
.055 (1.40) MAX
.200 (5.08
.160 (4.06
.200 (5.08
.125 (3.18
.400 (10.16
.370 (9.40
.065 (1.65
.045 (1.14
.020 (0.51
.016 (0.41
.020 (0.51) MIN
.040 (1.02
.020 (0.51
.150 (3.81
.015 (0.38
.008 (0.20
.320 (8.13
.290 (7.37
.400 (10.16
.320 (8.13
Dimensions: inches (mm)
2002 Microchip TechnologyInc.DS21426B-page 9
TC4626/TC4627
Package Dimensions (Continued)
16-Pin SOIC (Wide)
PIN1
.413(10.49).398(10.10)
.050(1.27)TYP.
.019(0.48).014(0.36)
.299(7.59).291(7.40)
.012(0.30).004(0.10)
.419(10.65).398(10.10)
.104(2.64).097(2.46)
8
°
MAX.
.013(0.33).009(0.23)
.050(1.27).016(0.40)
Dimensions: inches (mm)
DS21426B-page 10
2002 Microchip TechnologyInc.
TC4626/TC4627
Sales and Support
Data Sheets
Products supportedby a preliminary DataSheetmayhave an erratasheetdescribing minor operational differences and recommendedworkarounds.To determineif an errata sheet existsfora particular device, pleasecontact one of the following:
1.Your local Microchip sales office
2.The Microchip CorporateLiteratureCenter U.S. FAX: (480)792-7277
3.The Microchip Worldwide Site (www.microchip.com)
Pleasespecify which device, revision of silicon and Data Sheet (includeLiterature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn)to receive the most currentinformationon our products.
2002 Microchip Technology Inc.DS21426B-page11
TC4626/TC4627
NOTES:
DS21426B-page12 2002 Microchip Technology Inc.
TC4626/TC4627
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
K
EELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,
PICSTART, PRO MA TE, SEEVAL and The Embedded Control
SolutionsCompany areregiste red trademarksof MicrochipTechnologyIncorp or ated in the U.S.A. and other countries .
dsPIC, ECONOMONI TOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPA SM, MPLIB, MPLINK, MPSIM,
MXDEV,MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
TechnologyIncorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip TechnologyIncorporated in t he U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
®
PICmicro
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systemsisISO 9001certified.
2002 Microchip TechnologyInc.DS21426B-page 13
8-bit MCUs, KEELOQ®code hopping
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