1. Technical Specifications, Connections and Chassis
Overview2
2. Safety Instructions, Warnings, and Notes4
3. Directions for Use6
4. Mechanical Instructions6
5. Service Modes, Error Codes, and Fault Finding 7
6. Block Diagrams, Test Point Overviews, and
Waveforms
Chassis Block Diagram9
7. Circuit Diagrams and CBA LayoutsDiagram CBA
Main Board 01-29PT6457/44-MA11012
Main Board 01-29PT6457/55-MA11112
CRT Panel1314
Side I/O Panel 40-TB59PH-SIA1XG14
Layout Front IR Panel 40-TB59PH-FBB1XG14
Layout BTSC Panel 40-TB59PH-MPB1XG14
8. Alignments15
9. Circuit Descriptions, Abbreviation List, and IC Data
Sheets18
Copyright 2007 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Published by WS 0770 BU CD Customer ServicePrinted in the NetherlandsSubject to modificationEN 3122 785 17510
Page 2
EN 2TC5.1L CB1.
Technical Specifications, Connections and Chassis Overview
1.Technical Specifications, Connections and Chassis Overview
1.1Technical Specifications
Tuning - technology: PLL
Tuning - presets/channels: 181
Freq Bands: Full-Cable
TV Systems Off Air/ Cable: NTSC M (3.58 - 4.5)
TV Systems Multi: NTSC
Mains voltage: 180-240V
(29PT6457/44)
: 100-120V
: (29PT6457/55)
Mains frequency: 50/60Hz
Power consumption: 90W (29PT6457/44)
Ye - Video CVBS1 V
Wh - Audio L0.5 V
Rd - Audio R0.5 V
/ 75 ohmkq
PP
/10 kohmkq
RMS
/ 10 kohmkq
RMS
Cinch: Video YUV- In
Gn - Video Y1 V
Bu - Video U0.7 V
Rd - Video V0.7 V
/ 75 ohmjq
PP
/ 75 ohmjq
PP
/ 75 ohmjq
PP
Cinch: Audio - Out
Rd - Audio - R0.5 V
Wh - Audio - L0.5 V
/ 10 kohmkq
RMS
/ 10 kohmkq
RMS
G_16340_002.eps
100306
G_16340_001.eps
100306
Figure 1-1 Aerial connection
Aerial - In
-- F-typeCoax, 75 ohmD
H_17480_008.eps
050707
Figure 1-3 Side audio and video connections
S-Video (Hosiden): Video Y/C - In
1 - Ground Y Gnd H
2 - Ground C Gnd H
3 - Video Y 1 V
4 - Video C 0.3 V
/ 75 ohm j
PP
P / 75 ohm j
PP
Cinch: Video CVBS - In, Audio - In
Ye - Video CVBS1 V
Wh - Audio L0.5 V
Rd - Audio R0.5 V
/ 75 ohmjq
PP
/ 10 kohmjq
RMS
/ 10 kohmjq
RMS
Page 3
Technical Specifications, Connections and Chassis Overview
1.3Chassis Overview
See Chapter 10, Parts List.
EN 3TC5.1L CB1.
Page 4
EN 4TC5.1L CB2.
Safety Instructions, Warnings, and Notes
2.Safety Instructions, Warnings, and Notes
Index of this chapter:
2.1 Safety Instructions
2.2 Maintenance Instructions
2.3 Warnings
2.4 Notes
2.1Safety Instructions
Safety regulations require the following during a repair:
•Connect the set to the Mains/AC Power via an isolation
transformer (> 800 VA).
•Replace safety components, indicated by the symbol h,
only by components identical to the original ones. Any
other component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
•Wear safety goggles when you replace the CRT.
Safety regulations require that after a repair, the set must be
returned in its original condition. Pay in particular attention to
the following points:
•General repair instruction: as a strict precaution, we advise
you to re-solder the solder connections through which the
horizontal deflection current flows. In particular this is valid
for the:
1. Pins of the line output transformer (LOT).
2. Fly-back capacitor(s).
3. S-correction capacitor(s).
4. Line output transistor.
5. Pins of the connector with wires to the deflection coil.
6. Other components through which the deflection current
flows.
Note: This re-soldering is advised to prevent bad connections
due to metal fatigue in solder connections, and is therefore only
necessary for television sets more than two years old.
•Route the wire trees and EHT cable correctly and secure
them with the mounted cable clamps.
•Check the insulation of the Mains/AC Power lead for
external damage.
•Check the strain relief of the Mains/AC Power cord for
proper function, to prevent the cord from touching the CRT,
hot components, or heat sinks.
•Check the electrical DC resistance between the Mains/AC
Power plug and the secondary side (only for sets that have
a Mains/AC Power isolated power supply):
1. Unplug the Mains/AC Power cord and connect a wire
between the two pins of the Mains/AC Power plug.
2. Set the Mains/AC Power switch to the "on" position
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the
Mains/AC Power plug and the metal shielding of the
tuner or the aerial connection on the set. The reading
should be between 4.5 Mohm and 12 Mohm.
4. Switch "off" the set, and remove the wire between the
two pins of the Mains/AC Power plug.
•Check the cabinet for defects, to prevent touching of any
inner parts by the customer.
2.2Maintenance Instructions
We recommend a maintenance inspection carried out by
qualified service personnel. The interval depends on the usage
conditions:
•When a customer uses the set under normal
circumstances, for example in a living room, the
recommended interval is three to five years.
•When a customer uses the set in an environment with
higher dust, grease, or moisture levels, for example in a
kitchen, the recommended interval is one year.
•The maintenance inspection includes the following actions:
1. Perform the “general repair instruction” noted above.
2. Clean the power supply and deflection circuitry on the
chassis.
3. Clean the picture tube panel and the neck of the picture
tube.
2.3Warnings
•In order to prevent damage to ICs and transistors, avoid all
high voltage flashovers. In order to prevent damage to the
picture tube, use the method shown in figure “Discharge
picture tube”, to discharge the picture tube. Use a high
voltage probe and a multi-meter (position V
until the meter reading is 0 V (after approx. 30 s).
V
Figure 2-1 Discharge picture tube
•All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD w). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. Available
ESD protection equipment:
– Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822
310 10671.
– Wristband tester 4822 344 13999.
•Be careful during measurements in the high voltage
section.
•Never replace modules or other components while the unit
is switched "on".
•When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and prevents circuits
from becoming unstable.
2.4Notes
2.4.1General
•Measure the voltages and waveforms with regard to the
chassis (= tuner) ground (H), or hot ground (I), depending
on the tested area of circuitry. The voltages and waveforms
shown in the diagrams are indicative. Measure them in the
Service Default Mode (see chapter 5) with a color bar
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
•Where necessary, measure the waveforms and voltages
with (D) and without (E) aerial signal. Measure the
voltages in the power supply section both in normal
operation (G) and in stand-by (F). These values are
indicated by means of the appropriate symbols.
•The semiconductors indicated in the circuit diagram and in
the parts lists, are interchangeable per position with the
). Discharge
DC
E_06532_007.eps
250304
Page 5
Safety Instructions, Warnings, and Notes
EN 5TC5.1L CB2.
semiconductors in the unit, irrespective of the type
indication on these semiconductors.
•Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic” and the “double-D symbol”, are
trademarks of Dolby Laboratories.
2.4.2 Schematic Notes
•All resistor values are in ohms, and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 kohm).
•Resistor values with no multiplier may be indicated with
either an "E" or an "R" (e.g. 220E or 220R indicates 220
ohm).
•All capacitor values are given in micro-farads (μ= x10
nano-farads (n= x10
•Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
•An "asterisk" (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
•The correct component values are listed in the Spare Parts
List. Therefore, always check this list when there is any
doubt.
2.4.3 Rework on BGA (Ball Grid Array) ICs
General
Although (LF)BGA assembly yields are very high, there may
still be a requirement for component rework. By rework, we
mean the process of removing the component from the PWB
and replacing it with a new component. If an (LF)BGA is
removed from a PWB, the solder balls of the component are
deformed drastically so the removed (LF)BGA has to be
discarded.
-9
), or pico-farads (p= x10
-12
2.4.4Lead-free Solder
Philips CE is producing lead-free sets (PBF) from 1.1.2005
onwards.
Identification: The bottom line of a type plate gives a 14-digit
serial number. Digits 5 and 6 refer to the production year, digits
7 and 8 refer to production week (in example below it is 1991
week 18).
MODEL :
-6
),
).
PROD.NO:
Regardless of the special lead-free logo (which is not always
indicated), one must treat all sets from this date onwards
according to the rules as described below.
32PF9968/10
AG 1A0617 000001
Figure 2-2 Serial number example
MADE IN BELGIUM
220-240V 50/60Hz
~
128W
VHF+S+H+UHF
BJ3.0E LA
S
E_06532_024.eps
130606
P
b
Figure 2-3 Lead-free logo
Device Removal
As is the case with any component that is being removed, it is
essential when removing an (LF)BGA, that the board, tracks,
solder lands, or surrounding components are not damaged. To
remove an (LF)BGA, the board must be uniformly heated to a
temperature close to the reflow soldering temperature. A
uniform temperature reduces the risk of warping the PWB.
To do this, we recommend that the board is heated until it is
certain that all the joints are molten. Then carefully pull the
component off the board with a vacuum nozzle. For the
appropriate temperature profiles, see the IC data sheet.
Area Preparation
When the component has been removed, the vacant IC area
must be cleaned before replacing the (LF)BGA.
Removing an IC often leaves varying amounts of solder on the
mounting lands. This excessive solder can be removed with
either a solder sucker or solder wick. The remaining flux can be
removed with a brush and cleaning agent.
After the board is properly cleaned and inspected, apply flux on
the solder lands and on the connection balls of the (LF)BGA.
Note: Do not apply solder paste, as this has been shown to
result in problems during re-soldering.
Device Replacement
The last step in the repair process is to solder the new
component on the board. Ideally, the (LF)BGA should be
aligned under a microscope or magnifying glass. If this is not
possible, try to align the (LF)BGA with any board markers.
So as not to damage neighboring components, it may be
necessary to reduce some temperatures and times.
More Information
For more information on how to handle BGA devices, visit this
URL: www.atyourservice.ce.philips.com (needs subscription,
not available for all regions). After login, select “Magazine”,
then go to “Repair downloads”. Here you will find Information
on how to deal with BGA-ICs.
Due to lead-free technology some rules have to be respected
by the workshop during a repair:
•Use only lead-free soldering tin Philips SAC305 with order
code 0622 149 00106. If lead-free solder paste is required,
please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
workshops should be avoided because paste is not easy to
store and to handle.
•Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
– To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
– To exchange solder-tips for different applications.
•Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
reduce heat.
•Mix of lead-free soldering tin/parts with leaded soldering
tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If this cannot be avoided, carefully
clean the solder-joint from old tin and re-solder with new
tin.
•Use only original spare-parts listed in the Service-Manuals.
Not listed standard material (commodities) has to be
purchased at external companies.
•Special information for lead-free BGA ICs: these ICs will be
delivered in so-called "dry-packaging" to protect the IC
against moisture. This packaging may only be opened
shortly before it is used (soldered). Otherwise the body of
the IC gets "wet" inside and during the heating time the
structure of the IC will be destroyed due to high (steam-)
pressure inside the body. If the packaging was opened
before usage, the IC has to be heated up for some hours
(around 90°C) for drying (think of ESD-protection!).
Do not re-use BGAs at all!
Page 6
EN 6TC5.1L CB3.
Directions for Use
•For sets produced before 1.1.2005, containing leaded
soldering tin and components, all needed spare parts will
be available till the end of the service period. For the repair
of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with
mixed technologies), you can use the following method:
•Always use the highest temperature to solder, when using
SAC305 (see also instructions below).
•De-solder thoroughly (clean solder joints to avoid mix of
two alloys).
Caution: For BGA-ICs, you must use the correct temperatureprofile, which is coupled to the 12NC. For an overview of these
profiles, visit the website www.atyourservice.ce.philips.com
(needs subscription, but is not available for all regions)
You will find this and more technical information within the
"Magazine", chapter "Repair downloads".
For additional questions please contact your local repair help
desk.
2.4.5 Alternative BOM identification
In September 2003, Philips CE introduced a change in the way
the serial number (or production number, see Figure 2-1) is
composed. From this date on, the third digit in the serial
number (example: AG2B0335000001) indicates the number of
the alternative BOM (Bill of Materials used for producing the
specific model of TV set). It is possible that the same TV model
on the market is produced with e.g. two different types of
displays, coming from two different O.E.M.s.
By looking at the third digit of the serial number, the service
technician can see if there is more than one type of B.O.M.
used in the production of the TV set he is working with. He can
then consult the At Your Service Web site, where he can type
in the Commercial Type Version Number of the TV set (e.g.
28PW9515/12), after which a screen will appear that gives
information about the number of alternative B.O.M.s used.
If the third digit of the serial number contains the number 1
(example: AG1B033500001), then there is only one B.O.M.
version of the TV set on the market. If the third digit is a 2
(example: AG2B0335000001), then there are two different
B.O.M.s. Information about this is important for ordering the
correct spare parts!
For the third digit, the numbers 1...9 and the characters A...Z
can be used, so in total: 9 plus 26 = 35 different B.O.M.s can
be indicated by the third digit of the serial number.
2.4.6Practical Service Precautions
•It makes sense to avoid exposure to electrical shock.
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
•Always respect voltages. While some may not be
dangerous in themselves, they can cause unexpected
reactions that are best avoided. Before reaching into a
powered TV set, it is best to test the high voltage insulation.
It is easy to do, and is a good service precaution.
3.Directions for Use
You can download this information from the following websites:
http://www.philips.com/support
http://www.p4c.philips.com
4.Mechanical Instructions
See Chapter 10, Parts List.
Page 7
Service Modes, Error Codes, and Fault Finding
5.Service Modes, Error Codes, and Fault Finding
5.1Trouble Shooting
5.1.1 Can not Power On
EN 7TC5.1L CB5.
Can not Power On
Fuse OK?
(1) Check if B+ shorted to earth.
(2) To check whether D822 and R821 are
N
(3) To check whether D823 and R823 are
Is it IC801 Pin 1
shorted to earth?
Y
Check/Replace IC801
5.1.2 No Raster, Sound OK
No Raster
Sound OK
Check B+,
YY
turnoff.
turnoff. And whether C836 shorted.
+12V, Ok?
N
Is DB801 OK?
NN
Y
Check the components such as C801, C802, C806, C807 and C815
Is power supply for IC101 correct?
If not, check Q820, Q821, Q007, Q008,
D001
Check Horizontal Scan circuit:
Check H-Vcc and H-out of IC 101
Check Q401, T401 and Q411
To check whether R404, C401, T401,
Q401, R422 are ok?
Check Pin 13
(H-OUT) voltage
ok?
Y
Is there any shorted
in the scan part of
the circuit?
Change IC101
Y
N
Y
N
5.1.3 Raster OK, Sound OK, No TV/AV picture
Raster OK, Sound OK, No TV/AV picture
Check whether Q917 is
ok?
N
Replace Q917
YY
Replace C238
N
Check each
output voltage of
FBT
Change the
shorted part.
G_16340_005.eps
100306
Figure 5-2 No Raster, Sound OK
Change IC901 Check C238, ok?
G_16340_008.eps
100306
Figure 5-3 Raster OK, Sound OK, No TV/AV picture
Page 8
EN 8TC5.1L CB5.
5.1.4 Raster OK, Sound OK, No AV picture
Raster OK, Sound OK, No AV picture
Service Modes, Error Codes, and Fault Finding
Is the signal waveform at Pin 12 and
Pin 14 of IC901 right?
Y
Check Q917, Q918, Q919, ok?
N
Replace the fail component.
5.1.5 Raster OK, Sound OK, No TV picture
Raster OK, Sound OK, No TV picture
Is the signal waveform at Pin 15 of IC901
right?
N
To check whether R903, C903, R902
N
and R905, C908, R908 are ok?
Replace IC901
Y
G_16340_006.eps
100306
Figure 5-4 Raster OK, Sound OK, No AV picture
Replace
IC901
Y
Check R234, Q204, R235, C229
5.1.6No picture, dense noise dots
No picture, dense noise
dots
Is the antenna feed line
or the adapter broken?
Y
Handing the antenna
fault
N
Is the signal at Pin SCL,
SDA of tuner ok?
Check signal at P5, P57, P58,
P59, and P60 of IC101 and
replace the abnormal relative
circuit
Figure 5-5 Raster OK, Sound OK, No TV picture
Is the signal at
Pin41, Pin42 of
IC101 ok?
N
Is the signal at IF
pin of the tuner ok?
N
NN
Y
Check/Replace
Y
IC101
Check the relative
circuit of Q101,
Y
Z141 etc
Is the supply
voltage of tuner ok?
Y
Check/Replace
IC201, IC202,
D101.
G_16340_007.eps
100306
Check/Replace
Tuner
Y
Check EEPROM
G_16340_009.eps
Figure 5-6 No picture, dense noise dots
100306
Page 9
Block Diagrams, Test Point Overviews, and Waveforms
6.Block Diagrams, Test Point Overviews, and Waveforms
Chassis Block Diagram
EN 9TC5.1L CB6.
* /44 setsuse STR-W6756
H_17510_009.eps
021107
Page 10
Circuit Diagrams and CBA Layouts
7.Circuit Diagrams and CBA Layouts
Main Board 01-29PT6457/44-MA1
EN 10TC5.1L CB7.
H_17510_001.eps
021107
Page 11
Circuit Diagrams and CBA Layouts
Main Board 01-29PT6457/55-MA1
EN 11TC5.1L CB7.
H_17510_004.eps
021107
Page 12
Circuit Diagrams and CBA Layouts
Layout Main Board 40-TB59PH-MAB1XG (Top Side)
EN 12TC5.1L CB7.
H_17510_002.eps
021107
Page 13
CRT Panel
Circuit Diagrams and CBA Layouts
EN 13TC5.1L CB7.
G_16340_014.eps
100306
Page 14
Circuit Diagrams and CBA Layouts
EN 14TC5.1L CB7.
Layout CRT Panel
Layout Front IR Panel 40-TB59PH-FBB1XG
Layout BTSC Panel 40-TB59PH-MPB1XG
H_17510_007.eps
021107
Side I/O Panel 40-TB59PH-SIA1XG
H_17510_003.eps
021107
H_17480_005.eps
041007
H_17510_008.eps
021107
Page 15
8.Alignments
Alignments
EN 15TC5.1L CB8.
8.1How to Put the Set into Factory Mode
•Press the “D-MODE” button on the remote control.
•Press the “OK” button on the remote control.
•Press the “CH+” or the “CH-” button to select the parameter
you want to adjust.
•Press the “VOL+” or the “VOL-” button to adjust the
selected parameter.
•To put the new values into the memory, leave the factory
mode with the “D_MODE” button on the remote control.
22
8.2Adjustment of the B+ (BAT) voltage
1. Apply the Philips standard test pattern to the RF input.
2. Connect a DC voltmeter (range >200 V) to pins 1 (GND)
and 3 (+) of S804 [1].
3. Adjust potentiometer VR802 [2] in STANDARD mode in
such a way the voltage reading is 130 +/- 0.5 V.
21
8.3RF AGC Alignment:
1. Connect a test circuit as depicted in figure “Test circuit”.
2. Apply an 8-scale gray signal (80 dBμV).
3. Adjust the AGC data until the output of the test circuit
becomes 0.4 V (p-p) ±0.05 V.
4. Change the 8-scale gray signal to 60 dBμV.
5. The shown value of CRO should be the same as while
receiving the 80 dBμV signal. If not, repeat step 3 and 4
until the results for 60 dBμV and 80 dBμV input signal are
the same.
Figure 8-1 Test pin & potentiometer position
Q101
D2
C1
1N60
33pF
D1
C2
1N60
100pFR1100k
Figure 8-2 Test circuit
TO CRO
H_17480_007.eps
050707
H_17480_006.eps
051007
Page 16
EN 16TC5.1L CB8.
Alignments
8.4Screen & Focus Voltage Adjustment
1. Apply the test pattern signal in normal status.
2. Enter the Factory mode
3. Press the "TV/AV" button to stop the vertical scan (Note:
the RC/GC/BC is preset to 80, GD/BD to 40)
4. Adjust the SCREEN potentiometer on the line output
transformer in such a way the horizontal line is just visible
on the screen.
5. Measure the VG2 voltage with a High Voltage Meter and a
High Voltage Test stick (1000:1). The VG2 voltage should
be 675 ±50 V.
6. Turn on the vertical output, and adjust the "FOCUS"
potentiometer on the line output transformer in such a way
the focus is maximized. The “FOCUS” voltage should be
within the range of 7 - 8.0 kV.
8.5White Balance Adjustment (NORMAL)
Normal color temperature adjustment.
1. In Rich Status, choose a
AV input (Color Temperature = normal).
2. Adjust Brightness & Contrast until at the grey side Y = 5 ±1
Nits and at the white side Y = 85 ±10 Nits.
3. Use color analyzer to measure the grey side of the screen.
By adjusting the value of RC, GC and BC, set the reading
of the color analyzer x = 274 ±8 and y = 280 ±8.
4. Use color analyzer to measure the white side of the screen.
By adjusting the GD and BD, set the reading of the color
analyzer to x = 274 ±8 and y = 280 ±8.
5. Repeat steps 2 to 4 until the reading of the color analyzer
is correct on both grey and white picture.
Cool color temperature adjustment.
1. In Rich status, choose a
AV input (Color Temperature = cool).
2. Adjust RC-C, GC-C, BC-C, GD-C and BD-C as described
in 2, 3, 4 and 5 of the “Normal color temperature
adjustment” procedure until you have reached a reading on
the color analyzer of x = 263 ±8 and y = 265 ±8.
Warm color temperature adjustment.
1. In Rich status, choose a
AV input (Color Temperature = warm).
2. Adjust RC-W, GC-W, BC-W, GD-W and BD-W as
described in 2, 3, 4 and 5 of the “Normal color temperature
adjustment” procedure until you have reached a reading on
the color analyzer of x = 291 ±8 and y = 300 ±8.
CVI color temperature adjustment.
1. In Rich status, choose a
CVI input (Color Temperature = normal).
2. Adjust YUVRC, YUVGC, YUVBC, YUVGD and YUVBD as
described in 2, 3, 4 and 5 of the “Normal color temperature
adjustment” procedure until you have reached a reading on
the color analyzer of x = 274 ±8 and y = 280 ±8.
1
/2 grey and 1/2 white pattern from
1
/2 grey and 1/2 white pattern from
1
/2 grey and 1/2 white pattern from
1
/2 grey and 1/2 white pattern from
8.7Picture Geometry Adjustment
1. Apply the Philips NTSC standard testing pattern in normal
status.
2. Then enter menu 3.
3. Adjust the following data to get the minimum distortion:
a. HPOS6 (Horizontal Centre).
b. PARA6 (Level).
c. TRAP6 (Trapezium).
d. HSIZE6 (Horizontal Size).
e. CNRT6 (Top).
f. CNRB6 (Bottom).
4. Apply the Philips NTSC standard testing pattern in normal
status.
5. Enter menu 3.
6. Adjust the following data to get the minimum distortion:
a. HIGH6 (Height).
b. VP60 (Vertical Center).
c. VLIN6 (Linearity).
d. VSC6 (Vertical-S Correction).
7. Apply the Philips PAL standard testing pattern in normal
status.
8. Then enter menu 3.
9. Adjust the following data to get the minimum distortion:
a. HPOS6 (Horizontal Centre).
b. PARA6 (Level).
c. TRAP6 (Trapezium).
d. HSIZE6 (Horizontal Size).
e. CNRT6 (Top).
f. CNRB6 (Bottom).
10. Apply the Philips PAL standard testing pattern in normal
status.
11. Enter menu 2.
12. Adjust the following data to get the minimum distortion:
a. HIGH5 (Height).
b. VP50 (Vertical Center).
c. VLIN5 (Linearity).
d. VSC5 (Vertical-S Correction).
8.8The Peak White Adjustment
In Rich status and Color Temperature = Normal, apply the peak
white signal with a 14x14 cm window to the AV input. Enter
factory alignment menu 5, select SCNT to adjust the subcontrast until the spec of the window is 285 ±15 Nits.
8.9Initialization
Put the set into “Factory Mode” (see “How to Put the Set into
Factory Mode”, the first item of this chapter). Press the
"SOUND" button, the screen displays "WAIT". When the
screen displays "OK", the initialization is finished.
8.6Adjustment of Sub-brightness
1. In Rich & Normal status, apply standard grey & white
pattern via RF (NTSC-M).
2. Test the brightness of grey side of the picture to meet
BRTS 17 - 21 Nits.
Page 17
8.10 EEPROM Data:
Note: although all items are adjustable, we only recommend to
adjust the items with an asterisk (*). The other items are
adjustable as well, but we strongly discourage adjusting them.
B-Hz1K5 B-Hz5K B-Hz10K COMB1 COMB2 COMB3 AV GAIN OPTM3
BAS
C-Hz500 TRE
C-Hz1K5 C-Hz1K C-Hz10K
TIMER
BD-CYUVGDYUVBD
0CFD00
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EN 18TC5.1L CB9.
Circuit Descriptions, Abbreviation List, and IC Data Sheets
9.Circuit Descriptions, Abbreviation List, and IC Data Sheets
9.1Brief Introduction of the Chassis
9.1.1Chassis block diagram
* /44 sets use STR-W6756
9.1.2 Power Supply Section
This section mainly consists of
•IC STR-W6735 (/44 sets use STR-W6756) (IC801).
•Transformer (T803).
•Bridge rectifier (DB801).
•Accessory circuits.
The supply voltage for this chassis should be AC 110V. The
allowed voltage range is 90V to 140V, the frequency range is
50/60Hz.
The AC power with high/low frequency interference goes
through an RC filter, consisting of C801, T801, C802, R801,
and T802. The filter removes the high/low frequency
interference. Then DB801 transforms the AC power to DC
power. T803 and IC 801 work in standby state. T803 will
provide a power voltage to IC101. IC101 scans for the "KEY IN"
signal (Pin 3 of IC101) from the ON/OFF switch on the
keyboard. If "KEY IN" = "power on" signal, pin 64 (IC101) will
generate a signal to drive the photo coupler (IC8021). It acts as
a feed back circuit (feed back to Pin 6 of IC801) for controlling
IC801 to adjust MOSFET.
Transformer T803 provides the following voltages:
•+13V voltage from Pin16.
Figure 9-1 Chassis block diagram
•+130V (B+) voltage from Pin1.
•+12V from Pin 15.
•Pin 15 is also connected to two Positive Voltage
The picture below shows IC201 and IC202:
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021107
Regulators (IC201, IC202) in-series. The outputs of these
regulators are +9V and +5V respectively.
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Figure 9-2 IC 201/202
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Circuit Descriptions, Abbreviation List, and IC Data Sheets
6
9.1.3 Tuning Section
This section mainly consists of the tuner (TU101), the IF preamplifier circuit and the SAWFILTER.
The SIF signal is sent out together with the TV signal from
Pin30 of IC101. It passes through Q203, R225. X202 and a
High-pass filter (consisting of C254, L206, C253) filters out the
video signal and low frequency interference.
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EN 19TC5.1L CB9.
From Pin58 of IC101 the I2C bus clock signal goes to the tuner.
The tuner works during the clock time. IC101 will send out a
data signal from Pin57 to control the tuner's working state by
controlling the +33V voltage. +33V is provided from Pin10 of
T803. That voltage is put into the tuner at Pin7. A circuit inside
the tuner transforms +33V into a voltage between 0 and +33V
(as a function of the data, sent by IC101).
The AGC signal is a close loop control voltage that keeps the
amplitude of the signal constant.
Output of tuner is the Intermediate Frequency signal (IF signal).
The IF signal will pass pre-amplifier circuit (refer to the picture
below). The amplified IF signal passes the SAW filter and is
then sent to IC101 Pin41/42.
IC101 creates a CVBS signal and sends it out from Pin30.
CVBS will be selected by IC901, and then pass from Pin13 of
IC901 to Pin20/24 if IC101. IC101 will demodulate the CVBS
signal into an R, G, B signal. Next IC101 will send this R, G, B
signal from Pin50/51/52 to the CRT board.
Figure 9-4 Sound process section 1
SIF will be finally sent into Pin2 of IC1001. An analog automatic
gain control circuit (AGC) allows a wide range of input levels.
The analog-to-digital conversion of the IF sound signal is done
by an A/D-converter. The high pass filter, formed by a coupling
capacitor at SIF_IN1+ suppresses video components.
IC1001 is controlled via the I2C bus slave interface.
The AV sound signal will be directly sent to Pin37/38 or Pin40/
41 of IC1001. Q901/2 and Q903/4 form Emitter-Follower
circuits to provide a better load ability.
The (analog) sound signal will go from Pin26/27 of IC1001 to
Pin4/12 of IC602. IC602 is a dual bridge amplifier. The output
voltage of IC602 drives the speakers. The volume is adjusted
via the I2C bus.
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Figure 9-5 Sound process section 2
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EN 20TC5.1L CB9.
Circuit Descriptions, Abbreviation List, and IC Data Sheets
9.1.5 Vertical Output Section
This section mainly consists of IC301 (TDA8172), the Vertical
Coil and the related circuit. The supply voltage of IC301 are
+14V and -14V. These two voltages are provided by the LOT
section. For the vertical scan, IC101 creates a Saw-tooth
waveform at Pin16. This is the input signal of IC301. The main
task of IC101 is to create the vertical scan waveform. The
output signal of IC301 drives the Vertical Coil. If IC301 works in
normal state, Pin6 will send a square-signal to maintain a high
voltage at D214. If it does not, D214 will get a low voltage, Pin2
of IC101 senses this change and IC101 sends out a standby
signal.
9.1.6Horizontal Output and LOT Section
The horizontal drive pulse is a square wave. IC101 creates this
waveform at Pin13. Via Q401 the signal goes to the input of
Q411. Q411 is a horizontal output triode with a damper inside.
The signal from Pin C of Q411 drives the Horizontal Coil.
When Q411 goes into cut-off state, a sub-coil inside the LOT
will generate an EHT by inductance.
9.2IC description
9.2.1 Main IC (IC101)
Description:
The main IC is a TMPA8857CSNG, provided by TOSHIBA. It is
an integrated circuit, suited for PAL, NTSC and SECAM TV. An
MCU and a TV signal processor are integrated in a 64 pin DIP
package.
The MCU contains an 8-bit CPU, ROM, RAM, I/O-ports, timer/
counters, A/D-converters, an on-screen display controller,
remote control interfaces, IIC bus interfaces, and the closed
caption decoder.
The TV signal processor contains PIF, SIF, Video, multistandard chroma, deflection, and RGB processors.
TV Processor
IF
•Integrated PIF VCO, aligned automatically
•Negative demodulation PIF
•Multi-frequency SIF demodulator, without external tankcoil
Video
•Integrated chroma traps
•Black stretch
•Y-gamma
Chroma
•Integrated chroma BPF’s
•PAL/NTSC/SECAM demodulation
RGB/Base-band
•Integrated 1 H base-band delay line
•Base-band TINT control
•Internal OSD interface
•Half-tone and transparent for OSD
•External YCbCr interface for DVD
•RGB cut-off/drive controls by bus
•ABCL (ABL and ACL combined)
Synchronization
•Integrated fH x 640 VCO
•DC coupled vertical ramp output (single)
•EW correction with EHT output
•Sync out
Features:
MCU:
•High speed 8-bit CPU
•12 I/O ports
•I2C bus interface (multi-master)
•14-bit PWM output, 1 channel, for a voltage synthesizer
•7-bit PWM output, 1 channel
•8-bit A/D converter, 3 channels
•Remote control signal preprocessor
•Two 16-bit internal timer/counters, 2 channels
•Two 8-bit internal timer/counters, 2 channels
•Time base timer
•Watchdog timer
•16 interrupt sources: 5 external, 11 internal
•Stop and Idle power saving modes
CCD decoder
•Digital data slicer for NTSC
OSD
•Clock generation for OSD display
•Font ROM characters: 384 characters
•Characters display: 32 columns x 12 lines
•Composition: 16 x 18 dots
•Size of character: 3 (line by line)
•Color of character: 8 (character by character)
•Display position: H 256 / V 512 steps
•BOX function
•Fringing, smoothing, italic, underline function
•Conform to CCD regulation
•Jitter elimination
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Circuit Descriptions, Abbreviation List, and IC Data Sheets
EN 21TC5.1L CB9.
Figure 9-6 Block Diagram Main IC 1
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EN 22TC5.1L CB9.
Circuit Descriptions, Abbreviation List, and IC Data Sheets
9.2.2 Vertical Deflection Booster (IC 301)
The STV8172A is a vertical deflection booster, designed for TV
and monitor applications.
This device, supplied with up to 35 V, provides a maximum
output current of 2.5 A, to drive the vertical deflection yoke.
The internal fly back generator delivers fallback voltages of up
to 75 V.
Figure 9-8 Vertical Deflection Booster
Figure 9-7 Block Diagram Main IC 2
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Circuit Descriptions, Abbreviation List, and IC Data Sheets
EN 23TC5.1L CB9.
9.2.3 Demultiplexer (IC 901)
The HCF4052B is a monolithic integrated circuit, fabricated in
Metal Oxide Semiconductor technology, available in DIP and
SOP packages.
The HCF4052B analog multiplexer/demultiplexer is a digitally
controlled analog switch, having low ON impedance, and very
low OFF leakage current. This multiplexer circuit dissipates
extremely low quiescent power over the full supply voltage
range, independent of the logic states of the control signals.
When a logic “1” is present at the inhibit input, all channels are
off. This device is a differential 4-channel multiplexer, having 2
binary control inputs, A and B, and an inhibit input. The two
binary input signals select 1 of 4 pairs of channels to be turned
on and connect the analog inputs to the outputs.
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Figure 9-9 Demultiplexer
Table 9-3 Demultiplexer
PINSymbol
1 and 2Y CHANNELS IN/OUT
3COMMON "Y" OUT/IN
4 and 5Y CHANNELS IN/OUT
6INH
7VEE
8VSS
9B
10A
11 and 12X CHANNELS IN/OUT
13COMMON "X" OUT/IN
14 and 15X CHANNELS IN/OUT
16VDD
9.2.4 Sound Processor (IC1001)
Pin No. Pin NameTypeShort Description
19DVSUPDigital power supply +5
V
20DVSSDigital ground
21I2S_DA_IN2I2S2 data input
22RESETQINPower-on-reset
23NCNot connected
24NCNot connected
25VREF2Reference ground 2
High-voltage part
26DACM_ROUTLoudspeaker out, right
27DACM_LOUTLoudspeaker out, left
28NCNot connected
29VREF1Reference Ground 1
High voltage part
30SC1_OUT_R OUTAudio 1 output, right
31SC1_OUT_LOUTAudio 1 output, left
32NCNot connected
33AHVSUPAnalog power supply
8.0V
34CAPL_MVolume capacitor MAIN
35AHVSSAnalog ground
36AGNDCAnalog reference voltage
High-voltage part
37SC2_IN_LINAudio 2 input, left
38SC2_IN_RINAudio 2 input, right
39ASGAnalog shield Ground
40SC1_IN_LINAudio 1 input, left
41SC1_IN_RINAudio 1 input, right
42VREFTOPReference voltage IF A/D
converter
43MONO_ININMono input
44AVSSAnalog ground
9.2.5Dual Bridge Amplifier (IC 602)
The TDA7266SA is a dual bridge amplifier, specially designed
for LCD monitor, PC motherboard, TV, and portable radio
applications.