Datasheet TC5.1L CA Datasheet (Philips)

Page 1
Color Television Chassis
TC5.1L
H_17480_000.eps
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Contents Page
1. Technical Specifications, Connections and Chassis Overview 2
2. Safety Instructions, Warnings, and Notes 4
3. Directions for Use 6
4. Mechanical Instructions 6
5. Service Modes, Error Codes, and Fault Finding 7
6. Block Diagrams, Test Point Overviews, and
Waveforms
Chassis Block Diagram 9
7. Circuit Diagrams and CBA Layouts Diagram CBA Main Board 40-M134PH-MAG1XG 10 11-12 CRT Panel 13 14 Keyboard Panel 40-134SL6-KEA1XG 14 Keyboard Panel 40-134SL6-KEA1XG 14
8. Alignments 15
9. Circuit Descriptions, Abbreviation List, and IC Data Sheets 18
10. Spare Parts List 24
11. Revision List 26
©
Copyright 2007 Philips Consumer Electronics B.V. Eindhoven, The Netherlands. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.
Published by JY 0770 BU CD Customer Service Printed in the Netherlands Subject to modification EN 3122 785 17480
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EN 2 TC5.1L CA1.
Technical Specifications, Connections and Chassis Overview

1. Technical Specifications, Connections and Chassis Overview

1.1 Technical Specifications

Tuning - technology : PLL Tuning - presets/channels : 181 Freq Bands : Full-Cable TV Systems Off Air/ Cable : NTSC M (3.58 - 4.5) TV Systems Multi : NTSC Mains voltage : 90-140V Mains frequency : 50/60Hz Standby Power consumption : <1W Sound Systems : BTCS SAP Audio output (RMS) : 2x5W Scan Modes : 4:3 Sound Features : AVL, Mute Sound Control : 4 sound modes
: Balance : Bass Boost : Treble Boost, : Volume
Menu Languages : American English,
French, Spanish Clock/Timer Function : Sleep timer Terrestrial Antenna in : 75 Ohm (F type)
Figure 1-2 Rear audio and video connections
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1.2 Connection overview

1.2.1 Connections

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Cinch: Video CVBS - Out, Audio - Out
Ye - Video CVBS 1 V Wh - Audio L 0.5 V Rd - Audio R 0.5 V
/ 75 ohm kq
PP
/10 kohm kq
RMS
/ 10 kohm kq
RMS
Cinch: Video YUV- In
Gn - Video Y 1 V Bu - Video U 0.7 V Rd - Video V 0.7 V
/ 75 ohm jq
PP
/ 75 ohm jq
PP
/ 75 ohm jq
PP
Cinch: Audio - Out
Rd - Audio - R 0.5 V Wh - Audio - L 0.5 V
/ 10 kohm kq
RMS
/ 10 kohm kq
RMS
Figure 1-1 Aerial connection
Aerial - In
- - F-type Coax, 75 ohm D
H_17480_008.eps
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Figure 1-3 Side audio and video connections
S-Video (Hosiden): Video Y/C - In
1 - Ground Y Gnd H 2 - Ground C Gnd H 3 - Video Y 1 V 4 - Video C 0.3 V
/ 75 ohm j
PP
P / 75 ohm j
PP
Cinch: Video CVBS - In, Audio - In
Ye - Video CVBS 1 V Wh - Audio L 0.5 V Rd - Audio R 0.5 V
/ 75 ohm jq
PP
/ 10 kohm jq
RMS
/ 10 kohm jq
RMS
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Technical Specifications, Connections and Chassis Overview

1.3 Chassis Overview

See Chapter 10, Parts List.
EN 3TC5.1L CA 1.
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EN 4 TC5.1L CA2.
Safety Instructions, Warnings, and Notes

2. Safety Instructions, Warnings, and Notes

Index of this chapter:

2.1 Safety Instructions

2.2 Maintenance Instructions

2.3 Warnings

2.4 Notes

2.1 Safety Instructions
Safety regulations require the following during a repair:
• Connect the set to the Mains/AC Power via an isolation
transformer (> 800 VA).
• Replace safety components, indicated by the symbol h,
only by components identical to the original ones. Any other component substitution (other than original type) may increase risk of fire or electrical shock hazard.
• Wear safety goggles when you replace the CRT.
Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points:
• General repair instruction: as a strict precaution, we advise
you to re-solder the solder connections through which the horizontal deflection current flows. In particular this is valid for the:
1. Pins of the line output transformer (LOT).
2. Fly-back capacitor(s).
3. S-correction capacitor(s).
4. Line output transistor.
5. Pins of the connector with wires to the deflection coil.
6. Other components through which the deflection current flows.
Note: This re-soldering is advised to prevent bad connections due to metal fatigue in solder connections, and is therefore only necessary for television sets more than two years old.
• Route the wire trees and EHT cable correctly and secure them with the mounted cable clamps.
• Check the insulation of the Mains/AC Power lead for external damage.
• Check the strain relief of the Mains/AC Power cord for proper function, to prevent the cord from touching the CRT, hot components, or heat sinks.
• Check the electrical DC resistance between the Mains/AC Power plug and the secondary side (only for sets that have a Mains/AC Power isolated power supply):
1. Unplug the Mains/AC Power cord and connect a wire
between the two pins of the Mains/AC Power plug.
2. Set the Mains/AC Power switch to the "on" position
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the
Mains/AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be between 4.5 Mohm and 12 Mohm.
4. Switch "off" the set, and remove the wire between the
two pins of the Mains/AC Power plug.
• Check the cabinet for defects, to prevent touching of any inner parts by the customer.
2.2 Maintenance Instructions
We recommend a maintenance inspection carried out by qualified service personnel. The interval depends on the usage conditions:
• When a customer uses the set under normal circumstances, for example in a living room, the recommended interval is three to five years.
• When a customer uses the set in an environment with higher dust, grease, or moisture levels, for example in a kitchen, the recommended interval is one year.
• The maintenance inspection includes the following actions:
1. Perform the “general repair instruction” noted above.
2. Clean the power supply and deflection circuitry on the chassis.
3. Clean the picture tube panel and the neck of the picture tube.
2.3 Warnings
• In order to prevent damage to ICs and transistors, avoid all high voltage flashovers. In order to prevent damage to the picture tube, use the method shown in figure “Discharge picture tube”, to discharge the picture tube. Use a high voltage probe and a multi-meter (position V until the meter reading is 0 V (after approx. 30 s).
V

Figure 2-1 Discharge picture tube

• All ICs and many other semiconductors are susceptible to electrostatic discharges (ESD w). Careless handling during repair can reduce life drastically. Make sure that, during repair, you are connected with the same potential as the mass of the set by a wristband with resistance. Keep components and tools also at this same potential. Available ESD protection equipment: – Complete kit ESD3 (small tablemat, wristband,
connection box, extension cable and earth cable) 4822 310 10671.
– Wristband tester 4822 344 13999.
• Be careful during measurements in the high voltage section.
• Never replace modules or other components while the unit is switched "on".
• When you align the set, use plastic rather than metal tools. This will prevent any short circuits and prevents circuits from becoming unstable.
2.4 Notes

2.4.1 General

• Measure the voltages and waveforms with regard to the chassis (= tuner) ground (H), or hot ground (I), depending on the tested area of circuitry. The voltages and waveforms shown in the diagrams are indicative. Measure them in the Service Default Mode (see chapter 5) with a color bar signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
• Where necessary, measure the waveforms and voltages with (D) and without (E) aerial signal. Measure the voltages in the power supply section both in normal operation (G) and in stand-by (F). These values are indicated by means of the appropriate symbols.
• The semiconductors indicated in the circuit diagram and in the parts lists, are interchangeable per position with the
). Discharge
DC
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Safety Instructions, Warnings, and Notes
EN 5TC5.1L CA 2.
semiconductors in the unit, irrespective of the type indication on these semiconductors.
• Manufactured under license from Dolby Laboratories. “Dolby”, “Pro Logic” and the “double-D symbol”, are trademarks of Dolby Laboratories.

2.4.2 Schematic Notes

• All resistor values are in ohms, and the value multiplier is often used to indicate the decimal point location (e.g. 2K2 indicates 2.2 kohm).
• Resistor values with no multiplier may be indicated with either an "E" or an "R" (e.g. 220E or 220R indicates 220 ohm).
• All capacitor values are given in micro-farads (μ= x10 nano-farads (n= x10
• Capacitor values may also use the value multiplier as the decimal point indication (e.g. 2p2 indicates 2.2 pF).
• An "asterisk" (*) indicates component usage varies. Refer to the diversity tables for the correct values.
• The correct component values are listed in the Spare Parts List. Therefore, always check this list when there is any doubt.

2.4.3 Rework on BGA (Ball Grid Array) ICs

General
Although (LF)BGA assembly yields are very high, there may still be a requirement for component rework. By rework, we mean the process of removing the component from the PWB and replacing it with a new component. If an (LF)BGA is removed from a PWB, the solder balls of the component are deformed drastically so the removed (LF)BGA has to be discarded.
-9
), or pico-farads (p= x10
-12

2.4.4 Lead-free Solder

Philips CE is producing lead-free sets (PBF) from 1.1.2005 onwards.
Identification: The bottom line of a type plate gives a 14-digit serial number. Digits 5 and 6 refer to the production year, digits 7 and 8 refer to production week (in example below it is 1991 week 18).
MODEL :
-6
),
).
PROD.NO:
Regardless of the special lead-free logo (which is not always indicated), one must treat all sets from this date onwards according to the rules as described below.
32PF9968/10
AG 1A0617 000001
Figure 2-2 Serial number example
MADE IN BELGIUM
220-240V 50/60Hz
~
128W
VHF+S+H+UHF
BJ3.0E LA
S
E_06532_024.eps
130606
P
b
Figure 2-3 Lead-free logo
Device Removal
As is the case with any component that is being removed, it is essential when removing an (LF)BGA, that the board, tracks, solder lands, or surrounding components are not damaged. To remove an (LF)BGA, the board must be uniformly heated to a temperature close to the reflow soldering temperature. A uniform temperature reduces the risk of warping the PWB. To do this, we recommend that the board is heated until it is certain that all the joints are molten. Then carefully pull the component off the board with a vacuum nozzle. For the appropriate temperature profiles, see the IC data sheet.
Area Preparation
When the component has been removed, the vacant IC area must be cleaned before replacing the (LF)BGA. Removing an IC often leaves varying amounts of solder on the mounting lands. This excessive solder can be removed with either a solder sucker or solder wick. The remaining flux can be removed with a brush and cleaning agent. After the board is properly cleaned and inspected, apply flux on the solder lands and on the connection balls of the (LF)BGA. Note: Do not apply solder paste, as this has been shown to result in problems during re-soldering.
Device Replacement
The last step in the repair process is to solder the new component on the board. Ideally, the (LF)BGA should be aligned under a microscope or magnifying glass. If this is not possible, try to align the (LF)BGA with any board markers. So as not to damage neighboring components, it may be necessary to reduce some temperatures and times.
More Information
For more information on how to handle BGA devices, visit this URL: www.atyourservice.ce.philips.com (needs subscription, not available for all regions). After login, select “Magazine”, then go to “Repair downloads”. Here you will find Information on how to deal with BGA-ICs.
Due to lead-free technology some rules have to be respected by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order code 0622 149 00106. If lead-free solder paste is required, please contact the manufacturer of your soldering equipment. In general, use of solder paste within workshops should be avoided because paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-free soldering tin. The solder tool must be able: – To reach a solder-tip temperature of at least 400°C. – To stabilize the adjusted temperature at the solder-tip. – To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around 360°C - 380°C is reached and stabilized at the solder joint. Heating time of the solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400°C, otherwise wear-out of tips will increase drastically and flux-fluid will be destroyed. To avoid wear-out of tips, switch “off” unused equipment or reduce heat.
• Mix of lead-free soldering tin/parts with leaded soldering tin/parts is possible but PHILIPS recommends strongly to avoid mixed regimes. If this cannot be avoided, carefully clean the solder-joint from old tin and re-solder with new tin.
• Use only original spare-parts listed in the Service-Manuals. Not listed standard material (commodities) has to be purchased at external companies.
• Special information for lead-free BGA ICs: these ICs will be delivered in so-called "dry-packaging" to protect the IC against moisture. This packaging may only be opened shortly before it is used (soldered). Otherwise the body of the IC gets "wet" inside and during the heating time the structure of the IC will be destroyed due to high (steam-) pressure inside the body. If the packaging was opened before usage, the IC has to be heated up for some hours (around 90°C) for drying (think of ESD-protection!).
Do not re-use BGAs at all!
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EN 6 TC5.1L CA3.
Directions for Use
• For sets produced before 1.1.2005, containing leaded soldering tin and components, all needed spare parts will be available till the end of the service period. For the repair of such sets nothing changes.
In case of doubt whether the board is lead-free or not (or with mixed technologies), you can use the following method:
• Always use the highest temperature to solder, when using SAC305 (see also instructions below).
• De-solder thoroughly (clean solder joints to avoid mix of two alloys).
Caution: For BGA-ICs, you must use the correct temperature­profile, which is coupled to the 12NC. For an overview of these profiles, visit the website www.atyourservice.ce.philips.com (needs subscription, but is not available for all regions) You will find this and more technical information within the "Magazine", chapter "Repair downloads". For additional questions please contact your local repair help desk.

2.4.5 Alternative BOM identification

In September 2003, Philips CE introduced a change in the way the serial number (or production number, see Figure 2-1) is composed. From this date on, the third digit in the serial number (example: AG2B0335000001) indicates the number of the alternative BOM (Bill of Materials used for producing the specific model of TV set). It is possible that the same TV model
on the market is produced with e.g. two different types of displays, coming from two different O.E.M.s. By looking at the third digit of the serial number, the service technician can see if there is more than one type of B.O.M. used in the production of the TV set he is working with. He can then consult the At Your Service Web site, where he can type in the Commercial Type Version Number of the TV set (e.g. 28PW9515/12), after which a screen will appear that gives information about the number of alternative B.O.M.s used. If the third digit of the serial number contains the number 1 (example: AG1B033500001), then there is only one B.O.M. version of the TV set on the market. If the third digit is a 2 (example: AG2B0335000001), then there are two different B.O.M.s. Information about this is important for ordering the correct spare parts! For the third digit, the numbers 1...9 and the characters A...Z can be used, so in total: 9 plus 26 = 35 different B.O.M.s can be indicated by the third digit of the serial number.

2.4.6 Practical Service Precautions

• It makes sense to avoid exposure to electrical shock. While some sources are expected to have a possible dangerous impact, others of quite high potential are of limited current and are sometimes held in less regard.
• Always respect voltages. While some may not be dangerous in themselves, they can cause unexpected reactions that are best avoided. Before reaching into a powered TV set, it is best to test the high voltage insulation. It is easy to do, and is a good service precaution.

3. Directions for Use

You can download this information from the following websites: http://www.philips.com/support http://www.p4c.philips.com

4. Mechanical Instructions

See Chapter 10, Parts List.
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Service Modes, Error Codes, and Fault Finding

5. Service Modes, Error Codes, and Fault Finding

5.1 Trouble Shooting

5.1.1 Can not Power On

EN 7TC5.1L CA 5.
Can not Power On
Fuse OK?
(1) Check if B+ shorted to earth. (2) To check whether D822 and R821 are
N
(3) To check whether D823 and R823 are
Is it IC801 Pin 1 shorted to earth?
Y
Check/Replace IC801

5.1.2 No Raster, Sound OK

No Raster Sound OK
Check B+,
Y Y
turnoff.
turnoff. And whether C836 shorted.
+12V, Ok?
N
Is DB801 OK?
NN
Y
Check the components such as C801, C802, C806, C807 and C815
Is power supply for IC101 correct? If not, check Q820, Q821, Q007, Q008, D001
Check Horizontal Scan circuit: Check H-Vcc and H-out of IC 101 Check Q401, T401 and Q411
Check standby circuit: Check Pin64 of IC101, Check Q825, Q824, Q823, Q822.
Replace DB801
Figure 5-1 Can not Power On
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Is the power supply of Q401 and Q411 ok?
N
To check whether R404, C401, T401, Q401, R422 are ok?
Check Pin 13 (H-OUT) voltage ok?
Y
Is there any shorted in the scan part of the circuit?
Change IC101
Y
N
Y
N

5.1.3 Raster OK, Sound OK, No TV/AV picture

Raster OK, Sound OK, No TV/AV picture
Check whether Q917 is ok?
N
Replace Q917
Y Y
Replace C238
N
Check each output voltage of FBT
Change the shorted part.
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Figure 5-2 No Raster, Sound OK
Change IC901 Check C238, ok?
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Figure 5-3 Raster OK, Sound OK, No TV/AV picture
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EN 8 TC5.1L CA5.

5.1.4 Raster OK, Sound OK, No AV picture

Raster OK, Sound OK, No AV picture
Service Modes, Error Codes, and Fault Finding
Is the signal waveform at Pin 12 and Pin 14 of IC901 right?
Y
Check Q917, Q918, Q919, ok?
N
Replace the fail component.

5.1.5 Raster OK, Sound OK, No TV picture

Raster OK, Sound OK, No TV picture
Is the signal waveform at Pin 15 of IC901 right?
N
To check whether R903, C903, R902
N
and R905, C908, R908 are ok?
Replace IC901
Y
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Figure 5-4 Raster OK, Sound OK, No AV picture
Replace IC901
Y
Check R234, Q204, R235, C229

5.1.6 No picture, dense noise dots

No picture, dense noise dots
Is the antenna feed line or the adapter broken?
Y
Handing the antenna fault
N
Is the signal at Pin SCL, SDA of tuner ok?
Check signal at P5, P57, P58,
P59, and P60 of IC101 and replace the abnormal relative circuit
Figure 5-5 Raster OK, Sound OK, No TV picture
Is the signal at Pin41, Pin42 of IC101 ok?
N
Is the signal at IF pin of the tuner ok?
N
N N
Y
G_16340_007.eps
Check/Replace
Y
IC101
Check the relative circuit of Q101,
Y
Z141 etc
Is the supply voltage of tuner ok?
Y
Check/Replace IC201, IC202, D101.
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Check/Replace Tuner
Y
Check EEPROM
G_16340_009.eps
Figure 5-6 No picture, dense noise dots
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Block Diagrams, Test Point Overviews, and Waveforms

6. Block Diagrams, Test Point Overviews, and Waveforms

Chassis Block Diagram

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Circuit Diagrams and CBA Layouts

7. Circuit Diagrams and CBA Layouts

Main Board 40-M134PH-MAG1XG

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Circuit Diagrams and CBA Layouts

Layout Main Board 40-M134PH-MAG1XG (Top Side)

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Circuit Diagrams and CBA Layouts

Layout Main Board 40-M134PH-MAG1XG (Bottom Side)

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CRT Panel

Circuit Diagrams and CBA Layouts
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Circuit Diagrams and CBA Layouts
EN 14TC5.1U CA 7.

Layout CRT Panel

Keyboard Panel 40-134SL6-KEA1XG

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Layout CRT Panel

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Layout Front IR Panel 40-134SL6-IRA1XG

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8. Alignments

Alignments
EN 15TC5.1L CA 8.

8.1 How to Put the Set into Factory Mode

• Press the “D-MODE” button on the remote control.
• Press the “OK” button on the remote control.
• Press the “CH+” or the “CH-” button to select the parameter you want to adjust.
• Press the “VOL+” or the “VOL-” button to adjust the selected parameter.
• To put the new values into the memory, leave the factory mode with the “D_MODE” button on the remote control.
22

8.2 Adjustment of the B+ (BAT) voltage

1. Apply the Philips standard test pattern to the RF input.
2. Connect a DC voltmeter (range >200 V) to pins 1 (GND) and 3 (+) of S804 [1].
3. Adjust potentiometer VR802 [2] in STANDARD mode in such a way the voltage reading is 130 +/- 0.5 V.
21

8.3 RF AGC Alignment:

1. Connect a test circuit as depicted in figure “Test circuit”.
2. Apply an 8-scale gray signal (80 dBμV).
3. Adjust the AGC data until the output of the test circuit becomes 0.4 V (p-p) ±0.05 V.
4. Change the 8-scale gray signal to 60 dBμV.
5. The shown value of CRO should be the same as while receiving the 80 dBμV signal. If not, repeat step 3 and 4 until the results for 60 dBμV and 80 dBμV input signal are the same.

Figure 8-1 Test pin & potentiometer position

Q101
D2
C1
1N60
33pF
D1
C2
1N60
100pFR1100k

Figure 8-2 Test circuit

TO CRO
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EN 16 TC5.1L CA8.
Alignments

8.4 Screen & Focus Voltage Adjustment

1. Apply the test pattern signal in normal status.
2. Enter the Factory mode
3. Press the "TV/AV" button to stop the vertical scan (Note: the RC/GC/BC is preset to 80, GD/BD to 40)
4. Adjust the SCREEN potentiometer on the line output transformer in such a way the horizontal line is just visible on the screen.
5. Turn on the vertical output, and adjust the "FOCUS" potentiometer on the line output transformer in such a way the focus is maximized.

8.5 White Balance Adjustment (NORMAL)

1. Choose a white pattern 27 IRE (192.8 mV)
2. Measure the picture with a color analyzer.
3. Adjust RC, GC and BC.
4. Choose a white pattern 67 IRE (478.57 mV).
5. Measure the picture with a color analyzer.
6. Adjust GD and BD.
7. Repeat all previous steps until you get the right color on both dark and bright picture.
8. Adjust RC-C, GC-C, BC-C, GD-C and BD-C for Cool color temperature.
9. Adjust RC-W, GC-W, BC-W, GD-W and BD-W for Warm color temperature.
See figure “Color temperature settings” for reference.
value). It should give the maximum peak white value in MASA, sufficing the local dooming synchronously.

Table 8-1 Color temperature settings

Picture Mode Color Temperature (K) Δuv Y
Cool 12000 ±15% 0.000 ±0.005 90 ±15%
Normal 9300 ±10% 0.000 ±0.004 90 ±15%
Warm 6500 ±15% 0.000 ±0.005 90 ±15%

8.6 Adjustment of Sub-brightness

1. Apply the Grey-scale/Color bar (NTSC signal) to the AV input, in normal status.
2. Enter Factory alignment menu 5.
3. Select BRTC.
4. Adjust the sub-brightness, until the 2nd dark bar of 8 level Grey scales can just be seen.

8.7 Picture Geometry Adjustment

1. Apply the Philips standard testing pattern in normal status.
2. Then enter menu 3.
3. Adjust the following data to get the minimum distortion: a. HPOS6 (Horizontal Centre). b. PARA6 (Level). c. TRAP6 (Trapezium). d. HSIZE6 (Horizontal Size). e. CNRT6 (Top). f. CNRB6 (Bottom).
4. Apply the Philips standard testing pattern in normal status.
5. Enter menu 3.
6. Adjust the following data to get the minimum distortion: a. HIGH6 (Height). b. VP60 (Vertical Center). c. VLIN6 (Linearity). d. VSC6 (Vertical-S Correction).

8.8 The Peak White Adjustment

In Sports status, apply the peak white signal with a 14x14 cm window to the AV input (Brightness = 52, Contrast = 98). Enter factory alignment menu 5, select SCNT to adjust the sub­contrast until the spec of the window is 255 ±10 Nit (reference
Page 17
Alignments
EN 17TC5.1L CA 8.

8.9 Initialization

Put the set into “Factory Mode” (see “How to Put the Set into Factory Mode”, the first item of this chapter). Press the "SOUND" button, the screen displays "WAIT". When the

8.10 EEPROM Data:

Note: although all items are adjustable, we only recommend to
adjust the items with an asterisk (*). The other items are
adjustable as well, but we strongly discourage adjusting them. screen displays FGSFGSFGSFG "OK", the initialization is finished.

Table 8-2 EEPROM Data

EEPROM data
FAC 01 FAC 02
RC* GC* BC* GD* BD* HIGH5 VP50 VLIN5 VSC5 VBLK5 VCEN5
80 80 80 40 40 13 03 0A 0C 00 18
FAC 02
HIGH6* VP60* VLIN6* VSC6* VBLK6 VCEN6
1B 03 0C 0D 00 2A
FAC 03
HPOS5 PARA5 TRAP5 HSIZE5 CNRT5 CNRB5 VEHT5 HEHT5
0C 10 29 13 0A 06 03 03
FAC 03
HPOS6* PARA6* TRAP6* HSIZE6* CNRT6* CNRB6* VEHT6 HEHT6
0F 1D 23 21 05 07 03 03
FAC 04
CNTX CNTN BRTX BRTN COLX COLN TNTX TNTN
7F 08 27 42 35 00 28 28
FAC 05
BRTC* COLC COLP SCOL SCNT CNTC TNTCT TNTCV
40 2C 00 07 05 67 40 40
FAC 06
ST3 SV3 SV4 SVD ASSH SHPN SHPN
20 20 19 19 07 10 2A
FAC 07
MOD1 MOD2 MOD3 OPT OPTM1 OPTM2 HDCNT HSTOP
20 B0 70 37 C0 00 00 FF
FAC 08
RFAGC* BRTS OSD OSDF CCD OSD CCD OSDF TXCN RGCN
25 00 21 53 4A 65 1F 16
FAC 09
V01 V25 V50 V100 VOLMAX CURTCEN GATE COL-OUT
46 5A 6D 76 32 A5 2A 73
FAC 10
MODE4 MODE5 MODE6 MODE7 MODE8 MODE9
32 0B 1F D7 2D 02
FAC 11
MPB-STR MPB-HMC MPB-HP MPB-LP MPB-LIM SUB-FRE SUB-HP VOL-MAI
43 0D 07 11 00 28 02 01
FAC 12
SVM SVM1 OSD2 OSDF2 PYNX PYNN PYXS PYNS
05 05 20 64 28 18 22 10
FAC 13
CLTM CLVO CLVS ABL DCBS FLG0 FLG1
4B 4B 4B 27 14 82 0D
FAC 14 FAC 15
HAFC AGCC NOIS ONTM NSHP PVLVL PLMT RC-C GC-C BC-C GD-C
09 1C 01 08 1A 80 80 00 FC FB 06
FAC 16 FAC 17
RC-W GC-W BC-W GD-W BD-W YUVGC YUVBC D-COL D-BRI D-CON D-SHP
00 02 07 F6 E3 03 03 20 34 62 64
FAC 18 FAC 19
S-COL S-BRI S-CON S-SHP M-COL M-BRI M-CON M-SHP
15 32 44 46 19 37 4B 50
FAC 20
SEG-PO INT1 SEG-POINT2 DATA-VL DATA-VH DATA-UF SPE-POS1 SPE-DATA1 SENSI-ON SENSI -OFF
173 407 01 02 08 06 05 00 00
FAC 21 FAC 22
T-Hz120 ­BAS
1C 5C 0C 0C 0C 39 54 0C 0C 0C
FAC 23 FAC 24
B-Hz120-BAS B-Hz500-TRE B-Hz1K5 B-Hz5K B-Hz10K COMB1 COMB2 COMB3 AV GAIN OPTM3
12 1C 0C 0C 0C 00 05 00 19 08
T-Hz500 ­TRE
T-Hz1K5 T-Hz5K T-Hz10K C-Hz120-
BAS
C-Hz500 ­TRE
C-Hz1K5 C-Hz1K C-Hz10K
BD-C
0E
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Circuit Descriptions, Abbreviation List, and IC Data Sheets

9. Circuit Descriptions, Abbreviation List, and IC Data Sheets

9.1 Brief Introduction of the Chassis

9.1.1 Chassis block diagram

9.1.2 Power Supply Section

This section mainly consists of
• IC STR-W6735 (IC801).
• Transformer (T803).
• Bridge rectifier (DB801).
• Accessory circuits. The supply voltage for this chassis should be AC 110V. The allowed voltage range is 90V to 140V, the frequency range is 50/60Hz. The AC power with high/low frequency interference goes through an RC filter, consisting of C801, T801, C802, R801, and T802. The filter removes the high/low frequency interference. Then DB801 transforms the AC power to DC power. T803 and IC 801 work in standby state. T803 will provide a power voltage to IC101. IC101 scans for the "KEY IN" signal (Pin 3 of IC101) from the ON/OFF switch on the keyboard. If "KEY IN" = "power on" signal, pin 64 (IC101) will generate a signal to drive the photo coupler (IC8021). It acts as a feed back circuit (feed back to Pin 6 of IC801) for controlling IC801 to adjust MOSFET. Transformer T803 provides the following voltages:
• +13V voltage from Pin16.
Figure 9-1 Chassis block diagram
• +130V (B+) voltage from Pin1.
• +12V from Pin 15.
• Pin 15 is also connected to two Positive Voltage
The picture below shows IC201 and IC202:
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Regulators (IC201, IC202) in-series. The outputs of these regulators are +9V and +5V respectively.
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Figure 9-2 IC 201/202
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Circuit Descriptions, Abbreviation List, and IC Data Sheets
6

9.1.3 Tuning Section

This section mainly consists of the tuner (TU101), the IF pre­amplifier circuit and the SAWFILTER.
Table 9-1 Tuning section 1
Pin Symbol Description
1 AGC Auto gain control
2 AS I2C bus address select
3 SCL I2C bus serial clock
4 SDA I2C bus serial data
5
6 BP Supply voltage tuner section +5V
7 BT Supply voltage tuning section +31V
8 IF Intermediate frequency out
Table 9-2 Short specification of the tuner
Receiving Channel
Receiving System
Intermediate Frequency
Antenna Input Impedance
Output Imped­ance
Band change­over system
VHF LOW BAND: CH2~B(55.25~127.25MHz) VHF HIGH BAND: CH C~CH W+11(133.25~361.25MHz) CH W+12~69(367.25~801.25MHz)
NTSC
Picture carrier: 47.74MHz Colour carrier: 42.17MHz Sound carrier: 41.25MHz
Unbalanced 75Ohms
Unbalanced 75Ohms
Digital change by PLL IC
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Figure 9-3 Pre-amplifier circuit

9.1.4 Sound Process Section

The SIF signal is sent out together with the TV signal from
Pin30 of IC101. It passes through Q203, R225. X202 and a
High-pass filter (consisting of C254, L206, C253) filters out the
video signal and low frequency interference.
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EN 19TC5.1L CA 9.
From Pin58 of IC101 the I2C bus clock signal goes to the tuner. The tuner works during the clock time. IC101 will send out a data signal from Pin57 to control the tuner's working state by controlling the +33V voltage. +33V is provided from Pin10 of T803. That voltage is put into the tuner at Pin7. A circuit inside the tuner transforms +33V into a voltage between 0 and +33V (as a function of the data, sent by IC101). The AGC signal is a close loop control voltage that keeps the amplitude of the signal constant. Output of tuner is the Intermediate Frequency signal (IF signal). The IF signal will pass pre-amplifier circuit (refer to the picture below). The amplified IF signal passes the SAW filter and is then sent to IC101 Pin41/42. IC101 creates a CVBS signal and sends it out from Pin30. CVBS will be selected by IC901, and then pass from Pin13 of IC901 to Pin20/24 if IC101. IC101 will demodulate the CVBS signal into an R, G, B signal. Next IC101 will send this R, G, B signal from Pin50/51/52 to the CRT board.
Figure 9-4 Sound process section 1
SIF will be finally sent into Pin2 of IC1001. An analog automatic
gain control circuit (AGC) allows a wide range of input levels.
The analog-to-digital conversion of the IF sound signal is done
by an A/D-converter. The high pass filter, formed by a coupling
capacitor at SIF_IN1+ suppresses video components.
IC1001 is controlled via the I2C bus slave interface.
The AV sound signal will be directly sent to Pin37/38 or Pin40/
41 of IC1001. Q901/2 and Q903/4 form Emitter-Follower
circuits to provide a better load ability.
The (analog) sound signal will go from Pin26/27 of IC1001 to
Pin4/12 of IC602. IC602 is a dual bridge amplifier. The output
voltage of IC602 drives the speakers. The volume is adjusted
via the I2C bus.
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Figure 9-5 Sound process section 2
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Circuit Descriptions, Abbreviation List, and IC Data Sheets

9.1.5 Vertical Output Section

This section mainly consists of IC301 (TDA8172), the Vertical Coil and the related circuit. The supply voltage of IC301 are +14V and -14V. These two voltages are provided by the LOT section. For the vertical scan, IC101 creates a Saw-tooth waveform at Pin16. This is the input signal of IC301. The main task of IC101 is to create the vertical scan waveform. The output signal of IC301 drives the Vertical Coil. If IC301 works in normal state, Pin6 will send a square-signal to maintain a high voltage at D214. If it does not, D214 will get a low voltage, Pin2 of IC101 senses this change and IC101 sends out a standby signal.

9.1.6 Horizontal Output and LOT Section

The horizontal drive pulse is a square wave. IC101 creates this waveform at Pin13. Via Q401 the signal goes to the input of Q411. Q411 is a horizontal output triode with a damper inside. The signal from Pin C of Q411 drives the Horizontal Coil. When Q411 goes into cut-off state, a sub-coil inside the LOT will generate an EHT by inductance.

9.2 IC description

9.2.1 Main IC (IC101)

Description:
The main IC is a TMPA8857CSNG, provided by TOSHIBA. It is an integrated circuit, suited for PAL, NTSC and SECAM TV. An MCU and a TV signal processor are integrated in a 64 pin DIP package. The MCU contains an 8-bit CPU, ROM, RAM, I/O-ports, timer/ counters, A/D-converters, an on-screen display controller, remote control interfaces, IIC bus interfaces, and the closed caption decoder. The TV signal processor contains PIF, SIF, Video, multi­standard chroma, deflection, and RGB processors.
TV Processor
IF
• Integrated PIF VCO, aligned automatically
• Negative demodulation PIF
• Multi-frequency SIF demodulator, without external tank­coil
Video
• Integrated chroma traps
• Black stretch
• Y-gamma
Chroma
• Integrated chroma BPF’s
• PAL/NTSC/SECAM demodulation
RGB/Base-band
• Integrated 1 H base-band delay line
• Base-band TINT control
• Internal OSD interface
• Half-tone and transparent for OSD
• External YCbCr interface for DVD
• RGB cut-off/drive controls by bus
• ABCL (ABL and ACL combined)
Synchronization
• Integrated fH x 640 VCO
• DC coupled vertical ramp output (single)
• EW correction with EHT output
•Sync out
Features:
MCU:
• High speed 8-bit CPU
• 12 I/O ports
• I2C bus interface (multi-master)
• 14-bit PWM output, 1 channel, for a voltage synthesizer
• 7-bit PWM output, 1 channel
• 8-bit A/D converter, 3 channels
• Remote control signal preprocessor
• Two 16-bit internal timer/counters, 2 channels
• Two 8-bit internal timer/counters, 2 channels
• Time base timer
• Watchdog timer
• 16 interrupt sources: 5 external, 11 internal
• Stop and Idle power saving modes
CCD decoder
• Digital data slicer for NTSC
OSD
• Clock generation for OSD display
• Font ROM characters: 384 characters
• Characters display: 32 columns x 12 lines
• Composition: 16 x 18 dots
• Size of character: 3 (line by line)
• Color of character: 8 (character by character)
• Display position: H 256 / V 512 steps
• BOX function
• Fringing, smoothing, italic, underline function
• Conform to CCD regulation
• Jitter elimination
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Circuit Descriptions, Abbreviation List, and IC Data Sheets
EN 21TC5.1L CA 9.
Figure 9-6 Block Diagram Main IC 1
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Circuit Descriptions, Abbreviation List, and IC Data Sheets

9.2.2 Vertical Deflection Booster (IC 301)

The STV8172A is a vertical deflection booster, designed for TV and monitor applications. This device, supplied with up to 35 V, provides a maximum output current of 2.5 A, to drive the vertical deflection yoke. The internal fly back generator delivers fallback voltages of up to 75 V.
Figure 9-8 Vertical Deflection Booster
Figure 9-7 Block Diagram Main IC 2
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Circuit Descriptions, Abbreviation List, and IC Data Sheets
EN 23TC5.1L CA 9.

9.2.3 Demultiplexer (IC 901)

The HCF4052B is a monolithic integrated circuit, fabricated in Metal Oxide Semiconductor technology, available in DIP and SOP packages. The HCF4052B analog multiplexer/demultiplexer is a digitally controlled analog switch, having low ON impedance, and very low OFF leakage current. This multiplexer circuit dissipates extremely low quiescent power over the full supply voltage range, independent of the logic states of the control signals. When a logic “1” is present at the inhibit input, all channels are off. This device is a differential 4-channel multiplexer, having 2 binary control inputs, A and B, and an inhibit input. The two binary input signals select 1 of 4 pairs of channels to be turned on and connect the analog inputs to the outputs.
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Figure 9-9 Demultiplexer
Table 9-3 Demultiplexer
PIN Symbol
1 and 2 Y CHANNELS IN/OUT
3 COMMON "Y" OUT/IN
4 and 5 Y CHANNELS IN/OUT
6INH
7 VEE
8 VSS
9B
10 A
11 and 12 X CHANNELS IN/OUT
13 COMMON "X" OUT/IN
14 and 15 X CHANNELS IN/OUT
16 VDD

9.2.4 Sound Processor (IC1001)

Pin No. Pin Name Type Short Description
19 DVSUP Digital power supply +5
V
20 DVSS Digital ground
21 I2S_DA_IN2 I2S2 data input
22 RESETQ IN Power-on-reset
23 NC Not connected
24 NC Not connected
25 VREF2 Reference ground 2
High-voltage part
26 DACM_R OUT Loudspeaker out, right
27 DACM_L OUT Loudspeaker out, left
28 NC Not connected
29 VREF1 Reference Ground 1
High voltage part
30 SC1_OUT_R OUT Audio 1 output, right
31 SC1_OUT_L OUT Audio 1 output, left
32 NC Not connected
33 AHVSUP Analog power supply
8.0V
34 CAPL_M Volume capacitor MAIN
35 AHVSS Analog ground
36 AGNDC Analog reference voltage
High-voltage part
37 SC2_IN_L IN Audio 2 input, left
38 SC2_IN_R IN Audio 2 input, right
39 ASG Analog shield Ground
40 SC1_IN_L IN Audio 1 input, left
41 SC1_IN_R IN Audio 1 input, right
42 VREFTOP Reference voltage IF A/D
converter
43 MONO_IN IN Mono input
44 AVSS Analog ground

9.2.5 Dual Bridge Amplifier (IC 602)

The TDA7266SA is a dual bridge amplifier, specially designed for LCD monitor, PC motherboard, TV, and portable radio applications.
Table 9-4 Sound Processor
Pin No. Pin Name Type Short Description
1 AVSUP Analog power supply
+5V
2 ANA_IN+ IN IF Input 1
3 ANA_IN- IN IF common
4 TESTEN IN Test pin
5 XTAL_IN IN Crystal oscillator
6 XTAL_OUT OUT Crystal oscillator
7 TP Test pin
8 D_CTR_I/O_1 IN/OUT D_CTR_I/O_1
9 D_CTR_I/O_0 IN/OUT D_CTR_I/O_0
10 ADR_SEL IN I2C BUS address select
11 STANDBYQ IN Stand-by (Low-active)
12 I2C_CL IN/OUT I2C clock
13 I2C_DA IN/OUT I2C data
14 I2S_CL I2S clock
15 I2S_WS I2S word strobe
16 I2S_DA_OUT I2S data output
17 I2S_DA_IN1 I2S1 data input
18 ADR_CL ADR clock
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Figure 9-10 Dual Bridge Amplifier
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10. Spare Parts List

Spare Parts List
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Figure 10-1 Spare Parts

Table 10-1 Spare Parts List

ITEM NAME QTY. REMARK
1 Side AV PWB 1
2 S/T Screw W 3 X 10 AB 2 MGT Side AV PWB.
3 Speaker 2
4 Speaker Rubber Cushion 8
5 S/T Screw W 3 X 14 HS 4 MGT Speaker
6 Side AV Inlay 1
7 Plate Model NO. 1
8 S/T Screw F 3 X 10 BT 2 MGT Rear AV Jack
9 Rear AV Inlay 1
10 S/T Screw B 4 X 20 AB 8 MGT Rear and Front Cabinet
11 Rear Cabinet 1
12 Cushion (25mm X 7mm) 2
13 S/T Screw W 3 X 10 AB 3 MGT Main Board
14 Main Board 1
15 Main Board Bracket 1
16 CRT Screw HA 6 X 30 4 MGT CRT & Front Cabinet
17 Metal Cushion 4
18 CRT 1
19 Fibre Sheet 4
20 S/T Screw W 3 X 10 AB 6 MGT KEY Board & Front Cabinet
21 Key Board 1
22 S/T Screw W 3 X 10 AB 4 MGT Push Button
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Spare Parts List
ITEM NAME QTY. REMARK
23 Push Button 1
24 S/T Screw W 3 X 10 AB 1 MGT Lens
25 Lens 1
26 Decorative Piece for Power Knob 1
27 Power Knob 1
28 Power Spring 1
29 Logo 1
30 Front Cabinet 1
31 S/T Screw W 3 X 10 AB 4 MGT CRT Support
32 S/T Screw W 3 X 10 AB 4 MGT Guide Rail
33 Cushion (25mm X 7mm) 2
34 Power Line Block 1
35 Guide Rail (Left) 1
36 CRT Support 2
37 Guide Rail (Right) 1
EN 25TC5.1L CA 10.
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EN 26 TC5.1L CA11.

11. Revision List

Manual xxxx xxx xxxx.0
• First release.
Revision List
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