• High Capacitive Load Drive Capability – 1000pF
in 25nsec
• Short Delay Times – <78nsec Typ.
• Low Supply Current:
- With Logic "1" Input – 2.5mA
- With Logic "0" Input – 300µA
• Low Output Impedance – 7Ω
• Latch-Up Protected: Will Withstand >300mA
Reverse Current
• ESD Protected – 4kV
Applications
•
•
•
Device Selection Table
Part NumberPackageTemp. Range
TC4431COA8-Pin SOIC0°C to +70°C
TC4431CPA8-Pin PDIP0°C to +70°C
TC4431EJA8-Pin CERDIP-40°C to +85°C
TC4431EOA8-Pin SOIC-40°C to +85°C
TC4431EPA8-Pin PDIP-40°C to +85°C
TC4432COA8-Pin SOIC0°C to +70°C
TC4432CPA8-Pin PDIP0°C to +70°C
TC4432EJA8-Pin CERDIP-40°C to +85°C
TC4432EOA8-Pin SOIC-40°C to +85°C
TC4432EPA8-Pin PDIP-40°C to +85°C
Package Type
8-Pin PDIP/SOIC/CERDIP
V
1
DD
2
IN
TC4431
GND
V
DD
GND
IN
3
4
2
1
2
TC4432
3
4
2
Noninverting
Inverting
LOCK DIS
LOCK DIS
NOTE: SOIC pinout is identical to DIP.
8
7
6
5
7
6
78OUT
6
5
7
6
V
DD
OUT
OUT
GND
V
DD
OUT
GND
General Description
The TC4431/TC4432 are 30V CMOS buffer/drivers
suitable for use in high-side driver applications. They
will not latch up u nder any conditio ns within t heir po wer
and voltage ratings. They can accept, without damage
or logic upset, up to 30 0mA of reverse curr ent (of either
polarity) being forced back into their outputs. All
terminals are fully protected against up to 4kV of
electrostatic discharge.
Under-voltage lockout circuitry forces the output to a
"low" state when the input supply voltage drops below
7V . For oper ation in lo wer volt a ges, disab le the loc kout
and start-up circuit by grounding pin 3 (LOCK DIS); for
all other situations, pin 3 (LOCK DIS) should be left
floating. The under-voltage lockout and start-up circuit
gives brown out protection when driving MOSFETS.
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Input Voltage (Note 1)....................VDD + 0.3V to GND
Note:The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are pro vided for information al purposes only. The performance characteris tics listed herei n are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Supply Current vs. Capacitive Load
60
V = 12V
DD
50
40
(mA)
30
SUPPLY
I
20
10
0
100100010,000
C
LOAD
2MHz
900kHz
600kHz
200 kHz
20kHz
(pF)
Input Current vs. Input Voltage
50
45
40
35
30
25
20
15
INPUT CURRENT (mA)
10
5
0
3612 15 18 21 24 27 309
WITHOUT 1K RES.
WITH 1K RES.
INPUT VOLTAGE (VIN)
150
t
FALL
125
100
75
Time (nsec)
50
t
RISE
25
0
3612 15 18 21 24 27 309
300
T
250
D1
200
150
T
D2
TIME (nsec)
100
50
0
3612 15 18 21 24 27 309
Rise/Fall Time vs. V
V
(V)
DD
C
T
A
LOAD
= +25
DD
TD1 and TD2 Delay vs. V
C
LOAD
= +25
T
A
V
(V)
DD
= 1000pF
°C
DD
= 1000pF
°C
2002 Microchip Technology Inc.DS21424B-page 7
Page 8
TC4431/TC4432
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5.0PACKAGING INFORMATION
Package mar k ing data not available at this time.
5.1Package Dimensions
8-Pin Plastic DIP
.260 (6.60
.240 (6.10
.045 (1.14
.030 (0.76
.200 (5.08
.140 (3.56
.150 (3.81
.115 (2.92
8-Pin CDIP (Narrow
.400 (10.16
.348 (8.84
.110 (2.79
.090 (2.29
.022 (0.56
.015 (0.38
.110 (2.79
.090 (2.29
.070 (1.78
.040 (1.02
.040 (1.02
.020 (0.51
.300 (7.62
.230 (5.84
.310 (7.87
.290 (7.37
.015 (0.38
.008 (0.20
.400 (10.16
310 (7.87
Dimensions: inches (mm)
.055 (1.40) MAX
.200 (5.08
.160 (4.06
.200 (5.08
.125 (3.18
.400 (10.16
.370 (9.40
.065 (1.65
.045 (1.14
.020 (0.51
.016 (0.41
.020 (0.51) MIN
.040 (1.02
.020 (0.51
.150 (3.81
.015 (0.38
.008 (0.20
.320 (8.13
.290 (7.37
.400 (10.16
.320 (8.13
Dimensions: inches (mm)
DS21424B-page 8 2002 Microchip Technology Inc.
Page 9
Package Dimensions (Continued)
.
8
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8-Pin SOIC
TC4431/TC4432
.050 (1.27) TYP
.197 (5.00
.189 (4.80
.020 (0.51
.013 (0.33
.157 (3.99
.150 (3.81
.010 (0.25
.004 (0.10
.244 (6.20
.228 (5.79
.069 (1.75
.053 (1.35
.010 (0.25
.007 (0.18
.050 (1.27
.016 (0.40
Dimensions: inches (mm)
2002 Microchip Technology Inc.DS21424B-page 9
Page 10
TC4431/TC4432
NOTES:
DS21424B-page 10 2002 Microchip Technology Inc.
Page 11
TC4431/TC4432
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.Your local Microchip sales office
2.The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.DS21424B-page11
Page 12
TC4431/TC4432
NOTES:
DS21424B-page12 2002 Microchip Technology Inc.
Page 13
TC4431/TC4432
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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The Microchip name and logo, the Microchip logo, FilterLab,
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K
PICSTART, PRO MATE, SEEVAL and The Embedde d Control
Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and T otal Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro
devices, Serial EEPROMs, micrope ri ph era ls,
non-volatile memory and ana l og pro duc ts. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
®
8-bit MCUs, KEELOQ
®
code hoppin g
2002 Microchip Technology Inc.DS21424B-page 13
Page 14
M
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