Datasheet STPS30L60CT, STPS30L60CR Datasheet (SGS Thomson Microelectronics)

®

STPS30L60CW/CT/CG/CR

POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

I

F(AV)

V

RRM

2x15A

60 V

Tj (max) 150°C

(max) 0.56 V

V

F

FEATURES AND BENEFITS

NEGLIGIBLE SWITCHING LOSSES

■

LOW FORWARD VOLTAGE DROP

■

LOW THERMAL RESISTANCE

■

AVALANCHE CAPABILITY SPECIFIED

■

DESCRIPTION

Dual center tap Schottky rectifiers suited for
Switched Mode Power Supplies and high
frequency DC to DC converters. Packaged in
TO-220, D

2

PAK, I2PAK and TO-247 this device is

intended for use in high frequency inverters.

A1

TO-247

STPS30L60CW

A2

K

A1

D2PAK

STPS30L60CG

A1

A2

A2

K

K

A2

K

A1

TO-220AB

STPS30L60CT

A2

K

A1

I2PAK

STPS30L60CR

ABSOLUTE RATINGS (limiting values, per diode)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

I

RRM

P

ARM

T

Tj

dV/dt

dPtot

*:

Repetitive peak reverse voltage
RMS forward current
Average forward current Tc = 130°C

Surge non repetitive forward current tp = 10 ms Sinusoidal
Repetitive peak reverse current tp=2 µs square F=1kHz
Repetitive peak avalanche power tp = 1µs Tj = 25°C

stg

Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage

<

dTj Rth j a

July 2003 - Ed: 3B

Per diode

δ = 0.5

Per device

thermal runaway condition for a diodeon its own heatsink

−1()

60 V
30 A
15

30

230 A

2A

7800 W

- 65 to + 175 °C
150 °C

10000 V/µs

A

1/6

STPS30L60CW/CT/CG/CR

THERMAL RESISTANCES

Symbol Parameter Value Unit

R

th(j-c)

R

th(c)

Junction to case

When the diodes 1 and 2 areused simultaneously:

∆ Tj(diode 1) = P(diode1) xR

(Per diode) + P(diode 2) x R

th(j-c)

STATIC ELECTRICAL CHARACTERISTICS (per diode)

Symbol Parameter Tests Conditions Min. Typ. Max. Unit

Per diode

Total

1.5

0.8

°C/W

Coupling 0.1 °C/W

th(c)

*

I

R

V

F

Reverse leakage cur­rent

*

Forward voltage drop Tj = 25°CI

Tj = 25°C VR=V
Tj = 125°C

Tj = 125°C I
Tj=25°CI
Tj = 125°C I

=15A

F

=15A

F

=30A

F

=30A

F

RRM

Pulse test : * tp = 380 µs, δ <2%

To evaluate the maximum conduction losses use the following equation :
P=0.42xI

Fig. 1: Average forward power dissipation versus
average forward current (per diode).

PF(av)(W)

12
10

8
6
4
2
0

0 2 4 6 8 101214161820

F(AV)

δ = 0.05

+ 0.009 I

δ = 0.1

IF(av) (A)

F2(RMS)

δ = 0.2

δ = 0.5

δ

=tp/T

δ = 1

Fig. 2: Average forward current versus ambient
temperature(δ = 0.5, per diode).

IF(av)(A)

18
16
14
12
10

8

T

tp

6
4
2
0

0 25 50 75 100 125 150

δ

=tp/T

T

tp

480 µA

77 130 mA

0.6 V

0.5 0.56

0.75

0.65 0.7

Rth(j-a)=Rth(j-c)

Rth(j-a)=15°C/W

Tamb(°C)

2/6

STPS30L60CW/CT/CG/CR

Fig. 3: Normalized avalanche power derating

versus pulse duration.

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Fig. 5: Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode).

IM(A)

250

200

Fig. 4: Normalized avalanche power derating
versus junction temperature.

P(t)

ARM p

P (25°C)

ARM

1.2
1

0.8

0.6

0.4

0.2
0

0 25 50 75 100 125 150

T (°C)

j

Fig. 6: Relative variation of thermal impedance

junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

1.0

0.8

150

100

IM

50

0

1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

Tc=25°C

Tc=75°C

Tc=125°C

Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode).

IR(mA)

5E+2
1E+2

1E+1

1E+0

1E-1

1E-2

0 5 10 15 20 25 30 35 40 45 50 55 60

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

VR(V)

δ = 0.5

0.6

0.4

δ = 0.2

δ = 0.1

0.2

Single pulse

0.0
1E-4 1E-3 1E-2 1E-1 1E+0

tp(s)

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values, per diode).

C(nF)

2.0

1.0

0.5

0.2

VR(V)

0.1

1 10 100

F=1MHz
Tj=25°C

3/6

STPS30L60CW/CT/CG/CR

Fig. 9: Forward voltage drop versus forward

current (maximum values, per diode).

IFM(A)

200
100

10

1

0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50

Typical values

Tj=150°C

Tj=125°C

Tj=25°C

VFM(V)

PACKAGE MECHANICAL DATA

2

PAK

D

A

L2

E

L

L3

B2
B

G

C2

D

A1

C

A2

M

* FLAT ZONE NO LESS THAN 2mm

R

*

V2

Fig. 10: Thermal resistance junction to ambient
versus copper surface undertab forD

2

PAK (Epoxy

printed circuit board FR4, copper thickness: 35µm)

Rth(j-a) (°C/W)

80
70
60
50
40
30
20
10

0

0 4 8 12 16 20 24 28 32 36 40

S(Cu) (cm²)

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

FOOTPRINT

10.30

4/6

16.90

5.08

1.30

3.70

8.90

PACKAGE MECHANICAL DATA

2

PAK

I

E

L2

L1

L

e

b2
b1

b

c2

D

A1

STPS30L60CW/CT/CG/CR

DIMENSIONS

REF.

A

A 4.40 4.60 0.173 0.181

A1 2.49 2.69 0.098 0.106

b 0.70 0.93 0.028 0.037
b1 1.14 1.17 0.044 0.046
b2 1.14 1.17 0.044 0.046

c 0.45 0.60 0.018 0.024
c2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368

e 2.40 2.70 0.094 0.106

E 10.0 10.4 0.394 0.409

L 13.1 13.6 0.516 0.535

c

L1 3.48 3.78 0.137 0.149
L2 1.27 1.40 0.050 0.055

Millimeters Inches

Min. Max. Min. Max.

PACKAGE MECHANICAL DATA

TO-220AB

H2

Dia

L5

L6

L2

F2
F1

F

G1

G

L9

L4

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

C

C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027

L7

F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

D

G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551

M

E

L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154

M 2.6typ. 0.102typ.

Diam. 3.75 3.85 0.147 0.151

5/6

STPS30L60CW/CT/CG/CR

PACKAGE MECHANICAL DATA

TO-247

V

V

H

L5

L

F2

F4

L1

F3

L3

F1

V2

F(x3)

G

= =

Dia.

L4L2

D

ME

A

DIMENSIONS

REF.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.85 5.15 0.191 0.203
D 2.20 2.60 0.086 0.102
E 0.40 0.80 0.015 0.031

F 1.00 1.40 0.039 0.055
F1 3.00 0.118
F2 2.00 0.078
F3 2.00 2.40 0.078 0.094
F4 3.00 3.40 0.118 0.133

G 10.90 0.429

H 15.45 15.75 0.608 0.620

L 19.85 20.15 0.781 0.793
L1 3.70 4.30 0.145 0.169
L2 18.50 0.728
L3 14.20 14.80 0.559 0.582
L4 34.60 1.362
L5 5.50 0.216

M 2.00 3.00 0.078 0.118

V5° 5°

V2 60° 60°

Dia. 3.55 3.65 0.139 0.143

■ COOLING METHOD : C

■

RECOMMENDED TORQUE VALUE : 0.8M.N

■

MAXIMUM TORQUE VALUE : 1.0M.N

Ordering type Marking Package Weight Base qty

Delivery

mode

STPS30L60CW STPS30L60CW TO-247 4.4g 50 Tube

STPS30L60CT STPS30L60CT TO-220AB 2.3g 50 Tube
STPS30L60CG STPS30L60CG D
STPS30L60CR STPS30L60CR I

■

EPOXY MEETS UL94,V0

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2

PAK 1.5g 50 Tube

2

PAK 1.49 g 50 Tube

6/6