Datasheet STPS30L45C Datasheet (ST)

Page 1
STPS30L45C
Low drop power Schottky rectifier
Features
low forward voltage drop meaning very small
conduction losses
low switching losses allowing high frequency
low thermal resistance
avalanche rated
insulated package TO-220FPAB:
– insulating voltage = 2000 V DC – capacitance = 45 pF
avalanche capability specified
Description
Dual center tap Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters.
Packaged in TO-247, TO-220AB, TO-220FPAB,
2
D
PAK and I2PAK this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications.
K
2
PA K
I
STPS30L45CR
A1
TO-220AB
STPS30L45CT
TO-220FPAB
STPS30L45CFP
A1
K
A2
K
2
PAK
A2
A1
A2
A1
D
STPS30L45CG
A2
K
A2
K
A1
TO-247
STPS30L45CW
A2
K
A1

Table 1. Device summary

I
F(AV)
V
RRM
T
(max) 150 °C
j
(max) 0.5 V
V
F
2 x 15 A
45 V
October 2010 Doc ID 8002 Rev 4 1/12
www.st.com
12
Page 2
Characteristics STPS30L45C
d
-

1 Characteristics

Table 2. Absolute Ratings (limiting values, per diode)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
I
RRM
I
RSM
P
T
Repetitive peak reverse voltage 45 V
RRM
Forward rms current 30 A
Average forward current
Surge non repetitive forward current tp = 10 ms Sinusoidal 220 A
FSM
TO-220AB, TO-247,
2
PAK, D2PA K
I
TO-220FPAB T
=110 °C, δ = 0.5
c
Tc = 135 °C, δ = 0.5
Per diode Per device
Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A
Non repetitive peak reverse current tp = 100 µs square 3 A
Repetitive peak avalanche power tp = 1 µs T
ARM
Storage temperature range -65 to + 150 °C
stg
Maximum operating junction temperature
T
j
(1)
= 25 °C 6000 W
j
15 30
150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Ptot
--------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
1
--------------------------
<
Rth j a–()

Table 3. Thermal resistances

Symbol Parameter Value Unit
A
R
R
th(j-c)
th(c)
TO-220FPAB
Junction to case
2
TO-220AB, TO-247, I
PAK, D2PA K
TO-220FPAB 2.5
Coupling
TO-220AB, TO-247, I
2
PAK, D2PA K 0 .1 0
When the diodes 1 and 2 are used simultaneously:
ΔT
(diode 1) = P(diode1) x R
j
(Per diode) + P(diode 2) x R
th(j-c)
Per diode To ta l
Per diode To ta l
4
3.2 °C/W
1.60
0.85
°C/W
th(c)
2/12 Doc ID 8002 Rev 4
Page 3
STPS30L45C Characteristics

Table 4. Static electrical characteristics (per diode)

Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1)
I
R
V
F
Reverse leakage current
(1)
Forward voltage drop
Tj = 25 °C
VR = V
= 125 °C 100 200 mA
T
j
= 25 °C IF = 15 A 0.55
T
j
T
= 125 °C IF = 15 A 0.42 0.50
j
= 25 °C IF = 30 A 0.74
T
j
= 125 °C IF = 30 A 0.59 0.67
T
j
RRM
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.330 x I
Figure 1. Average forward power dissipation
PF(av)(W)
12
10
8
6
4
2
0
02468101214161820
versus average forward current (per diode)
δ = 0.1
δ = 0.05
δ = 0.2
IF(av) (A)
δ = 0.5
δ
δ = 1
T
=tp/T
Figure 2. Average forward current versus
ambient temperature (
δ = 0.5, per diode)
IF(av)(A)
18 16 14 12 10
8 6 4
tp
2
=tp/T
δ
0
0 25 50 75 100 125 150
Rth(j-a)=15°C/W
T
tp
F(AV)
Rth(j-a)=Rth(j-c)
Tamb(°C)
+ 0.011 I
0.4 mA
F2(RMS)
TO-220AB/TO-247/I²PAK/D²PAK
TO-220FPAB
V
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 4. Normalized avalanche power
derating versus junction temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
Doc ID 8002 Rev 4 3/12
T (°C)
j
Page 4
Characteristics STPS30L45C
1
Figure 5. Non repetitive surge peak forward
current versus overload duration
IM(A)
200 180
maximum values, per diode
160 140 120 100
80 60
I
M
40 20
0
1E-3 1E-2 1E-1 1E+0
t
δ
=0.5
t(s)
Tc=25°C
Tc=75°C
Tc=125°C
Figure 7. Relative variation of thermal
impedance junction to case versus pulse duration
Zth(j-c)/Rth(j-c)
1.0
0.8
Figure 6. Non repetitive surge peak forward
current versus overload duration (TO-220FPAB only)
IM(A)
140
maximum values, per diode
120
100
80
60
40
I
M
20
0
1E-3 1E-2 1E-1 1E+0
t
δ
=0.5
t(s)
Tc=25°C
Tc=75°C
Tc=125°C
Figure 8. Relative variation of thermal
impedance junction to case versus pulse duration (TO-220FPAB)
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
0.0 1E-4 1E-3 1E-2 1E-1 1E+0
tp(s)
δ
T
=tp/T
Figure 9. Reverse leakage current versus
reverse voltage applied (typical values, per diode)
IR(mA)
5E+2
1E+2
1E+1
1E+0
1E-1
1E-2
0 5 10 15 20 25 30 35 40 45
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=25°C
VR(V)
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
tp
Single pulse
0.0 1E-3 1E-2 1E-1 1E+0 1E+
tp(s)
Figure 10. Junction capacitance versus
reverse voltage applied (typical values, per diode)
C(pF)
2000
1000
500
200
VR(V)
100
12 51020 50
δ
=tp/T
T
F=1MHz Tj=25°C
tp
4/12 Doc ID 8002 Rev 4
Page 5
STPS30L45C Characteristics
Figure 11. Forward voltage drop versus
forward current (maximum values, per diode)
Figure 12. Thermal resistance junction to
ambient versus copper surface under tab for D
2
PAK
IFM(A)
200
100
Typical values
Tj=150°C
10
Tj=125°C
Tj=25°C
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Rth(j-a) (°C/W)
80
70
Epoxy printed circuit board FP4, copper thickness = 35 µm
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
S(cm²)
Doc ID 8002 Rev 4 5/12
Page 6
Package Information STPS30L45C

2 Package Information

Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque (TO-220AB, TO-220FPAB): 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. TO-220AB package dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C
1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
G 4.95 5.15 0.194 0.202
L2
F2
F1
F
G1
H2
Dia
G
L5
L9
L6
L4
A
C
L7
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
M
L4 13 14 0.511 0.551
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
6/12 Doc ID 8002 Rev 4
M 2.6 typ. 0.102 typ.
Dia. 3.75 3.85 0.147 0.151
Page 7
STPS30L45C Package Information
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory.

Table 6. I2PAK dimensions

Dimensions
L2
Ref.
A
E
c2
A 4.40 4.60 0.173 0.181
Millimeters Inches
Min. Max. Min. Max.
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
D
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
L1
A1
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
L
b1
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
b
e
e1
c
E 10 10.40 0.394 0.409
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
Doc ID 8002 Rev 4 7/12
Page 8
Package Information STPS30L45C

Table 7. TO-220FPAB package dimensions

Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
F2
D
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
L7
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
F
G1
G
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
8/12 Doc ID 8002 Rev 4
Page 9
STPS30L45C Package Information
Table 8. D
L2
L
L3
2
PAK package dimensions
A
E
B2
B
G
C2
A1
C
A2
M
*
* FLAT ZONE NO LESSTHAN 2mm
Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
D
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
R
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
V2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°

Figure 13. D2PAK footprint dimensions (in millimeters)

16.90
10.30
8.90
3.70
5.08
1.30
Doc ID 8002 Rev 4 9/12
Page 10
Package Information STPS30L45C

Table 9. TO-247 dimensions

Dimensions
Ref.
A 4.85 5.15 0.191 0.203
A1 2.20 2.60 0.086 0.102
b 1.00 1.40 0.039 0.055
Heat-sink plane
E
S
D
L1
L
11223
R
L2
b1
b2
b
e
A
c
A1
P
3
BACK VIEW
b1 2.00 2.40 0.078 0.094
b2 3.00 3.40 0.118 0.133
c 0.40 0.80 0.015 0.031
(1)
D
E 15.45 15.75 0.608 0.620
e 5.45 typ. 0.215 typ.
L 14.20 14.80 0.559 0.582
L1 3.70 4.30 0.145 0.169
L2 18.50 typ. 0.728 typ.
(2)
P
R 4.50 5.50 0.177 0.217
S 5.50 typ. 0.216 typ.
1. Dimension D plus gate protrusion does not exceed 20.5 mm
2. Resin thickness around the mounting hole is not less than 0.9 mm
Millimeters Inches
Min. Max. Min. Max.
19.85 20.15 0.781 0.793
3.55 3.65 0.139 0.143
10/12 Doc ID 8002 Rev 4
Page 11
STPS30L45C Ordering Information

3 Ordering Information

Table 10. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS30L45CT STPS30L45CT TO-220AB 2g 50 Tube
STPS30L45CG STPS30L45CG D2PA K 1.8g 50 Tube
2
STPS30L45CG-TR STPS30L45CG D
STPS30L45CW STPS30L45CW TO-247 4.4g 30 Tube
STPS30L45CR STPS30L45CR I2PA K 1.4g 50 Tube
STPS30L45CFP STPS30L45CFP TO-220FPAB 1.9 g 50 Tube
PA K 1.8g 500 Tape and reel

4 Revision history

Table 11. Document revision history

Date Revision Changes
Jul-2003 3B Previous issue
13-Oct-2010 4
Added paragraph above Tab l e 6 and updated I2PAK dimensions in
Ta b le 6 . Updated TO-247 dimensions in Ta bl e 9 .
Doc ID 8002 Rev 4 11/12
Page 12
STPS30L45C
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12/12 Doc ID 8002 Rev 4
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