Datasheet STPS30L40CT, STPS30L40CW, STPS30L40CG Datasheet (SGS Thomson Microelectronics)

Page 1
LOW DROPPOWER SCHOTTKY RECTIFIER
MAINPRODUCTSCHARACTERISTICS
STPS30L40CG/CT/CW
I
F(AV)
V
RRM
2 x 15A
40 V
Tj (max) 150 °C
V
(max) 0.50 V
F
FEATURESAND BENEFITS
VERYSMALLCONDUCTION LOSSES NEGLIGIBLESWITCHINGLOSSES LOWFORWARD VOLTAGEDROP LOWTHERMALRESISTANCE AVALANCHERATED
DESCRIPTION
Dual center tap schottky rectifiers suited for Switched Mode Power Supplies and high frequencyDC to DCconverters.
PackagedinTO-247,TO-220ABandD
PAKthese devicesare intended for use in low voltage,high frequency inverters, free-wheeling and polarity protectionapplications.
ABSOLUTE RATINGS
(limitingvalues,per diode)
A1
A2
A1
TO-220AB
STPS30L40CT
K
K
A2
A1
PAK
D
STPS30L40CG
A2
K
A2
K
A1
TO-247
STPS30L40CW
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
T
stg
Tj
dV/dt
dPtot
*:
dTj
July 1999 -Ed: 3A
Repetitivepeak reverse voltage RMSforwardcurrent Averageforward current Tc= 135°C
Surgenonrepetitiveforwardcurrent tp = 10 ms Sinusoidal Repetitivepeak reverse current tp=2µs square F=1kHz Non repetitivepeakreverse current tp = 100 µs square Storagetemperaturerange Maximumoperatingjunction temperature* Criticalrateof riseofreversevoltage
<
Rth(j
δ =0.5
1
thermal runawayconditionfor a diode on its own heatsink
a
)
Per diode Per device
40 V 30 A 15
30
220 A
1A 3A
- 65 to+ 150 °C 150 °C
10000 V/µs
A
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STPS30L40CG/CT/CW
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th (j-c)
R
th (c)
Junctionto case
Whenthediodes1 and2 areused simultaneously:
Tj(diode1)= P(diode1)x R
(Perdiode) + P(diode2)x R
th(j-c)
Per diode
Total
Coupling 0.10 °C/W
th(c)
1.60
0.85
°C/W
STATICELECTRICALCHARACTERISTICS
(per diode)
Symbol Parameter TestsConditions Min. Typ. Max. Unit
*
I
R
V
F
Reverseleakage current
*
Forward voltagedrop Tj =25°CI
Tj = 25°CV Tj = 100°C
Tj = 125°CI Tj = 25°CI Tj = 125°CI
R=VRRM
=15A
F
=15A
F
=30A
F
=30A
F
20 50 mA
0.42 0.50
0.59 0.67
360 µA
0.55 V
0.74
Pulsetest: * tp = 380µs,δ<2%
Toevaluatethe conductionlossesusethe followingequation: P = 0.330 x I
F(AV)
+0.011I
F2(RMS)
Fig. 1: Average forward power dissipation versus averageforwardcurrent(per diode).
PF(av)(W)
12
10
8
6
4
2
0
02468101214161820
2/6
δ = 0.05
δ = 0.1
δ = 0.2
IF(av)A
δ= 0.5
δ =1
T
=tp/T tp
δ
Fig. 2:
Average current versus ambient
temperature(δ=0.5) (perdiode).
IF(av)(A)
18 16 14 12 10
Rth(j-a)=15°C/W
8 6 4 2 0
0 25 50 75 100 125 150
δ
=tp/T
T
tp
Rth(j-a)=Rth(j-c)
Tamb(°C)
Page 3
STPS30L40CG/CT/CW
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values) (per diode).
IM(A)
200 180 160 140 120 100
80 60
IM
40 20
0 1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
Tc=25°C
Tc=75°C
Tc=125°C
Fig. 5: Reverse leakage current versus reverse voltageapplied (typicalvalues)(perdiode).
IR(mA)
2E+2 1E+2
1E+1
1E+0
Tj=150°C
Tj=100°C
Tj=75°C
Fig. 4: Relative variation of thermal transient impedancejunctionto caseversuspulseduration.
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
0.0
1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+0
Fig. 6:
Single pulse
tp(s)
Junction capacitance versus reverse
T
=tp/T tp
δ
voltageapplied(typicalvalues)(perdiode).
C(pF)
2000
1000
500
F=1MHz Tj=25°C
1E-1
1E-2
0 5 10 15 20 25 30 35 40
Fig. 7:
Forward voltage drop versus forward
Tj=25°C
VR(V)
current(maximumvalues)(per diode).
IFM(A)
200 100
10
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Typicalvalues
Tj=150°C
Tj=125°C
Tj=25°C
VFM(V)
200
100
12 51020 50
Fig. 8 :
Thermal resistance junction to ambient
VR(V)
versus copper surface under tab (Epoxy printed circuitboardFR4,copperthickness: 35µm) (STPS30L40CGonly).
Rth(j-a) (°C/W)
80 70 60 50 40 30 20 10
0
0 5 10 15 20 25 30 35 40
S(Cu) (cm )
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Page 4
STPS30L40CG/CT/CW
PACKAGEMECHANICALDATA
TO-220AB
H2
Dia
L5
L6
L2
F2
F1
F
G1
G
L9
L4
DIMENSIONS
REF.
A
C
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051
Millimeters Inches
Min. Max. Min. Max.
D 2.40 2.72 0.094 0.107
L7
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409
L2 16.4typ. 0.645typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116
M
E
L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154
M 2.6typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
Coolingmethod: C Recommendedtorque value: 0.55m.N Maximumtorque value : 0.70m.N
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PACKAGEMECHANICAL DATA
PAK
D
L2
L
L3
E
A1
B2
B
G
C2
STPS30L40CG/CT/CW
DIMENSIONS
REF.
A
A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
D
B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
C
R
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069
A2
M 2.40 3.20 0.094 0.126
R 0.40typ. 0.016 typ. V2 0° 8° 0° 8°
M
*
V2
Millimeters Inches
Min. Max. Min. Max.
* FLATZONE NO LESSTHAN 2mm
Coolingmethod: byconduction(method C)
FOOT PRINT (in millimeters)
PAK
D
16.90
10.30
1.30
8.90
3.70
5.08
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Page 6
STPS30L40CG/CT/CW
PACKAGEMECHANICAL DATA
TO-247
V
V
H
L5
L
F2
F4
L1
F3
L3
F1
V2
F(x3)
G
==
Dia.
L4L2
ME
A
D
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031
F 1.00 1.40 0.039 0.055 F1 3.00 0.118 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 F4 3.00 3.40 0.118 0.133
G 10.90 0.429
H 15.45 15.75 0.608 0.620
L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 18.50 0.728 L3 14.20 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216
M 2.00 3.00 0.078 0.118
V5° 5°
V2 60° 60°
Dia. 3.55 3.65 0.139 0.143
Coolingmethod: C Recommendedtorquevalue: 0.8m.N Maximumtorque value : 1.0m.N
Orderingtype Marking Package Weight Baseqty Delivery mode
STPS30L40CT STPS30L40CT TO-220AB 2g 50 Tube STPS30L40CG STPS30L40CG D
STPS30L40CG-TR STPS30L40CG D
PAK 1.8g 50 Tube
PAK 1.8g 500 Tape& reel
STPS30L40CW STPS30L40CW TO-247 4.4g 30 Tube
EpoxymeetsUL94,V0
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