Datasheet STPS3045G Datasheet (SGS Thomson Microelectronics)

®

MAIN PRODUCT CHARACTERISTICS

STPS3045G

POWER SCHO TTKY REC TIFIER

Tj

V

I

F(AV)

V

RRM

(max)

(max)

F

30 A
45 V

175°C

0.63 V

K

FEATURES AND BE NE F ITS

VERY SMALL CONDUCTION LOSS ES
NEGLIGIBLE SWIT CHING LOS SE S
EXTRE MELY F AST SWI TCHI NG

A

A

LOW THERMAL RESISTANCE
HIGH DISSIPATION M INIATURE PACKAGE

D

2

PAK

DESCRIPTION

Single Schottky rectifier suited for switchmode
power supply and high frequency DC to DC con­verters.

2

Packaged in D

PAK surface mount package , this
device is intended for use in low voltage, high fre­quency inverters, free wheeling and polarity pr o­tection applications.

ABSOLUTE RATINGS

(limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

Repetitive peak reverse voltage 45 V
RMS forward current 50 A
Average forward current Tc = 150°C

δ

= 0.5

Surge non repetitive forward current tp = 10 ms

30 A

200 A

Sinusoidal

I

RRM

Repetitive peak reverse current tp = 2 µs

1A

F = 1kHz square

I

RSM

Non Repetitive peak reverse current tp = 100µs square 3 A

Tstg Storage temperature range - 65 to + 175

Tj Maximum operating junction temperature* 175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

dTj

* :

October 1999 - Ed: 4A

1

<

Rth

thermal runaway condition for a diode on its own heatsink

(

)

j−a

°

C

1/5

STPS3045G

THERMAL RE SISTA NC ES

Symbol Parameter Value Unit

R

th (j-c)

Junction to case 1

°

STATIC ELECTRICAL CHARACTER ISTICS

Symbol Parameter Tests Conditions Min. Typ. Max. Unit

* Reverse leakage current Tj = 25°CV

I

R

= V

R

RRM

500

Tj = 125°C2080mA

** Forward voltage drop Tj = 125°CI

V

F

Tj = 25°CI
Tj = 125°CI

Pulse test : * tp = 5 ms, δ < 2 %

** tp = 380 µs, δ < 2%

= 30 A 0.53 0.63 V

F

= 60 A 0.84

F

= 60 A 0.68 0.78

F

To evaluate the conduction losses use the following equation :
P = 0.48 x I

F(AV)

+ 0.005 I

F2(RMS)

C/W

µ

A

Fig. 1:

Average forward power dissipation versus

average forward current.

PF(av)(W)

25

20

15

10

5

0

0 5 10 15 20 25 30 35 40

δ = 0.05

δ = 0.1

δ = 0.2

IF(av) (A)

δ = 0.5

δ

δ = 1

T

=tp/T

Fig. 2:

Average forward current versus ambient

temperature (δ=0.5).

IF(av)(A)

35
30
25
20
15

Rth(j-a)=30°C/W

10

tp

5
0

0 25 50 75 100 125 150 175

Rth(j-a)=Rth(j-c)

Tamb(°C)

δ

=tp/T

T

tp

2/5

Fig. 3:

Non repetitive surge peak forward current

versus overload duration (maximum values).

STPS3045G

Fig. 4:

junction to case versus pulse duration.

Relative variation of thermal impedance

IM(A)

400
350
300
250
200
150
100

I

M

50

0

1E-3 1E-2 1E-1 1E+0

Fig. 5:

t

δ

=0.5

t(s)

Reverse leakage current versus reverse

Tc=75°C
Tc=100°C

Tc=125°C

voltage applied (typical values)

IR(µA)

1E+5

1E+4

1E+3

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Zth(j-c)/Rth(j-c)

1.0

0.8

δ = 0.5

0.6

0.4

δ = 0.2

δ = 0.1

0.2

Single pulse

0.0
1E-4 1E-3 1E-2 1E-1 1E+0

Fig. 6:

Junction capacitance versus reverse

tp(s)

δ

=tp/T

T

tp

voltage applied (typical values).

C(nF)

5.0

1.0

F=1MHz
Tj=25°C

1E+2

1E+1

Tj=50°C

Tj=25°C

VR(V)

1E+0

0 5 10 15 20 25 30 35 40 45

Fig. 7:

Forward voltage drop versus forward current

(maximum values).

IFM(A)

200
100

10

1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4

Typical values

Tj=125°C

Tj=25°C

Tj=125°C

VFM(V)

0.1
12 51020 50

Fig. 8:

Thermal resistance junction to ambient ver­sus copper surface under tab (Epoxy printed c ircuit
board, copper thickness: 35µm)

Rth(j-a) (°C/W)

80
70
60
50
40
30
20

VR(V)

10

0

0 2 4 6 8 101214161820

S(Cu) (cm²)

3/5

STPS3045G

PACKAGE MECHANICAL DAT A

2

D

PAK

E

L2

L

L3

A1

B2
B

G

* FLAT ZONE NO LESS THAN 2mm

C2

DIMENSIONS

REF.

A

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009

D

B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

A2

L 15.00 15.85 0.590 0.624

L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069

M

*

V2

M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

FOOTPRINT DIMENSIONS

16.90

10.30

8.90

(in millimeters)

5.08

1.30

3.70

4/5

STPS3045G

Type Marking Package Weight Base qty Delivery mode

2

STPS3045G ST PS3045G D

STPS3045G-TR STPS3045G D

Epoxy meets UL94, V0

PAK 1.48g 50 Tube

2

PAK 1.48g 500 Tape & Reel

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