Datasheet STPS3045DJF Datasheet (ST)

Page 1
Features
STPS3045DJF
Power Schottky rectifier
Low forward voltage drop
Very small conduction losses
Extremely fast switching
Low thermal resistance
Avalanche capability specified
Thin package: 1 mm
ECOPACK
®
2 compliant component
Description
Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters.
Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications.
Its low profile was especially designed to be used in applications with space-saving constraints.
A
A
K
A
PowerFLAT 5x6
STPS3045DJF

Table 1. Device summary

Symbol Value
K
K
A
TM: PowerFLAT is a trademark of STMicroelectronics
I
F(AV)
V
RRM
T
(max) 150 °C
j
(typ) 0.41 V
V
F
30 A
45 V
May 2011 Doc ID 16758 Rev 3 1/7
www.st.com
7
Page 2
Characteristics STPS3045DJF

1 Characteristics

Table 2. Absolute ratings (limiting values, anode terminals short circuited)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
P
T
1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Symbol Parameter Value Unit
Repetitive peak reverse voltage 45 V
RRM
Forward rms current 45 A
Average forward current Tc = 95 °C, δ = 0.5 30 A
= 10 ms sinusoidal
t
Surge non repetitive forward current
FSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 12500 W
ARM
Storage temperature range -65 to + 175 °C
stg
Maximum operating junction temperature
T
j
dPtot
dTj
<
Rth(j-a)
1
p
= 25 °C
T
c
(1)
200 A
150 °C
R

Table 4. Static electrical characteristics (anode terminals short circuited)

Junction to case 2.5 °C/W
th(j-c)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
T
= 25 °C
(1)
I
V
Reverse leakage current
R
(1)
Forward voltage drop
F
j
T
= 125 °C - 20 80 mA
j
= 25 °C
T
j
T
= 125 °C - 0.41 0.46
j
T
= 25 °C
j
= 125 °C - 0.50 0.56
T
j
= V
V
R
= 15 A
I
F
IF = 30 A
RRM
--30A
--0.56
--0.64
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.43 x I
+ 0.00433 I
F(AV)
F2(RMS)
V
2/7 Doc ID 16758 Rev 3
Page 3
STPS3045DJF Characteristics
Figure 1. Average forward power dissipation
versus average forward current
P (W)
F(AV)
24
δ = 0.5
δ = 1
20
δ = 0.2
16
12
8
δ = 0.05
δ = 0.1
δ = t / T
p
T
t
p
4
I (A)
0
F(AV)
0 5 10 15 20 25 30 35 40
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
I (A)
F(AV)
35
30
25
20
15
10
5
0
T
δ = t / T
0 25 50 75 100 125 150
t
p
p
R= R
th(j-a) th(j-c)
T (°C)
amb
Figure 4. Normalized avalanche power
derating versus junction temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values)
I (A)
M
220
200
180
160
140
120
100
80
60
40
I
M
20
0
1.E-03 1.E-02 1.E-01 1.E+00
δ = 0.5
t
Figure 6. Relative variation of thermal
impedance, junction to case, versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
T = 25 °C
c
T = 75 °C
c
T = 125 °C
c
t(s)
Doc ID 16758 Rev 3 3/7
0.6
0.5
0.4
0.3
0.2 Single pulse
0.1
0.0
1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00
t (s)
p
Page 4
Characteristics STPS3045DJF
Figure 7. Reverse leakage current versus
reverse voltage applied (typical values)
I (mA)
R
1.E+02
1.E+01
1.E+00
1.E-01
T = 150 °C
j
T = 125 °C
j
T = 100 °C
j
T = 75 °C
j
T = 50 °C
j
T = 25 °C
j
1.E-02
1.E-03
V (V)
0 5 10 15 20 25 30 35 40 45
Figure 9. Forward voltage drop versus
forward current
I (A)
FM
60
55
50
45
40
35
30
25
20
15
10
5
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
T = 125 °C
j
(Maximum values)
T = 125 °C
j
(Typical values)
T = 25 °C
j
(Maximum values)
V (V)
FM
Figure 8. Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
10000
1000
R
100
1 10 100
Figure 10. Thermal resistance, junction to
ambient, versus copper surface under tab
R (°C/W)
th(j-a)
250
200
150
100
50
0
012345678910
Epoxy printed board FR4, copper thickness = 35 µm
F = 1 MHz
V = 30 mV
osc RMS
T = 25 °C
j
S (cm²)
cu
V (V)
R
4/7 Doc ID 16758 Rev 3
Page 5
STPS3045DJF Package information

2 Package information

Epoxy meets UL94,V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 5. PowerFLAT 5x6 dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref.
D2
E2
K
b
e
A
A1
D
L
A2
A 0.80 1.00 0.031 0.039
A1 0.02 0.05 0.001 0.002
A2 0.25 0.010
b 0.30 0.50 0.012 0.020
D 5.20 0.205
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
D2 4.11 4.31 0.162 0.170
e 1.27 0.050
E
E 6.15 0.242
E2 3.50 3.70 0.138 0.146
L 0.50 0.80 0.020 0.031
K 1.275 1.575 0.050 0.062

Figure 11. Footprint (dimensions in mm)

5.35
4.41
4.33
3.86
6.29
0.98
0.95
1.27
Doc ID 16758 Rev 3 5/7
0.62
Page 6
Ordering information STPS3045DJF

Figure 12. Tape and reel specifications

Dot identifying Pin A1 location
2.0
4.0
Ø 1.55
0.30
12.0
5.30
1.20
All dimensions are typical values in mm

3 Ordering information

0.20
6.30
8.0
User direction of unreeling
1.75
Ø 1.5
5.5
R 0.50

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS3045DJF-TR PS30 45 PowerFLAT 5x6 95 mg 3000 Tape and reel

4 Revision history

Table 7. Document revision history

Date Revision Changes
09-Nov-2009 1 First issue.
05-Jul-2010 2 Replace Power QFN with PowerFLAT.
20-May-2011 3
Updated package graphics and marking in Ta b le 6 . Added
Figure 12.
6/7 Doc ID 16758 Rev 3
Page 7
STPS3045DJF
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
STMicroelectronics group of companies
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 16758 Rev 3 7/7
Loading...