Datasheet STPS30170C Datasheet (ST)

®

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER

Table 1: Main Product Characteristics

V

V

F

I

F(AV)

RRM

T

j

(max)

2 x 15 A

170 V

175 °C

0.75 V

STPS30170C

A1

K

A2

FEATURES AND BENEFITS

■ High junction temperature capability

■ Low leakage current

■ Good trade off between leakage current and

forward voltage drop

■ Insulated package: TO-220FPAB

Insulating voltage: 2000 V DC
Capacitance: 45 pF

■ Avalanche specification

DESCRIPTION

Dual center tab Schottky rectifier suited for High
Frequency Switch Mode Power Supply.

A2

K

A1

TO-247

STPS30170CW

K

A1

TO-220FPAB

STPS30170CFP

A2

TO-220AB

STPS30170CT

K

D

STPS30170CG

Table 2: Order Codes

Part Numbers Marking

STPS30170CW STPS30170CW

STPS30170CT STPS30170CT

2

PAK

A2

K

A1

A2

A1

September 2005

STPS30170CFP STPS30170CFP

STPS30170CG STPS30170CG

STPS30170CG-TR STPS30170CG

REV. 1

1/9

STPS30170C

Table 3: Absolute Ratings (limiting values, per diode)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

P

ARM

T

T

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

------------- --

* : thermal runaway condition for a diode on its own heatsink

dTj

Table 4: Thermal Parameters

Repetitive peak reverse voltage 170 V

RMS forward current 30 A

Average forward current
δ = 0.5

TO-220FPAB Tc = 120 °C

TO-220AB /

D

2

PAK

Tc = 155 °C

TO-247 30

Per diode

Per device

Surge non repetitive forward current tp = 10ms sinusoidal 220 A

Repetitive peak avalanche power tp = 1µs Tj = 25 °C 10500 W

Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature * 175 °C

j

1

--------------- ----------->

Rth j a–()

15

A

Symbol Parameter Value Unit

R

th(j-c)

Junction to case

TO-220FPAB

TO-220AB / D

TO-247

2

PAK

Per diode
Total

Per diode
Total

Per diode
Total

4

3.3

1.6

0.85

1.5

0.8

°C/W

TO-220FPAB Coupling 2.6

R

th(c)

TO-220AB / D

2

PAK

Coupling 0.3

°C/W

TO-247 Coupling 0.3

When the diodes 1 and 2 are used simultaneously:

∆ Tj(diode 1) = P(diode 1) x R

(Per diode) + P(diode 2) x R

th(j-c)

th(c)

Table 5: Static Electrical Characteristics (per diode)

Symbol Parameter Tests conditions Min. Typ Max. Unit

= 25 °C

T

*

I

R

V

F

Reverse leakage current

**

Forward voltage drop

j

= 125 °C

T

j

T

= 25 °C

j

T

= 125 °C

j

= 25 °C

T

j

= 125 °C

T

j

V

= V

R

I

= 15 A

F

I

= 30 A

F

RRM

520 mA

0.69 0.75

0.80 0.86

20 µA

0.92

1

V

Pulse test: * tp = 5 ms, δ < 2%

** tp = 380 µs,

To evaluate the conduction losses use the following equation: P = 0.64 x I

2/9

δ < 2%

F(AV)

+ 0.0073 I

F2(RMS)

STPS30170C

0

(A)

0

(A)

Figure 1: Average forward power dissipation
versus average forward current (per diode)

P

(W)

F(AV)

14

12

10

8

6

4

2

0

0123456789101112131415161718

d=0.05

I

F(AV)

d=0.1

(A)

d=0.2 d=0.5

d

=t /T

d=1

T

t

p

p

Figure 3: Normalized avalanche power
derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 2: Average forward current versus
ambient temperature (δ = 0.5, per diode)

I

(A)

F(AV)

18

R

(TO-220AB, TO-247 & D²PAK)R

(TO-220AB, TO-247 & D²PAK)

th(j-a)=Rth(j-c)

16

th(j-a)=Rth(j-c)

14

12

10

R

=15 °C/W

8

th(j-A)

R

R

th(j-a)=Rth(j-c)

th(j-a)=Rth(j-c)

(TO-220FPAB)

(TO-220FPAB)

6

d

=t /T

T

t

p

p

T

(°C)

amb

4

2

0

0 25 50 75 100 125 150 175

Figure 4: Normalized avalanche power
derating versus junction temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25

50 75 100 125 150

T (°C)

j

Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode) (TO-220AB, TO-247, D

I

M

225

200

175

150

125

100

75

50

I

M

25

0

t

d

=0.5

1.E-03 1.E-02 1.E-01 1.E+0

TO-220AB, TO-247 & D²PAK

t(s)

2

TC=50°C

TC=75°C

TC=125°C

PAK)

Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values, per diode) (TO-220FPAB)

I

M

140

130

120

110

100

90

80

70

60

50

40

30

I

M

20

10

0

t

d

=0.5

t(s)

1.E-03 1.E-02 1.E-01 1.E+0

TO-220FPAB

TC=50°C

TC=75°C

TC=125°C

3/9

STPS30170C

0

Figure 7: Relative variation of thermal
impedance junction to case versus pulse
duration (per diode) (TO-220AB, TO-247,

2

D

PAK)

Z

th(j-c)/Rth(j-c)

1.0

TO-220AB, TO-247 & D²PAK

0.9

0.8

0.7

d=0.5

0.6

0.5

d=0.2

0.4

d=0.1

0.3

0.2

Single pulse

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00

tP(s)

d

=t /T

T

t

p

p

Figure 9: Reverse leakage current versus
reverse voltage applied (typical values, per
diode)

IR(µA)

1.E+06

1.E+05

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170

Tj=175°C

Tj=150°C

Tj=125°C

Tj=75°C

Tj=25°C

VR(V)

Figure 8: Relative variation of thermal
impedance junction to case versus pulse
duration (per diode) (TO-220FPAB)

Z

th(j-c)/Rth(j-c)

1.0

TO-220FPAB

0.9

0.8

0.7

d=0.5

0.6

0.5

0.4

d=0.2

0.3

0.2

0.1

0.0

D=0.1

Single pulse

tP(s)

d

=t /T

T

t

p

p

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

Figure 10: Junction capacitance versus
reverse voltage applied (typical values, per
diode)

C(pF)

1000

100

VR(V)

10

1 10 100 100

F=1MHz

=30mV

V

OSC

RMS

Tj=25°C

Figure 11: Forward voltage drop versus
forward current (maximum values, per diode,
low level)

IFM(A)

15.0

12.5

10.0

7.5

5.0

2.5
VFM(V)

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

4/9

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

Tj=125°C

Tj=125°C

(Typical values)

(Typical values)

Tj=25°C

(Maximum values)

Figure 12: Forward voltage drop versus
forward current (maximum values, per diode,
high level)

IFM(A)

100

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

Tj=125°C

Tj=125°C

(Typical values)

10

1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

(Typical values)

Tj=25°C

(Maximum values)

VFM(V)

Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(Epoxy printed circuit board, copper
thickness: 35 µm) (D

R

(°C/W)

th(j-a)

80

70

60

50

40

30

20

10

0

0 5 10 15 20 25 30 35 40

2

PAK)

D²PAK

SCU(cm²)

Figure 14: TO-247 Package Mechanical Data

STPS30170C

DIMENSIONS

REF.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

V

A 4.85 5.15 0.191 0.203

D 2.20 2.60 0.086 0.102

V

Dia

E 0.40 0.80 0.015 0.031

F 1.00 1.40 0.039 0.055

F1 3.00 0.118

H

A

F2 2.00 0.078

F3 2.00 2.40 0.078 0.094

L5

F4 3.00 3.40 0.118 0.133

G 10.90 0.429

L

L2

L4

F2

F4

F3

L1

L3

D

EM

F1

V2

F(x3)

G

H 15.45 15.75 0.608 0.620

L 19.85 20.15 0.781 0.793

L1 3.70 4.30 0.145 0.169

L2 18.50 0.728

L3 14.20 14.80 0.559 0.582

L4 34.60 1.362

L5 5.50 0.216

M 2.00 3.00 0.078 0.118

V5° 5°

V2 60° 60°

Dia. 3.55 3.65 0.139 0.143

5/9

STPS30170C

m

D

Figure 15: D2PAK Package Mechanical Data

A

L2

E

L

L3

B2

B

G

* FLAT ZONE NO LESS THAN 2m

C2

A1

C

A2

M

R

*

V2

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

Figure 16: Foot Print Dimensions (in millimeters)

16.90

10.30

8.90

3.70

5.08

1.30

6/9

Figure 17: TO-220FPAB Package Mechanical Data

A

B

Dia

L7

E

L3

L2

L4

G1

H

L6

L5

F1

F2

F

G

D

STPS30170C

DIMENSIONS

REF.

A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027

F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067

G 4.95 5.20 0.195 0.205

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.393 0.409

L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366

Dia. 3.00 3.20 0.118 0.126

Millimeters Inches

Min. Max. Min. Max.

Figure 18: TO-220AB Package Mechanical Data

H2

Dia

L5

L6

L2

F2

F1

F

G1

G

L9

L4

A

C

L7

D

M

E

DIMENSIONS

REF.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

7/9

STPS30170C

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.

Table 6: Ordering Information

Ordering type Marking Package Weight Base qty Delivery mode

STPS30170CW STPS30170CW TO-247 4.40 g 30 Tube

STPS30170CT STPS30170CT TO-220AB 2 g 50 Tube

STPS30170CFP STPS30170CFP TO-220FPAB 1.9 g 50 Tube

STPS30170CG STPS30170CG

STPS30170CG-TR STPS30170CG 1000 Tape & reel

■ Epoxy meets UL94, V0

■ Cooling method: by conduction (C)

■ TO-220 - Recommended torque value: 0.55 Nm, Maximum torque value: 0.7 Nm.

■ TO-247 - Recommended torque value: 0.8 Nm, Maximum torque value: 1.0 Nm.

D

2

PAK

1.48 g

50 Tube

Table 7: Revision History

Date Revision Description of Changes

16-Sep-2005 1 First issue.

8/9

STPS30170C

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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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All other names are the property of their respective owners

© 2005 STMicroelectronics - All rights reserved

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9/9