Datasheet STPS2L40U Datasheet (SGS Thomson Microelectronics)

®

LOW DROP POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTICS

STPS2L40U

I

F(AV)

V

RRM

2A

40 V

Tj (max) 150 °C

V

(max) 0.34V

F

FEATURES AND BENEFITS

VERY SMALL CONDUCTION LOSSES

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NEGLIGIBLE SWITCHING LOSSES

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LOW FORWARD VOLTAGE DROP

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SURFACE MOUNT MINIATURE PACKAGE
AVALANCHE CAPABILITY SPECIFIED

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DESCRIPTION

Single chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.

Packaged in SMB, this device is especially
intended for surface mounting and used in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.

ABSOLUTE RATINGS (limiting values)

SMB

(JEDEC DO-214AA)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

P

ARM

T

stg

Repetitive peak reverse voltage 40 V
RMS forward current 8 A
Average forward current TL= 130°C δ = 0.5 2 A
Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A
Repetitive peak avalanche power tp = 1µs Tj = 25°C 2200 W
Storage temperature range - 65 to + 150 °C

Tj Maximum operating junction temperature * 150 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

*:

<

dTj Rth j a

July 2003 - Ed: 2A

thermal runaway condition for a diode on its own heatsink

−1()

1/5

STPS2L40U

THERMAL RESISTANCES

Symbol Parameter Value Unit

R

th (j-l)

STATIC ELECTRICAL CHARACTERISTICS

Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit

I

R

V

Junction to lead SMB 20 °C/W

* Reverse leakage current Tj = 25°C VR=40V 220 µA

Tj = 100°C 20 mA
Tj = 125°C 38 80 mA

* Forward voltage drop Tj = 25°C IF= 1 A 0.39 V

F

Tj = 125°C 0.25 0.28
Tj = 25°C I

= 2 A 0.43

F

Tj = 125°C 0.31 0.34
Tj = 25°C I

= 4 A 0.5 V

F

Tj = 125°C 0.39 0.45

Pulse test:*tp=380µs, δ <2%

To evaluate the maximum conduction losses use the following equation :
P=0.22xI

Fig. 1: Average forward power dissipation versus
average forward current.

PF(av)(W)

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6

F(AV)

δ = 0.05

+ 0.06 I

δ = 0.1

F2(RMS)

δ = 0.2

IF(av) (A)

δ = 0.5

δ

=tp/T

δ = 1

T

Fig. 2: Average forward current versus ambient
temperature (δ=0.5).

IF(av)(A)

2.4

2.0

1.6

1.2

0.8

tp

0.4

0.0
0 25 50 75 100 125 150

δ

=tp/T

T

tp

Rth(j-a)=Rth(j-l)

Rth(j-a)=100°C/W

Tamb(°C)

2/5

STPS2L40U

Fig. 3: Normalized avalanche power derating

versus pulse duration.

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).

IM(A)

12
10

8
6
4

IM

2
0

1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

Ta=25°C

Ta=50°C

Ta=100°C

Fig. 4: Normalized avalanche power derating
versus junction temperature.

P(t)

ARM p

P (25°C)

ARM

1.2
1

0.8

0.6

0.4

0.2
0

0 25 50 75 100 125 150

T (°C)

j

Fig. 6: Relative variation of thermal impedance

junction to ambient versus pulse duration.

Zth(j-a)/Rth(j-a)

1.0

0.8

0.6

δ = 0.5

0.4

δ = 0.2

δ = 0.1

0.2

Single pulse

0.0
1E-2 1E-1 1E+0 1E+1 1E+2 1E+3

tp(s)

δ

=tp/T

T

tp

Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).

IR(mA)

1E+2

1E+1

1E+0

1E-1

1E-2

1E-3

0 5 10 15 20 25 30 35 40

Tj=125°C

Tj=25°C

VR(V)

Fig. 8: Junction capacitance versus reverse

voltage applied (typical values).

C(pF)

1000

F=1MHz
Tj=25°C

100

10

1 10 100

VR(V)

3/5

STPS1L40A/U

Fig. 9-1: Forward voltage drop versus forward

current (maximum values, high level).

IFM(A)

10.00

Tj=125°C

Tj=125°C

(typical

1.00

0.10

0.01

0 50 100150 200 250 300 350 400 450500 550 600 650 700

values)

Tj=25°C

VFM(mV)

Fig. 10: Thermalresistancejunctiontoambient

versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness
s(Cu) = 35µm)

Rth(j-a) (°C/W)

120

Fig. 9-2: Forward voltage drop versus forward
current (maximum values, low level).

IFM(A)

3.0

Tj=125°C

(typical values)

Tj=125°C

Tj=25°C

VFM(mV)

2.5

2.0

1.5

1.0

0.5

0.0

0 50 100 150 200 250 300 350 400 450 500

100

80
60
40
20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S(Cu) (cm²)

4/5

PACKAGE MECHANICAL DATA

SMB

E1

REF.

STPS2L40U

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

D

E

A1

C

L

A2

FOOT PRINT DIMENSIONS (in millimeters)

2.3

A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016
E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

b

D 3.30 3.95 0.130 0.156

L 0.75 1.60 0.030 0.063

1.52 2.75

1.52

Ordering type Marking Package Weight Base qty Delivery mode

STPS2L40U GD4 SMB 0.107g 2500 Tape & reel

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BAND INDICATES CATHODE

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EPOXY MEETS UL94,V0

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