Datasheet STPS2L30A Datasheet (SGS Thomson Microelectronics)

Page 1
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
STPS2L30A
I
F(AV)
V
2 A
30 V
Tj (max) 150 °C
(max) 0.375 V
V
F
FEATURES AND BENE FITS
LOW COST DEVICE WITH LOW DROP FORWARD VOLTAGE FOR LESS POWER DISSIPATION.
OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH LEADS TO THE HIGHEST YIELD IN THE APPLICATIONS.
HIGH POWER SURFAC E M OUNT MINIATURE PACKAGE.
DESCR IPT ION
Single Schottky rectifier suited t o Switched Mode Power Supplies and high frequency DC to DC converters, freewheel diode and integrated circuit latch up protection.
Packaged in SMA, this device is especially intended for use in parallel with MOSFETs in synchronous rectification.
SMA
JEDEC DO-214AC
ABSOLUTE RATINGS
(limiting values)
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
T
stg
Tj Maximum operating junction temperature * 150
Repetitive peak reverse voltage 30 V RMS forward current 10 A Average forward current TL = 120°C
δ
= 0.5 2 A Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A Repetitive peak reverse current tp = 2 µs F = 1kHz square 1 A Non repetitive peak reverse current tp = 100 µs square 1 A Storage temperature range - 65 to + 150
° °
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
dPtot
* :
August 1999 - Ed: 2A
dTj
<
1
Rth(j−a
thermal runaway condition for a diode on its own heatsink
)
C C
1/4
Page 2
STPS2L30A
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th (j-l)
Junction to lead 30
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameters Tests Conditions Min. Typ. Max. Unit
* Reverse leakage current Tj = 25°CV
I
R
= V
R
RRM
200
Tj = 100°C615mA
* Forward voltage drop Tj = 25°CI
V
F
= 2 A 0.45 V
F
Tj = 125°C 0.325 0.375 Tj = 25°CI
= 4 A 0.53
F
Tj = 125°C 0.43 0.51
Pulse test : * tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation : P = 0.24 x I
F(AV)
+ 0.068 I
F2(RMS )
°
C/W
µ
A
Fig. 1:
Average forward power dissipation versus
average forward current.
PF(av)(W)
1.2
1.0
0.8
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
δ = 1
0.6
0.4
T
0.2
=tp/T
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
Fig. 3:
Non repetitive surge peak forward current
IF(av) (A)
δ
tp
versus overload duration (maximum values).
IM(A)
10
8
6
4
I
M
2
0
1E-3 1E-2 1E-1 1E+0
t
δ
=0.5
t(s)
Ta=25°C
Ta=50°C
Ta=100°C
Fig. 2:
Average forward current versus ambient
temperature (δ=0.5).
IF(av)(A)
2.2
2.0
1.8
Rth(j-a)=Rth(j-l)
1.6
1.4
Rth(j-a)=120°C/W
1.2
1.0
0.8
0.6
T
0.4
0.2
=tp/T
δ
0.0 0 25 50 75 100 125 150
Fig. 4:
tp
Tamb(°C)
Relative variation of thermal impedance
junction to ambient versus puls e dur ation.
Zth(j-a)/Rth(j-a)
1.0
0.8
0.6
δ = 0.5
0.4
δ = 0.2
0.2
δ = 0.1
0.0
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Single pulse
tp(s)
δ
=tp/T
T
tp
2/4
Page 3
STPS2L30A
Fig. 5:
Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
1E+2
1E+1
1E+0
Tj=150°C
Tj=125°C
Tj=100°C
1E-1
1E-2
Tj=25°C
VR(V)
1E-3
0 5 10 15 20 25 30
Fig. 7-1:
Forward voltage drop versus forward c ur-
rent (maximum values, high lev el).
IFM(A)
10.00
1.00
Typical values
Tj=150°C
Tj=125°C
Tj=25°C
Fig. 6:
Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
500
F=1MHz Tj=25°C
100
VR(V)
10
12 5102030
Fig. 7-2:
Forward voltage drop versus forward c ur-
rent (typical values, low level).
IFM(A)
10.00
Tj=150°C
Tj=125°C
1.00
Tj=25°C
0.10
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Fig. 7-3:
Forward voltage drop versus forward c ur-
Tj=100°C
VFM(V)
rent (maximum values, low lev el).
IFM(A)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60
Typical values
Tj=150°C
Tj=125°C
Tj=25°C
Tj=100°C
VFM(V)
0.10
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Fig. 8:
Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness:
Rth(j-a) (°C/W)
140 120 100
80 60 40
VFM(V)
20
0
012345
S(Cu) (cm²)
3/4
Page 4
STPS2L30A
PACKAGE MECHANICAL DAT A
SMA
E1
D
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008
E
b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016
A1
C
L
A2
b
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
FOOT PRINT DIMENSIONS
(in millimeters)
1.65
1.45 1.45
2.40
Ordering type Marking Package Weight Base qty Delivery mode
STPS2L30A G30 SMA 0.068g 5000 Tape & reel
Band indicates cathode Epoxy meets UL94,V0
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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