Datasheet STPS2L30 Datasheet (ST)

STPS2L30

Low drop power Schottky rectifier

Features

■ Low cost device with low drop forward voltage

for less power dissipation

■ Optimized conduction/reverse losses trade-off

which lead to the highest yield in the
applications

■ Surface mount miniature packages

■ Avalanche capability specified

Description

Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters, freewheel diode and integrated circuit
latch up protection.

Packaged in SMA and low profile SMA and SMB,
this device is especially intended for use in
parallel with MOSFETs in synchronous
rectification.

A

K

SMA

STPS2L30A

A

K

SMB flat

STPS2L30UF

Table 1. Device summary

I

F(AV)

V

RRM

(max) 150 °C

T

j

(max) 0.375 V

V

F

A

K

SMA flat

STPS2L30AF

2 A

30 V

April 2008 Rev 6 1/10

www.st.com

10

Characteristics STPS2L30

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(AV)

I

FSM

P

ARM

T

stg

T

dPtot

---------------

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Repetitive peak reverse voltage 30 V

SMA flat T

Average forward current

SMB flat T

= 130 °C δ = 0.5

L

= 120 °C δ = 0.5

L

= 135 °C δ = 0.5

L

Surge non repetitive forward current tp =10 ms sinusoidal 75 A

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1500 W

Storage temperature range -65 to + 150 °C

Operating junction temperature

j

1

--------------------------

<

Rth j a–()

(1)

150 °C

2ASMA T

Symbol Parameter Value Unit

SMA flat 20

R

th(j-l)

Junction to lead

SMB flat 15

Table 4. Static electrical characteristics

°C/WSMA 30

Symbol Parameter Test Conditions Min. Typ. Max. Unit

(1)

I

R

V

F

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

(1)

Forward voltage drop

Tj = 25 °C

VR = V

= 2 A

I

F

= 4 A

I

F

RRM

= 100 °C 6 15 mA

T

j

= 25 °C

T

j

T

= 125 °C 0.325 0.375

j

= 25 °C

T

j

T

= 125 °C 0.43 0.51

j

200 µA

0.45

0.53

To evaluate the conduction losses use the following equation:
P = 0.24 x I

F(AV)

+ 0.068 I

F2(RMS)

V

2/10

STPS2L30 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Average forward current

versus ambient temperature
(δ = 0.5) SMB flat

I (A)

F(AV)

2.2

2.0

1.8

δ

=tp/T

R =120°C/W

th(j-a)

T

tp

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 25 50 75 100 125 150

R=R

th(j-a) th(j-l)

T (°C)

amb

SMB flat

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values) SMA

I (A)

M

10

9

8

7

6

5

4

3

2

IM

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMA

T =25°C

a

T =75°C

a

T =125°C

a

Figure 2. Average forward current versus

ambient temperature (δ = 0.5) SMA

I (A)

F(AV)

2.2

2.0

1.8

δ

=tp/T

R =120°C/W

th(j-a)

T

tp

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 25 50 75 100 125 150

R=R

th(j-a) th(j-l)

T (°C)

amb

SMA

Figure 4. Average forward current

versus ambient temperature
(δ = 0.5) SMA flat

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 25 50 75 100 125 150

δ

T

=tp/T

R

=200 °C/W

th(j-a)

tp

R

th(j-a)=Rth(j-l)

T (°C)

amb

SMA-Flat

Figure 6. Non repetitive surge peak forward

current versus overload duration
(maximum values) SMB flat

I (A)

M

30

25

20

15

10

IM

5

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB flat
(non exposed pad)

T =25°C

L

T =75°C

L

T =125°C

L

3/10

Characteristics STPS2L30

Figure 7. Non repetitive surge peak forward

current versus overload duration
(maximum values) SMA flat

I (A)

M

8

7

6

5

4

3

2

I

M

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMA-Flat

Ta=25 °C

Ta=75 °C

Ta=125 °C

Figure 9. Normalized avalanche power

derating versus junction
temperature

P(T)

ARM

ARM

j

T (°C)

j

P (25°C)

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

Figure 11. Relative variation of thermal

impedance junction to lead
versus pulse duration - SMB flat

Z/R

th(j-l) th(j-l)

1.0

SMB flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

Figure 8. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 10. Relative variation of thermal

impedance, junction to ambient,
versus pulse duration - SMA

Z/R

th(j-a) th(j-a)

1.0

SMA

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

T

=tp/T

Figure 12. Relative variation of thermal

impedance junction to ambient
versus pulse duration - SMA flat

Z/R

th(j-a) th(j-a)

1.0

SMA-Flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

tp

4/10

STPS2L30 Characteristics

Figure 13. Reverse leakage current versus

reverse voltage applied (typical
values)

I (mA)

R

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

0 5 10 15 20 25 30

T=150°C

j

T=125°C

j

T=100°C

j

T=25°C

j

V (V)

R

Figure 15. Forward voltage drop versus

forward current (high level)

I (A)

FM

10.0

Tj=125 °C

Tj=125 °C

(maximum values)

(maximum values)

Figure 14. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

100

V (V)

10

1 10 100

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 16. Forward voltage drop versus

forward current ( low level)

I (A)

FM

3.0

2.5

Tj=125 °C

2.0

Tj=125 °C

(maximum values)

(maximum values)

1.0

Tj=125 °C

(typical values)

0.1

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

V (V)

FM

Tj=25 °C

(maximum values)

Figure 17. Thermal resistance junction to

ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA, SMB flat)

R (°C/W)

th(j-a)

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMA

SMB flat)

S (Cm²)

CU

1.5

Tj=125 °C

1.0

0.5

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6

(typical values)

(maximum values)

V (V)

FM

Tj=25 °C

Figure 18. Thermal resistance junction to

ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA flat)

R (°C/W)

th(j-a)

200

180

160

140

120

100

80

60

40

20

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S (Cm²)

CU

SMA-Flat

5/10

Package Information STPS2L30

2 Package Information

● Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.

Table 5. SMA dimensions

Dimensions

®

Ref.

E1

D

E

A1

C

L

A2

b

Figure 19. SMA footprint (dimensions in mm)

1.4

2.63

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

1.4

1.64

6/10

5.43

STPS2L30 Package Information

Table 6. SMA flat (non exposed pad) dimensions

Dimensions

Ref.

A

D

c

A 0.90 1.10 0.035 0.043

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

b 1.25 1.65 0.049 0.065

L 2x

L1 2x

E

E1

c 0.15 0.40 0.006 0.016

D 2.25 2.95 0.088 0.116

E 4.80 5.60 0.189 0.220

L

b

L2 2x

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

L1 0.50 0.019

L2 0.50 0.019

Figure 20. SMA flat (non exposed pad) footprint dimensions

5.52

(0.217)

1.52

(0.060)

1.20

(0.047)

3.12

(0.123)

millime ters

(inches)

1.20

(0.047)

7/10

Package Information STPS2L30

Table 7. SMB flat dimensions

Dimensions

Ref.

A

D

L

E

E1

c

A 0.90 1.10 0.035 0.043

(1)

b

(1)

c

L2

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

L

b

E1 4.05 4.60 0.189 0.181

L1

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

1. Applies to plated leads

Figure 21. SMB flat footprint (dimensions in mm)

5.84

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

1.95 2.20 0.077 0.087

0.15 0.40 0.006 0.016

2.07

1.20 1.203.44

8/10

STPS2L30 Ordering information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS2L30A G30 SMA 0.068 g 5000 Tape and reel

STPS2L30UF FG30 SMB flat 0.050 g 5000 Tape and reel

STPS2L30AF F30 SMA flat 0.035 g 10000 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

Jul-2003 3A Last update.

Aug-2004 4

31-Jan-2007 5

23-Apr-2008 6 Reformatted to current standards. Added SMA flat package.

SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).

Reformatted to current standard. Added ECOPACK
statement. Added SMB flat package.

9/10

STPS2L30

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