Datasheet STPS2L25 Datasheet (ST)

Main product characteristics

d

-

STPS2L25

Low drop power Schottky rectifier

I

F(AV)

V

RRM

(max) 150° C

T

j

(max) 0.375 V

V

F

2 A

25 V

K

A

SMB

STPS2L25U

Features and benefits

■ Very low forward voltage drop for less power

dissipation

■ Optimized conduction/reverse losses trade-off

which means the highest efficiency in the
applications

■ Avalanche capability specified

K

Description

Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters.

Packaged in SMB, SMB flat for thermal resistance
characteristic improvement, this device is
especially intended for use in parallel with
MOSFETs in synchronous rectification.

Table 1. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(AV)

I

FSM

P

ARM

T

stg

T

Ptot

--------------

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Repetitive peak reverse voltage 25 V

Average forward current

SMB T

SMB flat T

Surge non repetitive forward current tp = 10 ms sinusoidal 75 A

Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1500 W

Storage temperature range -65 to + 150 °C

Operating junction temperature

j

1

--------------------------

<

Rth j a–()

(1)

= 125° C δ = 0.5

L

= 135° C δ = 0.5

L

SMB flat

STPS2L25UF

A

2A

150 °C

February 2007 Rev 5 1/9

www.st.com

9

Characteristics STPS2L25

1 Characteristics

Table 2. Thermal resistance

Symbol Parameter Value Unit

SMB 25

R

th(j-l)

Table 3. Static electrical characteristics

Junction to lead

SMB flat 15

Symbol Parameter Test Conditions Min. Typ. Max. Unit

(1)

I

R

V

F

1. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

(1)

Forward voltage drop

Tj = 25° C

Tj = 125° C

Tj = 25° C

Tj = 125° C

Tj = 25° C

Tj = 125° C

VR = V

IF = 2 A

IF = 4 A

RRM

15 30 mA

0.325 0.375

0.43 0.51

90 µA

0.45

0.53

To evaluate the maximum conduction losses, use the following equation:

P = 0.24 x I

F(AV)

+ 0.068 I

F2(RMS)

°C/W

V

2/9

STPS2L25 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6

δ = 0.05

δ = 0.1

δ = 0.2

I (A)

F(AV)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Average forward current

versus ambient temperature
(δ = 0.5) SMB flat

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

=tp/T

δ

0.0

0 25 50 75 100 125 150

T

R =100°C/W

th(j-a)

tp

R=R

th(j-a) th(j-l)

T (°C)

amb

SMB flat

Figure 2. Average forward current versus

ambient temperature (δ = 0.5) SMB

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

=tp/T

δ

0.0

0 25 50 75 100 125 150

T

R =100°C/W

th(j-a)

tp

R=R

th(j-a) th(j-l)

T (°C)

amb

SMB

Figure 4. Non repetitive surge peak forward

current versus overload duration
(maximum values) SMB

I (A)

M

10

9

8

7

6

5

4

3

2

IM

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB

T =25°C

a

T =75°C

a

T =125°C

a

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values) SMB flat

I (A)

M

30

25

20

15

10

IM

5

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB flat

T =25°C

L

T =75°C

L

T =125°C

L

Figure 6. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

3/9

p

10 100 1000

Characteristics STPS2L25

Figure 7. Normalized avalanche power

derating versus junction
temperature

P(t)

ARM p

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 9. Relative variation of thermal

impedance junction to lead
versus pulse duration - SMB flat

Z/R

th(j-l) th(j-l)

1.0

SMB flat

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

Figure 8. Relative variation of thermal

impedance junction to ambient
versus pulse duration - SMB

Z/R

th(j-a) th(j-a)

1.0

SMB

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

δ

=tp/T

T

tp

Figure 10. Reverse leakage current versus

reverse voltage applied (typical
values)

I (mA)

R

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

0 5 10 15 20 25

T=150°C

j

T=125°C

j

T=100°C

j

T=25°C

j

V (V)

R

Figure 11. Junction capacitance versus

reverse voltage applied (typical
values)

C(pF)

1000

100

V (V)

10

1 10 100

R

4/9

F=1MHz

V =30mV

OSC RMS

T=25°C

j

Figure 12. Forward voltage drop versus

forward current (typical values)

I (A)

FM

10.0

T=125°C

j

T=150°C

j

1.0

0.1

0.0 0.1 0.2 0.3 0.4 0.5 0.6

V (V)

FM

T=25°C

j

STPS2L25 Characteristics

Figure 13. Forward voltage drop versus

forward current (maximum values,
high level)

I (A)

FM

10.0

Tj=125 °C

Tj=125 °C

(maximum values)

(maximum values)

1.0

Tj=125 °C

(typical values)

0.1

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

V (V)

FM

Tj=25 °C

(maximum values)

Figure 15. Thermal resistance junction to

ambient versus copper surface
under each lead (epoxy printed
board FR4, e

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMB flat

CU

SMB

S (Cm²)

CU

=35µm)

Figure 14. Forward voltage drop versus

forward current (maximum values,
low level)

I (A)

FM

3.0

2.5

Tj=125 °C

2.0

1.5

1.0

0.5

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6

Tj=125 °C

(maximum values)

(maximum values)

Tj=125 °C

(typical values)

V (V)

FM

Tj=25 °C

(maximum values)

5/9

Package information STPS2L25

2 Package information

● Epoxy meets UL94, V0

Table 4. SMB dimensions

Dimensions

E1

D

E

A1

C

L

A2

b

Ref.

Figure 16. SMB footprint (dimensions in mm)

1.62

2.60

5.84

1.62

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

2.18

6/9

STPS2L25 Package information

Table 5. SMB Flat dimensions

Dimensions

Ref.

A

D

L

E

E1

c

A 0.90 1.10 0.035 0.043

(1)

b

(1)

c

L2

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

L

b

E1 4.05 4.60 0.189 0.181

L1

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

1. Applies to plated leads

Figure 17. SMB Flat footprint (dimensions in mm)

5.84

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

1.95 2.20 0.077 0.087

0.15 0.40 0.006 0.016

2.07

1.20 1.203.44

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.

7/9

Ordering information STPS2L25

3 Ordering information

Ordering type Marking Package Weight Base qty Delivery mode

STPS2L25U G23 SMB 0.107 g 2500 Tape and reel

STPS2L25UF FG23 SMB flat 0.50 g 5000 Tape and reel

4 Revision history

Date Revision Changes

July 2003 4A Last update

08-Feb-2007 5

Reformatted to current standard. Added ECOPACK
statement. Added SMB flat package.

8/9

STPS2L25

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