Datasheet STPS2H100 Datasheet (ST)

Features

STPS2H100

Power Schottky rectifier

■ Negligible switching losses

■ High junction temperature capability

■ Low leakage current

■ Good trade-off between leakage current and

forward voltage drop

■ Avalanche capability specified

Description

Schottky rectifiers designed for high frequency
miniature switched mode power supplies such as
adaptators and on board DC/DC converters.
Available in SMA, SMB, low-profile SMB.

A

K

SMA

STPS2H100A

A

K

SMB flat

STPS2H100UF

Table 1. Device summary

Symbol Value

I

F(AV)

V

RRM

(max) 175 °C

T

j

(max) 0.65 V

V

F

A

K

SMB

STPS2H100U

2 A

100 V

February 2010 Doc ID 6115 Rev 7 1/10

www.st.com

10

Characteristics STPS2H100

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

V

I

F(AV)

I

P

T

1. condition to avoid thermal runaway for a diode on its own heatsink

Table 3. Thermal resistance

Repetitive peak reverse voltage 100 V

RRM

Average forward current

Surge non repetitive forward current tp =10 ms sinusoidal 75 A

FSM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W

ARM

Storage temperature range -65 to + 175 °C

stg

Operating junction temperature

T

j

dPtot

dTj

<

Rth(j-a)

1

SMA / SMB T

SMB flat T

(1)

= 130 °C δ = 0.5

L

= 150 °C δ = 0.5

L

2A

175 °C

Symbol Parameter Value Unit

SMA 30 °C/W

R

th(j-l)

Junction to lead

SMB 25

SMB flat 15

Table 4. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

T

= 25 °C

(1)

I

V

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

Reverse leakage current

R

(2)

Forward voltage drop

F

j

T

= 125 °C 0.4 1 mA

j

= 25 °C

T

j

T

= 125 °C 0.6 0.65

j

T

= 25 °C

j

= 125 °C 0.69 0.74

T

j

V

R

= 2 A

I

F

I

= 4 A

F

= V

RRM

To evaluate the conduction losses use the following equation: P = 0.56 x I

F(AV)

+ 0.045 I

1µA

0.79

V

0.88

F2(RMS)

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STPS2H100 Characteristics

Figure 1. Average forward power dissipation

versus average forward current

P (W)

F(AV)

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

δ = 0.05

I (A)

F(AV)

δ = 0.1

δ = 0.2

δ = 0.5

=tp/T

δ

δ = 1

T

tp

Figure 3. Average forward current versus

ambient temperature (δ = 0.5)
(SMB flat)

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0 25 50 75 100 125 150 175

δ

=tp/T

T

tp

R=R

th(j-a) th(j-l)

T (°C)

amb

SMB flat

R =40°C/W

th(j-a)

. S =2.5 cm

CU

2

Figure 5. Normalized avalanche power

derating versus junction
temperature

P(Tj)

ARM

P (25 °C)

ARM

1.2

1

0.8

0.6

0.4

0.2

0

25 50 75 100 125 150

T (°C)

j

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)
(SMA / SMB)

I (A)

F(AV)

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

SMA
R =100°C/W

th(j-a)

2

S =1.5cm

(CU)

T

tp

=tp/T

δ

0 25 50 75 100 125 150 175

R=R

th(j-a) th(j-I)

SMB
R =80°C/W

th(j-a)

S =1.5cm

(CU)

T (°C)

amb

SMB

SMA

2

Figure 4. Normalized avalanche power

derating versus pulse duration

P(tp)

ARM

P (1 µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 6. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMA)

I (A)

M

10

9

8

7

6

5

4

3

IM

2

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMA

T =25°C

a

T =75°C

a

T =125°C

a

Doc ID 6115 Rev 7 3/10

Characteristics STPS2H100

Figure 7. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMB)

I (A)

M

10

9

8

7

6

5

4

3

IM

2

1

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB

T =25°C

a

T =75°C

a

T =125°C

a

Figure 9. Relative variation of thermal

impedance junction to ambient
versus pulse duration (SMA / SMB)

Z/R

th(j-a) th(j-a)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

t (s)

p

SMB

SMA

δ

=tp/T

T

tp

Figure 11. Reverse leakage current versus

reverse voltage applied
(typical values)

I (µA)

R

1.E+04

1.E+03

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

0 20406080100

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

V (V)

R

Figure 8. Non repetitive surge peak forward

current versus overload duration
(maximum values) (SMB flat)

I (A)

M

30

25

20

15

10

IM

5

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

SMB flat

T =25°C

L

T =75°C

L

T =125°C

L

Figure 10. Relative variation of thermal

impedance junction to lead
versus pulse duration (SMB flat)

Z/R

th(j-l) th(j-l)

1.0

SMB flat
(non exposed pad)

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

Single pulse

0.1

0.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

t (s)

p

Figure 12. Junction capacitance versus

reverse voltage applied
(typical values)

C(pF)

100

V (V)

10

1 10 100

R

F=1MHz

V =30mV

OSC RMS

T=25°C

j

4/10 Doc ID 6115 Rev 7

STPS2H100 Characteristics

Figure 13. Forward voltage drop versus

forward current (low level)

I (A)

FM

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

Tj=125°C

Tj=125°C

(Typical values)

(Typical values)

(Maximum values)

V (V)

FM

Tj=25°C

Figure 15. Thermal resistance junction to

ambient versus copper surface
under each lead (SMA)

R (°C/W)

th(j-a)

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

S (cm²)

CU

SMA

Figure 14. Forward voltage drop versus

forward current (high level)

I (A)

FM

100

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

Tj=125°C

Tj=125°C

(Typical values)

(Typical values)

10

Tj=25°C

(Maximum values)

V (V)

1

0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8

FM

Figure 16. Thermal resistance junction to

ambient versus copper surface
under each lead (SMB)

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

S (cm²)

CU

SMB

Figure 17. Thermal resistance junction to ambient versus copper surface under each lead

(SMB flat)

R (°C/W)

th(j-a)

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Epoxy printed circuit board FR4,

Copper thickness = 35 µm

SMB flat

S (cm²)

CU

Doc ID 6115 Rev 7 5/10

Package information STPS2H100

2 Package information

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. SMA dimensions

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

.

Dimensions

Ref.

E1

Millimeters Inches

Min. Max. Min. Max.

D

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

E

A1

C

L

A2

b

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

Figure 18. SMA footprint (dimensions in mm)

1.4

2.63

1.4

5.43

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1.64

STPS2H100 Package information

Table 6. SMB dimensions

Dimensions

E1

D

E

A1

C

L

A2

b

Ref.

Figure 19. SMB footprint (dimensions in mm)

1.62

2.60

5.84

1.62

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.096

A2 0.05 0.20 0.002 0.008

b 1.95 2.20 0.077 0.087

c 0.15 0.40 0.006 0.016

E 5.10 5.60 0.201 0.220

E1 4.05 4.60 0.159 0.181

D 3.30 3.95 0.130 0.156

L 0.75 1.50 0.030 0.059

2.18

Doc ID 6115 Rev 7 7/10

Package information STPS2H100

Table 7. SMB flat dimensions

Dimensions

Ref.

A

D

L

E

E1

c

A 0.90 1.10 0.035 0.043

(1)

b

(1)

c

L2

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

L

b

E1 4.05 4.60 0.189 0.181

L1

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

1. Applies to plated leads

Figure 20. SMB flat footprint (dimensions in mm)

5.84

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

1.95 2.20 0.077 0.087

0.15 0.40 0.006 0.016

2.07

1.20 1.203.44

8/10 Doc ID 6115 Rev 7

STPS2H100 Ordering information

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS2H100A S21 SMA 0.068 g 5000 Tape and reel

STPS2H100U G21 SMB 0.107 g 2500 Tape and reel

STPS2H100UF FG21 SMB flat 0.050 g 5000 Tape and reel

4 Revision history

Table 9. Document revision history

Date Revision Changes

Jul-2003 4A Last update.

Aug-2004 5

08-Feb-2007 6

SMA package dimensions update. Reference A1 max.
changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches).

Reformatted to current standards. Added ECOPACK
statement. Added SMB flat package.

15-Feb-2010 7 Updated weight for SMB flat in Table 8.

Doc ID 6115 Rev 7 9/10

STPS2H100

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10/10 Doc ID 6115 Rev 7