Datasheet STPS20L25CG, STPS20L25CT Datasheet (SGS Thomson Microelectronics)

®

LOW DROP POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTIC S

STPS20L25CT/CG

I

F(AV)

V

RRM

2 x 10 A

25 V

Tj (max) 150 °C

(max) 0.35 V

V

F

FEATURES AND BENEFITS

VERY LOW F O RW ARD VOLTAG E DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK

OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS

DESCR IPTION

Dual center tap Schottky rectifier suited to
Switched Mode Power Supplies and high
frequency DC to DC converters.

Packaged in TO-220AB and D

2

PAK, this device is
especially intended for use as a rectifier at the
secondary of 3.3V SMP S units.

A1

A2

A1

TO-220AB

STPS20L25CT

K

K

A2

K

A2

A1

D2PAK

STPS20L25CG

ABSOLUTE RATINGS

(limiting values, per diode)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

I

RRM

I

RSM

T

stg

Repetitive peak reverse voltage 25 V
RMS forward current 30 A
Average forward current Tc = 145°C

δ

= 0.5

Per diode
Per device

10

20
Surge non repetitive forward current tp = 10 ms S inusoidal 220 A
Repetitive peak reverse current tp=2 µs square F=1kHz 1 A
Non repetitive peak reverse current tp = 100 µs square 3 A
Storage temperature range - 65 to + 150

Tj Maximum operating junction temperature * 150 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

dPtot

* :

June 1999 - Ed : 3A

dTj

<

1

Rth(j−a

thermal runaway condition for a diode on its own heatsink

)

A

°

C

1/5

STPS20L25CT/CG

THERMAL RE SISTA NC ES

Symbol Parameter Value Unit

R

th (j-c)

Junction to case Per diode 1.5

Total 0.8

R

th (c)

Coupling

0.1

When the diodes 1 and 2 are used simultaneously :

∆

Tj(diode 1) = P(diode1) x R

(Per diode) + P(diode 2) x R

th(j-c)

th(c)

STATIC ELECTRICAL CHARACTE RISTICS (per diode)

Symbol Tests conditions Tests conditions Min. Typ. Max. Unit

I

* Reverse leakage current Tj = 25°CV

R

= V

R

RRM

800

Tj = 125°C 125 250 m A

V

* Forward voltage drop Tj = 25°CI

F

Tj = 125°CI
Tj = 25°CI
Tj = 125°CI

= 10 A 0.46 V

F

= 10 A 0.30 0.35

F

= 20 A 0.56

F

= 20 A 0.41 0.48

F

°

C/W

µ

A

Pulse test : * tp = 380 µs, δ < 2%

To evaluate the maximum conduction losses use the following equation :
P = 0.22 x I

Fig.1 :

Average forward power dissipation versus

average forward current.

PF(av)(W)

5

4

3

2

1

0

01234567891011

F(AV)

δ = 0.05

+ 0.013 I

δ = 0.1

IF(av) (A)

F2(RMS )

δ = 0.2

δ = 0.5

δ

=tp/T

T

δ = 1

Fig.2 :

Average forward current versus ambient

temperature ( δ = 0.5).

IF(av)(A)

12
10

8
6
4
2

tp

0

0 25 50 75 100 125 150

δ

=tp/T

T

tp

Rth(j-a)=Rth(j-c)

Rth(j-a)=50°C/W

Tamb(°C)

2/5

STPS20L25CT/CG

Fig.3 :

Non repetitive surge peak forward current

versus overload duration (maximum values).

IM(A)

200
180
160
140
120
100

80
60

I

M

40
20

0

1E-3 1E-2 1E-1 1E+0

Fig.5 :

t

δ

=0.5

t(s)

Reverse leakage current versus reverse

Tc=25°C

Tc=75°C

Tc=100°C

voltage applied (typical values).

IR(mA)

5E+2
1E+2

1E+1

1E+0

Tj=150°C

Tj=125°C

Fig.4 :

Relative variation of thermal impedance

junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

1.0

0.8

δ = 0.5

0.6

0.4

δ = 0.2

δ = 0.1

0.2

0.0

1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+0

Fig.6 :

Single pulse

Junction capacitance versus reverse

tp(s)

δ

=tp/T

T

tp

voltage applied (typical values).

C(nF)

5.0

1.0

F=1MHz
Tj=25°C

1E-1

1E-2

0 5 10 15 20 25

Fig.7 :

Forward voltage drop versus forward

Tj=25°C

VR(V)

current (maximum values).

IFM(A)

100.0

Typical values

10.0

1.0

0.1

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

Tj=150°C

Tj=25°C

Tj=125°C

VFM(V)

0.1
12 51020 50

Fig.8 :

Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 µm).
(STPS20L25G only)

Rth(j-a) (°C/W)

80
70
60
50
40
30
20

VR(V)

10

0

0 4 8 12 16 20 24 28 32 36 40

S(Cu) (cm²)

3/5

STPS20L25CT/CG

PACKAGE MECHANICAL DAT A

2

PAK

D

E

L2

L

L3

A1

B2

B

G

* FLAT ZONE NO LESSTHAN 2mm

C2

DIMENSIONS

REF.

A

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009

D

B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

A2

L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069

M

*

V2

M 2.40 3.20 0.094 0. 126
R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

FOOTPRINT DIMENSIONS

16.90

10.30

8.90

4/5

(in millimeters)

1.30

3.70

Cooling method: by conduction ( method C)

5.08

PACKAGE ME CHANICAL D AT A

TO-220AB

H2

Dia

L5

L6

L2

F2
F1

F

G1

G

L9

L4

STPS20L25CT/CG

DIMENSIONS

REF.

A

C

A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107

L7

E 0.49 0.70 0.019 0.027

F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066

D

G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.

M

E

L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

Diam. 3.75 3.85 0.147 0.151

Millimeters Inches

Min. Max. Min. Max.

Cooling method : C
Recommended torque value : 0.55 m.N
Maximum torque value : 0.70 m.N

Ordering type Marking Package Weight Base qty

Delivery

mode

STPS20L25CT STPS20L25CT TO-220AB 2.23g 50 Tube

2

STPS20L25CG STPS20L25CG D

STPS20L25CG-TR STPS20L25CG D

PAK 1.48g 50 Tube

2

PAK 1.48g 1000 Tape & reel

Epoxy meets UL94,V0

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