The STLC3055 is a SLIC device specifically designed for WLL (Wireless Local Loop) and ISDNTerminalAdaptors. One of the distinctive characteristic of this device is theability to operate with
a single supply voltage (from +5.5V to +15.8V)
and self generate the negative battery by means
of an on chip DC/DC converter controller that
drives an externalMOSswitch.
The battery level is properly adjusted depending
on the operatingmode. A useful characteristic for
TQFP44
STLC3055QTR
October 1999
TX
RX
ZAC1
ZAC
RS
ZB
CKTTX
CTTX1
CTTX2
FTTX
D0D1D2DET
INPUT LOGICAND DECODER
Status and functions
SUPERVISION
AC PROC
TTX PROC
RTTX CAC ILTF RD IREF RLIM RTH
REFERENCE
OUTPUT LOGIC
LINE
DRIVER
Vcc
Vss
Agnd
OUTPUT
STAGE
DC PROC
DC/DC
CONV.
VOLT.
REG.
AGND
Vbat
BGND
TIP
RING
CREV
CSVR
CLK
RSENSE
GATE
VF
CVCC
VPOS
VBAT
1/22
Page 2
STLC3055
DESCRIPTION (continued)
these applications is the integratedringing generator.
The control interface is a parallel type with open
drainoutput and3.3V logiclevels.
The metering pulses are generated on chip starting fromtwo logic signals(0, 3.3V) one define the
metering pulse frequency and the other the meteringpulse duration. An on chipcircuit then provides the proper shaping and filtering. Metering
pulse amplitude and shaping (rising and decay
time) can be programmed by external components. A dedicated cancellation circuit avoid pos-
PIN CONNECTION
VBAT1
CREV
N.C.
TIP
44 43 42 41394038 37 36 35 34
sible CODEC input saturation due to Metering
pulse echo.
Constant current feed can be set from 20mA to
40mA. Off-hook detection threshold is programmable from 5mAto 9mA.
The device, developed in BCD100II technology
(100V process), operates in the extended temperature range and integrates a thermal protection that sets the device in power down when Tj
exceeds140°C.
N.C.
N.C.
N.C.
RING
N.C.
VBAT
BGND
RES
N.C.
N.C.
DET
CKTTX
CTTX1
CTTX2
1
D0
2
D1
3
D2
4
PD
5
6
7
8
9
10
12 13 14 15 16
RX
FTTX
RTTX
171118 19 20 21 22
ZB
RS
ZAC
ZAC1
CAC
TX
VF
CLK
33
32
31
30
29
28
27
26
25
24
23
D97TL279A
CSVR
ILTF
RD
RTH
IREF
RLIM
AGND
CVCC
VPOS
RSENSE
GATE
ABSOLUTEMAXIMUM RATINGS
SymbolParameterValueUnit
V
pos
A/BGNDAGND to BGND-1 to +1V
V
dig
T
j
(1)
V
btot
Positive Supply Voltage-0.4 to +17V
Pin D0, D1, D2, DET, CKTTX-0.4 to 5.5V
Max. junction Temperature150°C
Vbtot=|Vpos|+|Vbat|. (Totalvoltage applied tothe device
100V
supply pins).
(1) Vbat is selfgenerated bythe on chip DC/DC converter and can be programmed via RF1 and RF2.
RF1and RF2 shall beselected in order tofulfil the a.mlimits (see External Components Table page 10)
2/22
Page 3
STLC3055
OPERATINGRANGE
SymbolParameterValueUnit
V
pos
A/BGNDAGND to BGND-100 to +100V
V
dig
T
op
(1)
V
bat
(1) Vbat is selfgenerated bythe on chip DC/DC converter and can be programmed via RF1 and RF2.
RF1and RF2 shall beselected in order tofulfil the a.mlimits (see External Components Table page 10)
THERMALDATA
SymbolParameterValueUnit
R
thj-amb
PIN DESCRIPTION
N.NameFunction
25VPOSPositive supply inputranging from 5.5Vto 15.8V.
34BGNDBattery Ground, must beshorted with AGND.
27AGNDAnalog Ground, must be shortedwith BGND.
16ZACAC impedance synthesis.
15ZAC1RX bufferoutput, the AC impedanceis connected fromthis node to ZAC.
17RSProtection resistors image (theimage resistor is connectedfrom this node to ZAC).
18ZBBalance Networkfor 2 to 4 wire conversion (the balanceimpedance ZB is connectedfrom this
20TX4 wire output port (TXoutput). The signal is referred toAGND. If connected to single supply
14RX4 wireinput port (RX input); 300KΩinput impedance. This signal is referred to AGND. If
19CACAC feedbackinput, AC/DC split capacitor (CAC).
32ILTFTransversal line current image output.
41TIP2 wire port; TIP wire (Ia is the current sourced from this pin).
37RING2 wire port;RING wire (Ib is the current sunk into thispin).
28RLIMConstant current feedprogramming pin (viaRLIM). RLIM should be connected close to this
30RTHOff-hook threshold programming pin (via RTH).RTH should be connected close to this pin
29IREFInternal bias current setting pin. RREF should be connected close to this pin and PCB layout
43CREVReverse polaritytransition time control.One proper capacitor connected between thispin and
31RDDC feedback and ring trip input. RD should be connected closeto this pin and PCBlayout
Positive Supply Voltage5.5 to +15.8V
Pin D0, D1, D2, DET, CKTTX, PD-0.25 to 5.25V
Ambient Operating Temperature Range-40 to +85°C
Self Generated Battery Voltage-74 max.V
Thermal Resistance Junctionto AmbientTyp.60°C/W
node to AGND. ZA impedance is connected from this node to ZAC1).
CODEC input it must beDC decoupled with proper capacitor.
connected to single supply CODECoutput itmust beDC decoupledwith proper capacitor.
pin andPCB layout should avoid noise injection on this pin.
and PCB layout should avoid noise injectionon this pin.
should avoid noise injection on this pin.
AGND is setting the reverse polarity transitiontime. This is the same transitiontime used to
shape the”trapezoidal ringing” during ringing injection.
should avoid noise injection on this pin.
3/22
Page 4
STLC3055
PIN DESCRIPTION (continued)
N.NameFunction
4PDPower Down input. Normally connected to CVCC (or to logic level high). Can beused to set
26CVCCInternal positive voltage supplyfilter.
35VBATRegulated battery voltage self generated by the device via DC/DC converter. Must be shorted
23GATEDriver for external Power MOS transistor.
21VFFeedback inputfor DC/DC converter controller.
22CLKPower Switch ControllerClock (typ. 125KHz). From version marked STLC3055 A5, this pin
24RSENSEVoltage input for current sensing. RSENSE should beconnected close to this pin and VPOS
8DETLogic interface output of the supervision detector(active low).
33CSVRBattery supply filter capacitor.
12RTTXMetering pulse cancellation buffer output. TTX filter network should be connected to this point.
13FTTXMetering pulse buffer input this signal is sent to the line andused to perform TTX filtering.
10CTTX1Metering burst shaping external capacitor.
11CTTX2Metering burst shaping external capacitor.
9CKTTXMetering pulse clock input (12 KHz or 16KHz square wave).
44VBAT1Frame connection. Must be shorted to VBAT.
5RESReserved, must be connected toAGND.
6, 7,36,
38,39,
40,42
NCNot connected.
FUNCTIONALDESCRIPTION
The STLC3055 is a device specifically developed
for WLL and ISDN-TAapplications.
It is based on a SLIC core, on purpose optimised
for these applications, with the addition of a
DC/DC converter controller to fulfil the WLL and
ISDN-TAdesignrequirements.
The SLIC performs the standard feeding, signallingand transmissionfunctions.
It can be set in three different operating modes
via the D0, D1, D2 pins of the control logic interface (0 to 3.3V logic levels). The loop status is
carriedout onthe DET pin (activelow).
The DETpin is an opendrain output to alloweasy
interfacingwithboth 3.3Vand 5Vlogic levels.
The fourpossible SLIC’soperatingmodes are:
Power Down
TIP andRing terminals in open circuitsetting PD=0 and D0=D1=0.
to VBAT1.
can also be connected to CVCC or AGND. Whenthe CLK pin is connected toCVCC an
internal auto-oscillation is internally generatedand it is used instead of the external clock.
When the CLK pin is connected to AGND, theGATE output is disabled.
pin. The PCB layoutshould minimize the extra resistanceintroduced bythe copper tracks.
If notused should be left open.
HighImpedanceFeeding (HI-Z)
Active
Ringing
Table 1shows how to set the differentSLIC operatingmodes.
The DC/DC converter controller is driving an external power MOS transistor (P-Channel) in order
to generate the negative battery voltage needed
for device operation.
The DC/DC converter controller is synchronised
withan externalCLK (125KHZtyp.).
From version marked STLC3055 A5, it can be
synchronisedto an internalclock generatedwhen
the pin CLK is connected to CVCC. One sensing
resistor in series to Vpos supply allows to fix the
maximumallowed input peakcurrent.This feature
is implemented in order to avoid overload on
Vpos supply in case of line transient (ex. ring trip
detection).
The typical value is obtained for a sensing resistor equal to 110mΩ that will guarantee an average current consumptionfrom Vpos < 700mA.
When in on-hook the self generated battery voltage is set to a predefinedvalue.
This value can be adjustedvia one externalresistor (RF1) and it is typical -50V. When RINGmode
is selectedthis valueis increasedto -70V typ.
Once the line goes in off-hook condition, the
DC/DC converter automatically adjust the generated battery voltage in order to feed the line with
a fixedDC current(programmablevia RLIM) optimising in this way the power dissipation.
This operating mode is normally selected when
the telephoneis in on-hook in order to monitorthe
line status keeping the power consumption at the
minimum.
The output voltage in on-hook condition is equal
totheself generatedbatteryvoltage(-50V typ).
When off-hook occurs the DET becomes active
(lowlogic level).
The off-hook threshold in HI-Z mode is the same
value asprogrammed inACTIVE mode.
The DC characteristic in HI-Z mode is just equal
to the self generated battery with 2x(1500W+Rp)
in series (see fig.1), where Rp is the externalprotectionresistance.
Figure1. DCCharacteristicin HI-Z Mode.
IL
Vbat
2x(R1+Rp)
Slope: 2x(R1+Rp)
(R1=1500ohm)
OPERATINGMODES
Power Down
DC CHARACTERISTIC& SUPERVISION
Whenthis modeis selected theSLIC is switched
off and the TIP and RING pins are in high impedance. Also the line detectorsare disabled thereforethe off-hookconditioncannot be detected.
This mode can be selected in emergency condition when it is necessary to cut any current deliveredto the line.
This mode is alsoforced by STLC3055 in case of
thermaloverload(Tj > 140°C).
In this case the device goes back to the previous
status as soon as the junction temperature decreaseunder the hysteresisthreshold.
AC CHARACTERISTICS
The 2W port is set in high impedance, the TX
output buffer is a low impedance output, no AC
transmissionis possible.
High Impedance Feeding (HI-Z)
DC CHARACTERISTIC& SUPERVISION
VL
Vbat (-50V)
AC CHARACTERISTICS
The AC impedance shown at the 2W port
(TIP/RING) is the same as the DCone. The
TIP/RINGAC impedance will be 2x(1500Ω+ Rp)
or highimpedance.
Active
DC CHARACTERISTICS & SUPERVISION
When this mode is selected the STLC3055 pro-
videsboth DC feedingandAC transmission.
The STLC3055 feedsthe line witha constantcur-
rent fixed by RLIM (20mA to 40mA range). The
on-hook voltage is typically 40V allowing on-hook
transmission;the selfgeneratedVbat is-50V typ.
If the loop resistance is very high and the line
current cannot reach the programmed constant
currentfeed value,the STLC3055 behaveslike a
40V voltage source with a series impedance
equal to the protection resistors 2xRp (typ.
2x41Ω) plus the internal resistance. Fig. 2 shows
thetypical DCcharacteristicin ACTIVE mode.
5/22
Page 6
STLC3055
Figure2. DC characteristicin ACTIVE mode
IL
Ilim
(20 to
40mA)
2Rp
10V
VL
Vbat (-50V)
The line status (on/off hook) is monitored by the
SLIC’s supervision circuit. The off-hook threshold
can be programmed via the externalresistor R
TH
in the range from5mA to 9mA.
Independentlyon the programmed constant cur-
rent value, the TIP and RING buffers have a currentsource capabilitylimited to70mA typ.
Moreover the power available at Vbat is controlled by the DC/DC converter that limits the peak
current drawn from the Vpos supply. The maximum allowed current peak is set by the R
SENSE
resistorand it is typically900mApk.
POLARITYREVERSAL
The D2 bit controls the line polarity, the transition
betweenthe two polaritiesis performed in a ”soft”
way. This means that the TIP and RING wire exchange their polarities following a ramp transition
(see fig.3). The transition time is controlled by an
external capacitor CREV. This capacitor is also
setting the shape of the ringing trapezoidal waveform.
Whenthe control pins set battery reversal the line
polarity is reversed with a proper transition time
setvia an externalcapacitor(CREV).
Figure3. TIP/RING typical transitionfrom
Directto ReversePolarity
GND
TIP
4V typ.
40V typ
ON-HOOK
dV/dT set
by CREV
RING
AC CHARACTERISTICS
The SLIC provides the standard SLIC transmis-
sion functions:
Input impedance synthesis: can be real or
complex and is set by a scaled (x50) external
ZACimpedance.
Transmit and receive: The AC signal present
on the 2W port (TIP/RING)is transferredto the
TX outputwith a -6dBgain and from the RX input to the2W portwith a 0dBgain.
2 to 4 wire conversion: The balance impedance can be real or complex, the proper cancellation is obtained by means of two external
impedanceZA and ZB.
Once in Active mode (D1=1) the SLIC can operate in different states setting properly D0 and D2
controlbits (see also Table 2).
METERING PULSE INJECTION(TTX)
The metering pulses circuit consist of a burst
shaping generator that gives a square wave
shaped and a low pass filter to reduce the harmonic distortionof theoutput signal.
The metering pulse is obtained starting from two
logicsignals:
CKTTX: is a square wave at the TTX frequency (12 or 16KHz) and should be permanently applied to the CKTTX pin or at least for
all the duration of the TTX pulse (including rising and decayphases).
D0: enable the TTX generation circuit and definethe TTXpulse duration.
This two signals are then processed by a dedicated circuitry integrated on chip that generate
the metering pulse as an amplitude modulated
shaped squarewave (SQTTX)(see fig.4).
Both the amplitude and the envelope of the
squarewave (SQTTX) can be programmed by
means of external components. In particular the
amplitudeis set by the two resistorsRLV and the
6/22
Page 7
Figure4. Meteringpulse generationcircuit.
CTTX1
STLC3055
Low PassFilter
C1
RLV
BURST
SHAPING
GENERATOR
D0
CKTTX
Square wavepulse metering
CS
CTTX2
SQTTX
RLV
shapingby thecapacitorCS.
The waveform so generated is then filtered and
injectedon the line.
The lowpass filtercan be obtained usingthe inte-
grated buffer OP1 connected between pin FTTX
(OP1 non inverting input) and RTTX(OP1 output)
(see fig.4) and implementing a ”Sallen and Key”
configuration.
Dependingon the externalcomponents count it is
possible to build an optimisedapplication depending on the distortion level required. In particular harmonic distortion levels equal to 13%,
6% and 3% can be obtained respectively with
first,second andthirdorder filters(see fig.4).
The circuit showed in the ”Applicationdiagram” is
relatedto thesimple firstorderfilter.
Once the shaped and filtered signal is obtained at
RTTX buffer outputit is injectedon the TIP/RING
pins with a +6dBgain.
It should be noted that this is the nominal condition obtained in presence of ideal TTX echo cancellation(obtained via proper settingof RTTXand
CTTX). In addition the effective level obtained on
the line will depend on the line impedance, the
protection resistor value and the series switch
(SW1or SW2)on resistance.
In the typical application (TTX line impedance
=200Ω ,RP=41Ω, SW1,2 on resistance = 9Ω
and ideal TTX echo cancellation) the metering
pulse level on the line will be 1.33 timesthe level
appliedto theRTTX pin.
RTTX
R1
CFL
R2
FTTX
OP1
+
C2
Sinusoidalwave
pulse metering
Required external components vs.filter order.
Order CFLR1C!R2C2THD
1X13%
2XXXX6%
3XXXXX3%
As already mentioned the metering pulse echo
cancellationis obtained by means of two external
components(RTTXand CTTX) thatshould match
the line impedance at the TTX frequency. This
simplenetwork has a doubleeffect:
Synthesise a low output impedance at the
TIP/RINGpins at theTTXfrequency.
Cut the eventual TTX echo that will be transferredfromthe line tothe TX output.
Ringing
When this mode is selected STLC3055 self generate an higher negativebattery (-70V typ.) in order to allow a balanced ringing signal of typically
65Vpeak.
In this condition both the DC and AC feedback
loop are disabled and the SLIC line drivers operateas voltagebuffers.
The ring waveform is obtained toggling the D2
controlbit atthedesired ringfrequency.This bitin
fact controls the line polarity (0=direct; 1=reverse). As in the ACTIVE mode the line voltage
transition is performed with a ramp transition,obtaining in this way a trapezoidal balanced ring
waveform(seefig.5).
The shaping is defined by the CREV external
capacitor.
Selecting the proper capacitor value it is possible
toget differentcrest factorvalues.
The following table shows the crest factor values
7/22
Page 8
STLC3055
Figure 5. TIP/RING typical ringingwaveform
GND
2.5V typ.
TIP
65V
typ.
dV/dT set
byCREV
RING
VBAT
2.5V typ.
obtained with a 20Hz and 25Hz ring frequency
and with 1REN. This value are valid either with
Europeanor USA specification:
If for any reason the ringer load will be too high
the self generated battery will drop in order to
keep thepower consumptionto thefixed limit and
therefore also the ring voltage level will be reduced.
In the typical application with R
SENSE
= 110mΩ
the peak current from Vpos is limited to about
900mA, which correspond to an average current
of 700mA max. In this condition the STLC3055
can drive up to 3REN with a ring frequency
fr=25Hz (1REN = 1800Ω + 1.0µF, European
standard).
In order to drive up to 5REN (1REN= 6930Ω +
8µF, US standard) it is necessary to modify the
externalcomponentsas follows:
CREV = 15nF
RD = 2.2KΩ
Power On Requirements
In order to avoid damage to the device when
Vpos is first appliedit is recommendedto keep all
the logic inputs to a lowlogic level (0V)until Vpos
is >5.5V.
In case this power up sequence cannot be guaranteed it’s recommended to connect a shottkydiode (BAT46 or equivalent) between VBAT and
BGNDsee figurebelow.
The ring trip detection is performed sensing the
variation of the AC line impedance from on hook
(relatively high) to off-hook (low). This particular
ring tripmethod allows to operatewithoutDC offset superimposed on the ring signal and therefore
obtaining the maximumpossible ring level on the
load starting from a givennegative battery.
It should be noted that such a method is optimised for operationon shortloop applicationsand
may not operateproperly in presenceof long loop
applications(>500Ω ).
Once ring trip is detected,the DET output is activated (logic level low), at this point the card controller or a simple logic circuitshould stop the D2
toggling in order to effectivelydisconnect the ring
signal and then set the STLC3055 in the proper
operatingmode (normallyACTIVE).
RING LEVEL IN PRESENCE OF MORE TELEPHONEIN PARALLEL
As already mentioned above the maximum current that can be drawn from the Vpos supply is
controlledand limitedvia theexternal RSENSE.
This will limit also the power available at the self
generatednegative battery.
Figure 6. Shottkydiode connection
BGND
STLC3055
VBAT
BAT46
8/22
Page 9
STLC3055
LayoutRecommendation
A properly designed PCB layout is a basic issue
to guarantee a correct behaviour and good noise
performances.
Particularcare must be taken on the ground connection and in this case the star configuration allowssurely to avoid possibleproblems(see ApplicationDiagram Fig. 7).
The ground of the power supply (VPOS) has to
be connected to the center of the star, let’s call
this point PGND. This point shouldshow a resistance as low as possible, that means it should be
a groundplane.
Noise sources can be identified in not enough
good grounds, not enough low impedance supplies and parasitic coupling between PCB tracks
and high impedancepins of the device.
In particular to avoid noise problems the layout
should prevent any coupling between the DC/DC
converter components and analog pins that are
referred to AGND (ex: RD, IREF, RTH, RLIM,
VF). As a first reccomendation the components
CV, L, D1, CVPOS, RSENSE should be kept as
close as possible to each other and isolated from
the other components.
Additionalimprovements can be obtained:
decoupling the center of the star from the analog ground of STLC3055using smallchokes.
adding a capacitor in the range of 100nF between VPOS and AGND in order to filter the
switchfrequency on VPOS.
ExternalComponents List
In order to properly define the external components value the following system parameters
have to be defined:
The ACinput impedanceshown by the SLIC at
the line terminals ”Zs” to which the return loss
measurement is referred. It can be real (typ.
600Ω) or complex.
The AC balance impedance, it is the equivalent impedance of the line ”Zl” used for evaluation of the trans-hybrid loss performances
(2/4 wire conversion). It is usually a complex
impedance.
The value of the two protection resistors Rp in
series with theline termination.
The line impedance at the TTX frequency
”Zlttx”.
The metering pulse level amplitude measured
at line termination ”V
der filtering, V
LOTTX
”. In case of low or-
LOTTX
represents the amplitude
(Vrms) of the fundamental frequency component.(typ 12 or 16KHz).
Pulse metering envelope rise and decay time
constant”τ”.
The slope of the ringing waveform”∆V
TR
/
”.
∆
T
The value of the constant current limit current
”Ilim”.
The value of the off-hook current threshold
”.
”I
TH
The value of the ring trip rectified average
thresholdcurrent”I
RTH
”.
The value ofthe requiredself generated negative battery ”V
”in ring mode (max value
BATR
is 70V). This value can be obtained from the
desiredring peak level +5V.
The value of the maximum current peak sunk
fromVpos ”IPK”.
RDS(ON)≤1.2Ω,VDS = -100V
Total gate charge=20nC max.
with VGS=4.5Vand VDS=1V
ID>500mA
D1DC/DC converter series diodeVr > 100V, t
RSENSEDC/DC converter peak current
RSENSE = 100mV/I
50nsSMBYW01-200
≤
RR
PK
limiting
L (8)DC/DC converterinductorDC Resistance≤0.1Ω(9)L=125µH RFP1304PV
CF1DC/DC converter feedback loop
stability
RF1Negative battery programming
250KΩ<RF1<300KΩ(7)300kW 1%
level
RF2Negative battery programming
level
Possible choiches:
IRF9510 or IRF9520or
IRF9120 or equivalent
or equivalent
110mΩ
@I
= 900mA
PK
(Manuf.: All Inductive)
or SUMIDA CDRH125
or equivalent
220pF to470pF (10)
@V
BATR
9.1kΩ 1%
STLC3055
= -70V
(1) In caseZs=Zl, ZA and ZB can bereplaced by two resistors of same value:RA=RB=|Zs|.
(2) In thiscase CTTXis justoperating as a DC decouplingcapacitor (fp=100Hz).
(3) Defining ZTTXas theimpedance ofRTTX in series with CTTX,RTTX and CTTXcanalso be calculated from the following formula:
ZTTX=50*(Zlttx+2Rp+18Ω).
(4) CVpos should be defined depending on the power supply currentcapability and maximum allowable ripple.
(5) For lowripple application use 2x47µF in parallel.
(6) Can be saved if proper PCB layout avoid noise coupling on RD pin (high impedanceinput).
(7) RF1 setsthe selfgenerated battery voltage in RING and ACTIVE(Il=0) mode asfollows:
267k
Ω
V
BAT(ACTIVE)
V
BATR(RING)
VBATR should be defined considering the ringpeak level required (Vringpeak=VBATR-6V typ.).
The above relation is valid provided that the Vpos power supply current capability and the RSENSE programming allow to source all the
current requested by the particularringer loadconfiguration.
(8) Core: MICROMETALS T50-26CIRON POWDER, AL-VALUE 61nH/N2
Current rating: 2A (50/60Hz)
Operating Temperature -25° to+60° Centigrades
Inductance: 14µH +/-15% at1KHz, 1mA
DC resistance of winding:MAX.100 mOhm
Code: RFY1303
Wire: UEW2,0,60 mm
Turns: 50
Inductance (f=1KHz): >125µH
(9) For highefficiency in HI-Z mode coil resistance @125kHz must be <3ohm
(10) Functionof thiscapacitor is to introduce a zero at the resonance frequency for loopstability.In case some parasitic resistance are already
present in the loop (Coil, CVBAT, PCB layout), the presence of this capacitor can degrade the device noise performances; in this case CF1
should be removedbeing the loop stabilityalready guaranteed by theparasitic resistance.
Testconditions:V
Externalcomponentsas listedin the ”Typical Values” columnof EXTERNAL COMPONENTSTable.
Note: Testing of all parameteris performedat 25°C. Characterisation aswell as design rules used allow
correlationof tested performancesat other temperatures.All parameterslisted here are met in the operating range: -40to +85°C.
DC CHARACTERISTICS
SymbolParameterTest ConditionMin.Typ.Max.Unit
V
lohi
V
lohi
V
loa
V
loa
IlimLim. currentprogramming range ACTIVE mode2040mA
Referring to the application diagram shown in fig. 7 of the STLC3055 datasheet and using as external
components the Typ. Values specified in the ”External Components” Table (page 13) find below the
properconfigurationfor eachmeasurement.
All measurements requiring DC current termination should be performed using ”Wandel & Goltermann
DC Loop HoldingCircuit GH-1” or equivalent.
FigureA1. 2W Return Loss
2WRL= 20Log(|Zref+ Zs|/|Zref-Zs|) = 20Log(E/2Vs)
W&G GH1
Zref
TIP
600ohm
1Kohm
E
1Kohm
Vs
100µF
100mA
DC max
Zin = 100K
200 to 6kHz
100µF
STLC3055
application
circuit
TX
FigureA2. THLTrans HybridLoss
THL = 20Log|Vrx/Vtx|
W&GGH1
100µF
100mA
600ohm
DCmax
Zin= 100K
200 to 6kHz
100µF
TIP
STLC3055
application
RING
circuit
RING
RX
TX
Vtx
RX
Vrx
16/22
Page 17
FigureA3. G24TransmitGain
G24 = 20Log|2Vtx/E|
STLC3055
W&G GH1
600ohm
E
FigureA4. G42Receive Gain
G42 = 20Log|VI/Vrx|
Vl
600ohm
100µF
100mA
DC max
Zin = 100K
200to 6kHz
100µF
100µF
100mA
DC max
Zin = 100K
200 to 6kHz
100µF
W&G GH1
TIP
STLC3055
application
RING
TIP
RING
TX
Vtx
circuit
RX
TX
STLC3055
application
circuit
RX
FigureA5. PSRRCPowersupply rejection Vpos to 2Wport
FigureA9. V2Wpand W4Wp: Idle channelpsophometric noise at line and TX.
V2Wp= 20Log|Vl/0.774l|;V4Wp = 20Log|Vtx/0.774l|
W&G GH1
STLC3055
TIP
100µF
STLC3055
application
circuit
RING
Vl
psophometric
filtered
600ohm
100mA
DC max
Zin = 100K
200 to 6kHz
100µF
APPENDIX B
STLC3055OvervoltageProtection
FigureB1. Simplifiedconfiguration for indoor overvoltage protection
BGND
2x
SM4T39RX
STLC3055
TIP
RING
RP1
RP1RP2
RP2
TX
Vtx
psophometric
filtered
RX
TIP
RING
VBAT
RP2: Fuse orPTC
FigureB2. Standard overvoltage protection configurationfor K20compliance
BGND
2x
SM4T39RX
STLC3055
TIP
RING
VBAT
RP1RP2
LCP1511
RP1RP2
RP2:Fuse or PTC
TIP
RING
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Page 20
STLC3055
APPENDIX C
TYPICALSTATEDIAGRAM FOR STLC3055OPERATION
FigureC1.
Tj>Tth
PD=0,D0=D1=0
Power
Down
Ring Burst
Normally used for
On Hook
Transmission
Active
On Hook
Ring Burst
Ring Pause
D0=0, D1=1,
D2=0
D0=1, D1=0, D2=0/1
PD=1, D0=D1=0
On HookDetection for T>Tref
HI-Z
Feeding
Active
On Hook Condition
Off Hook Detection
Off Hook
D0=0, D1=1,
D2=0
Note: all state transitionsare underthe microprocessor control.
Ringing
Ring Trip
Detection
Off HookDetection
20/22
Page 21
STLC3055
21/22
Page 22
STLC3055
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes noresponsibility for the consequences
of use of such informationnor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in thispublication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized foruse as critical components in lifesupport devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999STMicroelectronics –Printed in Italy– AllRights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil- China - Finland - France- Germany- Hong Kong - India- Italy - Japan - Malaysia - Malta - Morocco -
Singapore- Spain - Sweden- Switzerland - United Kingdom -U.S.A.
http://www.st.com
22/22
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