Datasheet STLC3055QTR, STLC3055Q Datasheet (SGS Thomson Microelectronics)

Page 1
STLC3055
WLL & ISDN-TA SUBSCRIBER LINE INTERFACE CIRCUIT
MONOCHIP SLIC OPTIMISED FOR WLL & ISDN-TAAPPLICATIONS
IMPLEMENT ALL KEY FEATURES OF THE BORSHTFUNCTION
SINGLESUPPLY(5.5 TO 15.8V) BUILT IN DC/DC CONVERTER CONTROL-
LER. SOFT BATTERY REVERSAL WITH PRO-
GRAMMABLE TRANSITIONTIME. ON-HOOKTRANSMISSION. PROGRAMMABLE OFF-HOOK DETECTOR
THRESHOLD METERING PULSE GENERATION AND FIL-
TER INTEGRATEDRINGING INTEGRATEDRINGTRIP PARALLEL CONTROL INTERFACE (3.3V
LOGICLEVEL) PROGRAMMABLE CONSTANT CURRENT
FEED SURFACE MOUNTPACKAGE INTEGRATEDTHERMALPROTECTION
-40 TO +85°COPERATINGRANGE
BLOCKDIAGRAM
ORDERING NUMBERS: STLC3055Q
DESCRIPTION
The STLC3055 is a SLIC device specifically de­signed for WLL (Wireless Local Loop) and ISDN­TerminalAdaptors. One of the distinctive charac­teristic of this device is theability to operate with a single supply voltage (from +5.5V to +15.8V) and self generate the negative battery by means of an on chip DC/DC converter controller that drives an externalMOSswitch.
The battery level is properly adjusted depending on the operatingmode. A useful characteristic for
TQFP44
STLC3055QTR
October 1999
TX RX
ZAC1
ZAC
RS ZB
CKTTX CTTX1 CTTX2
FTTX
D0 D1 D2 DET
INPUT LOGICAND DECODER
Status and functions
SUPERVISION
AC PROC
TTX PROC
RTTX CAC ILTF RD IREF RLIM RTH
REFERENCE
OUTPUT LOGIC
LINE
DRIVER
Vcc
Vss
Agnd
OUTPUT
STAGE
DC PROC
DC/DC
CONV.
VOLT.
REG.
AGND
Vbat
BGND
TIP
RING
CREV
CSVR
CLK RSENSE GATE VF
CVCC
VPOS
VBAT
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STLC3055
DESCRIPTION (continued)
these applications is the integratedringing gener­ator.
The control interface is a parallel type with open drainoutput and3.3V logiclevels.
The metering pulses are generated on chip start­ing fromtwo logic signals(0, 3.3V) one define the metering pulse frequency and the other the me­teringpulse duration. An on chipcircuit then pro­vides the proper shaping and filtering. Metering pulse amplitude and shaping (rising and decay time) can be programmed by external compo­nents. A dedicated cancellation circuit avoid pos-
PIN CONNECTION
VBAT1
CREV
N.C.
TIP
44 43 42 41 3940 38 37 36 35 34
sible CODEC input saturation due to Metering pulse echo.
Constant current feed can be set from 20mA to 40mA. Off-hook detection threshold is program­mable from 5mAto 9mA.
The device, developed in BCD100II technology (100V process), operates in the extended tem­perature range and integrates a thermal protec­tion that sets the device in power down when Tj exceeds140°C.
N.C.
N.C.
N.C.
RING
N.C.
VBAT
BGND
RES
N.C.
N.C.
DET
CKTTX
CTTX1
CTTX2
1
D0
2
D1
3
D2
4
PD
5
6
7
8
9
10
12 13 14 15 16
RX
FTTX
RTTX
171118 19 20 21 22
ZB
RS
ZAC
ZAC1
CAC
TX
VF
CLK
33
32
31
30
29
28
27
26
25
24
23
D97TL279A
CSVR
ILTF
RD
RTH
IREF
RLIM
AGND
CVCC
VPOS
RSENSE
GATE
ABSOLUTEMAXIMUM RATINGS
Symbol Parameter Value Unit
V
pos
A/BGND AGND to BGND -1 to +1 V
V
dig
T
j
(1)
V
btot
Positive Supply Voltage -0.4 to +17 V
Pin D0, D1, D2, DET, CKTTX -0.4 to 5.5 V Max. junction Temperature 150 °C Vbtot=|Vpos|+|Vbat|. (Totalvoltage applied tothe device
100 V
supply pins).
(1) Vbat is selfgenerated bythe on chip DC/DC converter and can be programmed via RF1 and RF2.
RF1and RF2 shall beselected in order tofulfil the a.mlimits (see External Components Table page 10)
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STLC3055
OPERATINGRANGE
Symbol Parameter Value Unit
V
pos
A/BGND AGND to BGND -100 to +100 V
V
dig
T
op
(1)
V
bat
(1) Vbat is selfgenerated bythe on chip DC/DC converter and can be programmed via RF1 and RF2.
RF1and RF2 shall beselected in order tofulfil the a.mlimits (see External Components Table page 10)
THERMALDATA
Symbol Parameter Value Unit
R
thj-amb
PIN DESCRIPTION
N. Name Function
25 VPOS Positive supply inputranging from 5.5Vto 15.8V. 34 BGND Battery Ground, must beshorted with AGND. 27 AGND Analog Ground, must be shortedwith BGND. 16 ZAC AC impedance synthesis. 15 ZAC1 RX bufferoutput, the AC impedanceis connected fromthis node to ZAC. 17 RS Protection resistors image (theimage resistor is connectedfrom this node to ZAC). 18 ZB Balance Networkfor 2 to 4 wire conversion (the balanceimpedance ZB is connectedfrom this
20 TX 4 wire output port (TXoutput). The signal is referred toAGND. If connected to single supply
14 RX 4 wireinput port (RX input); 300KΩinput impedance. This signal is referred to AGND. If
19 CAC AC feedbackinput, AC/DC split capacitor (CAC). 32 ILTF Transversal line current image output. 41 TIP 2 wire port; TIP wire (Ia is the current sourced from this pin). 37 RING 2 wire port;RING wire (Ib is the current sunk into thispin). 28 RLIM Constant current feedprogramming pin (viaRLIM). RLIM should be connected close to this
30 RTH Off-hook threshold programming pin (via RTH).RTH should be connected close to this pin
29 IREF Internal bias current setting pin. RREF should be connected close to this pin and PCB layout
43 CREV Reverse polaritytransition time control.One proper capacitor connected between thispin and
31 RD DC feedback and ring trip input. RD should be connected closeto this pin and PCBlayout
Positive Supply Voltage 5.5 to +15.8 V
Pin D0, D1, D2, DET, CKTTX, PD -0.25 to 5.25 V Ambient Operating Temperature Range -40 to +85 °C Self Generated Battery Voltage -74 max. V
Thermal Resistance Junctionto Ambient Typ. 60 °C/W
node to AGND. ZA impedance is connected from this node to ZAC1).
CODEC input it must beDC decoupled with proper capacitor.
connected to single supply CODECoutput itmust beDC decoupledwith proper capacitor.
pin andPCB layout should avoid noise injection on this pin.
and PCB layout should avoid noise injectionon this pin.
should avoid noise injection on this pin.
AGND is setting the reverse polarity transitiontime. This is the same transitiontime used to shape the”trapezoidal ringing” during ringing injection.
should avoid noise injection on this pin.
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STLC3055
PIN DESCRIPTION (continued)
N. Name Function
4 PD Power Down input. Normally connected to CVCC (or to logic level high). Can beused to set
26 CVCC Internal positive voltage supplyfilter. 35 VBAT Regulated battery voltage self generated by the device via DC/DC converter. Must be shorted
23 GATE Driver for external Power MOS transistor. 21 VF Feedback inputfor DC/DC converter controller. 22 CLK Power Switch ControllerClock (typ. 125KHz). From version marked STLC3055 A5, this pin
24 RSENSE Voltage input for current sensing. RSENSE should beconnected close to this pin and VPOS
1 D0 Control Interface: input bit0. 2 D1 Control Interface: input bit1. 3 D2 Control interface: input bit 2.
8 DET Logic interface output of the supervision detector(active low). 33 CSVR Battery supply filter capacitor. 12 RTTX Metering pulse cancellation buffer output. TTX filter network should be connected to this point.
13 FTTX Metering pulse buffer input this signal is sent to the line andused to perform TTX filtering. 10 CTTX1 Metering burst shaping external capacitor. 11 CTTX2 Metering burst shaping external capacitor.
9 CKTTX Metering pulse clock input (12 KHz or 16KHz square wave). 44 VBAT1 Frame connection. Must be shorted to VBAT.
5 RES Reserved, must be connected toAGND.
6, 7,36,
38,39,
40,42
NC Not connected.
FUNCTIONALDESCRIPTION
The STLC3055 is a device specifically developed for WLL and ISDN-TAapplications.
It is based on a SLIC core, on purpose optimised for these applications, with the addition of a DC/DC converter controller to fulfil the WLL and ISDN-TAdesignrequirements.
The SLIC performs the standard feeding, signal­lingand transmissionfunctions.
It can be set in three different operating modes via the D0, D1, D2 pins of the control logic inter­face (0 to 3.3V logic levels). The loop status is carriedout onthe DET pin (activelow).
The DETpin is an opendrain output to alloweasy interfacingwithboth 3.3Vand 5Vlogic levels.
The fourpossible SLIC’soperatingmodes are:
Power Down
TIP andRing terminals in open circuitsetting PD=0 and D0=D1=0.
to VBAT1.
can also be connected to CVCC or AGND. Whenthe CLK pin is connected toCVCC an internal auto-oscillation is internally generatedand it is used instead of the external clock. When the CLK pin is connected to AGND, theGATE output is disabled.
pin. The PCB layoutshould minimize the extra resistanceintroduced bythe copper tracks.
If notused should be left open.
HighImpedanceFeeding (HI-Z) Active Ringing
Table 1shows how to set the differentSLIC oper­atingmodes.
Table1. SLICoperatingmodes.
PD D0 D1 D2 Operating Mode
0 0 0 X Power Down 1 0 0 X H.I. Feeding(HI-Z) 1 0 1 0 Active NormalPolarity 1 0 1 1 Active ReversePolarity 1 1 1 0 Active TTX injection (N.P.) 1 1 1 1 Active TTX injection (R.P.) 1 1 0 0/1 Ring (D2 bit toggles @ fring)
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STLC3055
The DC/DC converter controller is driving an ex­ternal power MOS transistor (P-Channel) in order to generate the negative battery voltage needed for device operation.
The DC/DC converter controller is synchronised withan externalCLK (125KHZtyp.).
From version marked STLC3055 A5, it can be synchronisedto an internalclock generatedwhen the pin CLK is connected to CVCC. One sensing resistor in series to Vpos supply allows to fix the maximumallowed input peakcurrent.This feature is implemented in order to avoid overload on Vpos supply in case of line transient (ex. ring trip detection).
The typical value is obtained for a sensing resis­tor equal to 110mthat will guarantee an aver­age current consumptionfrom Vpos < 700mA.
When in on-hook the self generated battery volt­age is set to a predefinedvalue.
This value can be adjustedvia one externalresis­tor (RF1) and it is typical -50V. When RINGmode is selectedthis valueis increasedto -70V typ.
Once the line goes in off-hook condition, the DC/DC converter automatically adjust the gener­ated battery voltage in order to feed the line with a fixedDC current(programmablevia RLIM) opti­mising in this way the power dissipation.
This operating mode is normally selected when the telephoneis in on-hook in order to monitorthe line status keeping the power consumption at the minimum.
The output voltage in on-hook condition is equal totheself generatedbatteryvoltage(-50V typ).
When off-hook occurs the DET becomes active (lowlogic level).
The off-hook threshold in HI-Z mode is the same value asprogrammed inACTIVE mode.
The DC characteristic in HI-Z mode is just equal to the self generated battery with 2x(1500W+Rp) in series (see fig.1), where Rp is the externalpro­tectionresistance.
Figure1. DCCharacteristicin HI-Z Mode.
IL
Vbat
2x(R1+Rp)
Slope: 2x(R1+Rp)
(R1=1500ohm)
OPERATINGMODES Power Down
DC CHARACTERISTIC& SUPERVISION Whenthis modeis selected theSLIC is switched
off and the TIP and RING pins are in high imped­ance. Also the line detectorsare disabled there­forethe off-hookconditioncannot be detected.
This mode can be selected in emergency condi­tion when it is necessary to cut any current deliv­eredto the line.
This mode is alsoforced by STLC3055 in case of thermaloverload(Tj > 140°C).
In this case the device goes back to the previous status as soon as the junction temperature de­creaseunder the hysteresisthreshold.
AC CHARACTERISTICS The 2W port is set in high impedance, the TX
output buffer is a low impedance output, no AC transmissionis possible.
High Impedance Feeding (HI-Z)
DC CHARACTERISTIC& SUPERVISION
VL
Vbat (-50V)
AC CHARACTERISTICS The AC impedance shown at the 2W port
(TIP/RING) is the same as the DC one. The TIP/RINGAC impedance will be 2x(1500Ω+ Rp) or highimpedance.
Active
DC CHARACTERISTICS & SUPERVISION When this mode is selected the STLC3055 pro-
videsboth DC feedingandAC transmission. The STLC3055 feedsthe line witha constantcur-
rent fixed by RLIM (20mA to 40mA range). The on-hook voltage is typically 40V allowing on-hook transmission;the selfgeneratedVbat is-50V typ.
If the loop resistance is very high and the line current cannot reach the programmed constant currentfeed value,the STLC3055 behaveslike a 40V voltage source with a series impedance equal to the protection resistors 2xRp (typ. 2x41Ω) plus the internal resistance. Fig. 2 shows thetypical DCcharacteristicin ACTIVE mode.
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STLC3055
Figure2. DC characteristicin ACTIVE mode
IL
Ilim
(20 to
40mA)
2Rp
10V
VL
Vbat (-50V)
The line status (on/off hook) is monitored by the SLIC’s supervision circuit. The off-hook threshold can be programmed via the externalresistor R
TH
in the range from5mA to 9mA. Independentlyon the programmed constant cur-
rent value, the TIP and RING buffers have a cur­rentsource capabilitylimited to70mA typ.
Moreover the power available at Vbat is control­led by the DC/DC converter that limits the peak current drawn from the Vpos supply. The maxi­mum allowed current peak is set by the R
SENSE
resistorand it is typically900mApk.
POLARITYREVERSAL The D2 bit controls the line polarity, the transition
betweenthe two polaritiesis performed in a ”soft” way. This means that the TIP and RING wire ex­change their polarities following a ramp transition (see fig.3). The transition time is controlled by an external capacitor CREV. This capacitor is also setting the shape of the ringing trapezoidal wave­form.
Whenthe control pins set battery reversal the line polarity is reversed with a proper transition time setvia an externalcapacitor(CREV).
Figure3. TIP/RING typical transitionfrom
Directto ReversePolarity
GND
TIP
4V typ.
40V typ ON-HOOK
dV/dT set by CREV
RING
AC CHARACTERISTICS The SLIC provides the standard SLIC transmis-
sion functions:
Input impedance synthesis: can be real or complex and is set by a scaled (x50) external ZACimpedance.
Transmit and receive: The AC signal present on the 2W port (TIP/RING)is transferredto the TX outputwith a -6dBgain and from the RX in­put to the2W portwith a 0dBgain.
2 to 4 wire conversion: The balance imped­ance can be real or complex, the proper can­cellation is obtained by means of two external impedanceZA and ZB.
Once in Active mode (D1=1) the SLIC can oper­ate in different states setting properly D0 and D2 controlbits (see also Table 2).
Table2. SLICstates in ACTIVEmode
D0 D1 D2 Operating Mode
0 1 0 Active Normal Polarity 0 1 1 Active Reverse Polarity 1 1 0 Active TTX injection (N.P.) 1 1 1 Active TTX injection (R.P.)
METERING PULSE INJECTION(TTX) The metering pulses circuit consist of a burst
shaping generator that gives a square wave shaped and a low pass filter to reduce the har­monic distortionof theoutput signal.
The metering pulse is obtained starting from two logicsignals:
CKTTX: is a square wave at the TTX fre­quency (12 or 16KHz) and should be perma­nently applied to the CKTTX pin or at least for all the duration of the TTX pulse (including ris­ing and decayphases).
D0: enable the TTX generation circuit and de­finethe TTXpulse duration.
This two signals are then processed by a dedi­cated circuitry integrated on chip that generate the metering pulse as an amplitude modulated shaped squarewave (SQTTX)(see fig.4).
Both the amplitude and the envelope of the squarewave (SQTTX) can be programmed by means of external components. In particular the amplitudeis set by the two resistorsRLV and the
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Page 7
Figure4. Meteringpulse generationcircuit.
CTTX1
STLC3055
Low PassFilter
C1
RLV
BURST
SHAPING
GENERATOR
D0
CKTTX
Square wavepulse metering
CS
CTTX2
SQTTX
RLV
shapingby thecapacitorCS. The waveform so generated is then filtered and
injectedon the line. The lowpass filtercan be obtained usingthe inte-
grated buffer OP1 connected between pin FTTX (OP1 non inverting input) and RTTX(OP1 output) (see fig.4) and implementing a ”Sallen and Key” configuration.
Dependingon the externalcomponents count it is possible to build an optimised application de­pending on the distortion level required. In par­ticular harmonic distortion levels equal to 13%, 6% and 3% can be obtained respectively with first,second andthirdorder filters(see fig.4).
The circuit showed in the ”Applicationdiagram” is relatedto thesimple firstorderfilter.
Once the shaped and filtered signal is obtained at RTTX buffer outputit is injectedon the TIP/RING pins with a +6dBgain.
It should be noted that this is the nominal condi­tion obtained in presence of ideal TTX echo can­cellation(obtained via proper settingof RTTXand CTTX). In addition the effective level obtained on the line will depend on the line impedance, the protection resistor value and the series switch (SW1or SW2)on resistance.
In the typical application (TTX line impedance =200,RP=41Ω, SW1,2 on resistance = 9 and ideal TTX echo cancellation) the metering pulse level on the line will be 1.33 timesthe level appliedto theRTTX pin.
RTTX
R1
CFL
R2
FTTX
­OP1
+
C2
Sinusoidalwave pulse metering
Required external components vs.filter order.
Order CFL R1 C! R2 C2 THD
1 X 13% 2 XXXX6% 3XXXXX3%
As already mentioned the metering pulse echo cancellationis obtained by means of two external components(RTTXand CTTX) thatshould match the line impedance at the TTX frequency. This simplenetwork has a doubleeffect:
Synthesise a low output impedance at the TIP/RINGpins at theTTXfrequency.
Cut the eventual TTX echo that will be trans­ferredfromthe line tothe TX output.
Ringing
When this mode is selected STLC3055 self gen­erate an higher negativebattery (-70V typ.) in or­der to allow a balanced ringing signal of typically 65Vpeak.
In this condition both the DC and AC feedback loop are disabled and the SLIC line drivers oper­ateas voltagebuffers.
The ring waveform is obtained toggling the D2 controlbit atthedesired ringfrequency.This bitin fact controls the line polarity (0=direct; 1=re­verse). As in the ACTIVE mode the line voltage transition is performed with a ramp transition,ob­taining in this way a trapezoidal balanced ring waveform(seefig.5).
The shaping is defined by the CREV external capacitor.
Selecting the proper capacitor value it is possible toget differentcrest factorvalues.
The following table shows the crest factor values
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STLC3055
Figure 5. TIP/RING typical ringingwaveform
GND
2.5V typ.
TIP
65V
typ.
dV/dT set byCREV
RING
VBAT
2.5V typ.
obtained with a 20Hz and 25Hz ring frequency and with 1REN. This value are valid either with Europeanor USA specification:
CREV
22nF 1.2 1.26 27nF 1.25 1.32 33nF 1.33 Not significant (*)
(*) Distorsion already less than 10%.
CREST
FACTOR
@20Hz
CREST
FACTOR
@25Hz
If for any reason the ringer load will be too high the self generated battery will drop in order to keep thepower consumptionto thefixed limit and therefore also the ring voltage level will be re­duced.
In the typical application with R
SENSE
= 110m the peak current from Vpos is limited to about 900mA, which correspond to an average current of 700mA max. In this condition the STLC3055 can drive up to 3REN with a ring frequency fr=25Hz (1REN = 1800+ 1.0µF, European standard).
In order to drive up to 5REN (1REN= 6930+ 8µF, US standard) it is necessary to modify the externalcomponentsas follows:
CREV = 15nF RD = 2.2K
Power On Requirements
In order to avoid damage to the device when Vpos is first appliedit is recommendedto keep all the logic inputs to a lowlogic level (0V)until Vpos is >5.5V.
In case this power up sequence cannot be guar­anteed it’s recommended to connect a shottkydi­ode (BAT46 or equivalent) between VBAT and BGNDsee figurebelow.
The ring trip detection is performed sensing the variation of the AC line impedance from on hook (relatively high) to off-hook (low). This particular ring tripmethod allows to operatewithoutDC off­set superimposed on the ring signal and therefore obtaining the maximumpossible ring level on the load starting from a givennegative battery.
It should be noted that such a method is opti­mised for operationon shortloop applicationsand may not operateproperly in presenceof long loop applications(>500).
Once ring trip is detected,the DET output is acti­vated (logic level low), at this point the card con­troller or a simple logic circuitshould stop the D2 toggling in order to effectivelydisconnect the ring signal and then set the STLC3055 in the proper operatingmode (normallyACTIVE).
RING LEVEL IN PRESENCE OF MORE TELE­PHONEIN PARALLEL
As already mentioned above the maximum cur­rent that can be drawn from the Vpos supply is controlledand limitedvia theexternal RSENSE.
This will limit also the power available at the self generatednegative battery.
Figure 6. Shottkydiode connection
BGND
STLC3055
VBAT
BAT46
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STLC3055
LayoutRecommendation
A properly designed PCB layout is a basic issue to guarantee a correct behaviour and good noise performances.
Particularcare must be taken on the ground con­nection and in this case the star configuration al­lowssurely to avoid possibleproblems(see Appli­cationDiagram Fig. 7).
The ground of the power supply (VPOS) has to be connected to the center of the star, let’s call this point PGND. This point shouldshow a resis­tance as low as possible, that means it should be a groundplane.
Noise sources can be identified in not enough good grounds, not enough low impedance sup­plies and parasitic coupling between PCB tracks and high impedancepins of the device.
In particular to avoid noise problems the layout should prevent any coupling between the DC/DC converter components and analog pins that are referred to AGND (ex: RD, IREF, RTH, RLIM, VF). As a first reccomendation the components CV, L, D1, CVPOS, RSENSE should be kept as close as possible to each other and isolated from the other components.
Additionalimprovements can be obtained:
decoupling the center of the star from the ana­log ground of STLC3055using smallchokes.
adding a capacitor in the range of 100nF be­tween VPOS and AGND in order to filter the switchfrequency on VPOS.
ExternalComponents List
In order to properly define the external compo­nents value the following system parameters have to be defined:
The ACinput impedanceshown by the SLIC at the line terminals ”Zs” to which the return loss measurement is referred. It can be real (typ. 600) or complex.
The AC balance impedance, it is the equiva­lent impedance of the line ”Zl” used for evalu­ation of the trans-hybrid loss performances (2/4 wire conversion). It is usually a complex impedance.
The value of the two protection resistors Rp in series with theline termination.
The line impedance at the TTX frequency ”Zlttx”.
The metering pulse level amplitude measured at line termination ”V der filtering, V
LOTTX
”. In case of low or-
LOTTX
represents the amplitude (Vrms) of the fundamental frequency compo­nent.(typ 12 or 16KHz).
Pulse metering envelope rise and decay time constant”τ”.
The slope of the ringing waveform”∆V
TR
/
”.
T
The value of the constant current limit current ”Ilim”.
The value of the off-hook current threshold
”.
”I
TH
The value of the ring trip rectified average thresholdcurrent”I
RTH
”.
The value ofthe requiredself generated nega­tive battery ”V
in ring mode (max value
BATR
is 70V). This value can be obtained from the desiredring peak level +5V.
The value of the maximum current peak sunk fromVpos ”IPK”.
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STLC3055
EXTERNAL COMPONENTS
Name Function Formula Typ. Value
RREF Bias setting current RREF = 1.3/Ibias
Ibias = 50µA
CSVR Negative Battery Filter CSVR = 1/(2π fp 1.8M)
fp = 50Hz
RD Ring Trip threshold setting
resistor
RD = 100/I
RTH
2KΩ<RD<5K
CAC AC/DC split capacitance 22µF 20% 15VL
RP Line protection resistor Rp > 30 41Ω 1% RS Protection and series switches
RS = 100 (Rp + 9)5k@Rp=41
resistance image
ZAC Two wire AC impedance ZAC = 50⋅(Zs - 2Rp -18Ω) 25kΩ1%
ZA (1) SLIC impedancebalancing
ZA = 50 Zs 30k1%
network
ZB (1) Line impedance balancing
ZB = 50⋅Zl 30kΩ1%
network
CCOMP AC feedback loop compensation CCOMP = 1/(2πfo⋅100⋅(RP+9Ω))
fo = 250kHz
CH Trans-Hybrid Loss frequency
CH = CCOMP 120pF 10% 10VL
compensation
RLIM Current limiting programming RLIM = 1300/Ilim
RTH Off-hook threshold programming
(ACTIVE mode)
CREV Reverse polarity transition time
32.5kΩ< RLIM < 65k RTH = 260/I
TH
27k<RTH < 52k CREV = (1/3750) T/V
) 22nF 10% 10V
TR
programming
RTTX (3) Pulse metering cancellation
RTTX = 50Re[(Zlttx+2Rp+18Ω)] 15k
resistor
CTTX (3) Pulse metering cancellation
CTTX = 1/{50⋅2πfttx[-lm(Zlttx)]} 100nF 10% 10V (2)
capacitor
RLV Pulse metering level resistor RLV = 63.310
= (|Zlttx + 2Rp + 18Ω|/|Zlttx|)
α
CS Pulse metering shaping
CS =τ/(2⋅RLV) 100nF 10% 10V
capacitor
3
αV
LOTTX
@τ= 6ms, RLV = 27.1k
CFL Pulse metering filter capacitor CFL = 2/(2πfttx⋅RLV) 1nF 10% 10V
RDD Pull up resistors 100k
CVCC Internally supply filter capacitor 100nF 20% 10V
CVpos Positive supply filter capacitor
with low impedance for switch mode power supply
CV Battery supply filter capacitor
with low impedance for switch mode power supply
CVB High frequencynoise filter 470nF 20% 100VL
26kΩ1%
1.5nF 10% 100VL
4.12kΩ1%
@ IRTH =24mA
@ RD = 4.12k
@ Zs= 600
@ Zs= 600
@ Zl = 600
120pF 10% 10VL
@Rp=41
52.3kΩ1%
@ Ilim = 25mA
28.7kΩ1%
@ITH= 9mA
@ 12V/ms
@Zlttx = 200Ωreal
@ Zlttx = 200real
27k1%
@V
LOTTX
@fttx = 12kHz
RLV = 27k
100µF(4)
100µF 20% 100V(5)
= 275mVrms
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Page 11
EXTERNAL COMPONENTS(continued)
Name Function Formula Typ. Value
CRD (6) High frequency noise filter 100nF 10% 15VL
Q1 DC/DC converter switch P ch.
MOS transistor
RDS(ON)1.2,VDS = -100V Total gate charge=20nC max. with VGS=4.5Vand VDS=1V ID>500mA
D1 DC/DC converter series diode Vr > 100V, t
RSENSE DC/DC converter peak current
RSENSE = 100mV/I
50ns SMBYW01-200
RR
PK
limiting
L (8) DC/DC converterinductor DC Resistance≤0.1Ω(9) L=125µH RFP1304PV
CF1 DC/DC converter feedback loop
stability
RF1 Negative battery programming
250KΩ<RF1<300KΩ(7) 300kW 1%
level
RF2 Negative battery programming
level
Possible choiches: IRF9510 or IRF9520or IRF9120 or equivalent
or equivalent
110m
@I
= 900mA
PK
(Manuf.: All Inductive)
or SUMIDA CDRH125
or equivalent
220pF to470pF (10)
@V
BATR
9.1k1%
STLC3055
= -70V
(1) In caseZs=Zl, ZA and ZB can bereplaced by two resistors of same value:RA=RB=|Zs|. (2) In thiscase CTTXis justoperating as a DC decouplingcapacitor (fp=100Hz). (3) Defining ZTTXas theimpedance ofRTTX in series with CTTX,RTTX and CTTXcanalso be calculated from the following formula:
ZTTX=50*(Zlttx+2Rp+18Ω). (4) CVpos should be defined depending on the power supply currentcapability and maximum allowable ripple. (5) For lowripple application use 2x47µF in parallel. (6) Can be saved if proper PCB layout avoid noise coupling on RD pin (high impedanceinput). (7) RF1 setsthe selfgenerated battery voltage in RING and ACTIVE(Il=0) mode asfollows:
267k
V
BAT(ACTIVE)
V
BATR(RING)
VBATR should be defined considering the ringpeak level required (Vringpeak=VBATR-6V typ.). The above relation is valid provided that the Vpos power supply current capability and the RSENSE programming allow to source all the current requested by the particularringer loadconfiguration. (8) Core: MICROMETALS T50-26CIRON POWDER, AL-VALUE 61nH/N2
Current rating: 2A (50/60Hz) Operating Temperature -25° to+60° Centigrades Inductance: 14µH +/-15% at1KHz, 1mA DC resistance of winding:MAX.100 mOhm Code: RFY1303 Wire: UEW2,0,60 mm Turns: 50
Inductance (f=1KHz): >125µH (9) For highefficiency in HI-Z mode coil resistance @125kHz must be <3ohm (10) Functionof thiscapacitor is to introduce a zero at the resonance frequency for loopstability.In case some parasitic resistance are already present in the loop (Coil, CVBAT, PCB layout), the presence of this capacitor can degrade the device noise performances; in this case CF1 should be removedbeing the loop stabilityalready guaranteed by theparasitic resistance.
-46V -48V -49V -50V
-62V -65V -68V -70V
280k
294kW 300k
11/22
Page 12
STLC3055
Figure6. ApplicationDiagram.
CCOMP
CONTROL
INTERFACE
SUGGESTED GROUND LAY-OUT
TTX CLOCK
D0 D1 D2
SUPPLY GND
CFL
VDD
CH
RDD
RLV
RLV
ZAC
RD
CVPOS
RD
VPOS
RSENSE
GATE
VBAT
CLK
RING
CSVR CREV
RTH
RLIM
IREF
CRD
RSENSE
TIP
CLK
RREF
CVB
RP
RP
CREV
RLIM
CF1
D96TL275D
TIP
RING
RF1
RF2
RTH
CSVR
Q1
D1
L
CVVF
RX
TX
TX
AGND VPOS
RS
RX
RS ZAC ZAC1
ZA
ZB
ZB
DETDET D0 D1 D2
CKTTX
CTTX1
CS
CTTX2 FTTX
RTTX
RTTX
AGND
BGND
PGND
CTTX
CVCC
BGND CVCC
STLC3055
CAC
ILTF
CAC
Figure7. ApplicationDiagramwithout MeteringPulse Generation.
RD
CVPOS
RD
VPOS
RSENSE
GATE
VBAT
CLK
RING
CSVR CREV
RTH
RLIM
IREF
CRD
RSENSE
TIP
CCOMP
CONTROL
INTERFACE
SUGGESTED GROUND LAY-OUT
TTX CLOCK
D0 D1 D2
SUPPLY GND
VDD
CH
RDD
ZAC
RX
TX
TX
AGND VPOS
RS
RX
RS ZAC ZAC1
ZA
ZB
ZB
CVCC
BGND CVCC
STLC3055
DETDET D0 D1 D2
CKTTX
CTTX1
CTTX2
FTTX
AGND
BGND
PGND
RTTX
CAC
ILTF
CAC
CLK
RREF
CVB
RP
RP
CREV
RLIM
CF1
D98TL380A
TIP
RING
RF1
RF2
RTH
CSVR
Q1
D1
L
CVVF
12/22
Page 13
STLC3055
ELECTRICAL CHARACTERISTICS
Testconditions:V Externalcomponentsas listedin the ”Typical Values” columnof EXTERNAL COMPONENTSTable. Note: Testing of all parameteris performedat 25°C. Characterisation aswell as design rules used allow
correlationof tested performancesat other temperatures.All parameterslisted here are met in the oper­ating range: -40to +85°C.
DC CHARACTERISTICS
Symbol Parameter Test Condition Min. Typ. Max. Unit
V
lohi
V
lohi
V
loa
V
loa
Ilim Lim. currentprogramming range ACTIVE mode 20 40 mA
Ilima Lim. current accuracy ACTIVE mode.
Rfeed HI Feeding resistance HI-Z (High Impedance feeding) 2.4 3.6 k
Zrx RX port input impedance 280 k
AC CHARACTERISTICS
L/T Long. totransv.
T/L Transv. to long.
T/L Transv. to long.
2WRL 2W return loss 300 to 3400Hz,
THL Trans-hybrid loss 300 to 3400Hz,
Ovl 2W overload level at line terminals on ref. imped.
TXoff TX output offset ACTIVE N. P., R
G24 Transmit gain abs. 0dBm @ 1020Hz,
G42 Receive gain abs. 0dBm @ 1020Hz,
G24f TX gain variation vs. freq. rel. 1020Hz; 0dBm,
Line voltage Il = 0,HI-Z
Line voltage Il = 0,HI-Z
Line voltage Il = 0,ACTIVE
Line voltage Il = 0,ACTIVE
(see Appendix for test circuit)
(see Appendix for test circuit)
(see Appendix for test circuit)
= 6.0V,AGND = BGND,NormalPolarity,T
pos
(High impedance feeding) T
= 0 to 85°C
amb
(High impedance feeding) T
= -40to 85°C
amb
T
= 0 to 85°C
amb
T
= -40to 85°C
amb
Rel. to programmed value 20mA to 40mA
Rp = 41Ω, 1% tol., ACTIVE N. P., R f = 300 to 3400Hz
Rp = 41Ω, 1% tol., ACTIVE N. P., R f = 300 to 3400Hz
Rp = 41Ω, 1% tol., ACTIVE N. P., R f = 1kHz
ACTIVE N. P., R
20Log|VRX/VTX|, ACTIVE N. P., R
ACTIVE N. P., R
ACTIVE N. P., R
ACTIVE N. P., R
300 to 3400Hz, ACTIVE N. P., R
=25°C.
amb
44 50 V
42 48 V
33 40 V
31 37 V
-10 10 mA
48 50 dB
= 600Ω(*)
L
40 45 dB
= 600Ω(*)
L
48 53 dB
= 600(*)
L
22 26 dB
= 600Ω(*)
L
30 dB
= 600Ω(*)
L
10 dBm
= 600Ω(*)
L
= 600Ω(*) -150 150 mV
L
-6.4 -5.6 dB
= 600(*)
L
-0.4 0.4 dB
= 600Ω(*)
L
-0.12 0.12 dB
= 600(*)
L
Ω Ω
13/22
Page 14
STLC3055
ELECTRICAL CHARACTERISTICS(continued)
Symbol Parameter Test Condition Min. Typ. Max. Unit
G42f RX gain variation vs.freq. rel. 1020Hz; 0dBm,
300 to 3400Hz, ACTIVE N. P., R
= 600Ω(*)
L
V2Wp Idle channelnoise at line psophometric filtered
ACTIVE N. P., R T
= 0 to +85°C
amb
= 600(*)
L
V2Wp Idle channelnoise at line psophometric filtered
ACTIVE N. P., R T
= -40to +85°C
amb
= 600Ω(*)
L
V4Wp Idle channelnoise at line psophometric filtered
ACTIVE N. P., R T
= 0 to +85°C
amb
= 600Ω(*)
L
V4Wp Idle channelnoise at line psophometric filtered
ACTIVE N. P., R T
= -40to +85°C
amb
Thd Total Harmonic Distortion ACTIVE N. P., R
= 600(*)
L
= 600Ω(*) -46 dB
L
VTTX Metering pulse level on line ACTIVE - TTX
Zl = 200Ωfttx = 12kHz
CLKfreq CLK operatingrange -10% 125 10% kHz
-0.12 0.12 dB
-73 -68 dBmp
-68 dBmp
-75 -70 dBmp
-75 dBmp
200 250 mVrms
(*) RL: Line Resistance
RING
Vring Line voltage RING D2 toggling@ fr = 25Hz
Load = 3REN; Crest Factor =1.25 1REN = 1800Ω+ 1.0µF T
= 0 to +85°C
amb
Vring Line voltage RING D2 toggling@ fr = 25Hz
Load = 3REN; Crest Factor =1.25 1REN = 1800Ω + 1.0µF T
= -40to +85°C
amb
DETECTORS
IOFFTHA Off/hook current threshold ACT. mode, RTH = 28.7kΩ1%
(Prog. ITH =9mA)
ROFTHA Off/hook loopresistance
threshold
ACT. mode, RTH = 28.7kΩ1% (Prog. ITH =9mA)
IONTHA On/hook current threshold ACT. mode, RTH = 28.7kΩ 1%
(Prog. ITH =9mA)
RONTHA On/hook loopresistance
threshold
ACT. mode, RTH = 28.7kΩ1% (Prog. ITH =9mA)
IOFFTHI Off/hook current threshold Hi Z mode, RTH =28.7kΩ1%
(Prog. ITH =9mA)
ROFFTHI Off/hook loop resistance
threshold
Hi Z mode, RTH = 28.7k1% (Prog. ITH =9mA)
IONTHI On/hook current threshold Hi Z mode, RTH = 28.7kΩ1%
(Prog. ITH =9mA)
RONTHI On/hook loop resistance
threshold
Hi Z mode, RTH = 28.7kΩ1% (Prog. ITH =9mA)
45 49 Vrms
44 48 Vrms
10.5 mA
3.4 k
6mA
8k
10.5 mA
800
6mA
8k
14/22
Page 15
STLC3055
ELECTRICAL CHARACTERISTICS(continued)
Symbol Parameter Test Condition Min. Typ. Max. Unit
Irt Ring Trip detectorthreshold
range
Irta Ring Trip detectorthreshold
accuracy
Trtd Ring trip detection time RING TBD ms
Td Dialling distortion ACTIVE -1 1 ms
Rlrt (1) Loop resistance 500
ThAl Tj for th. alarmactivation 160 °C
(1) Rlrt =Maximum loop resistance (incl.telephone) for correctring trip detection.
DIGITAL INTERFACE
INPUTS: D0, D1, D2, PD, CLK OUTPUTS: DET
Vih In put highvoltage 2 V
Vil Input low voltage 0.8 V Iih Input highcurrent -10 10
Iil Input low current -10 10
Vol Output low voltage Iol = 1mA 0.45 V
PSRR AND POWER CONSUMPTION
PSERRC Power supply rejection Vpos to
2W port
Ivpos Vpos supply current @ ii = 0 HI-Z On-Hook
Ipk Peak currentlimiting accuracy RING Off-Hook
RING 20 50 mA
RING -15 15 %
Vripple = 100mVrms 50 to 4000Hz
ACTIVE On-Hook, RING (line open)
RSENSE = 110m
26 36 dB
52 93
120
-20% 950 +20% mApk
60 115 140
µ µ
mA mA mA
A A
15/22
Page 16
STLC3055
APPENDIX A
STLC3055Test Circuits
Referring to the application diagram shown in fig. 7 of the STLC3055 datasheet and using as external components the Typ. Values specified in the ”External Components” Table (page 13) find below the properconfigurationfor eachmeasurement.
All measurements requiring DC current termination should be performed using ”Wandel & Goltermann DC Loop HoldingCircuit GH-1” or equivalent.
FigureA1. 2W Return Loss
2WRL= 20Log(|Zref+ Zs|/|Zref-Zs|) = 20Log(E/2Vs)
W&G GH1
Zref
TIP
600ohm
1Kohm
E
1Kohm
Vs
100µF
100mA DC max
Zin = 100K 200 to 6kHz
100µF
STLC3055 application
circuit
TX
FigureA2. THLTrans HybridLoss
THL = 20Log|Vrx/Vtx|
W&GGH1
100µF
100mA
600ohm
DCmax
Zin= 100K 200 to 6kHz
100µF
TIP
STLC3055 application
RING
circuit
RING
RX
TX
Vtx
RX
Vrx
16/22
Page 17
FigureA3. G24TransmitGain
G24 = 20Log|2Vtx/E|
STLC3055
W&G GH1
600ohm
E
FigureA4. G42Receive Gain
G42 = 20Log|VI/Vrx|
Vl
600ohm
100µF
100mA DC max
Zin = 100K 200to 6kHz
100µF
100µF
100mA DC max
Zin = 100K 200 to 6kHz
100µF
W&G GH1
TIP
STLC3055 application
RING
TIP
RING
TX
Vtx
circuit
RX
TX
STLC3055 application
circuit
RX
FigureA5. PSRRCPowersupply rejection Vpos to 2Wport
PSSRC= 20Log|Vn/Vl|
W&G GH1
TIP
100µF
Vl
600ohm
100mA DC max
Zin = 100K 200 to 6kHz
100µF
RING
STLC3055
application
circuit
VPOS
~
Vrx
TX
RX
Vn
17/22
Page 18
STLC3055
FigureA6. L/TLongitudinal toTransversal Conversion
L/T = 20Log|Vcm/Vl|
W&G GH1
100µF
100mA DC max
Zin = 100K 200 to 6kHz
100µF
Vcm
300ohm
300ohm
100µF
Impedance matching betterthan 0.1%
100µF
FigureA7. T/LTransversalto LongitudinalConversion
T/L = 20Log|Vrx/Vcm|
W&G GH1
100µF
100mA DC max
Zin = 100K 200 to 6kHz
100µF
600ohm
Vcm
300ohm
100µF
Impedancematching better than 0.1%
TIP
TX
STLC3055
Vl
application
circuit
RING
TIP
RX
TX
STLC3055 application
circuit
RING
RX
Vrx
300ohm
100µF
FigureA8. VTTXMeteringPulse level on line
Vlttx
200ohm
18/22
TIP
STLC3055 application
RING
circuit
CKTTX
TX
RX
fttx (12 or 16kHz)
Page 19
FigureA9. V2Wpand W4Wp: Idle channelpsophometric noise at line and TX.
V2Wp= 20Log|Vl/0.774l|;V4Wp = 20Log|Vtx/0.774l|
W&G GH1
STLC3055
TIP
100µF
STLC3055 application
circuit
RING
Vl
psophometric
filtered
600ohm
100mA DC max
Zin = 100K 200 to 6kHz
100µF
APPENDIX B
STLC3055OvervoltageProtection
FigureB1. Simplifiedconfiguration for indoor overvoltage protection
BGND
2x
SM4T39RX
STLC3055
TIP
RING
RP1
RP1 RP2
RP2
TX
Vtx
psophometric
filtered
RX
TIP RING
VBAT
RP2: Fuse orPTC
FigureB2. Standard overvoltage protection configurationfor K20compliance
BGND
2x
SM4T39RX
STLC3055
TIP
RING
VBAT
RP1 RP2
LCP1511
RP1 RP2
RP2:Fuse or PTC
TIP
RING
19/22
Page 20
STLC3055
APPENDIX C
TYPICALSTATEDIAGRAM FOR STLC3055OPERATION
FigureC1.
Tj>Tth
PD=0,D0=D1=0
Power Down
Ring Burst
Normally used for On Hook Transmission
Active
On Hook
Ring Burst
Ring Pause D0=0, D1=1, D2=0
D0=1, D1=0, D2=0/1
PD=1, D0=D1=0
On HookDetection for T>Tref
HI-Z
Feeding
Active
On Hook Condition
Off Hook Detection
Off Hook
D0=0, D1=1, D2=0
Note: all state transitionsare underthe microprocessor control.
Ringing
Ring Trip Detection
Off HookDetection
20/22
Page 21
STLC3055
21/22
Page 22
STLC3055
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes noresponsibility for the consequences of use of such informationnor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in thispublication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized foruse as critical components in lifesupport devices or systems without express written approval of STMicroelectronics.
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22/22
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