Page 1
STGB8NC60KD - STGD8NC60KD
STGF8NC60KD - STGP8NC60KD
600 V - 8 A - short circuit rugged IGBT
Features
■ Lower on voltage drop (V
■ Lower C
RES
/ C
ratio (no cross-conduction
IES
susceptibility)
■ Very soft ultra fast recovery antiparallel diode
■ Short circuit withstand time 10 µs
Applications
CE(sat)
)
TO-220
2
3
3
2
1
2
1
DPAK
■ High frequency motor controls
■ SMPS and PFC in both hard switch and
resonant topologies
■ Motor drivers
Description
This IGBT utilizes the advanced PowerMESH™
process resulting in an excellent trade-off
between switching performance and low on-state
behavior.
Table 1. Device summary
Order codes Marking Package Packaging
3
2
1
TO-220FP
D
²
PAK
Figure 1. Internal schematic diagram
3
1
STGB8NC60KDT4 GB8NC60KD D²PAK Tape and reel
STGD8NC60KDT4 GD8NC60KD DPAK Tape and reel
STGF8NC60KD GF8NC60KD TO-220FP Tube
STGP8NC60KD GP8NC60KD TO-220 Tube
April 2008 Rev 2 1/18
www.st.com
18
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Contents STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2/18
Page 3
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical ratings
1 Electrical ratings
Table 2. Absolute maximum ratings
Val ue
Symbol Parameter
V
I
I
CES
I
C
I
C
CL
CP
V
I
FSM
I
Collector-emitter voltage (VGE = 0)
(1)
Collector current (continuous) at TC = 25 °C
(1)
Collector current (continuous) at TC = 100 °C
(2)
Turn-off latching current 30 A
(3)
Pulsed collector current 30 A
Gate-emitter voltage ±20 V
GE
Diode RMS forward current at TC = 25 °C
F
Surge not repetitive forward current
= 10 ms sinusoidal
t
p
Insulation withstand voltage (RMS) from all
V
ISO
P
TOT
T
three leads to external hea sink
( t=1 s; T
= 25 °C)
C
Total dissipation at TC = 25 °C
Operating junction temperature – 55 to 150 °C
j
Short circuit withstand time
T
scw
1. Calculated according to the iterative formula:
2. V
3. Pulse width limited by max junction temperature allowed
clamp
= 80% (V
(V
V
GE
= 0.5 V
CE
, TC = 125 °C, RG = 10 Ω,
BR(CES)
= 12 V)
ICTC()
), VGE=15 V, RG=10 Ω, TJ=150 °C
CES
------------------------------- --------------------------------------------- --------------------------=
R
THJ C–VCESAT MAX()TCIC
T
JMAXTC
D²PAK
TO-220
DPAK TO-220FP
600 V
15 7 A
84A
7A
20 A
-- -- 2500 V
65 62 24 W
10 µs
–
,()×
Unit
Table 3. Thermal resistance
Symbol Parameter
R
thj-case
R
thj-case
R
thj-amb
Thermal resistance junction-case max
IGBT
Thermal resistance junction-case max
diode
Thermal resistance junction-ambient max 62.5 °C/W
Val ue
D²PAK
TO-220
DPAK TO-220FP
Unit
1.9 2.0 5.1 °C/W
44.57°C/W
3/18
Page 4
Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
2 Electrical characteristics
(T
=25°C unless otherwise specified)
CASE
Table 4. Static
Symbol Parameter Test conditions Min. Typ. Max. Unit
Collector-emitter
V
(BR)CES
V
CE(sat)
V
GE(th)
I
CES
I
GES
g
fs
1. Pulse duration = 300 us, duty cycle 1.5 %
breakdown voltage
= 0)
(V
GE
Collector-emitter saturation
voltage
Gate threshold voltage
Collector cut-off current
= 0)
(V
GE
Gate-emitter leakage
current (VCE = 0)
(1)
Forward transconductance
= 1 mA
I
C
= 15 V, IC = 3 A
V
GE
= 15 V, IC = 3 A, TC = 125°C
V
GE
V
= VGE, IC= 250 µA
CE
V
= 600 V
CE
V
= 600 V, TC = 125 °C
CE
VGE= ±20 V
= 15 V, IC= 3 A
V
CE
600 V
2.2
2.75 V
1.8
4.5 6.5 V
1501µA
±100 nA
1.9 S
Table 5. Dynamic
V
mA
Symbol Parameter Test conditions Min. Typ. Max. Unit
C
C
C
Q
Q
Q
Input capacitance
ies
Output capacitance
oes
Reverse transfer
res
capacitance
g
Total gate charge
Gate-emitter charge
ge
Gate-collector charge
gc
= 25 V, f = 1 MHz,
V
CE
= 0
V
GE
V
= 390 V, IC = 3 A,
CE
= 15 V,
V
GE
(see Figure 20)
380
46
8.5
19
5
9
Table 6. Switching on/off (inductive load)
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
(di/dt)
t
d(on)
t
(di/dt)
Turn-on delay time
Current rise time
r
Turn-on current slope
on
Turn-on delay time
Current rise time
r
Turn-on current slope
on
= 390 V, IC = 3 A
V
CC
= 10 Ω, VGE= 15 V
R
G
(see Figure 21)
VCC = 390 V, IC =3 A
= 10 Ω, VGE= 15 V,
R
G
T
= 125 °C
C
(see Figure 21)
17
6
655
16.5
6.5
575
pF
pF
pF
nC
nC
nC
ns
ns
A/µs
ns
ns
A/µs
4/18
Page 5
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics
Table 6. Switching on/off (inductive load) (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
tr(V
t
d(off
t
r(Voff
t
d(off
)
off
Off voltage rise time
)
Turn-off delay time
Current fall time
t
f
)
Off voltage rise time
)
Turn-off delay time
Current fall time
t
f
= 390 V, IC = 3 A,
V
cc
= 10 Ω, VGE =15 V
R
GE
(see Figure 21)
= 390 V, IC = 3 A,
V
cc
=10 Ω, VGE =15 V,
R
GE
= 125 °C
T
C
(see Figure 21)
33
72
82
60
106
136
ns
ns
ns
ns
ns
ns
Table 7. Switching energy (inductive load)
Symbol Parameter Test conditions Min. Typ. Max. Unit
(1)
E
on
E
off
E
E
on
E
off
E
1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in
a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current
Turn-on switching losses
(2)
Turn-off switching losses
Total switching losses
ts
(1)
Turn-on switching losses
(2)
Turn-off switching losses
Total switching losses
ts
= 390 V, IC = 3 A
V
CC
= 10 Ω, VGE=15 V
R
G
(see Figure 21)
VCC = 390 V, IC = 3 A
R
= 10 Ω, VGE= 15 V,
G
= 125 °C
T
C
(see Figure 21)
55
85
140
87
162
249
µJ
µJ
µJ
µJ
µJ
µJ
Table 8. Collector-emitter diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
= 3 A
Q
I
Q
I
V
t
rrm
t
rrm
Forward on-voltage
F
rr
Reverse recovery time
Reverse recovery charge
rr
Reverse recovery current
rr
Reverse recovery time
Reverse recovery charge
rr
Reverse recovery current
I
F
= 3 A, TC = 125 °C
I
F
= 3 A, VR = 30 V,
I
F
di/dt = 100 A/µs
(see Figure 22)
= 3 A,VR = 30 V,
I
F
=125 °C, di/dt = 100 A/µs
T
C
(see Figure 22)
1.6
1.3
23.5
16.5
1.4
39
39
2
2.1 V
V
ns
nC
A
ns
nC
A
5/18
Page 6
Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
2.1 Electrical characteristics (curves)
Figure 2. Output characteristics Figure 3. Transfer characteristics
Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs
temperature
Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations
6/18
Page 7
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics
Figure 8. Normalized gate threshold voltage
vs temperature
Figure 10. Normalized breakdown voltage vs
temperature
Figure 9. Collector-emitter on voltage vs
collector current
Figure 11. Switching losses vs temperature
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
7/18
Page 8
Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
Figure 14. Thermal impedance for TO-220/
D²PAK
Figure 16. Forward voltage drop versus
forward current
Figure 15. Turn-off SOA
Figure 17. Thermal impedance for DPAK
Figure 18. Thermal impedance for TO-220FP
8/18
Page 9
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Test circuit
3 Test circuit
Figure 19. Test circuit for inductive load
switching
Figure 20. Gate charge test circuit
Figure 21. Switching waveform Figure 22. Diode recovery time waveform
9/18
Page 10
Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
10/18
Page 11
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data
TO-220 mechanical data
Dim
mm inch
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c0.48 0.70 0.019 0.027
D 15.25 15.75 0.6 0.62
D1 1.27 0.050
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F1.23 1.32 0.048 0.051
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L3028.90 1.137
∅P 3.75 3.85 0.147 0.151
Q2.65 2.95 0.104 0.116
11/18
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Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
TO-252 (DPAK) mechanical data
DIM.
A 2.20 2.40
A1 0.901.10
A2 0.03 0.23
b 0.64 0.90
b4 5.20 5.40
c 0.45 0.60
c2 0.48 0.60
D 6.00 6.20
D1 5.10
E 6.40 6.60
E1 4.70
e2.28
e1 4.40 4.60
H 9.35 10.10
L1
L1 2.80
L2 0.80
L4 0.60 1
R0.20
V2 0
min. typ max.
o
mm.
o
8
12/18
0068772_G
Page 13
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data
D²PAK (TO-263) mechanical data
Dim
Min Typ Max Min Typ Max
mm inch
A 4.40 4.60 0.173 0.181
A1 0.03 0.23 0.001 0.009
b 0.70 0.93 0.027 0.037
b2 1.14 1.70 0.045 0.067
c 0.45 0.60 0.017 0.024
c2 1.23 1.360.048 0.053
D 8.95 9.350.352 0.368
D1 7.50 0.295
E 10 10.40 0.3940.409
E1 8.50 0.334
e 2.54 0.1
e1 4.88 5.28 0.1920.208
H15 15.850.5900.624
J1 2.49 2.69 0.099 0.106
L2.29 2.79 0.090 0.110
L1 1.27 1.40 0.05 0.055
L2 1.30 1.75 0.051 0.069
R 0.4 0.016
V2 0° 8°0° 8°
0079457_M
13/18
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Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
Dim.
mm. inch
Min. Typ Max. Min. Typ. Max.
A 4.40 4.60 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.017 0.027
F 0.75 1.00 0.0300.039
F1 1.15 1.50 0.045 0.067
F2 1.15 1.50 0.045 0.067
G4.955.200.1950.204
G1 2.40 2.70 0.094 0.106
H 10 10.40 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.80 10.60 0.385 0.417
L5 2.93.6 0.114 0.141
L6 15.90 16.40 0.626 0.645
L7 99.300.354 0.366
Dia3 3.2 0.118 0.126
TO-220FP mechanical data
L2
A
B
D
E
H
G
L6
F
L3
G1
123
F2
F1
L7
L4
L5
7012510-I
Dia
14/18
Page 15
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Packaging mechanical data
5 Packaging mechanical data
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11. 6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
15/18
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Packaging mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
mm inch
MIN. MAX. MIN. MAX.
16/18
BASE QTY BULK QTY
2500 2500
Page 17
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Revision history
6 Revision history
Table 9. Document revision history
Date Revision Changes
02-Oct-2007 1 First release
01-Apr-2008 2 Updated Figure 14 and Figure 17
17/18
Page 18
STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD
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