STMicroelectronis unique "Single Feature Size™"
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a
remarkable manufacturing reproducibility.
APPLICATIONS
■ SOLENOID AND RELAY DRIVERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ DC-DC CONVERTERS
■ AUTOMOTIVE ENVIRONMENT
3
1
2
D
PAK
TO-263
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
2
PAK
I
TO-262
3
2
1
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
DS
V
DGR
V
GS
(
I
•)
D
I
D
(
I
••)
DM
P
tot
E
AS
T
stg
T
j
(
Current limited by package
•)
Pulse wi dth limited by safe operating area.
(
••)
.
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
55V
55V
Gate- source Voltage± 20V
Drain Current (continuos) at TC = 25°C
Drain Current (continuos) at TC = 100°C
80A
57A
Drain Current (pulsed)320A
Total Dissipation at TC = 25°C
300W
Derating Factor2W/°C
(1)
Single Pulse Avalanche Energy870mJ
Storage Temperature
Max. Operating Junction Temperature
(1) Starting T
-55 to 175°C
= 25 oC, ID = 40A, VDD = 30V
j
1/11March 2002
Page 2
STB80NF55-08/-1 STP80NF55-08
THERMA L D ATA
Rthj-case
Rthj-amb
T
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Maximum Lead Temperature For Soldering Purpose
l
Max
Max
Typ
0.5
62.5
300
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
V
(BR)DSS
Drain-source
= 250 µA VGS = 0
D
55V
Breakdown Voltage
V
= Max Rating
DS
V
= Max Rating TC = 125°C
DS
V
= ± 20V
GS
1
10
±100nA
ON
(*)
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
= VGS I
DS
V
= 10 V ID = 40 A
GS
= 250 µA
D
234V
0.00650.008
V
Resistance
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
15 V ID= 18 A
DS =
= 25V, f = 1 MHz, VGS = 0
V
DS
40S
3850
800
250
µA
µA
Ω
pF
pF
pF
2/11
Page 3
STB80NF55-08/-1 STP80NF55-08
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
= 30 V ID = 40 A
t
d(on)
Turn-on Delay Time
t
r
Rise Time
V
DD
R
= 4.7 Ω VGS = 10 V
G
(Resistive Load, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
= 44V ID = 80 A VGS= 10V
V
DD
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
= 30 V ID = 40 A
t
d(off)
Turn-off Delay Time
t
f
Fall Time
V
DD
R
= 4.7Ω, V
G
GS
= 10 V
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: P ul se duration = 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by s afe operating area.
Source-drain Current
(•)
Source-drain Current (pulsed)
(*)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
= 80 A VGS = 0
SD
= 80 Adi/dt = 100A/µs
I
SD
V
= 25 VTj = 150°C
DD
(see test circuit, Figure 5)
25
85
115
24
46
70
25
80
245
6.4
155nC
80
320
1.5V
ns
ns
nC
nC
ns
ns
A
A
ns
nC
A
Safe Operating AreaThermal Impedance
3/11
Page 4
STB80NF55-08/-1 STP80NF55-08
Output CharacteristicsTransfer Characteristics
TransconductanceStatic Drain-source On Resistance
Gate Charge vs Gate-source VoltageCapacitance Variations
4/11
Page 5
STB80NF55-08/-1 STP80NF55-08
Normalized Gate Threshold Voltage vs TemperatureNormalized on Resistance vs Temperature
Source-drain Diode Forward CharacteristicsNormalized Breakdown Voltage vs Temperature.
..
..
5/11
Page 6
STB80NF55-08/-1 STP80NF55-08
Fig. 1: Unclamped Inductive Load Test CircuitFig. 1: Unclamped Inductive Load Test CircuitFig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implic ation or otherwise under any patent or patent ri ghts of STMicroelectronics . S pecificat i ons menti oned in thi s publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as cri tical comp onents in lif e support dev i ces or systems wi thout exp ress written approval of STMicroe l ectronics.
The ST logo is registered trademark of STMicroelectronics
2002 STMi croelectronics - All Ri ghts Reserved
All other na m es are the property of the i r respectiv e owners.
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STMicroelectronics GROUP OF COMPANIES
http:// www.st.com
11/11
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