Datasheet STP80NF55-08, STB80NF55-08-1 Datasheet (SGS Thomson Microelectronics)

Page 1
STP80NF55-08
STB80NF55-08 STB80NF55-08-1
N-CHANNEL 55V - 0.0065 - 80A D2PAK/I2PAK/TO-220
STripFET™ II POWER MOSFET
TYPE
STB80NF55-08/-1 STP80NF55-08
TYPICAL R
LOW THRESHOLD DRIVE
DS
V
DSS
55 V 55 V
(on) = 0.0065
R
DS(on)
<0.008 <0.008
I
D
80 A
80 A
DESCRIPTION
This Power MOSFET is the latest dev elo pment of
STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on­resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
APPLICATIONS
SOLENOID AND RELAY DRIVERS
MOTOR CONTROL, AUDIO AMPLIFIERS
DC-DC CONVERTERS
AUTOMOTIVE ENVIRONMENT
3
1
2
D
PAK
TO-263
3
2
1
TO-220
INTERNAL SCHEMATIC DIAGRAM
2
PAK
I
TO-262
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
(
I
•)
D
I
D
(
I
••)
DM
P
tot
E
AS
T
stg
T
j
(
Current limited by package
•)
Pulse wi dth limited by safe operating area.
(
••)
.
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ)
55 V 55 V
Gate- source Voltage ± 20 V
Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C
80 A
57 A Drain Current (pulsed) 320 A Total Dissipation at TC = 25°C
300 W
Derating Factor 2 W/°C
(1)
Single Pulse Avalanche Energy 870 mJ Storage Temperature Max. Operating Junction Temperature
(1) Starting T
-55 to 175 °C
= 25 oC, ID = 40A, VDD = 30V
j
1/11March 2002
Page 2
STB80NF55-08/-1 STP80NF55-08
THERMA L D ATA
Rthj-case
Rthj-amb
T
Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature For Soldering Purpose
l
Max Max
Typ
0.5
62.5 300
°C/W °C/W
°C
ELECTRICAL CHARACTERISTICS (T
= 25 °C unless otherwise specified)
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
V
(BR)DSS
Drain-source
= 250 µA VGS = 0
D
55 V
Breakdown Voltage
V
= Max Rating
DS
V
= Max Rating TC = 125°C
DS
V
= ± 20V
GS
1
10
±100 nA
ON
(*)
I
DSS
I
GSS
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
= 0)
= 0)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
= VGS I
DS
V
= 10 V ID = 40 A
GS
= 250 µA
D
234V
0.0065 0.008
V
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(*)
g
fs
C
iss
C
oss
C
rss
Forward Transconductance Input Capacitance
Output Capacitance Reverse Transfer Capacitance
V
15 V ID= 18 A
DS =
= 25V, f = 1 MHz, VGS = 0
V
DS
40 S
3850
800 250
µA µA
pF pF pF
2/11
Page 3
STB80NF55-08/-1 STP80NF55-08
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 30 V ID = 40 A
t
d(on)
Turn-on Delay Time
t
r
Rise Time
V
DD
R
= 4.7 Ω VGS = 10 V
G
(Resistive Load, Figure 3)
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
= 44V ID = 80 A VGS= 10V
V
DD
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
= 30 V ID = 40 A
t
d(off)
Turn-off Delay Time
t
f
Fall Time
V
DD
R
= 4.7Ω, V
G
GS
= 10 V
(Resistive Load, Figure 3)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
(*)
Pulsed: P ul se duration = 300 µs, duty cycle 1.5 %.
(
•)Pulse width limited by s afe operating area.
Source-drain Current
(•)
Source-drain Current (pulsed)
(*)
Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
I
= 80 A VGS = 0
SD
= 80 A di/dt = 100A/µs
I
SD
V
= 25 V Tj = 150°C
DD
(see test circuit, Figure 5)
25 85
115
24 46
70 25
80
245
6.4
155 nC
80
320
1.5 V
ns ns
nC nC
ns ns
A A
ns
nC
A
Safe Operating Area Thermal Impedance
3/11
Page 4
STB80NF55-08/-1 STP80NF55-08
Output Characteristics Transfer Characteristics
Transconductance Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage Capacitance Variations
4/11
Page 5
STB80NF55-08/-1 STP80NF55-08
Normalized Gate Threshold Voltage vs Temperature Normalized on Resistance vs Temperature
Source-drain Diode Forward Characteristics Normalized Breakdown Voltage vs Temperature.
. .
. .
5/11
Page 6
STB80NF55-08/-1 STP80NF55-08
Fig. 1: Unclamped Inductive Load Test CircuitFig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For Resistive
Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/11
Page 7
STB80NF55-08/-1 STP80NF55-08
D2PAK MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.028 0.037 B2 1.14 1.7 0.045 0.067
C 0.45 0.6 0.018 0.024 C2 1.21 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368 D1 8 0.315
E 10 10.4 0.394 0.409 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.591 0.624 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.069
M 2.4 3.2 0.094 0.126
R 0.4 0.016 V2
MIN. TYP. MAX. MIN. TYP. TYP.
mm. inch.
0.106
7/11
Page 8
STB80NF55-08/-1 STP80NF55-08
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106 E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531 L1 3.48 3.78 0.137 0.149 L2 1.27 1.4 0.050 0.055
mm inch
C
A
A1
C2
B2
B
e
E
L1
L2
D
L
P011P5/E
8/11
Page 9
STB80NF55-08/-1 STP80NF55-08
E
TO-220 MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
mm inch
A
C
D
D1
L2
F1
L5
Dia.
G1
F
F2
L9
G
H2
L7
L6
L4
P011C
9/11
Page 10
STB80NF55-08/-1 STP80NF55-08
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795
G 24.4 26.4 0.960 1.039
N 100 3.937 T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0075 0.082
R50 1.574
T0.25 0.35 .0.0098 0.0137
W 23.7 24.3 0.933 0.956
mm inch
MIN. MAX. MIN. MAX.
* on sales type
10/11
BASE QTY BULK QTY
1000 1000
Page 11
STB80NF55-08/-1 STP80NF55-08
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or patent ri ghts of STMicroelectronics . S pecificat i ons menti oned in thi s publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as cri tical comp onents in lif e support dev i ces or systems wi thout exp ress written approval of STMicroe l ectronics.
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11/11
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