Datasheet STA505 Datasheet (SGS Thomson Microelectronics)

Page 1
40V 3.5A QUAD POWER HALF BRIDGE
MINIMUM INPUT OUTPUT PULSE WIDTH
DISTORTION
200m R
CMOS COMPATIBLE LOGIC INPUTS
THERMAL PROTECT I O N
THERMAL WARNING OUTPUT
UNDER VOLTAGE PROTECTION
DESCRIPTION
STA505 is a monoli thic quad half bridge stage in Mul­tipower BCD Technology. The device can be us ed as dual bridge or reconfigured, by connecting CONFIG pin to Vdd pin, as single bridge with double current capability, and as half bridge (Binary mode) with half current capability.
The device is particularly designed to make the out-
COMPLEMENTAR Y DM OS
dsON
STA505
MULTIPOWER BCD TECHNOLOGY
PowerSO36
ORDERING NUMBER: STA505
put stage of a stereo All-Digital High Efficiency (DDX™) amplifier capable to deliver 50 + 50W @ THD = 10% at V 80W @ THD = 10% at V BTL configuration.
The input pins have threshold proportional to Ibias pin voltage.
30V output power on 8Ω load and
cc
36V on 8Ω load in single
cc
AUDIO APPLICATION CIRCUIT (Dual BTL)
29
IN1A
+3.3V
TH_WAR
100nF
C58
R57 10K
100nF
C60
100nF
R59 10K
C58
C53
100nF
IN1A
IN1B
IN2A
IN2B
IBIAS
CONFIG
PWRDNPWRDN
FAULT
TRI-STATE
TH_WAR
IN1B
V V V V
VCCSIGN
V
SIGN
CC
IN2A
GND-Reg
GND-Clean
IN2B 32
GNDSUB
DD DD SS SS
23 24
25
27 26
28
30
21 22 33 34
35
36
31
20
19
1
PROTECTIONS
&
LOGIC
REGULATORS
M17
M15
M16
M14
1A
V
CC
15
M3
M2
M5
M4
C30 1µF
17
OUT1A
16
OUT1A
14
GND1A
12
V
1B
CC
OUT1B
OUT1B
GND1B
2A
V
CC
OUT2A
OUT2A GND2A
2B
V
CC
OUT2B
OUT2B
GND2B
C32 1µF
C31 1µF
C33 1µF
11
10
13
7
8
9
6
4
3
2
5
L18 22µH
C52
330pF
R63
20
L19 22µH
L113 22µH
C109
330pF
R104
20
L112 22µH
D00AU1148B
C20
100nF
R98
6
R100
6
C21
100nF
C110
100nF
R103
6
R102
6
C111
100nF
C99
100nF
470nF
C101
100nF
C107
100nF
C108
470nF
C106
100nF
C23
+V
1000µF
CC
C55
July 2003
1/9
Page 2
STA505
PIN FUNCTION
Pin Description
1 GND-SUB Substrate ground
35 ; 36 Vcc Sign Signal Positive Supply
15 Vcc1A Positive Supply 12 Vcc1B Positive Supply
7 Vcc2A Positive Supply
4 Vcc2B Positive Supply 14 GND1A Negative Supply 13 GND1B Negative Supply
6 GND2A Negative Supply
5 GND2B Negative Supply
16 ; 17 OUT1A Output half bridge 1A 10 ; 11 OUT1B Output half bridge 1B
8 ; 9 OUT2A Output half bridge 2A 2 ; 3 OUT2B Output half bridge 2B
29 IN1A Input of half bridge 1A 30 IN1B Input of half bridge 1B 31 IN2A Input of half bridge 2A 32 IN2B Input of half bridge 2B
21 ; 22 Vdd 5V Regulator referred to ground 33 ; 34 Vss 5V Regulator referred to +Vcc
25 PWRDN Stand-by pin 26 TRI-STATE Hi-Z pin 27 FAULT Fault pin advisor 24 CONFIG Configuration pin 28 TH-WAR Thermal warning advisor 19 GND-clean Logical ground 23 IBIAS High logical state setting voltage 18 NC Not connected 20 GND-Reg Ground for regulator Vdd
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Page 3
FUNCTIONAL PIN STATUS
PIN NAME Logical value IC -STATUS
FAULT 0 Fault detected (Short circuit, or Thermal ..)
STA505
FAULT
(*)
1 Normal Operation
TRI-STATE 0 All powers in Hi-Z state TRI-STATE 1 Normal operation
PWRDN 0 Low absorpion PWRDN 1 Normal operation
THWAR 0 Temperature of the IC =130C
THWAR
(*)
1 Normal operation
CONFIG 0 Normal Operation
CONFIG
(*) : The pin is open collector. To have the high logic va l ue, it needs to be pulled up by a r esistor. (**): To put CONFIG = 1 mean s c onnect Pin 24 (CONFIG) to Pins 21, 22 (Vdd)
(**)
1 OUT1A=OUT1B ; OUT2A=OUT2B
(IF IN1A = IN1B; IN2A = IN2B)
PIN CONNECTION
V
Sign
CC
VCCSign
V
SS
V
SS
IN2B
IN1B IN1A
FAULT
TRI-STATE
PWRDN
CONFIG
IBIAS
V
DD
V
DD
36 35 34 33 32 31 30 29 28
26 25
23 22 21 20 19
D01AU1273
1 2 3 4 5 6 7 8
9 1027 11 12 1324 14 15 16 17 18
GND-SUB OUT2B OUT2B
2B
V
CC
GND2B GND2AIN2A V
2A
CC
OUT2A OUT2ATH_WAR OUT1B OUT1B V
1B
CC
GND1B GND1A V
1A
CC
OUT1A OUT1AGND-Reg N.C.GND-Clean
3/9
Page 4
STA505
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CE
V
max
T
op
T
stg
DC Supply Voltage (Pin 4,7,12,15) 40 V Maximum Voltage on pins 23 to 32 5.5 V Operating Temperature Range 0 to 70 °C
, TjStorage and Junction Temperature -40 to 150 °C
THERMAL DATA
Symbol Parameter Min. Typ. Max. Unit
T
j-case
T
T
warn
t
hSD
ELECTRICAL CHARACTERISTCS
Symbol Parameter Test conditions Min. Typ. Max. Unit
R
dsON
I
Thermal Resistance Junction to Case (thermal pad) 2.5 °C/W Thermal shut-down junction temperature 150 °C
jSD
Thermal war ning tempe rature 130 °C Thermal shut-d own hysteresis 25 °C
(Ibias = 3.3V; Vcc = 30V; T = 25°C unless otherwise specified)
Power Pchannel/Nchannel MOSFET RdsON
Power Pchannel/Nchannel
dss
leakage Idss
Id=1A; 200 270 m
Vcc=35V 50 µA
Power Pchannel RdsON
g
N
Id=1A 95 %
Matching
g
Power Nchannel RdsON
P
Id=1A 95 %
Matching Dt_s Low current Dead Time (static) see test circuit no.1; see fig. 1 10 20 ns Dt_d High current Dead Time (dinamic) L=22µH; C = 470nF; Rl = 8
50 ns
Id=3.5A; see fig. 3
t
d ON
t
d OFF
V
V
Turn-on delay time Resistive load 100 ns
Turn-off delay time Resistive load 100 ns
t
Rise time Resistive load; as fig.1; 25 ns
r
t
Fall time Resistive load; as fig. 1; 25 ns
f
Supply voltage operating voltage 9 36 V
CC
High level input voltage Ibias/2
IN-H
+300mV
V
Low level input voltage Ibias/2
IN-L
-300mV
I
IN-H
I
IN-L
Hi level Input current Pin voltage = Ibias 1 µA
Low level input current Pin voltage = 0.3V 1 µA
V
V
4/9
Page 5
STA505
ELECTRICAL CHARACTERISTCS
(continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
PWRDN-H
Hi level PWRDN pin input current Ibias = 3.3V 35 µA
V
Low logical state voltage VL (pin
L
Ibias = 3.3V 0.8 V
PWRDN, TRISTATE) (note 1)
V
High logical state voltage VH (pin
H
Ibias = 3.3V 1.7 V
PWRDN, TRISTATE) (note 1)
I
VCC-
PWRDN
I
FAULT
Supply current from Vcc in Power
Down
Output Current pins
FAULT -TH-WARN when
PWRDN = 0 3 mA
Vpin = 3.3V 1 mA
FAULT CONDITIONS
I
VCC-hiz
Supply current from Vcc in Tri-
Tri-state=0 22 mA
state I
VCC
I
VCC-q
Supply current from Vcc in
operation
both channel switching)
Isc (short circuit current limit)
Input pulse width = 50% Duty; Switching Frequency = 384Khz; No LC filters;
80 mA
3.5 6 8 A
(note 2)
I
OUT-SH
Undervoltage protection threshold 7 V
V
Notes: 1. The following table explains the VL, VH variation with Ibias
Output minimum pulse width No Load 70 150 ns
OV
Ibias VLmin VHmax Unit
2.7 0.7 1.5 V
3.3 0.8 1.7 V 5 0.85 1.85 V
Note 2: If used in single BTL configuration, the device may be not short circuit protected
LOGIC TRUTH TABLE
(see fig. 2)
TRI-STATE INxA INxB Q1 Q2 Q3 Q4
0 x x OFF OFF OFF OFF Hi-Z 1 0 0 OFF OFF ON ON DUMP 1 0 1 OFF ON ON OFF NEGATIVE 1 1 0 ON OFF OFF ON POSITIVE 1 1 1 ON ON OFF OFF Not used
OUTPUT
MODE
5/9
Page 6
STA505
Figure 1. Tes t Circ ui t.
Low current dead time = MAX(DTr,DTf)
Duty cycle = 50%
INxY
M58
+Vcc
OUTxY
OUTxY
Vcc
(3/4)Vcc
(1/2)Vcc (1/4)Vcc
t
DTfDTr
R 8
Figure 2.
Figure 3.
M57
gnd
+V
CC
Q1
INxA INxB
OUTxA
Q3
GND
High Current Dead time for Bridge application = ABS(DTout(A)-DTin(A))+ABS(DTOUT(B)-DTin(B))
+V
Q2
OUTxB
Q4
D00AU1134
CC
+
V67 =
-
vdc = Vcc/2
D03AU1458
Duty cycle=A Duty cycle=B
M58
DTin(A)
INxA
M57
Duty cycle A and B: Fixed to have DC output current of 3.5A in the direction shown in figure
Q1
OUTxA
Q3
DTout(A)
Iout=3.5A
C69
470nF
Rload=8
C71 470nF
DTout(B) DTin(B)
L68 22µL67 22µ
Iout=3.5A
C70
470nF
Q2
OUTxB
Q4
M64
M63
6/9
INxB
D00AU1162
Page 7
STA505
Figure 4. Typical Single BTL Configuration to obtain 80W @ THD 10%, RL = 8, VCC = 36V (note 1)
IBIAS
+3.3V
TH_WAR
10K
nPWRDN
IN1A
IN1B
100nF
100nF
X7R
10K
100nF
100nF
X7R
100nF
X7R
Add.
GND-Clean
GND-Reg
TH_WAR
FAULT
TRI-STATE
VCCSIGN
V
GNDSUB
23 N.C.
19
20
V
DD
21
V
DD
22
CONFIG
24
28
PWRDN
25
27 26
IN1A
29
IN1B
30
IN2A
31
IN2B
32
V
SS
33
V
SS
34
35
SIGN
CC
36
1
18
17
OUT1A
16
OUT1A
11
OUT1B
10
OUT1B OUT2A
9
OUT2A
8
OUT2B
3
OUT2B
2
V
1A
CC
15
1B
V
CC
12
2A
V
CC
7
2B
V
CC
4
GND1A
14
GND1B
13
GND2A
6
GND2B
5
22
1/2W
330pF
1µF X7R
1µF X7R
22µH
22µH
6.2
1/2W
6.2
1/2W
100nF
FILM
100nF
FILM
2200µF
63V
100nF
X7R
100nF
X7R
+36V
+36V
470nF
FILM
8
D01AU1274
Note: 1. "A PWM modulator as driver is needed . In part i cular, this res ul t is performed using the ST A 30X+STA50X demo board".
Figure 5. Typical Quad Half bridge Configuration
+V
CC
C21
2200µF
+3.3V
TH_WAR
C58
100nF
1P
V
CC
IN1A
R57
R59
10K
10K
TRI-STATE
C58
100nF
IN1B
C53
100nF
C60
100nF
IN2A
GND-Clean
IN2B
IBIAS
CONFIG
PWRDNPWRDN
FAULT
TH_WAR
IN1B
VCCSIGN
V
SIGN
CC
IN2A
GND-Reg
IN2B 32
GNDSUB
23 24
25
PROTECTIONS
27
&
LOGIC
26
28
30
21
V
DD
V
22
DD
V V
REGULATORS
33
SS
34
SS
35
36
31
20
19
1
29
IN1A
M3
M2
M5
M4
M17
M15
M16
M14
15
17
16
14
12
11
10
13
7
8
9
6
4
3
2
5
D03AU1474
OUTPL
OUTPL PGND1P
V
1N
CC
OUTNL
OUTNL
PGND1N
2P
V
CC
OUTPR
OUTPR PGND2P
V
2N
CC
OUTNR
OUTNR
PGND2N
L11 22µH
C71
R41
100nF
20
C41
330pF
C51
C61
1µF
100nF
R42
C42
330pF
R43
C43
330pF
C52
C62
1µF
100nF
R44
C44
330pF
R51
6
L12 22µH
C72
100nF
20
R52
6
L13 22µH
C73
100nF
20
R53
6
L14 22µH
C74
100nF
20
R54
6
C81
100nF
C82
100nF
C83
100nF
C84
100nF
R61
C31 820µF
5K
C91 1µF
R62
5K
R63
C32 820µF
5K
C92 1µF
R64
5K
R65
C33 820µF
5K
C93 1µF
R66
5K
R67
C34 820µF
5K
C94 1µF
R68
5K
For more information refer to the application notes AN1456 and AN1661
7/9
Page 8
STA505
DIM.
(1) “D and E1” do not include mold flash or protusions. (2) No intrusion allowed inwards the leads.
MIN. TYP. MAX. MIN. TYP. MA X.
A 3.25 3.5 0.128 0.138 A2 3.3 0.13 A4 0.8 1 0.031 0.039 A5 0.2 0.008
a1 0 0.075 0 0.003
b 0.22 0.38 0.008 0.015 c 0.23 0.32 0.009 0.012
D 15.8 16 0.622 0.630 D1 9.4 9.8 0.37 0.38 D2 1 0 .039
E 13.9 14.5 0.547 0.57 E1 10.9 11.1 0.429 0.437 E2 2.9 0.114 E3 5.8 6.2 0.228 0.244 E4 2.9 3.2 0.114 1.259
e
e3 11.05 0.435
G 0 0.07 5 0 0.003
H 15.5 15.9 0.61 0.625
h 1.1 0.043 L 0.8 1.1 0.031 0.043
N 10˚ (max)
s 8˚ (max)
Mold flash or protusions sh al l not exceed 0.15 m m (0.006”)
mm inch
0.65 0.026
OUTLINE AND
MECHANICAL DA T A
PowerSO36 (SLUG UP)
8/9
7183931
Page 9
STA505
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