– 2x 38 W into 4 Ω at 18 V, 1 kHz, 10% THD
– 2x 34 W into 8 Ω at 22 V, 1 kHz, 10% THD
– 2x 24W into 4Ω at 14.4 V, 1 kHz, 10% THD
– 2x 15 W into 8 Ω at 16 V, 1 kHz, 10% THD
– 4x 13 W into 2 Ω at 15 V, 1 kHz, 10% THD
– 4x 11 W into 4 Ω at 18 V, 1 kHz, 10% THD
– 4x 7 W into 4 Ω at 14.4 V, 1 kHz, 10% THD
■ Minimum external components count:
– no bootstrap capacitors
– no Boucherot cells
– internally fixed gain 20 dB
■ Standby function (CMOS compatible)
■ No audible pop during standby operations
■ Diagnostic facilities:
– clip detector
– output to GND short-circuit detector
– output to VS short-circuit detector
– soft short-circuit check at turn-on
– thermal shutdown warning
STA540
4 x 13 W dual/quad power amplifier
Datasheet − production data
Multiwatt15
Description
The STA540 is a 4-channel, class-AB audio
amplifier designed for high quality sound
applications.
The amplifiers have single-ended outputs with
integrated short-circuit protection, thermal
protection and diagnostic functions.
Protection
■ Output AC/DC short circuit
■ Soft short-circuit check at turn-on
■ Thermal cutoff/limiter to prevent chip from
The chip is housed in the 15-pin Multiwatt
ECOPACK
®
Pb-free package which is RoHS
(2002/95/EC) compliant.
overheating
■ High inductive loads
■ ESD
Table 1.Device summary
Order codeTemperature rangePackagePacking
STA540-40 to 150° CMultiwatt15Tube
April 2012Doc ID 13907 Rev 61/25
This is information on a product in full production.
The best audio performance is obtained with the configuration where each speaker
has its own DC blocking capacitor. However, if the application allows a little
degradation of the spatial image it is possible to connect a couple of speakers with
only one low-value DC blocking capacitor.
470μF
18
15
19
14
Suggested applications:
4x 13 W into 2 Ω, at 15 V
4x 11 W into 4 Ω, at 18 V
4x 9 W into 2 Ω, at 12 V
4x 8 W into 4 Ω, at 16 V
4x 5 W into 4 Ω, at 12 V
470μF
Figure 5.Dual bridge
ST_BY
IN_L
IN_R
10/25Doc ID 13907 Rev 6
10 kΩ
10 µF
470 nF
470 nF
47 µF
13
STA540
3
7
4
5
12
11
6
89 10
100 nF
1
2
15
14
1000 µF
OUT_R
OUT_L
Suggested applications:
V
S
2x 38 W into 4 Ω, at 18 V, 1 kHz, 10% THD
2x 34 W into 8 Ω, at 22 V, 1 kHz, 10% THD
2x 24 W into 4 Ω, at 14.4 V, 1 kHz, 10% THD
2x 15 W into 8 Ω, at 16 V, 1 kHz, 10% THD
Page 11
STA540Standard application circuits
Figure 6.Stereo plus bridge drive
ST_BY
IN_L
IN_R
IN_Bridge
10 kΩ
10 µF
220 nF
220 nF
470 nF
47 µF
7
4
5
3
13
STA540
12
11
6
89 10
V
100 nF
1
2200 µF
2
2200 µF
15
S
1000 µF
OUT_L
OUT_R
OUT_Bridge
14
Suggested applications:
2x 9 W into 2 Ω, +1x 18 W into 4 Ω, at 12 V
2x 12 W into 2 Ω, +1x 26 W into 4 Ω, at 14.4 V
2x 8 W into 4 Ω, +1x 16 W into 8 Ω, at 16 V
Doc ID 13907 Rev 611/25
Page 12
Electrical characteristics curvesSTA540
4 Electrical characteristics curves
Figure 7.Quiescent drain current versus
supply voltage (single-ended and
bridge)
Figure 8.Quiescent output voltage versus
supply voltage (single-ended and
bridge)
Figure 9.Output power versus supply voltage Figure 10. Output power versus supply voltage
Po ( W)
20
18
16
14
12
SINGLE ENDED
Ω
RL= 2
f= 1 KHz
THD= 10 %
10
8
THD= 1 %
6
4
2
0
8910 11 12 13 14 15 16 17 18
Vs (V)
Po (W)
12
11
10
9
8
7
SINGLE ENDED
RL= 4
Ω
f= 1 KHz
THD= 10 %
6
5
THD= 1 %
4
3
2
1
0
8910 11 12 13 14 15 16 17 18
Vs (V)
Figure 11. Output power versus supply voltage Figure 12. Distortion versus output power
12/25Doc ID 13907 Rev 6
Page 13
STA540Electrical characteristics curves
4
4
Figure 13. Distortion versus output powerFigure 14. Distortion versus output power
Figure 15. Output power versus supply voltage Figure 16. Output power versus supply voltage
12
12
Po(W)
Po(W)
11
11
S.E.
S.E.
10
10
Rl=8ohm
Rl=8ohm
9
9
f=1KHz
f=1KHz
8
8
7
7
T.H.D=10%
6
6
5
5
4
4
3
3
2
2
1
1
0
0
+8+2
+8+2
+10+ 12+14+16+18+20+22
+10+ 12+14+16+18+20+22
T.H. D=1 0%
Vs(V)
Vs(V)
T.H.D=1%
T.H. D=1 %
Figure 17. Supply voltage rejection versus
35
35
Po(W)
Po(W)
32.5
32.5
30
30
BTL
BTL
27.5
27.5
Rl=8ohm
Rl=8ohm
25
25
f=1KHz
f=1KHz
22.5
22.5
20
20
17.5
17.5
15
15
12.5
12.5
10
10
7.5
7.5
5
5
2.5
2.5
0
0
+8+22+10+12+14+16+18+20
+8+22+10+12+14+16+18+20
T.H.D=10%
T.H.D=10 %
Vs(V)
Vs(V)
T.H.D=1%
T.H.D=1%
Figure 18. Crosstalk versus frequency
frequency
Doc ID 13907 Rev 613/25
Page 14
Electrical characteristics curvesSTA540
Figure 19. Standby attenuation versus
threshold voltage
Figure 21. Total power dissipation and
efficiency versus output power
Figure 20. Total power dissipation and
efficiency versus output power
14/25Doc ID 13907 Rev 6
Page 15
STA540Thermal information
5 Thermal information
In order to avoid the intervention of the thermal protection, placed at Tj =150° C for thermal
muting and T
resistance, R
The parameters that influence the calculation are:
●maximum dissipated power for the device (P
●maximum thermal resistance junction to case (R
●maximum ambient temperature T
There is also an additional term that depends on the Iq (quiescent current).
5.1 Heatsink specification examples
=160° C for thermal shutdown, it is important to calculate the heatsink thermal
j
, correctly.
th_HS
)
d
max
th_j-case
amb_max
)
5.1.1 R
Given VS = 14.4 V, RL = 4 Ω x 4 channels, R
P
the maximum power dissipated in the device is:
and the required thermal resistance of the heatsink is:
5.1.2 R
Given VS = 14.4 V, RL = 2x 2 Ω (SE) + 1x 4 Ω (BTL), P
the maximum power dissipated in the device is:
calculation for 4 single-ended channels
th_HS
= 4 x 7 W then
out
calculation for 2 single-ended channels plus 1 BTL channel
th_HS
R
th_HS
P
dmax
P
dmax
NChannel
150 T
–
--------------------------------------------- - R
amb_max
P
dmax
2
2
V
CC
------------------- -
2Π2R
V
------------------- -4 2.6210.5W=⋅=⋅=
2Π2R
L
th_j-case
2
CC
L
th_j-case
2
2V
CC
--------------------25.25 10.5 21W=+⋅=+⋅=
Π2R
L
= 1.8° C/W, T
150 50–
----------------------1.87.7° C/W=–=–=
10.5
= 2 x 12 W + 1 x 26 W then
out
amb_max
= 50° C and
and the required thermal resistance of the heatsink is:
150 T
–
R
th_HS
--------------------------------------------- - R
amb_max
P
dmax
Doc ID 13907 Rev 615/25
th_j-case
150 50–
----------------------1.83°C/W=–=–=
21
Page 16
Thermal informationSTA540
5.1.3 Calculations using music power
The thermal resistance value calculated in each of the two above examples specifies a
heatsink capable of sustaining the maximum dissipated power. Realistically, however, and
as explained in the Application Note (AN1965), the heatsink can be smaller when the
application is musical content.
When music power is considered the resulting dissipation is about 40% less than the
calculated maximum. Thus, smaller or cheaper heatsinks can be employed. The heatsink
thermal resistance values are modified as follows:
for example 5.1.1: 10.5 W - 40% = 6.3 W, thus giving R
for example 5.1.2: 21 W - 40% = 12.6 W, thus giving R
th_c-amb
th_c-amb
= 14° C/W,
= 6° C/W.
16/25Doc ID 13907 Rev 6
Page 17
STA540Practical information
6 Practical information
6.1 Highly flexible amplifier configuration
The availability of four independent channels makes it possible to accomplish several kinds
of applications ranging from four speakers stereo (F/R) to two-speaker bridge solutions.
When working with single-ended configurations, the polarity of the speakers driven by the
inverting amplifier must be reversed with respect to those driven by non-inverting channels.
This is to avoid phase irregularities causing sound alterations especially during the
reproduction of low frequencies.
6.2 Easy single-ended to bridge transition
The change from single-ended to bridge configuration is made simple by connecting the two
inputs together and also the speaker directly between the two outputs (no need for
additional external components, in fact the output DC blocking capacitors are eliminated).
However, take care to use an inverting/non-inverting amplifier pair.
6.3 Internally fixed gain
The advantages in internally fixing the gain (to 20 dB in single-ended configuration and to
26 dB in bridge configuration) are:
●components and space saving,
●output noise, supply voltage rejection and distortion optimization.
6.4 Silent turn on/off and muting/standby function
The standby mode can be easily activated by means of a CMOS logic level applied to
pin ST-BY through a RC filter.
Under standby conditions, the device is turned off completely (supply current = 1 mA typical,
output attenuation = 80 dB minimum).
All on/off operations are virtually pop-free. Furthermore, at turn-on the device stays in mute
condition for a time determined by the value of the SVR capacitor. This prevents transients,
coming from previous stages, from producing unpleasant acoustic effects at the speakers.
6.5 Driving circuit for standby mode
Some precautions need to be taken when designing the driving circuit for pin 7, ST-BY. For
instance, the pin cannot be directly driven by a voltage source having a current capability
higher than 5 mA. In practical cases a series resistance must be inserted, giving it the
double purpose of limiting the current at pin 7 and to smooth down the standby on/off
transitions. And, when done in combination with a capacitor, prevents output pop.
A capacitor of at least 100 nF from pin 7 to S-GND, with no resistance in between, is
necessary to ensure correct turn-on.
Doc ID 13907 Rev 617/25
Page 18
Practical informationSTA540
6.6 Output stage
The fully complementary output stage is possible with the power ICV PNP component.
This novel design is based on the connection shown in Figure 22 and allows the full
exploitation of its capabilities. The clear advantages this new approach has over classical
output stages are described in the following sections.
6.6.1 Rail-to-rail output voltage swing without bootstrap capacitors
The output swing is limited only by the V
range of 0.3 Ω (R
) each.
sat
of the output transistors, which are in the
CEsat
Classical solutions adopting composite PNP-NPN for the upper output stage have higher
saturation loss on the top side of the waveform.
This unbalanced saturation causes a significant power reduction. The only way to recover
power includes of the addition of expensive bootstrap capacitors.
6.6.2 Absolute stability without external compensation
With reference to the circuit shown in Figure 22, the low frequency gain V
than unity, that is, approximately 1 + R2/R1. The DC output level (VCC
auxiliary amplifier common to all the channels.
By controlling the amount of this local feedback it is possible to force the loop gain (A*β) to
less than unity at frequency where the phase shift is 180°. This means that the output buffer
is intrinsically stable and not prone to oscillation.
The above feature has been achieved even though there is very low closed-loop gain of the
amplifier.
This contrasts with the classical PNP-NPN stage which makes use of external RC networks,
namely the Boucherot cells, for reducing the gain at high frequencies.
Figure 22. The new output stage
is greater
out/Vin
/ 2) is fixed by an
18/25Doc ID 13907 Rev 6
Page 19
STA540Practical information
6.7 Built–in protection
6.7.1 Diagnostic facilities (pin 10)
The STA540 is equipped with diagnostic circuitry that is able to detect the following events:
●clipping of the output signal,
●thermal shutdown,
●output fault:
–short circuit to GND,
–short circuit to VS,
–soft short circuit at turn-on.
The event is signalled when the open collector output of pin 10 begins to sink current.
6.7.2 Short-circuit protection
Reliable and safe operation in the presence of all kinds of output short circuit is assured by
the built-in protection. As well as the AC/DC short circuit to GND and to VS, and across the
speaker, there is a soft short-circuit condition, which is signalled on pin 10 (DIAGNOSTICD)
during the turn-on phase, to verify output circuit integrity in order to ensure correct amplifier
operation.
This particular kind of protection acts in such a way as to prevent the device being turned on
(via pin ST-BY) when a resistive path (that is a DC path) less than 16 Ω exists between the
output and GND. This would avoid loud speaker damage should, for example, the output
coupling capacitor develop an internal short circuit.
As mentioned previously, it is important to limit the external current driving pin ST-BY
to 5 mA. The reason is that the associated circuitry is normally disabled with currents
greater than 5 mA.
The soft short-circuit protection is particularly attractive when, in the single-ended
configuration, one capacitor is shared between two outputs (see Figure 23).
Figure 23. Shared capacitor in single-ended configuration
Doc ID 13907 Rev 619/25
Page 20
Practical informationSTA540
6.7.3 Clipping detection
Figure 24. Clipping detection waveforms
Current sinking at pin 10 occurs when a certain distortion level is reached at each output.
This function initiates a gain-compression facility whenever the amplifier is overdriven.
6.7.4 Thermal shutdown
With the thermal shutdown feature, the diagnostics output (pin 10) signals the closeness of
the junction temperature to the shutdown threshold. Typically, current sinking at pin 10 starts
approximately 10° C before the shutdown temperature is reached.
Figure 25. Output fault waveforms (see Figure 26)
Figure 26. Fault waveforms
ST-BY PIN
VOLTAGE
2V
OUT TO Vs SHORT
OUTPUT
WAVEFORM
Vpin 10
OUT TO GND SHORT
CORRECT TURN-ON
SOFT SHORT
FAULT DETECTION
t
t
CHECK AT TURN-ON
(TEST PHASE)
20/25Doc ID 13907 Rev 6
D05AU1603mod
SHORT TO GND
OR TO Vs
t
Page 21
STA540Practical information
6.8 Handling the diagnostic information
As different diagnostic information (clipping detection, output fault, approaching thermal
shutdown) becomes available at pin 10 so the behavior of the signal at this pin changes.
In order to discriminate the event, signal DIAGNOSTICD, pin 10, must be interpreted
correctly. Figure 27 shows a combination of events on the output waveform and the
corresponding output on pin 10.
This events could be diagnosed based on the timing of the output signal on pin 10. For
example, the clip-detector signalling under fault conditions could produce a low level for a
short time. On the other hand, an output short circuit would probably produce a low level for
a much longer time. With these assumptions, an interface circuit based on the one shown in
Figure 28 could differentiate the information and flag the appropriate circuits.
Figure 27. Waveforms
ST-BY PIN
VOLTAGE
t
Vs
OUTPUT
WAVEFORM
Vpin 10
WAVEFORM
D05AU1604mod
Figure 28. Interface circuit diagram
CLIPPING
SHORT TO GND
OR TO Vs
THERMAL
PROXIMITY
t
t
Doc ID 13907 Rev 621/25
Page 22
Practical informationSTA540
6.9 PCB ground layout
The device has two distinct ground pins, P-GND (power ground) and S-GND (signal ground)
which are disconnected from each other at chip level. For superior performance the pins
P-GND and S-GND must be connected together on the PCB by low-resistance tracks.
For the PCB-ground configuration, a star-like arrangement, where the center is represented
by the supply-filtering electrolytic capacitor ground, is recommended. In an arrangement
such as this, at least two separate paths must be provided, one for P-GND and one for
S-GND.
The correct ground assignments are as follows:
●on S-GND:
–standby capacitor (pin 7, or any other standby driving networks),
–SVR capacitor (pin 6), to be placed as close as possible to the device,
–input signal ground (from active/passive signal processor stages)
●on P-GND:
–power supply filtering capacitors for pins 3 and 13. The negative terminal of the
electrolytic capacitor(s) must be directly tied to the battery negative line and this
should represent the starting point for all the ground paths.
6.10 Mute function
If the mute function is desired, it can be implemented on pin 6, SVR, as shown in Figure 29.
Figure 29. Optional mute function circuit
MUTE
0
PLAY
VS = 10 to 16 V,
mute off: V
mute on: V
Using a different value for R1 than the suggested 3.3 kΩ, results in two different situations:
●R1 > 3.3 kΩ:
–pop noise improvement,
–lower mute attenuation;
●R1 < 3.3 kΩ:
–pop noise degradation,
–higher mute attenuation.
≥ 0.6 to 0.8 V,
SVR
≥ 0.2 V
SVR
IN L
R1 3.3K
10K
0.22μF
0.22μF
0.47μF
470μF
10μF
13
7
4
5
11
6
8
9
DIAGNOSTICS
3
1
2200μF
2
2200μF
15
14
10
D06AU1632
ST-BY
IN R
IN BRIDGE12
5V
R2 10K
1000μF100nF
OUT L
OUT R
OUT
BRIDGE
V
S
22/25Doc ID 13907 Rev 6
Page 23
STA540Package information
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Figure 30. Mechanical data and package dimensions (Multiwatt15)
DIM.
A0.197
B2.650.104
C1.60.063
D10.039
E0.490.55 0.0190.022
F0.660.75 0.0260.030
G1.021.271.52 0.040 0.050 0.060
G117.53 17.78 18.03 0.690 0.700 0.710
H119.60.772
H220.20.795
L21.922.222.5 0.862 0.874 0.886
L121.722.122.5 0.854 0.870.886
L217.6518.1 0.6950.713
L317.25 17.5 17.7 5 0.679 0.689 0.699
L410.310.710.9 0.406 0.421 0.429
L72.652.90.1040.114
M4.254.554.85 0.167 0.179 0.191
M14.735.085.43 0.186 0.200 0.214
S1.92.60.0750.102
S11.92.60.0750.102
Dia13.653.85 0.1440.152
mminch
MIN. TYP. MAX. MIN. TYP. MAX.
5
OUTLINE AND
MECHANICAL DATA
Multiwatt15 (Vertical)
0016036 J
Doc ID 13907 Rev 623/25
Page 24
Revision historySTA540
8 Revision history
Table 6.Document revision history
DateRevisionChanges
May-20061Initial release
Sep-20062Minor non-technical edits
Updated description on page 1
Oct-20073
Updated pin naming, numbering in all relevant figures
Minor non-technical edits
21-Jan-20084
02-Apr-20125
24-Apr-20126
Updated power specifications on pages 1, 6 and 8
Updated short-circuit output current in Table 5
Modified V
to VSB and updated parameters in Table 5: Electrical
ST-BY
characteristics
®
Updated ECOPACK
text in Section 7: Package information
Updated dimension A in Figure 30: Mechanical data and package
dimensions (Multiwatt15)
24/25Doc ID 13907 Rev 6
Page 25
STA540
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