Datasheet SPW17N80C3 Datasheet (INFINEON)

Page 1
SPW17N80C3
jmax
)
A
jmax
A
j
g
Cool MOS™ Power Transistor
Feature
New revolutionary high voltage technology
Worldwide best R
DS(on)
Ultra low gate charge
Periodic avalanche rated
Extreme dv/dt rated
Type Package Ordering Code
SPW17N80C3 P-TO247 Q67040-S4359
in TO 247
Marking
17N80C3
V
R
I
DS
D
800 V
0.29
17 A
P-TO247
Maximum Ratings
Parameter Symbol Value Unit
Continuous drain current
T
= 25 °C
C
T
= 100 °C
C
Pulsed drain current, tp limited by T
Avalanche energy, single pulse
I
= 3.4 A, VDD = 50 V
D
Avalanche energy, repetitive tAR limited by T
I
= 17 A, VDD = 50 V
D
Avalanche current, repetitive t
limited by T
R
jmax
I
I
E
1
E
I
Gate source voltage V
Gate source voltage AC (f >1Hz)
Power dissipation, T
= 25°C P
C
V
Operating and storage temperature T
D
D puls
AS
AR
R
GS
GS
tot
T
,
17
11
51
670 mJ
0.5
17 A
±20
±30
208 W
st
-55... +150
A
V
°C
Page 1
2004-03-03Rev. 2.1
Page 2
Maximum Ratings
SPW17N80C3
Parameter
Drain Source voltage slope
VDS = 640 V, ID = 17 A, Tj = 125 °C
Symbol Value Unit
dv/dt 50 V/ns
Thermal Characteristics
Parameter
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
Soldering temperature,
Symbol Values Unit
R
thJC
R
thJA
T
- - 260 °C
sold
1.6 mm (0.063 in.) from case for 10s
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter
Drain-source breakdown voltage
Drain-Source avalanche
Symbol Conditions Values Unit
V
(BR)DSS
V
(BR)DS
VGS=0V, ID=0.25mA 800 - - V
VGS=0V, ID=17A - 870 -
breakdown voltage
min. typ. max.
- - 0.6 K/W
- - 62
min. typ. max.
Gate threshold voltage V
Zero gate voltage drain current I
Gate-source leakage current I
Drain-source on-state resistance R
Gate input resistance
R
GS(th)
DSS
GSS
DS(on)
G
ID=1000µΑ, VGS=V
VDS=800V, VGS=0V,
T
=25°C,
j
=150°C
T
j
VGS=20V, VDS=0V - - 100 nA
VGS=10V, ID=11A,
T
=25°C
j
=150°C
T
j
f=1MHz, open Drain - 0.7 -
2.1 3 3.9
DS
-
0.5
-
-
-
0.25
0.78
µA
25
-
250
0.29
-
Page 2
2004-03-03Rev. 2.1
Page 3
Electrical Characteristics , at Tj = 25 °C, unless otherwise specified
SPW17N80C3
Parameter
Symbol Conditions Values Unit
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Effective output capacitance,
2)
C
energy related
Effective output capacitance,
3)
C
time related
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
fs
iss
oss
rss
o(er)
o(tr)
d(on)
r
d(off)
f
V
2*I
DS
D*RDS(on)max
I
=11A
D
VGS=0V, VDS=25V,
f=1MHz
VGS=0V,
V
=0V to 480V
DS
VDD=400V, VGS=0/10V,
I
=17A, RG=4.7,
D
T
=125°C
j
,
min. typ. max.
- 15 - S
- 2320 - pF
- 1250 -
- 60 -
- 59 - pF
- 124 -
- 25 - ns
- 15 -
- 72 82
- 6 9
Gate Charge Characteristics
Gate to source charge
Gate to drain charge Q
Gate charge total Q
Gate plateau voltage V
1
Repetitve avalanche causes additional power losses that can be calculated as P
2
C
is a fixed capacitance that gives the same stored energy as C
o(er)
3
C
is a fixed capacitance that gives the same charging time as C
o(tr)
Q
gs
gd
g
(plateau)
VDD=640V, ID=17A - 12 - nC
VDD=640V, ID=17A,
V
=0 to 10V
GS
VDD=640V, ID=17A - 6 - V
while VDS is rising from 0 to 80% V
oss
while VDS is rising from 0 to 80% V
oss
- 46 -
- 91 177
=EAR*f.
AV
DSS
DSS
.
.
Page 3
2004-03-03Rev. 2.1
Page 4
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
SPW17N80C3
Parameter
Inverse diode continuous
Symbol Conditions Values Unit
I
S
forward current
Inverse diode direct current,
I
SM
pulsed
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
Peak reverse recovery current I
Peak rate of fall of reverse
SD
rr
rr
rrm
dirr/dt
recovery current
Typical Transient Thermal Characteristics
Symbol
Value Unit Symbol Value Unit
min. typ. max.
TC=25°C - - 17 A
- - 51
VGS=0V, IF=IS - 1 1.2 V
VR=400V, IF=IS ,
/dt=100A/µs
di
F
- 550 - ns
- 15 - µC
- 51 - A
- 1200 - A/µs
Thermal resistance
R
th1
R
th2
R
th3
R
th4
R
th5
R
th6
P
tot
typ. typ.
Thermal capacitance
0.00812 K/W
0.016
0.031
0.114
0.135
0.059
T
R
j T
th1
(t)
C
th1
C
th2
C
th1
C
th2
C
th3
C
th4
C
th5
C
th6
R
th,n
C
th,n
T
case
amb
External Heatsink
0.0003562
0.001337
0.001831
0.005033
0.012
0.092
Ws/K
Page 4
2004-03-03Rev. 2.1
Page 5
SPW17N80C3
1 Power dissipation
P
= f (TC)
tot
SPW17N80C3
240
W
200
180
160
tot
P
140
120
100
80
60
40
20
0
0 20 40 60 80 100 120
°C
2 Safe operating area
ID = f ( VDS )
parameter : D = 0 ,
2
10
A
1
10
D
I
0
10
-1
10
-2
10
160
T
C
10
0
T
=25°C
C
tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms DC
1
10
10
2
V
V
DS
10
3
3 Transient thermal impedance
Z
= f (tp)
thJC
parameter: D = t
1
10
K/W
0
10
thJC
-1
Z
10
-2
10
-3
10
-4
10
-7
10
10
/T
p
D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse
-6
10
-5
10
-4
10
-3
4 Typ. output characteristic
ID = f (VDS); Tj=25°C
parameter: t
70
A
60
55
50
45
D
I
40
35
30
25
20
15
10
5
-1
10
s
t
p
0
0 5 10 15 20
= 10 µs, V
p
GS
8V
7V
6V
5V
20V 10V
V
DS
30
V
Page 5
2004-03-03Rev. 2.1
Page 6
SPW17N80C3
5 Typ. output characteristic
ID = f (VDS); Tj=150°C
parameter: t
35
A
25
D
I
20
15
10
5
0
0 5 10 15 20
= 10 µs, V
p
GS
20V 10V 8V 7V
6.5V
6V
5.5V
5V
4.5V
4V
V
DS
V
30
6 Typ. drain-source on resistance
R
DS(on)
parameter:
=f(ID)
T
=150°C, V
j
1.5
1.3
1.2
DS(on)
R
1.1
1
0.9
0.8
0.7
0.6
0.5 0 5 10 15 20 25
4V
4.5V 5V
5.5V
GS
6V
6.5V
A
I
7V 8V 10V 20V
35
D
7 Drain-source on-state resistance
R
DS(on)
parameter : I
R
= f (Tj)
= 11 A, VGS = 10 V
D
SPW17N80C3
1.6
1.2
DS(on)
1
0.8
0.6
0.4
0.2
0
-60 -20 20 60 100
98%
typ
°C
8 Typ. transfer characteristics
= f ( VGS ); V
I
D
DS
2 x I
D
x R
DS(on)max
parameter: tp = 10 µs
65
A
55
50
45
D
40
I
35
30
25
20
15
10
5
180
T
j
0
0 2 4 6 8 10 12 14 16
25°C
150°C
V
V
20
GS
Page 6
2004-03-03Rev. 2.1
Page 7
SPW17N80C3
j
9 Typ. gate charge
= f (Q
V
GS
parameter: I
SPW17N80C3
16
V
12
0.2 V
GS
0.8 V
10
V
8
6
4
2
0
0 20 40 60 80 100 120
)
Gate
= 17 A pulsed
D
DS max
DS max
nC
Q
160
Gate
10 Forward characteristics of body diode
IF = f (VSD)
parameter: T
2
10
A
1
10
F
I
0
10
-1
10
0 0.4 0.8 1.2 1.6 2 2.4
, tp = 10 µs
SPW17N80C3
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
3
V
V
SD
11 Avalanche SOA
IAR = f (tAR)
par.:
T
150 °C
j
18
A
14
12
AR
I
10
8
6
4
2
0
10
-3
10
T
-2
-1
10
(START)
=125°C
j
10 0 10 1 10
T
(START)
j
=25°C
2
µs
t
AR
10
12 Avalanche energy
EAS = f (Tj)
par.: I
4
= 3.4 A, VDD = 50 V
D
700
mJ
600
550
500
AS
450
E
400
350
300
250
200
150
100
50
0
25 50 75 100
°C
T
150
j
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2004-03-03Rev. 2.1
Page 8
SPW17N80C3
13 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (Tj)
SPW17N80C3
980
V
940
920
900
880
860
840
820
800
780
760
740
720
-60 -20 20 60 100
°C
14 Avalanche power losses
PAR = f (f )
parameter:
500
W
400
350
AR
P
300
250
200
150
100
50
180
T
j
0
10
E
=0.5mJ
AR
4
10
5
Hz
10
6
f
15 Typ. capacitances
C = f (VDS)
parameter:
10
pF
10
10
C
10
10
10
V
=0V, f=1 MHz
GS
5
4
3
2
1
0
0 100 200 300 400 500 600
C
rss
16 Typ. C
E
=f(VDS)
oss
18
stored energy
oss
µJ
oss
14
12
C
iss
E
10
C
oss
800
V
V
DS
8
6
4
2
0
0 100 200 300 400 500 600
V
V
800
DS
Page 8
2004-03-03Rev. 2.1
Page 9
Definition of diodes switching characteristics
SPW17N80C3
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2004-03-03Rev. 2.1
Page 10
P-TO-247-3-1
15.9
6.35
ø3.61
SPW17N80C3
5.03
2.03
4.37
6.17
9.91
20.9
1.75
D
1.14
0.243
General tolerance unless otherwise specified: Leadframe parts: ±0.05
D 7
2.97 x 0.127
16
1.2
2
2.92
5.46
5.94
Package parts: ±0.12
20˚
41.22
0.762 MAX.
+0.05
2.4
Page 10
2004-03-03Rev. 2.1
Page 11
SPW17N80C3
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 11
2004-03-03Rev. 2.1
Page 12
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