■ Improved ESD Specifications:
+15kV Human Body Model
+15kV IEC1000-4-2 Air Discharge
+8kV IEC1000-4-2 Contact Discharge
SP486E and SP487E
DESCRIPTION…
The SP486E and SP487E are low-power quad differential line drivers that meet the
specifications of RS-485 and RS-422 serial protocols with enhanced ESD performance. The
ESD tolerance has been improved on these devices to over +15kV for both Human Body
Model and IEC1000-4-2 Air Discharge Method. These devices are superior drop-in replacements to Sipex's SP486 and SP487 devices as well as popular industry standards. As with
the original versions, the SP486E features a common driver enable control and the SP487E
provides independent driver enable controls for each pair of drivers. Both feature wide
common-mode input ranges. Both are available in 16-pin plastic DIP and SOIC packages.
These are stress ratings only and functional operation
of the device at these or any other above those indicated
in the operation sections of the specifications below is
not implied. Exposure to absolute maximum rating
conditions for extended periods of time may affect
reliability.
Small Outline .......................................... 375mW
(derate 7mW/°C above +70°C)
Lead Temperature (soldering, 10 sec) ......... 300°C
SPECIFICATIONS
VCC = 5V±5%; typicals at 25°C; T
PARAMETERMIN.TYP.MAX.UNITCONDITIONS
DC CHARACTERISTICS
Digital InputsDI, EN, EN, EN
Voltage
V
IL
V
IH
Input Current+2µAVIN = 0V to V
DRIVER OUTPUTS
Differential VoltageV
Change in Output Magnitude0.2VoltsR
for Complementary Output State
Common Mode Output Voltage2.33VoltsR
Change in Common Mode Output Magnitude0.2VoltsR
for Complementary Output StateRL = 50Ω (RS-422)
Maximum Data Rate10Mbps
Short–circuit Current
V
OH
V
OL
High Impedance Output Current+2+200µAVO = –7V to +12V
Pin 1 — DI1 — Driver 1 Input — If Driver 1
output is enabled, logic 0 on DI1 forces driver
output DO1A low and DO1B high. A logic 1 on
DI1 with Driver 1 output enabled forces driver
DO1A high and DO1B low.
Pin 2 — DO1A — Driver 1 output A.
Pin 3 — DO1B — Driver 1 output B.
Pin 4 — EN — Driver Output Enable. Please
refer to SP486ETruth Table (1).
S
1
V
OUTPUT
UNDER TEST
C
L
500 ohms
S
CC
2
Figure 3. Driver Timing Test Load
Pin 8 — GND — Digital Ground.
Pin 9 — DI3 — Driver 3 Input — If Driver 3
output is enabled, logic 0 on DI3 forces driver
output DO3A low and DO3B high. A logic 1 on
DI3 with Driver 3 output enabled forces driver
DO3A high and DO3B low.
Pin 10 — DO3A — Driver 3 output A.
Pin 11 — DO3B — Driver 3 output B.
Pin 12 — EN — Driver Output Disable. Please
refer to SP486ETruth Table (1).
Pin 13 — DO4B — Driver 4 output B.
Pin 5 — DO2B — Driver 2 output B.
Pin 6 — DO2A — Driver 2 output A.
Pin 1 — DI1 — Driver 1 Input — If Driver 1
output is enabled, logic 0 on DI1 forces driver
output DO1A low and DO1B high. A logic 1 on
DI1 with Driver 1 output enabled forces driver
DO1A high and DO1B low.
Pin 2 — DO1A — Driver 1 output A.
Pin 3 — DO1B — Driver 1 output B.
Pin 4 — EN1/EN2 — Driver 1 and 2 Output
Enable. Please refer to SP487ETruth Table (2).
Pin 5 — DO2B — Driver 2 output B.
Pin 6 — DO2A — Driver 2 output A.
Pin 7 — DI2 — Driver 2 Input — If Driver 2
output is enabled, logic 0 on DI2 forces driver
output DO2A low and DO2B high. A logic 1 on
DI2 with Driver 2 output enabled forces driver
DO2A high and DO2B low.
Pin 8 — GND — Digital Ground.
Pin 9 — DI3 — Driver 3 Input — If Driver 3
output is enabled, logic 0 on DI3 forces driver
output DO3A low and DO3B high. A logic 1 on
DI3 with Driver 3 output enabled forces driver
DO3A high and DO3B low.
Pin 10 — DO3A — Driver 3 output A.
Pin 12 — EN3/EN4 — Driver 3 and 4 Output
Enable. Please refer to SP487ETruth Table (2).
Pin 13 — DO4B — Driver 4 output B.
Pin 14 — DO4A — Driver 4 output A.
Pin 15 — DI4 — Driver 4 Input — If Driver 4
output is enabled, logic 0 on DI4 forces driver
output DO4A low and DO4B high. A logic 1 on
DI4 with Driver 3 output enabled forces driver
DO4A high and DO4B low.
Pin 16 — Supply Voltage VCC — 4.75V ≤ VCC ≤
5.25V.
FEATURES…
The SP486E and SP487E are low–power quad
differential line drivers meeting RS-485 and
RS-422 standards. The SP486E features active
high and active low common driver enable
controls; the SP487E provides independent,
active high driver enable controls for each pair
of drivers. The driver outputs are short–circuit
limited to 200mA. Data rates up to 10Mbps are
supported. Both are available in 16–pin plastic
DIP and SOIC packages.
add up to 330add up to 330ΩΩ f for IEC1000-4-2.or IEC1000-4-2.
S S
V V
SW2
SW2SW2
Device
Under
Test
6
Page 7
ESD TOLERANCE
The SP486E and SP487E devices incorporate
ruggedized ESD cells on all driver output and
receiver input pins. The ESD structure is
improved over our previous family for more
rugged applications and environments sensitive
to electro-static discharges and associated
transients. The improved ESD tolerance is at
least +15kV without damage nor latch-up.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconductors.
This method is also specified in MIL-STD-883,
Method 3015.7 for ESD testing. The premise of
this ESD test is to simulate the human body’s
potential to store electro-static energy and
discharge it to an integrated circuit. The
simulation is performed by using a test model as
shown in Figure 6. This method will test the IC’s
capability to withstand an ESD transient during
normal handling such as in manufacturing areas
where the ICs tend to be handled frequently.
The IEC-1000-4-2, formerly IEC801-2, is
generally used for testing ESD on equipment and
systems. For system manufacturers, they must
guarantee a certain amount of ESD protection
since the system itself is exposed to the outside
environment and human presence. The premise
with IEC1000-4-2 is that the system is required
to withstand an amount of static electricity when
ESD is applied to points and surfaces of the
equipment that are accessible to personnel during
normal usage. The transceiver IC receives most
of the ESD current when the ESD source is
applied to the connector pins. The test circuit for
IEC1000-4-2 is shown on Figure 7. There are
two methods within IEC1000-4-2, the Air
Discharge method and the Contact Discharge
method.
i ➙
30A
15A
0A
t=0nst=30ns
t ➙
Figure 8. ESD Test Waveform for IEC1000-4-2
With the Air Discharge Method, an ESD voltage
is applied to the equipment under test (EUT)
through air. This simulates an electrically charged
person ready to connect a cable onto the rear of
the system only to find an unpleasant zap just
before the person touches the back panel. The
high energy potential on the person discharges
through an arcing path to the rear panel of the
system before he or she even touches the system.
This energy, whether discharged directly or
through air, is predominantly a function of the
discharge current rather than the discharge
voltage. Variables with an air discharge such as
approach speed of the object carrying the ESD
potential to the system and humidity will tend to
change the discharge current. For example, the
rise time of the discharge current varies with the
approach speed.
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the
ESD arc. The discharge current rise time is
constant since the energy is directly transferred
without the air-gap arc. In situations such as
hand held systems, the ESD charge can be directly
discharged to the equipment from a person already
holding the equipment. The current is transferred
on to the keypad or the serial port of the equipment
directly and then travels through the PCB and finally
to the IC.
The circuit model in Figures 6 and 7 represent
the typical ESD testing circuit used for all three
methods. The CS is initially charged with the DC
power supply when the first switch (SW1) is on.
Now that the capacitor is charged, the second
switch (SW2) is on while SW1 switches off. The
voltage stored in the capacitor is then applied
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than the
Human Body Model. The larger storage capacitor
injects a higher voltage to the test point when
SW2 is switched on. The lower current limiting
resistor increases the current charge onto the test
point.
through RS, the current limiting resistor, onto the
device under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under test
receives a duration of voltage.
For the Human Body Model, the current limiting
resistor (RS) and the source capacitor (CS) are
1.5kW an 100pF, respectively. For IEC-1000-4-2,
the current limiting resistor (RS) and the source
capacitor (CS) are 330W an 150pF, respectively.
DEVICE PIN HUMAN BODY IEC1000-4-2
TESTED MODEL Air Discharge Direct Contact Level
Model .................................. Enable/Disable ........................ Temperature Range ......................... Package
SP486ECP ....... Common; active Low and Active High ............ 0°C to +70°C ..................16–pin Plastic DIP
SP486ECT........ Common; active Low and Active High............ 0°C to +70°C...........................16–pin SOIC
SP486EEP........ Common; active Low and Active High.......... –40°C to +85°C................16–pin Plastic DIP
SP486EET........ Common; active Low and Active High ..........–40°C to +85°C.........................16–pin SOIC
SP487ECP ............ One per driver pair; active High ................. 0°C to +70°C..................16–pin Plastic DIP
SP487ECT............. One per driver pair; active High ................. 0°C to +70°C...........................16–pin SOIC
SP487EEP............. One per driver pair; active High ............... –40°C to +85°C................16–pin Plastic DIP
SP487EET............. One per driver pair; active High ...............–40°C to +85°C.........................16–pin SOIC
Please consult the factory for pricing and availability on a Tape-On-Reel option.
Corporation
SIGNAL PROCESSING EXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: sales@sipex.com
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.