Datasheet SP483ECN, SP483ECP, SP483EEN, SP483EEP Datasheet (Sipex Corporation)

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SP483E

Enhanced Low EMI Half-Duplex

RS-485 Transceiver

■ +5V Only

■ Low Power BiCMOS

■ Driver/Receiver Enable for Multi-Drop

configurations

■ Enhanced ESD Specifications: +15KV Human Body Model +15KV IEC1000-4-2 Air Discharge +8KV IEC1000-4-2 Contact Discharge

■ Low EMI Transceiver limited to 250kbps

DESCRIPTION

The SP483E is a half-duplex transceiver that meets the specifications of RS-485 and RS-422 serial protocols with enhanced ESD performance. The ESD tolerance has been improved on this device to over ±15kV for both Human Body Model and IEC1000-4-2 Air Discharge Method. This device is pin-to-pin compatible with Sipex's SP483 device as well as popular industry standards. As with the original version, the SP483E features Sipex's BiCMOS design allowing low power operation without sacrificing performance. The SP483E meet the requirements of the RS-485 and RS-422 protocols up to 250kbps under load. The SP483E is internally slew rate limited to reduce EMI and can meet the requirements of RS-485 and RS-422 up to 250kbps. The SP483E is also equipped with a low power Shutdown mode.

RO 1 RE 2

DE 3

DI 4

SP483E

8 Vcc 7 B 6 A

5 GND

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ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.

VCC............................................................................................................+7V

Input Voltages

Output Voltages

Storage Temperature.......................................................-65˚C to +150˚C

Power Dissipation...........................................................................500mW

Logic........................................................-0.3V to (VCC+0.5V)

Drivers..................................................-0.3V to (VCC+0.5V)

Receivers................................................................. ±15V

Logic........................................................-0.3V to (VCC+0.5V)

Drivers...................................................................... ±15V

Receivers............................................-0.3V to (VCC+0.5V)

SPECIFICATIONS

to T

and VCC = 5V ± 5% unless otherwise noted.

MIN

MAX

PARAMETERS MIN. TYP. MAX. UNITS CONDITIONS SP483E DRIVER

DC Characteristics

Differential Output Voltage GND V Differential Output Voltage 2 V

Differential Output Voltage 1.5 V Change in Magnitude of Driver

Volts Unloaded; R = ∞ ;

Volts with load; R = 50Ω; (RS-422);

Volts with load; R = 27Ω; (RS-485);

see Figure 1

Differential Output Voltage for Complimentary States 0.2 Volts R = 27Ω or R = 50Ω;

see Figure 1

Driver Common-Mode Output Voltage 3 Volts R = 27Ω or R = 50Ω;

see Figure 1

Input High Voltage 2.0 Volts Applies to DE, DI, RE Input Low Voltage 0.8 Volts Applies to DE, DI, RE Input Current Applies to DE, DI, RE

Driver Input 10µA DI

Control Lines 1µA DE, RE Driver Short-Circuit Current V

= HIGH ±250 mA -7V ≤ VO ≤ +12V

OUT

= LOW ±250 mA -7V ≤ VO ≤ +12V

OUT

SP483E DRIVER AC Characteristics

Maximum Data Rate 250 Kbps RE = 5V, DE = 5V; R

CL1 = CL2 = 100pF

Driver Input to Output 250 800 2000 ns t Driver Input to Output 250 800 2000 ns t Driver Skew 100 800 ns Driver Rise or Fall Time 250 2000 ns From 10% to 90%; R Driver Enable to Output High 250 2000 ns C

Driver Enable to Output Low 250 2000 ns C Driver Disable Time from Low 300 3000 ns C Driver Disable Time from High 300 3000 ns C

SP481E/SP485

E RECEIVER

; R

PLH

see Figures 3 and 5

PHL

see Figures 3 and 5

= 54Ω, CL1 = CL2 = 100pF;

DIFF

; R

= 54Ω, CL1 = CL2 = 100pF;

DIFF

see Figures 3 and 5,

SKEW

CL1 = C

= 100pF;

= 15pF;

= | t

- t

DPLH

= 100pF;

see Figures 4 & 6; see Figures 4 & 6;

see Figures 2 & 8;

= 54Ω,

DIFF

DPHL

= 54Ω,

DIFF

ee Figures 3 and

S1 closed S2 closed

S2 closed S1 closed

DC Characteristics

Differential Input Threshold -0.2 +0.2 Volts -7V ≤ V Input Hysteresis 20 mV VCM = 0V

≤ +12V

Output Voltage High 3.5 Volts IO = -4mA, VID = +200mV Output Voltage Low 0.4 Volts IO = +4mA, VID = -200mV Three-State (High Impedance) Output Current ±1 µA 0.4V ≤ VO ≤ 2.4V; RE = 5V Input Resistance 12 15 kΩ -7V ≤ V Input Current (A, B); VIN = 12V +1.0 mA DE = 0V, VCC = 0V or 5.25V, VIN = 12V

≤ +12V

Input Current (A, B); VIN = -7V -0.8 mA DE = 0V, VCC = 0V or 5.25V, VIN = -7V Short-Circuit Current 7 95 mA 0V ≤ VCM ≤ V

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SPECIFICATIONS (continued)

to T

and VCC = 5V ± 5% unless otherwise noted.

MIN

MAX

PARAMETERS MIN. TYP. MAX. UNITS CONDITIONS SP483E RECEIVER

AC Characteristics

Maximum Data Rate 250 Kbps RE = 0V, DE = 0V Receiver Input to Output 250 2000 ns t

Receiver Input to Output 250 2000 ns t Diff. Receiver Skew It

I 100 ns R

PLH-tPHL

Receiver Enable to Output Low 45 70 ns C Receiver Enable to Output High 45 70 ns C Receiver Disable from Low 45 70 ns C Receiver Disable from High 45 70 ns C

SP483E

Shutdown Timing

Time to Shutdown 50 200 600 ns RE = 5V, DE = 0V Driver Enable from Shutdown to Output High 2000 ns CL = 100pF; Driver Enable from Shutdown to Output Low 2000 ns CL = 100pF; Receiver Enable from Shutdown to Output High 300 2500 ns CL = 15pF; Receiver Enable from Shutdown to Output Low 300 2500 ns CL = 15pF;

; R

PLH

DIFF

CL1 = C

; R

PHL

DIFF

CL1 = C

= 54Ω; C

DIFF

Figures 3 & 7

= 15pF;

= 100pF;

= 54Ω, = 54Ω,

Figures 3 & 7

100pF;

Figures 3 & 7

= C

= 100pF;

Figures 2 & 8;

Figures 2 & 8; Figures 2 & 8;

S1 closed

S2 closed S1 closed S2 closed

See Figures 4 & 6;

See Figures 4 & 6; See Figures 2 & 8; See Figures 2 & 8;

S2 closed

S1 closed S2 closed S1 closed

POWER REQUIREMENTS

Supply Voltage +4.75 +5.25 Volts Supply Current

SP483E

No Load 900 µA RE = 0V, DI = 0V or VCC; DE = V

600 µA RE = 0V, DI = 0V or 5V; DE = 0V

SP483E

Shutdown Mode 10 µA DE = 0V, RE=V

ENVIRONMENTAL AND MECHANICAL

Operating Temperature Commercial (_C_) 0 +70 °C Industrial (_E_) -40 +85 °C Storage Temperature -65 +150 °C Package Plastic DIP (_P) NSOIC (_N)

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RO 1

RE 2

DE 3

DI 4

SP485

Top View

SP483E

Pinout (Top View)

8 V

7 B

6 A

5 GND

PIN FUNCTION

Pin 1 – RO – Receiver Output. Pin 2 – RE – Receiver Output Enable Active LOW. Pin 3 – DE – Driver Output Enable Active HIGH. Pin 4 – DI – Driver Input. Pin 5 – GND – Ground Connection. Pin 6 – A – Driver Output/Receiver Input

Non-inverting. Pin 7 – B – Driver Output/Receiver Input Inverting.

Pin 8 – Vcc – Positive Supply 4.75V<Vcc< 5.25V.

Receiver

Output

1kTest Point

Figure 1. RS-485 Driver DC Test Load Circuit Figure 2. Receiver Timing Test Load Circuit

DIFF

15pF

Figure 3. RS-485 Driver/Receiver Timing Test Circuit

Output

Under

Test

500

Figure 4. RS-485 Driver Timing Test Load #2 Circuit

f = 100kHz; tR < 10ns; tF < 10ns

+3V

DRIVER

OUTPUT

DIFFERENTIAL

OUTPUT

VA – V

SKEW = | tDPLH - tDPHL

1/2V

+ –

1.5V 1.5V t

PLH

DPLH

PHL

DPHL

1/2V

Figure 5. Driver Propagation Delays

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INPUTS OUTPUTS

LINE

RE DE DI CONDITION B A

X 1 1 No Fault 0 1 X 1 0 No Fault 1 0 X0X X ZZ X 1 X Fault Z Z

Table 1. Transmit Function Truth Table

INPUTS OUTPUTS

RE DE A - B R

0 0 +0.2V 1 0 0 -0.2V 0 0 0 Inputs Open 1 10 X Z

Table 2. Receive Function Truth Table

+3V

1.5V 1.5V

0V 5V

A, B

Figure 6. Driver Enable and Disable Times

0D2

A – B

SKEW = | tPHL - tPLH

Figure 7. Receiver Propagation Delays

–

0D2

PHL

f = 100kHz; tR < 10ns; tF < 10ns

2.3V

Output normally LOW

Output normally HIGH

0V 0V

1.5V 1.5V

f = 100kHz; tR < 10ns; tF < 10ns

INPUT

OUTPUT

PLH

0.5V

+3V

f = 100kHz; tR < 10ns; tF < 10ns

1.5V 1.5V t

Figure 8. Receiver Enable and Disable Times

1.5V

Output normally LOW

Output normally HIGH

0.5V

0.5V t

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DESCRIPTION...

Receivers...

The SP483E is a half-duplex differential transceiver that meets the requirements of RS-485 and RS-422. Fabricated with a Sipex proprietary BiCMOS process, the SP483E requires a fraction of the power of older bipolar designs.

The RS-485 standard is ideal for multi-drop applications and for long-distance interfaces. RS-485 allows up to 32 drivers and 32 receivers to be connected to a data bus, making it an ideal choice for multi-drop applications. Since the cabling can be as long as 4,000 feet, RS-485 transceivers are equipped with a wide (-7V to +12V) common mode range to accommodate ground potential differences. Because RS-485 is a differential interface, data is virtually immune to noise in the transmission line.

Drivers...

The driver outputs of the SP483E are differential outputs meeting the RS-485 and RS-422 standards. The typical voltage output swing with no load will be 0 Volts to +5 Volts. With worst case loading of 54Ω across the differential outputs, the drivers can maintain greater than 1.5V voltage levels. The drivers have an enable control line which is active HIGH. A logic HIGH on DE (pin 3) will enable the differential driver outputs. A logic LOW on DE (pin 3) will tri-state the driver outputs.

The SP483E has internally slew rate limited driver outputs to minimize EMI. The maximum data rate for the SP483E drivers is 250 Kbps under load.

The SP483E receivers have differential inputs with an input sensitivity as low as ±200mV. Input impedance of the receivers is typically 15kΩ (12kΩ minimum). A wide common mode range of -7V to +12V allows for large ground potential differences between systems. The receivers have a tri-state enable control pin. A logic LOW on RE (pin 2) will enable the receiver, a logic HIGH on RE (pin 2) will disable the receiver.

The SP483E receiver is rated for data rates up to 250 Kbps. The receivers are equipped with the fail-safe feature. Fail-safe guarantees that the receiver output will be in a HIGH state when the input is left unconnected.

Shutdown Mode...

The SP483E is equipped with a Shutdown mode. To enable the Shutdown state, both the driver and receiver must be disabled simultaneously. A logic LOW on DE (pin 3) and a logic HIGH on RE (pin 2) will put the SP483E into Shutdown mode. In Shutdown, supply current will drop to typically 1µA.

ESD TOLERANCE...

The SP483E device incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least ±15kV without damage nor latch-up.

There are different methods of ESD testing applied:

a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact

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The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 9. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently.

The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and

systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 10. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method.

SW1

SW1SW1

DC Power Source

Figure 9. ESD Test Circuit for Human Body Model

SW1

SW1SW1

DC Power Source

SW2

SW2SW2

Contact-Discharge Module

Contact-Discharge ModuleContact-Discharge Module

SW2

SW2SW2

Device Under Test

RS and RV add up to 330Ω for IEC1000-4-2.

andand RR

S S

Figure 10. ESD Test Circuit for IEC1000-4-2

add up to 330add up to 330ΩΩ f for IEC1000-4-2.or IEC1000-4-2.

V V

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With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.

i ➙

30A

15A

t=0ns t=30ns

t ➙

Figure 11. ESD Test Waveform for IEC1000-4-2

The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred

voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test

receives a duration of voltage. without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally

For the Human Body Model, the current limiting

resistor (RS) and the source capacitor (CS) are

1.5kΩ an 100pF, respectively. For IEC-1000-4-

2, the current limiting resistor (RS) and the source

capacitor (CS) are 330Ω an 150pF, respectively. to the IC.

The higher CS value and lower RS value in the The circuit model in Figures 9 and 10 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The

HUMAN BODY IEC1000-4-2

DEVICE PIN

TESTED

MODEL Air Discharge Direct Contact Level

Driver Outputs ±15kV ±15kV ±8kV 4 Receiver Inputs ±15kV ±15kV ±8kV 4

IEC1000-4-2 model are more stringent than the

Human Body Model. The larger storage capacitor

injects a higher voltage to the test point when

SW2 is switched on. The lower current limiting

resistor increases the current charge onto the test

point.

Table 1. Transceiver ESD Tolerance Levels

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D1 = 0.005" min.

(0.127 min.)

e = 0.100 BSC

(2.540 BSC)

ALTERNATE

END PINS

(BOTH ENDS)

PACKAGE: PLASTIC

DUAL–IN–LINE (NARROW)

A1 = 0.015" min.

(0.381min.)

A = 0.210" max.

(5.334 max).

eA = 0.300 BSC

(7.620 BSC)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

8–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.355/0.400

(9.017/10.160)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

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DIMENSIONS (Inches)

Minimum/Maximum

(mm) A

8–PIN

0.053/0.069

(1.346/1.748)

0.004/0.010

(0.102/0.249

0.014/0.019 (0.35/0.49)

0.189/0.197 (4.80/5.00)

0.150/0.157

(3.802/3.988)

0.050 BSC

(1.270 BSC)

0.228/0.244

(5.801/6.198)

0.010/0.020

(0.254/0.498)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC) (NARROW)

h x 45°

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ORDERING INFORMATION

Model Temperature Range Package

SP483ECN ....................................................... 0˚C to +70˚C............................................... 8-pin Narrow SOIC

SP483ECP........................................................ 0˚C to +70˚C...................................................8-pin Plastic DIP

SP483EEN...................................................... .-40˚C to +85˚C............................................. 8-pin Narrow SOIC

SP483EEP ...................................................... -40˚C to +85˚C .................................................8-pin Plastic DIP

Please consult the factory for pricing and availability on a Tape-On-Reel option.

Corporation

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation Headquarters and

Sales Office

22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com

Sales Office

233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.

Datasheet SP483ECN, SP483ECP, SP483EEN, SP483EEP Datasheet (Sipex Corporation)

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