Datasheet SMP30-120, SMP30-130, SMP30-180, SMP30-200, SMP30-220 Datasheet (SGS Thomson Microelectronics)

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Page 1
SMP30-xxx Series
FEATURES
n BIDIRECTIONAL CROWBAR PROTECTION. n VOLTAGE RANGE: FROM 62 V TO 270 V. n HOLDING CURRENT :
IH= 150 mA min.
IPP= 30 A, 10/1000 µs.
n JEDEC REGISTERED PACKAGE OUTLINE
DESCRIPTION
The SMP30-xxx series has been designed to protect telecommunication equipments against lightning surges and overvoltages induced by AC power lines.
SMA
(JEDEC DO-214AA)
SCHEMATIC DIAGRAM
TRISIL
TM
COMPLIES WITH THE
FOLLOWING STANDARDS:
(CCITT) ITU-K20
Peak Surge
Voltage
(V)
1000 10/700 5/310 25 -
Voltage
Waveform
(µs)
Current
Waveform
(µs)
Admissible
Ipp
(A)
Necessary
(CCITT) ITU-K17 1500 10/700 5/310 38 ­VDE0433
2000 10/700 5/310 40 10 VDE0878 2000 1.2/50 1/20 50 ­IEC-1000-4-5
FCC Part 68, lightning surge type A
FCC Part 68, lightning surge
level 2 level 3
1500
800
10/700
1.2/50
10/160 10/560
5/310
8/20
10/160 10/560
25 50
65 50
1000 9/720 5/320 25 ­type B
BELLCORE TR-NWT-001089 First level
BELLCORE TR-NWT-001089
2500
1000
2/10
10/1000
2/10
10/1000
125
30
5000 2/10 2/10 125 15.0 Second level
BELLCORE TR-NWT-001089
1500 2/10 2/10 100 ­Intra building lightning
CNET l31-24 1000 0.5/700 0.8/310 25 -
January 2000 - Ed: 5B
Resistor
()
-
-
15.5
8.0
15.0
23.3
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Page 2
SMP30-xxx Series
ABSOLUTE MAXIMUM RATINGS (T
amb
=25°C)
Symbol Parameter Value Unit
P Power dissipation on infinite heatsink T
IPPPeak pulse current 10/1000 µs
I
TSM
I2t
Non repetitive surge peak on-state current tp = 20 ms 15 A I2t value for fusing
dV/dt Critical rate of rise of off-state voltage V
T
stg
T
j
T
L
Storage temperature range Maximum junction temperature
Maximumleadtemperatureforsolderingduring10sat5mmforcase
=50°C3 W
amb
30
8/20 µs
60
tp = 20 ms 1 A2s
RM
5 kV/µs
- 55 to + 150 150
260 °C
THERMAL RESISTANCES
Symbol Parameter Value Unit
Rth(j-l) Junction to leads 30 °C/W
Rth(j-a)
Junction to ambient on printed circuit
120 °C/W
with standard footprint dimension
A
°C °C
ELECTRICAL CHARACTERISTICS
(T
=25°C)
amb
Symbol Parameter
V
RM
I
RM
V
V
BR
V
BO
I
H
I
BO
I
PP
Stand-off voltage Leakage current at stand-off voltage Continuous Reverse voltage
R
Breakdown voltage
Breakover voltage
Holding current Breakover current Peak pulse current
C Capacitance
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Page 3
SMP30-xxx Series
Type
Marking IRM@V
RM
max max
note 1
µAVµAV VmAmA pF
SMP30-62 SMP30-68 SMP30-100 SMP30-120 SMP30-130 SMP30-180 SMP30-200 SMP30-220 SMP30-240 SMP30-270
Note 1: IRmeasured at VRguarantee V Note 2: Measured at 50 Hz(1cycle) - See test circuit1. Note 3: See test circuit 2. Note 4: VR= 1V, F =1MHz. Note 5: VR= 50V,F = 1MHz
QAA QAB QAC QAD QAE QAF QAG QAH
QAI
QAJ
2 2 2 2 2 2 2 2 2 2
BRmin
108 117 162 180 198 216 243
V
56 61 90
50 50 50 50 50 50 50 50 50 50
R
TEST CIRCUIT 1 FORIBOand VBOparameters :
tp
Auto
Transfo r m er
220V/2A
static relay.
IR@V
100 120 130 180 200 220 240 270
=20ms
R
62 68
note 2
R1
140
R2
240
VBO@I
max
82
90 133 160 173 240 267 293 320 360
BO
800 800 800 800 800 800 800 800 800 800
I
H
min
note 3
150 150 150 150 150 150 150 150 150 150
typ
note 4
50 50 40 40 35 35 30 30 30 30
C
typ
note 5
20 20 16 16 14 14 12 12 12 12
V
out
I
220V
Transformer
220V/800V
5A
BO
measure
TEST PROCEDURE :
n Pulse Test duration (tp = 20ms):
- For Bidirectional devices = Switch K is closed
- For Unidirectional devices = Switch K is open.
n V
OUT
Selection
- Device with VBO< 250 Volt
-V
OUT
= 250 V
RMS,R1
= 140 .
- Device with VBO 250 Volt
-V
OUT
= 480 V
RMS,R2
= 240 .
K
D.U.T
V
BO
measure
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Page 4
SMP30-xxx Series
TEST CIRCUIT 2 for IHparameter.
R
-V
P
V
BAT
D.U.T .
= - 48 V
Surge generator
This is a GO-NOGO Test which allows to confirm the holding current (IH) level in afunctional test circuit.
TEST PROCEDURE :
n 1) Adjust the current level at the I
value by short circuiting the AK of the D.U.T.
H
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 µs.
3) The D.U.T will come back off-state within 50 ms max.
4/6
Page 5
SMP30-xxx Series
Fig. 1: Non repetitive surge peak on-sate current
versus overload duration (Tj initial=25°C).
ITSM(A)
20
F = 50Hz
15
10
5
0
1E-2 1E-1 1E+0 1E+1 1E+2 1E+3
t(s)
Fig. 3: Relative variation of junction capacitance
versus reverse applied voltage (typical values)
C[VR]/C[VR=1V]
1.0
F = 1MHz
0.5
Fig. 2: Relative variation of holding currentversus junction temperature.
IH[Tj] / IH[Tj=25°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20 0 20 40 60 80 100 120
Tj(°C)
Fig. 4: On-state voltage versus on-state current
(typical values).
IT(A)
50
Tj = 25°C
20 10
0.2
0.1 1 10 100 300
VR(V)
Fig. 5: Variation of thermal impedance junction to
ambient versus pulse duration.
Zth(j-a)(°CW)
1E+2
1E+1
1E+0
1E-1
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
tp(s)
5
2 1
012345678910
VT(V)
Fig. 6: Relative variation of VBOvoltage versus
junction temperature.
Vbo[Tj]/Vbo[Tj=25°C]
1.10
1.05
1.00
270 V
0.95
62V
0.90
-40 -20 0 20 40 60 80 100
Tj(°C)
5/6
Page 6
SMP30-xxx Series
ORDER CODE
SMP 30 - 62
SURFACE MOUNT PROTECTION
MARKING : Logo, Date Code, Part Number.
PACKAGE MECHANICAL DATA
SMA (JEDEC DO-214AA)
E1
D
E
A1
C
L
A2
IPP=30A
b
VOLTAGE
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.70 0.075 0.106 A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
FOOT PRINT (in millimeters)
Weight: 0.06 g Packaging : Tape and reel.
1.65
2.40
1.45 1.45
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