Note 1: IRmeasured at VRguarantee V
Note 2: Measured at 50 Hz(1cycle) - See test circuit1.
Note 3: See test circuit 2.
Note 4: VR= 1V, F =1MHz.
Note 5:VR= 50V,F = 1MHz
QAA
QAB
QAC
QAD
QAE
QAF
QAG
QAH
QAI
QAJ
2
2
2
2
2
2
2
2
2
2
BRmin
108
117
162
180
198
216
243
V
56
61
90
50
50
50
50
50
50
50
50
50
50
R
TEST CIRCUIT 1 FORIBOand VBOparameters :
tp
Auto
Transfo r m er
220V/2A
static
relay.
IR@V
100
120
130
180
200
220
240
270
=20ms
R
62
68
note 2
R1
140
R2
240
VBO@I
max
82
90
133
160
173
240
267
293
320
360
BO
800
800
800
800
800
800
800
800
800
800
I
H
min
note 3
150
150
150
150
150
150
150
150
150
150
typ
note 4
50
50
40
40
35
35
30
30
30
30
C
typ
note 5
20
20
16
16
14
14
12
12
12
12
V
out
I
220V
Transformer
220V/800V
5A
BO
measure
TEST PROCEDURE :
n Pulse Test duration (tp = 20ms):
- For Bidirectional devices = Switch K is closed
- For Unidirectional devices = Switch K is open.
n V
OUT
Selection
- Device with VBO< 250 Volt
-V
OUT
= 250 V
RMS,R1
= 140 Ω.
- Device with VBO 250 Volt
-V
OUT
= 480 V
RMS,R2
= 240 Ω.
K
D.U.T
V
BO
measure
3/6
Page 4
SMP30-xxx Series
TEST CIRCUIT 2 for IHparameter.
R
-V
P
V
BAT
D.U.T .
= - 48 V
Surge generator
This is a GO-NOGO Test which allows to confirm the holding current (IH) level in afunctional test circuit.
TEST PROCEDURE :
n 1) Adjust the current level at the I
value by short circuiting the AK of the D.U.T.
H
2) Fire the D.U.T with a surge Current : Ipp = 10A , 10/1000 µs.
3) The D.U.T will come back off-state within 50 ms max.
4/6
Page 5
SMP30-xxx Series
Fig. 1: Non repetitive surge peak on-sate current
versus overload duration (Tj initial=25°C).
ITSM(A)
20
F = 50Hz
15
10
5
0
1E-21E-11E+01E+11E+21E+3
t(s)
Fig. 3: Relative variation of junction capacitance
versus reverse applied voltage (typical values)
C[VR]/C[VR=1V]
1.0
F = 1MHz
0.5
Fig. 2: Relative variation of holding currentversus
junction temperature.
IH[Tj] / IH[Tj=25°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40-20020406080100120
Tj(°C)
Fig. 4: On-state voltage versus on-state current
(typical values).
IT(A)
50
Tj = 25°C
20
10
0.2
0.1
110100300
VR(V)
Fig. 5: Variation of thermal impedance junction to
ambient versus pulse duration.
Zth(j-a)(°CW)
1E+2
1E+1
1E+0
1E-1
1E-31E-21E-11E+01E+11E+2 5E+2
tp(s)
5
2
1
012345678910
VT(V)
Fig. 6: Relative variation of VBOvoltage versus
junction temperature.
Vbo[Tj]/Vbo[Tj=25°C]
1.10
1.05
1.00
270 V
0.95
62V
0.90
-40-20020406080100
Tj(°C)
5/6
Page 6
SMP30-xxx Series
ORDER CODE
SMP 30-62
SURFACE MOUNT PROTECTION
MARKING : Logo, Date Code, Part Number.
PACKAGE MECHANICAL DATA
SMA (JEDEC DO-214AA)
E1
D
E
A1
C
L
A2
IPP=30A
b
VOLTAGE
DIMENSIONS
REF.
MillimetersInches
Min.Max.Min.Max.
A11.902.700.0750.106
A20.050.200.0020.008
b1.251.650.0490.065
c0.150.410.0060.016
E4.805.600.1890.220
E13.954.600.1560.181
D2.252.950.0890.116
L0.751.600.0300.063
FOOT PRINT (in millimeters)
Weight: 0.06 g
Packaging : Tape and reel.
1.65
2.40
1.451.45
Information furnishedis believedto be accurateand reliable.However, STMicroelectronicsassumes noresponsibilityfortheconsequences of
use ofsuch informationnor foranyinfringement ofpatents orother rights ofthird partieswhich mayresult from itsuse. Nolicense isgranted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. Thispublication supersedes and replaces allinformation previously supplied.
STMicroelectronics products are not authorized for useascritical componentsin life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2000 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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6/6
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