Datasheet SL74HC161D, SL74HC161N Datasheet (SLS)

Page 1
SL74HC161
Semiconductor
Presettable Counters
High-Performance Silicon-Gate CMOS
The SL74HC161 is identical in pinout to the LS/ALS161. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs.
The SL74HC161 is programmable 4-bit synchronous counter that feature parallel Load, asynchronous Reset, a Carry Output for cascading and count-enable controls.
The SL74HC161 is binary counter with asynchronous Reset.
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 µA
High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION
SL74HC161N Plastic
SL74HC161D SOIC
LOGIC DIAGRAM
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
PIN 16 =VCC
PIN 8 = GND
FUNCTION TABLE
Inputs Outputs
Reset Load Enable P Enable T Clock Q0 Q1 Q2 Q3 Function
L X X X X L L L L Reset to “0” H L X X P0 P1 P2 P3 Preset Data H H X L No change No count
SLS
H H L X No change No count H H H H Count up Count H X X X No change No count
X=don’t care P0,P1,P2,P3 = logic level of Data inputs Ripple Carry Out = Enable T Q0 Q1 Q2 Q3
System Logic
Page 2
SL74HC161
Semiconductor
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to G ND) -0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V
V
DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V
OUT
IIN DC Input Current, per Pin ±20 mA
I
DC Output Current, per Pin ±25 mA
OUT
ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750 500
Tstg Storage Temperature -65 to +150 °C
TL Lead Temperature, 1 mm from Case for 10 Seconds
260 °C
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage (Referenced to GND) 2.0 6.0 V
VIN, V
DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V
OUT
TA Operating Temperature, All Package Types -55 +125 °C
tr, tf Input Rise and Fall Time (Figure 1) VCC =2.0 V
VCC =4.5 V V
=6.0 V
CC
0 0 0
500 400
mW
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and V GND(VIN or V
OUT
)VCC.
should be constrained to the range
OUT
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
System Logic
SLS
Page 3
SL74HC161
Semiconductor
DC ELECTRICAL CHARACTERISTICS(Voltages Referenced to GND)
VCC Guaranteed Limit
Symbol Parameter Test Conditions V 25 °C
to
-55°C
VIH Minimum High-Level
Input Voltage
VIL Maximum Low -Level
Input Voltage
VOH Minimum High-Level
Output Voltage
VIN=VIH or VIL
VOL Maximum Low -Level
Output Voltage
VIN=VIH or VIL
IIN Maximum Input
V
=0.1 V or VCC-0.1 V
OUT
I
≤ 20 µA
OUT
V
=0.1 V or VCC-0.1 V
OUT
I
 ≤ 20 µA
OUT
VIN=VIH or VIL
I
 ≤ 20 µA
OUT
I
 ≤ 6.0 mA
OUT
I
 ≤ 7.8 mA
OUT
VIN=VIH or VIL
I
 ≤ 20 µA
OUT
I
 ≤ 6.0 mA
OUT
I
 ≤ 7.8 mA
OUT
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
1.5
3.15
4.2
0.5
1.35
1.8
1.9
4.4
5.9
3.98
5.48
0.1
0.1
0.1
0.26
0.26
VIN=VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA
Leakage Current
85
°C
1.5
3.15
4.2
0.5
1.35
1.8
1.9
4.4
5.9
3.84
5.34
0.1
0.1
0.1
0.33
0.33
125
°C
1.5
3.15
4.2
0.5
1.35
1.8
1.9
4.4
5.9
3.7
5.2
0.1
0.1
0.1
0.4
0.4
Unit
V
V
V
V
ICC Maximum Quiescent
Supply Current (per Package)
System Logic
SLS
VIN=VCC or GND I
=0µA
OUT
6.0 4.0 40 160 µA
Page 4
SL74HC161
Semiconductor
AC ELECTRICAL CHARACTERISTICS(C
=50pF,Input tr=tf=6.0 ns)
L
VCC Guaranteed Limit
Symbol Parameter V 25 °C to
85°C ≤125°C Unit
-55°C
f
Maximum Clock Frequency (Figures 1,6) 2.0
max
t
PLH
Maximum Propagation Delay Clock to Q
t
(Figures 1,6) 2.0
PHL
t
Maximum Propagation Delay Reset to Q
PHL
(Figures 2 and 6)
t
PLH
Maximum Propagation Delay Enable T to Ripple
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
6 30 35
120
20 16
145
22 18
145
20 17
110
16 14
5 24 28
160
23 20
185
25 20
185
22 19
150
18 15
Carry Out
t
(Figures 3,6) 2.0
PHL
4.5
6.0
135
18 15
175
20 16
4 20 24
200
28 22
320
30 23
220
25 21
190
20 17
210
22 20
MHz
ns
ns
ns
ns
ns
t
PLH
Maximum Propagation Delay Clock to Ripple
t
Carry Out (Figures 1,6) 2.0
PHL
t
Maximum Propagation Delay Reset to Ripple Carry
PHL
Out (Figures 2,6)
t
, t
TLH
Maximum Output Transition Time, Any Output
THL
(Figures 1 and 6)
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
120
22 18
145
22 20
155
22 18
75 15 13
160
27 22
185
28 24
190
26 22
95 19 16
200
30 25
220
35 28
230
30 25
110
22 19
CIN Maximum Input Capacitance - 10 10 10 pF
Power Dissipation Capacitance (Per Gate) Typical @25°C,VCC=5.0 V
CPD Used to determine the no-load dynamic power
consumption: PD=CPDV
2
f+ICCVCC
CC
30 pF
ns
ns
ns
ns
SLS
System Logic
Page 5
SL74HC161
Semiconductor
TIMING REQUIREMENTS (C
VCC Guaranteed Limit
Symbol Parameter V 25 °C to
tSU Minimum Setup Time, Preset Data Inputs to Clock
(Figure 4)
tSU Minimum Setup Time, Load to Clock
(Figure 4)
tSU Minimum Setup Time, Enable T or Enable P to
Clock (Figure 5)
th Minimum Hold Time, Clock to Load or Preset Data
Inputs (Figure 4)
th Minimum Hold Time, Clock to Enable T or Enable
P (Figure 5)
t
Minimum Recovery Time, Reset Inactive to Clock
rec
(Figure 2)
=50pF,Input tr=tf=6.0 ns)
L
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
-55°C
40 15 12
60 15 12
80 20 17
3 3 3
3 3 3
80 15 12
85°C ≤125°C Unit
60 20 18
75 20 18
95 25 23
3 3 3
3 3 3
95 20 17
80 30 20
90 30 20
110
35 25
3
3
3
3
3
3
110
26 23
ns
ns
ns
ns
ns
ns
t
Minimum Recovery Time, Load Inactive to Clock
rec
(Figure 4)
tw Minimum Pulse Width, Clock (Figure 1) 2.0
tw Minimum Pulse Width, Reset (Figure 2) 2.0
t
Maximum Input Rise and Fall Times
r, tf
(Figure 1)
2.0
4.5
6.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
80 15 12
60 12 10
60 12 10
500 400
95 20 17
75 15 13
75 15 13
500 400
110
26 23
90 18 15
90 18 15
500 400
ns
ns
ns
ns
SLS
System Logic
Page 6
SL74HC161
Semiconductor
Figure 1. Switching Waveforms Figure 2. Switching Waveforms
Figure 3. Switching Waveforms Figure 4. Switching Waveforms
Figure 5. Switching Waveforms Figure 6. Test Circuit
SLS
System Logic
Page 7
SL74HC161
Semiconductor
VCC=Pin 16
GND=Pin 8
The flip-flops shown in the circuit diagrams are Toggle-Enable flip-flops. A Toggle-Enable flip-flop is a combination of a D flip-flop and a T flip-flop. When loading data from Preset inputs P0, P1, P2, and P3, the Load signal is used to disable the Toggle input (Tn) of the flip-flop. The logic level at the Pn input is then clocked to the Q output of the flip-flop on the next rising edge of the clock.
A logic zero on the Reset device input forces the internal clock (C) high and resets the Q output of the flip­flop low.
Figure 7.Expanded logic diagram
System Logic
SLS
Page 8
SL74HC161
Semiconductor
Sequence illustrated in waveforms:
1. Reset outputs to zero.
2. Preset to binary twelve.
3. Count to thirteen, four teen, fifteen, zero, one, and two.
4. Inhibit.
Figure 8. Timing Diagram
SLS
System Logic
Page 9
SL74HC161
Semiconductor
TYPICAL APPLICATIONS CASCADING
Note:When used in these cascaded configurations the clock f
Actual performance will depend on number of stages. This limitation is due to set up times between Enable (Port) and clock.
Figure 9. N-Bit Synchronous Counters
guaranteed limits may not apply.
max
SLS
Figure 10. Nibble Ripple Counter
System Logic
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