ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol LimitUnit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 150 °C)
J
a, b
Pulsed Drain Current (10 µs Pulse Width)
Continuous Source-Drain Diode Current
Maximum Power Dissipation
a, b
a, b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
c, d
TC = 25 °C
T
= 70 °C
C
TA = 25 °C
TA = 70 °C
TC = 25 °C
TA = 25 °C
TC = 25 °C
T
= 70 °C
C
T
= 25 °C
A
TA = 70 °C
V
DS
V
GS
I
D
I
DM
I
S
P
D
, T
T
J
stg
- 8
± 8
c
-1.6
c
- 1.6
a, b, c
- 1.6
a, b, c
- 1.6
c
- 8
c
- 1.6
a, b
- 1.47
2.27
1.45
a, b
1.47
a, b
0.95
- 55 to 150
260
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol TypicalMaximumUnit
Maximum Junction-to-Ambient
a, d
t ≤ 5 s
Maximum Junction-to-Foot (Drain)Steady State
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. Package limited.
d. Maximum under Steady State conditions is 125 °C/W.
Document Number: 74634
S-71945-Rev. A, 10-Sep-07
R
thJA
R
thJF
7085
4455
°C/W
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1
Page 2
New Product
Si1405BDH
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min TypMaxUnit
Static
Drain-Source Breakdown Voltage
V
Temperature CoefficientΔVDS/T
DS
V
Temperature CoefficientΔV
GS(th)
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
a
a
a
Input Capacitance
Reverse Transfer Capacitance
Total Gate Charge
V
DS
J
GS(th)/TJ
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
r
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Qgs
Q
t
d(on)
t
d(off)
gd
R
g
t
r
t
f
Gate-Drain Charge
Gate Resistance
Tur n - On D e l a y T im e
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
VGS = 0 V, ID = - 250 µA
ID = - 250 µA
V
= VGS, ID = - 250 µA
DS
VDS = 0 V, VGS = - 8 V
V
V
DS
= - 8 V, V
DS
= - 8 V, V
V
V
V
GS
≤ 5 V, V
DS
= - 4.5 V, ID = - 2.8 A
GS
= - 2.5 V, ID = - 2.3 A
GS
= - 1.8 V, ID = - 0.5 A
GS
= 0 V
GS
= 0 V, TJ = 55 °C
= - 4.5 V
GS
VDS = - 4 V, ID = - 2.8 A
VDS = - 4 V, V
VDS = - 4 V, V
= 0 V, f = 1 MHz
GS
= - 4.5 V, ID = - 2.8 A
GS
f = 1 MHz6.3Ω
V
= - 4 V, RL = 1.78 Ω
DD
≅ - 2.25 A, V
I
D
= - 4.5 V, Rg = 1 Ω
GEN
TC = 25 °C
IS = 1.4 A, V
GS
= 0 V
IF = - 1.4 A, di/dt = 100 A/µs, TJ = 25 °C
- 8V
- 5.4
1.98
mV/°C
- 0.45- 0.95V
- 100nA
- 1
- 10
- 8A
0.0910.112
0.1320.160
0.1710.205
4.8S
305
108
66
3.675.5
0.61
0.98
1015
2639
1624
710.5
- 1.6
- 8
- 0.8- 1.2V
2335ns
5.88.7nC
6
17
µA
Ω
pFOutput Capacitance
nCGate-Source Charge
ns
A
ns
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2
Document Number: 74634
S-71945-Rev. A, 10-Sep-07
Page 3
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si1405BDH
Vishay Siliconix
8
VGS = 5 V thru 2.5 V
6
VGS = 2 V
4
- Drain Current (A)I
D
2
0
01234
VDS - Drain-to-Source Voltage (V)
VGS = 1.5 V
Output Characteristics
0.5
0.4
VGS = 1.8 V
0.3
3.0
2.4
1.8
1.2
- Drain Current (A)I
D
0.6
0.0
0.00.40.81.21.62.0
VGS - Gate-to-Source Voltage (V)
TJ = 25 °C
TJ = 125 °C
Transfer Characteristics
500
400
C
iss
300
TJ = - 55 °C
- D to S On-Resistance (Ω)r
DS(on)
0.2
0.1
0.0
02468
VGS = 2.5 V
VGS = 4.5 V
ID - Drain Current (A)
On-Resistance vs. Drain Current and Gate Voltage
5
- Gate-to-Source Voltage (V)
GS
V
ID = 2.8 A
4
3
2
1
0
012345
VDS = 4 V
VDS = 6.4 V
Qg - Total Gate Charge (nC)
Gate Charge
200
C - Capacitance (pF)
100
0
02468
1.8
1.5
1.2
- On-Resistance r
(Normalized)
0.9
DS(on)
0.6
0.3
- 50- 250255075100125150
On-Resistance vs. Junction Temperature
C
oss
C
rss
VDS - Drain-to-Source Voltage (V)
Capacitance
VGS = 4.5 V, ID = 2.8 A
= 2.5 V, ID = 2.3 A
V
GS
VGS = 1.8 V, ID = 0.5 A
TJ- Junction Temperature (°C)
Document Number: 74634
S-71945-Rev. A, 10-Sep-07
www.vishay.com
3
Page 4
New Product
Si1405BDH
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
10
1
0.1
- Source Current (A)I
S
0.01
0.001
0.00.20.40.60.81.01.2
TJ = 150 °C
TJ = 25 °C
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
0.9
(V)V
GS(th)
0.8
0.7
0.6
ID = 250 µA
- On-Resistance (Ω)r
DS(on)
Power (W)
0.24
ID = 2.8 A
0.18
TA = 125 °C
0.12
0.06
0.00
012345
VGS - Gate-to-Source Voltage (V)
TA = 25 °C
On-Resistance vs. Gate-to-Source Voltage
30
25
20
15
10
0.5
0.4
- 50- 250255075100125150
TJ - Temperature (°C)
Threshold Voltage
10
Limited by r
1
0.1
- Drain Current (A)
D
I
0.01
0.001
0.1
TA = 25 °C
Single Pulse
* V
GS
Safe Operating Area, Junction-to-Ambient
DS(on)*
BVDSS Limited
1
V
- Drain-to-Source Voltage (V)
DS
minimum VGS at which r
DS(on)
5
0
0.1
Time (s)
100.01
Single Pulse Power, Junction-to-Ambient
100 ms
1 s
10 s
DC
10
is specified
00611000.001
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Document Number: 74634
S-71945-Rev. A, 10-Sep-07
Page 5
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Si1405BDH
Vishay Siliconix
5
4
3
3.0
2.4
1.8
Power
2
Package Limited
- Drain Current (A)
D
I
1
0
0255075100125150
TC - Case Temperature (°C)
Current Derating*
* The power dissipation PD is based on T
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?74634.
Document Number: 74634
S-71945-Rev. A, 10-Sep-07
www.vishay.com
5
Page 6
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
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