ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter Symbol 5 sSteady State Unit
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
= 150 °C)
J
a
Pulsed Drain Current
Continuous Diode Current (Diode Conduction)
Maximum Power Dissipation
a
a
Operating Junction and Storage Temperature Range
TA = 25 °C
T
= 85 °C
A
TA = 25 °C
T
= 85 °C
A
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
, T
J
stg
- 1.5- 1.4
- 1.2- 1.0
- 0.8- 0.8
0.6250.568
0.4000.295
- 20
± 12
- 5
W
- 55 to 150°C
V
A
THERMAL RESISTANCE RATINGS
Parameter Symbol TypicalMaximumUnit
Maximum Junction-to-Ambient
a
t ≤ 5 s
Steady State180220
Maximum Junction-to-Foot (Drain)Steady State
Notes:
a. Surface Mounted on 1" x 1" FR4 Board.
Document Number: 73253
S-71951-Rev. B, 10-Sep-07
R
thJA
R
thJF
165200
°C/W
105130
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1
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New Product
Si1403BDL
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min TypMaxUnit
Static
V
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
b
a
a
Total Gate Charge
Gate-Drain Charge
Gate Resistance
Tur n - O n D e l ay Time
Rise Time
Turn-Off Delay Time
Fall Ti me
Source-Drain Reverse Recovery Time
Body Diode Reverse Recovery Charge
V
GS(th)
I
GSS
I
DSS
I
V
D(on)
a
r
DS(on)
g
fs
V
SD
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
rr
Q
rr
V
V
DS
I
D
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
= VGS, ID = - 250 µA
DS
VDS = 0 V, VGS = ± 12 V
V
= - 20 V, V
DS
= - 20 V, V
DS
= - 5 V, V
DS
V
= - 4.5 V, ID = - 1.5 A
GS
V
= - 3.6 V, ID = - 1.4 A
GS
V
= - 2.5 V, ID = - 0.8 A
GS
GS
= 0 V
GS
= 0 V, TJ = 85 °C
= - 4.5 V
GS
VDS = - 10 V, ID = - 1.5 A
IS = - 0.8 A, V
= - 10 V, V
GS
= 0 V
GS
= - 4.5 V, ID = - 1.5 A
f = 1.0 MHz9Ω
V
= - 10 V, RL = 10 Ω
DD
≅ - 1 A, V
= - 4.5 V, Rg = 6 Ω
GEN
IF = - 0.8 A, di/dt = 100 A/µs
- 0.6- 1.3V
± 100 nA
- 1
- 5
- 2A
0.1200.150
0.1400.175
0.2200.265
3.4S
- 0.8- 1.1V
294.5
0.65
1.0
1320
3045
2842
1320
1225
48nC
µA
Ω
nCGate-Source Charge
ns
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
4.0
3.2
2.4
1.6
- Drain Current (A)I
D
0.8
0.0
0.00.81.62.43.24.0
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2
VGS = 5 thru 2.5 V
- Drain-to-Source Voltage (V)
V
DS
Output Characteristics
2 V
1.5 V
1, 0.5 V
4.0
TC = - 55 °C
3.2
2.4
1.6
- Drain Current (A)I
D
0.8
0.0
0.00.51.01.52.02.53.0
- Gate-to-Source Voltage (V)
V
GS
25 °C
Transfer Characteristics
Document Number: 73253
S-71951-Rev. B, 10-Sep-07
125 °C
Page 3
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.40
Si1403BDL
Vishay Siliconix
500
0.32
VGS = 2.5 V
0.24
- On-Resistance (Ω)r
0.16
DS(on)
0.08
0.00
01234
On-Resistance vs. Drain Current
5
VDS = 10 V
I
= 1.5 A
D
4
3
2
- Gate-to-Source Voltage (V)
GS
V
1
ID - Drain Current (A)
VGS = 3.6 V
VGS = 4.5 V
400
300
200
C - Capacitance (pF)
100
0
048121620
1.6
1.4
1.2
1.0
- On-Resistance
(Normalized)
DS(on)
r
0.8
C
iss
C
oss
C
rss
VDS - Drain-to-Source Voltage (V)
Capacitance
VGS = 4.5 V
I
= 1.5 A
D
0
0.00.51.01.52.02.53.0
10
1
- Source Current (A)I
S
0.1
0.00.30.60.91.21.5
Source-Drain Diode Forward Voltage
Document Number: 73253
S-71951-Rev. B, 10-Sep-07
Qg - Total Gate Charge (nC)
Gate Charge
TJ = 150 °C
V
- Source-to-Drain Voltage (V)
SD
TJ = 25 °C
0.6
- 50 - 250255075100 125150
T
- Junction Temperature (°C)
J
On-Resistance vs. Junction Temperature
0.40
0.35
0.30
0.25
0.20
- On-Resistance (Ω)r
0.15
0.10
DS(on)
0.05
0.00
012345
ID = 0.8 A
VGS - Gate-to-Source Voltage (V)
ID = 1.5 A
On-Resistance vs. Gate-to-Source Voltage
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New Product
Si1403BDL
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73253.
Document Number: 73253
www.vishay.com
S-71951-Rev. B, 10-Sep-07
5
Page 6
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
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or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
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Customers using or selling these products for use in such applications do so at their own risk and agree to fully
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