The SCAN182541A is a high performance BiCMOS line
driver featuring se pa rate da ta i npu ts o rga nize d i nt o d ual 9bit bytes with byte-oriented paired output enable control
signals. This device is compliant with IEEE 1149.1 Standard Test Access Port and Boundary-Scan architecture
with the incorporation of th e defined Boundary-Scan test
logic and test access port consisting of Test Data Input
(TDI), Test Data Out (TDO), Test Mode Select (TMS), and
Test Clock (TCK).
Features
■ IEEE 1149.1 (JTAG) Compliant
■ High performance BiCMOS technology
Ω series resistor outputs elim inate need for external
■ 25
terminating resistors
■ Dual output enable signals per byte
■ 3-STATE outputs for bus-oriented applications
■ 25 mil pitch SSOP (Shrink Small Outline Package)
■ Includes CLAMP, IDCODE and HIGHZ instructions
■ Additional instructions SAMPLE-IN, SAMPLE-OUT and
EXTEST-OUT
■ Power up 3-STATE for hot insert
■ Member of Fairchild’s SCAN Products
Ordering Code:
Order Number
SCAN182541ASSCMS56A56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Devices also availab l e in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering code.
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Block Diagrams
Inputs
†AOE
AO
AI
2
(0–8)
(0–8)
†BOE
Inputs
†BOE
1
BI
2
(0–8)
BO
(0–8)
LLHH
HXXZ
XHXZ
LLLL
Z = High Impedance
†= Inactive-to-ac ti ve tr ans ition must occur to enable outputs upon
power-up.
Byte A
Tap Controller
Byte B
Note: BSR stands for Boun dary Scan Register.
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Page 3
Description of BOUNDARY-SCAN Circuitry
The scan cells used in the BOUNDARY-SCAN register are
one of the followin g two types de pending upon t heir location. Scan cell TYPE1 is intended to solely observe system
data, while TYPE2 has the additional ability to control system data.
Scan cell TYPE1 is located on each system input pin while
scan cell TYPE2 is locate d at each system output pi n as
well as at each of the two internal active-high output enable
signals. AOE controls the activity of the A-outputs while
BOE controls the activity of the B-outputs. Each will activate their respectiv e outputs by loading a logi c high.
The BYPASS register is a single bit shift register stage
identical to scan cell TYPE1. It captures a fixed logic low.
Bypass Register Scan Chain Definition
SCAN182541A Product IDCODE
(32-Bit Code per IEEE 1149.1)
Version Entity
0000111111 0000001001000000011111
MSBLSB
Logic 0
PartManufacturerRequired b
y
NumberID1149.1
Scan Cell TYPE1
The INSTRUCTION r egist er is a n 8-b it r egister whic h captures the default val ue of 10 000001 (SA MPLE/PRE LOAD)
during the CAPTURE-IR inst ruct ion comm and. Th e benef it
of capturing SAMPLE/PRELOAD as the default instruction
during CAPTURE-IR is that the user is no longer required
to shift in the 8-bit instruction for SAMPLE/P RELOAD . The
sequence of: CAPTURE-IR
update the SAMPLE/PRELOAD instruction. For more information refer to the section on instruction definitions.
Absolute Maximum Ratings(Note 1)Recommended Operating
Storage Temperature−65°C to +150°C
Ambient Temperature under Bias
Junction Temperature under Bias
Pin Potential to Ground Pin−0.5V to +7.0V
V
CC
Input Voltage (Note 2)
SCAN182541A
Input Current (Note 2)
−55°C to +125°C
−55°C to +150°C
−0.5V to +7.0V
−30 mA to +5.0 mA
Voltage Applied to Any Output
in Disabled or Power-Off State
in the HIGH State
−0.5V to +5.5V
−0.5V to V
Current Applied to Output
in LOW State (Max)Twice the Rated I
DC Latchup Source Current
Over Voltage Latchup (I/O)10V
EDS (HBM) Min.2000V
OL
−500 mA
Conditions
Free Air Ambient Temperature
Supply Voltage
Minimum Input Edge Rate(
Data Input50 mV/ns
Enable Input20 mV/ns
CC
(mA)
Note 1: Absolute Maximum Ratings are values beyond which the device
may be damaged or have its useful life impair ed. Functional operation
under these conditi ons is not implied.
Note 2: Either voltage lim it or c urrent limit is sufficient to prot ect inputs.
DC Electrical Characteristics
−40°C to +85°C
+4.5V to +5.5V
∆V/∆t)
SymbolParameter
V
V
V
V
V
I
IH
I
BVI
I
BVIT
I
IL
V
IIH + I
IIL + L
I
OZH
I
OZL
I
OS
I
CEX
I
ZZ
Input HIGH Voltage2.0VRecognized HIGH Signal
IH
Input LOW Voltage0.8VRecognized LOW Signal
IL
Input Clamp Diode VoltageMin−1.2VIIN =−18 mA
CD
Output HIGH VoltageMin2.5VIOH =−3 mA
OH
Output LOW VoltageMin0.8VIOL = 15 mA
OL
Input HIGH Current
Input HIGH Current Breakdown TestMax7µAVIN = 7.0V
Input HIGH Current Breakdown Test (I/O)Max100µAVIN = 5.5V
Input LOW Current
Input Leakage Test0.04.75VIID = 1.9 µA
ID
Output Leakage CurrentMax50µAV
OZH
Output Leakage CurrentMax−50µAV
OZL
Output Leakage CurrentMax50µAV
Output Leakage CurrentMax−50µAV
Output Short-Circuit CurrentMax−100−275mAV
Output HIGH Leakage CurrentMax50µAV
Bus Drainage Test0.0100µAV
V
Min2.0VIOH =−32 mA
All Others
TMS, TDIMax5µAVIN = V
All Others
TMS, TDIMax−385µAVIN = 0.0V
Max5µAVIN = 2.7V (Note 3)
Max5µAVIN = V
Max−5µAVIN = 0.5V (Note 3)
Max−5µAV
MinTypMaxUnitsConditions
CC
All Other Pins Grounded
All Others Grounded
= 0.0V
IN
OUT
OUT
OUT
OUT
OUT
OUT
OUT
CC
CC
= 2.7V
= 0.5V
= 2.7V
= 0.5V
= 0.0V
= VCC
= 5.5V
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Page 9
DC Electrical Characteristics (Continued)
SCAN182541A
SymbolParameter
I
I
I
I
CCH
CCL
CCZ
CCT
Power Supply CurrentMax250µAV
Power Supply CurrentMax65mAV
Power Supply CurrentMax250µATDI, TMS = V
Additional ICC/InputAll Other InputsMax2.9mAVIN = VCC − 2.1V
TDI, TMS InputsMax3mAV
I
CCD
Note 3: Guaranteed not tested.
Dynamic I
CC
No LoadMax0.2mA/Outputs Open
AC Electrical Characteristics
Normal Operation:
SymbolParameter
t
PLH
t
PHL
t
PLZ
t
PHZ
t
PZL
t
PZH
t
PLH
t
PHL
t
PLZ
t
PHZ
t
PZL
t
PZH
t
PLH
t
PHL
t
PLH
t
PHL
t
PLH
t
PHL
t
PLZ
t
PHZ
t
PLZ
t
PHZ
t
PLZ
t
PHZ
t
PZL
t
PZH
t
PZL
t
PZH
t
PZL
t
PZH
Note 4: Voltage Range 5.0V ± 0.5V
Propagation Delay5.01.03.45.2
Data to Q1.94.16.5
Disable Time5.02.05.28.7
Enable Time5.02.46.19.6
Propagation Delay5.03.26.09.4
TCK to TDO4.57.611.3
Disable Time5.02.55.89.9
TCK to TDO3.77.411.8
Enable Time5.04.98.612.9
TCK to TDO3.16.710.7
Propagation Delay3.76.710.3
TCK to Data Out during Update-DR State5.04.98.312.4
Propagation Delay4.27.912.2
TCK to Data Out during Update-IR State5.05.39.213.8
Propagation Delay5.09.414.6
TCK to Data Out during Test Logic Reset State5.06.210.916.4
Disable Time3.77.913.0
TCK to Data Out during Update-DR State5.04.38.713.7
Disable Time3.78.514.2
TCK to Data Out during Update-IR State5.04.39.414.8
Disable Time 4.710.116.6
TCK to Data Out during Test Logic Reset State5.05.510.917.3
Enable Time5.59.814.7
TCK to Data Out during Update-DR State5.04.07.912.5
Enable Time5.810.916.5
TCK to Data Out during Update-IR State5.04.39.014.4
Enable Time6.612.519.1
TCK to Data Out during Test Logic Reset State5.04.910.516.9
V
MinTypMaxUnitsConditions
CC
= VCC; TDI, TMS = V
OUT
Max1.0mAV
Max65.8mAV
= VCC; TDI, TMS = GND
OUT
= LOW; TDI, TMS = V
OUT
= LOW; TDI, TMS = GND
OUT
CC
Max1.0mATDI, TMS = GND
= VCC − 2.1V
IN
MHzOne Bit Toggling, 50% Duty Cycle
V
CC
(V)
TA =−40°C to +85°C
CL = 50 pF
(Note 4)MinTypMax
1.95.69.2
1.65.18.5
CC
CC
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
9www.fairchildsemi.com
Page 10
AC Operating Requirements
Scan Test Operation:
V
SymbolParameter
CC
(V)
(Note 5)Guaranteed Minimum
SCAN182541A
t
S
t
H
t
S
t
H
t
S
Setup Time
Data to TCK (Note 6)
Hold Time
Data to TCK (Note 6)
Setup Time, H or L
AOE
, BOEn to TCK (Note 7)
n
Hold Time, H or L
TCK to AOEn, BOEn (Note 7)
Setup Time, H or L
Internal AOE
, BOEn,5.02.7ns
n
5.02.2ns
5.01.8ns
5.03.7ns
5.01.8ns
to TCK (Note 8)
t
H
Hold Time, H or L
TCK to Internal5.01.8ns
AOEn, BOEn (Note 8)
t
S
t
H
t
S
t
H
t
W
Setup Time, H or L
TMS to TCK
Hold Time, H or L
TCK to TMS
Setup Time, H or L
TDI to TCK
Hold Time, H or L
TCK to TDI
5.07.5ns
5.01.8ns
5.05.0ns
5.02.0ns
Pulse Width TCK H5.010.0
L10.8
f
MAX
t
PU
t
DN
Note 5: Voltage Range 5.0V ± 0.5V
Note 6: This delay represent s th e t im ing relationship between the data input and TCK at the associated scan cells numbered 0-8, 9-17, 18-26 and 27-35.
Note 7: Timing pertains to BSR 38 and 41 or BSR 37 and 40.
Note 8: This delay represents the timing relationship between AOE/BOE and TCK for scan cells 36 and 39 only.
Note: All Input Timing Delays involv ing TCK are measu red from the rising edg e of T C K.
Maximum TCK Clock Frequency5.050MHz
Wait Time, Power Up to TCK5.0100ns
Power Down Delay0.0100ms
TA =−40°C to +85°C
C
= 50 pF
L
Units
ns
Capacitance
SymbolParameterTypUnits
C
IN
C
OUT
Note 9: C
Input Capacitance5.8pFVCC = 0.0V
Output Capacitance (Note 9)13.8pFVCC = 5.0V
is measured at frequency f = 1 MHz, per MIL-STD-883B, Method 3012.
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provide d in the l abe ling, can be reasonably expected to result in a significant injury to the
user.
Package Number MS56A
2. A critical compo nent in any com ponen t of a life s upp ort
device or system whose failure to perform can be reasonably expected to cause the failure of the l ife support
device or system, or to affect its safety or effectiveness.
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Ω
Series Resistor Outputs
11www.fairchildsemi.com
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