Datasheet SAA5261PS-017, SAA5261PS-101, SAA5261PS-102, SAA5261PS-103, SAA5261PS-104 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated Circuits, IC02

1998 Apr 22

INTEGRATED CIRCUITS

SAA5261; SAA5262; SAA5263

10-page intelligent teletext
decoders

1998 Apr 22 2

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

FEATURES
SAA5261, SAA5262 and SAA5263

• Complete 625-line teletext decoder in a single
integrated circuit thereby reducing printed-circuit board
area and cost

• Automatic detection of transmitted pages so that only
existing pages will be selected by page-up and
page-down once inventory validated

• Automatic detection of transmitted Fastext links or
service information (packet 8/30)

• On-screen display for user interface (menus, etc.) using
teletext and dedicated menu icons

• Video Programming System (VPS) decoding

• Wide Screen Signalling (WSS) decoding

• 8-page Fastext decoder

• 6-page TOP decoder in addition to capture ofBasic TOP

Table (BTT) and 3 Additional Information Table (AIT)
pages

• 4-page user defined list mode

• Yugoslavian, Cyrillic, Greek/Turkish, Thai,

Arabic/Hebrew, Pan-European and
Arabic/English/French language coverage

• High level command interface via I

2

C-bus giving easy

control from a low software overhead

• High level command interface is backward compatible to
SAFARI interface

• 625 and 525 line display

• RGB interface to standard colour decoder ICs, push-pull

output drive

• Versatile 8-bit open-drain I/O expander

• Single 12 MHz crystal oscillator for reduced cost

• +5 V power supply.

SAA5262 and SAA5263

• Automatic Channel Installation (ACI)

• Enhanced SAFARI interface providing additional

commands.

SAA5263

• Electronic Programme Guide (EPG) feature.

GENERAL DESCRIPTION

The SAA526xPS ICs are single-chip 10-page 625-line
World System Teletext (WST) decoders with a high level
command interface, SAFARI compatible.

It has been designed so that the overall system cost is kept
to a minimum. This has been achieved through the
capability of the device to be driven from a single +5 V
power supply, low cost 12 MHz crystal oscillator and the
high level command interface, which offers the benefit of
low software overhead in the TV microcontroller.

The SAA526xPS offers automatic detection of Fastext or
TOP transmissions. The device also incorporates a facility
to detect the pages in the transmission, which allows only
transmitted pages to be selected by page-up and
page-down.

SAA5262 and SAA5263 provide Automatic Channel
Installation (ACI) information.

SAA5263 provides access to Electronic Programme Guide
(EPG) information.

1998 Apr 22 3

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

ORDERING INFORMATION

QUICK REFERENCE DATA

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

SAA5261PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
SAA5262PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
SAA5263PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DDD

digital supply voltage 4.5 5.0 5.5 V

I

DDD(M)

microcontroller supply current − 20 35 mA

I

DDA

analog supply current − 35 50 mA

I

DDD(T)

teletext supply current − 50 80 mA

f

xtal

crystal frequency − 12 − MHz

T

amb

operating ambient temperature −20 − +70 °C

1998 Apr 22 4

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

SYSTEM

CONTROLLER

MEMORY

INTERFACE

PACKET 26

PROCESSING

ENGINE

TELETEXT

ACQUISITION

AND

DECODING

24 TO 18
HAMMING
DECODER

POWER-ON

RESET

DISPLAY

35

VDS COR B

V

DDAVDDD(T)VDDD(M

)

R

PON RGBREF G

res

E/W
PDI
SA

SAA526xPS DISLCBD

FP
DIS8/30
HSMODE
DISDSR
VSMODE
PUINL
V0-V7

ME8/30T
SDA1

SCL1
SDA2
SCL2

BLACK

HSYNC

VSYNC

XTALI

MGL418

XTALOCVBS2CVBS1

I

ref

PL

FRAME

RESET

V

SSD2

V

SSD1

V

SSA

OSCGND

43

27

21

26

23281322 24

42 41

40

37

36

49

25

50

14

15

45

1-8

51

19

46

18

47

17

48

16

20

52

30 29 31 32 33 34 38 39 44

DRAM

REFRESH

AND TIMING

10 k × 8

DRAM

I2C-BUS

INTERFACE

WSS

ACQUISITION

AND

DECODING

INPUT CLAMP

AND SYNC

SEPARATOR

DISPLAY

CLOCK

GENERATOR

12 MHz
CLOCK

GENERATOR

VPS

ACQUISITION

AND

DECODING

TELETEXT

OR

VPS

CONTROL

ANALOG-

TO-DIGITAL

CONVERTER

ANALOG-

REFERENCE
GENERATOR

SERIAL-TO-

PARALLEL

CONVERTER

DATA SLICER

AND CLOCK

REGENERATOR

9 to 12

1998 Apr 22 5

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

PINNING

SYMBOL PIN DESCRIPTION

V0 1 versatile open-drain input/output bit 0 (should be tied HIGH)
V1 2 versatile open-drain input/output bit 1 (should be tied HIGH)
V2 3 versatile open-drain input/output bit 2 (should be tied HIGH)
V3 4 versatile open-drain input/output bit 3 (should be tied HIGH)
V4 5 versatile open-drain input/output bit 4 (should be tied HIGH)
V5 6 versatile open-drain input/output bit 5 (should be tied HIGH)
V6 7 versatile open-drain input/output bit 6 (should be tied HIGH)
V7 8 versatile open-drain input/output bit 7 (should be tied HIGH)
res 9 reserved
res 10 reserved
res 11 reserved
res 12 reserved
V

SSD1

13 digital ground 1
SCLK1 14 serial clock input 1 (NVRAM)
SDAT1 15 serial data input/output 1 (NVRAM)
SA 16 slave address input: LOW selects 58H; HIGH selects 60H
FP 17 field polarity input: LOW selects first half line; HIGH selects second half line at the start of an

even field
HSMODE 18 horizontal sync mode control input: LOW selects HSYNC on rising edge
VSMODE 19 vertical sync mode control input. LOW selects VSYNC on rising edge
PDI 20 power-down imminent input: this input should be pulled LOW to indicate that the system is

about to lose power
PL 21 phase-lock output: HIGH indicates that the system is phase-locked to the CVBS input
V

SSA

22 analog ground
CVBS1 23 CVBS input: this signal is applied via a 100 nF capacitor (nominal input 1 V (p-p)
CVBS2 24 this pin should be connected to ground if unused
BLACK 25 black level input: a 100 nF capacitor should be connected to V

SSA

I

ref

26 reference current input for analog circuits: for correct operation a 27 kΩ resistor should be

connected to V

SSA

FRAME 27 Frame output for use in non-interlaced displays: during teletext off, teletext mixed with TV

picture and subtitles this pin is inactive. In full teletext mode this pin provides a 25 Hz square
wave. FRAME = 1 = odd, FRAME = 0 = even.

V

SSD2

28 digital ground 2
COR 29 contrast reduction: active LOW output which allows selective contrast reduction of the

television picture to enhance a mixed mode display

PON 30 picture on output: HIGH indicates that a TV picture is present and that the SAA526xPS is in

TV mode, mix mode, subtitle mode or news flash mode
RGBREF 31 RGB reference input: drive level reference for RGB outputs
B 32 blue dot rate character output of the blue colour information: the high voltage level is defined

by the RGBREF pin (can source 4 mA)

1998 Apr 22 6

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

G 33 green dot rate character output of the green colour information: the high voltage level is

defined by the RGBREF pin (can source 4 mA)
R 34 red dot rate character output of the red colour information: the high voltage level is defined by

the RGBREF pin (can source 4 mA)
VDS 35 push-pull output for blanking the TV picture
HSYNC 36 horizontal sync input: the polarity of this pulse is set by input HSMODE
VSYNC 37 vertical sync input: the polarity of this pulse is set by input VSMODE
V

DDA

38 analog supply voltage (+5 V)

V

DDD(T)

39 digital supply voltage for teletext circuits (+5 V)
OSCGND 40 ground for crystal oscillator
XTALI 41 12 MHz crystal oscillator input
XTALO 42 12 MHz crystal oscillator output
RESET 43 reset input
V

DDD(M)

44 digital supply voltage for microcontroller (+5 V)
PUINL 45 power-up in list mode control input: LOW selects auto TOP/Fastext on power-up; HIGH

selects LIST mode on power-up
DISDSR 46 disable default status row input: LOW enables display of status row
DIS8/30 47 disable packet 8/30 display input: LOW enables display of packet 8/30
DISLCBD 48 disable Link Control Byte (LCB) decode input: LOW enables decoding of the LCB in Fastext
SCLK2 49 serial clock input (I

2

C-bus)

SDAT2 50 serial data input/output (I

2

C-bus)

ME8/30T 51 mesh 8/30 and time displays input: HIGH will select a meshed display for the packet 8/30 and

time
E/

W 52 East/West language select input: LOW selects West language

SYMBOL PIN DESCRIPTION

1998 Apr 22 7

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Fig.2 Pin configuration.

handbook, halfpage

SAA526xPS

MGL417

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26

V0
V1
V2
V3
V4
V5
V6

V7
res
res
res
res

V

SSD1

SCL1

SDA1

SA
FP

HSMODE
VSMODE

PDI

PL

V

SSA

CVBS1
CVBS2
BLACK

I

ref

E/W
ME8/30T
SDA2
SCL2
DISLCBD
DIS8/30
DISDSR
PUINL
V

DDD(M)

RESET
XTALO
XTALI
OSCGND
V

DDD(T)

V

DDA

VSYNC
HSYNC
VDS
R
G
B
RGBREF
PON
COR
V

SSD2

FRAME

52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27

1998 Apr 22 8

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

HIGH LEVEL COMMAND INTERFACE

The I2C-bus interface is used to pass control commands and data between the SAA526xPS and the television
microcontroller. The interface uses high level commands, which are backward compatible with the SAFARI interface.

The formats for the I2C-bus transmission are as follows:

Table 1 User command

Table 2 System command

Table 3 System read

Table 4 I

2

C-bus address

START I

2

C-bus

ADDRESS

WRITE ACK COMMAND ACK STOP

START I2C-bus

ADDRESS

WRITE ACK COMMAND ACK PARAMETER ACK STOP

START I2C-bus

ADDRESS

READ ACK DATA NACK STOP

PIN 16 = LOW PIN 16 = HIGH

ADDRESS DESCRIPTION ADDRESS DESCRIPTION

01 01 100 read = 1; write = 0 0110 000 read = 1; write = 0

Table 5 Control commands

COMMAND

BYTE

(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

03 − picture
04 − TV status
07 − time
10 − program 0
11 − program 1
12 − program 2
13 − program 3
14 − program 4
15 − program 5
16 − program 6
17 − program 7
18 − program 8

19 − program 9
1A − program 10
1B − program 11
1C − program 12
1D − program 13
1E − program 14

1F − program 15
20 − red
21 − green
22 − yellow
23 − subtitle
24 − text status
25 − hold
26 − reveal
27 − cancel
28 − index
29 − list toggle
2B − reveal toggle
2C − store
2D − previous
2F − subcode
30 − digit 1
31 − digit 2
32 − digit 3

COMMAND

BYTE
(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

1998 Apr 22 9

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

33 − digit 4
34 − digit 5
35 − digit 6
36 − digit 7
37 − digit 8
38 − digit 9
39 − digit 0
3A − size
3B − up
3C − down
3D − cyan
3E − mix
3F − text
4A 0 read PAL + line
89 00 to 41 select list
91 00 to 03 or

00 to 80

force mode

92 00 read broadcast status
93 00 or 01 read network

identification
94 0 read PCS byte
98 OSD data OSD mode on
99 0 OSD mode off
9A 0 OSD display on
9B 0 OSD display off
9C 0 OSD cursor on
9D 0 OSD cursor off
9E 0, row, column OSD position
9F 0 followed by

20 bytes

OSD data write

A0 00 to FF bitwise parameter or

V7 to V0
A1 00 to FF bitwise parameter

and V7 to V0
A2 00 to FF returns V7to V0 on

I

2

C-bus read

A3 PWM

No.

PWM

data

PWM control

B0 reg data or text register
B1 reg data and text register
B2 reg data read text register
B8 0 quick list

COMMAND

BYTE

(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

SAA5262 and SAA5263 only

B9 0 get time
C0 0 = disable set ACI mode

1 = enable
C1 0 get ACI status
C2 0 select next ACI channel
C3 information type get ACI information
D0 0 get device version
D1 page type and

page number

set page number

D2 page type get page number
D3 page type and

language

set language

D4 page type get language
D5 row 24 control enable/disable row 24
D6 start column

and

length string

set row 24 contents

D7 string type,

index length

and string

set string contents

D8 option type and

values

set option

D9 movement type move cursor

SAA5263 only

C8 EPG mode set EPG mode
C9 0 get EPG status

CA number and list

of features

set EPG feature list

CB 0 get number of EPG

CNIs found
CC CNI index get found EPG CNIs
CD number and list

of CNIs

set EPG CNI list

CE table type, item

type and string

index

get EPG item

information

COMMAND

BYTE
(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

1998 Apr 22 10

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Fig.3 625 display format.

handbook, full pagewidth

25

rows

23

lines

250

lines

287

lines

312

lines

40 characters

MGL122

40 µs

10.5
µs

52 µs

64 µs

TV PICTURE AREA

TEXT DISPLAY AREA

FIELD SCANNING AREA

∆X

∆Y

Fig.4 525 display format.

handbook, full pagewidth

25

rows

17

lines

225

lines

243

lines

263

lines

40 characters

MGL123

40 µs

10.5
µs

52 µs

63.55 µs

TV PICTURE AREA

TEXT DISPLAY AREA

FIELD SCANNING AREA

∆X

∆Y

1998 Apr 22 11

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

CHARACTER SETS
Geographical coverage

Fig.5 SAA5261PS/101 Yugoslavia.

handbook, full pagewidth

MGL412

Fig.6 SAA5261PS/109 Cyrillic, SAA5262PS/122 Cyrillic.

handbook, full pagewidth

MGL128

1998 Apr 22 12

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Fig.7 SAA5261/113 Greek/Turkish, SAA5262PS/123 Greek/Turkish.

handbook, full pagewidth

MGL129

Fig.8 SAA5261PS/104 Thai, SAA5262PS/124 Thai.

handbook, full pagewidth

,,,,,

,,,,,

,,,,,

MGL132

1998 Apr 22 13

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Fig.9 SAA5261P/105 Arabic/Hebrew, SAA5262PS/125 Arabic/Hebrew.

ok, full pagewidth

MGL130

Fig.10 SAA5261PS/117 Pan-European, SAA5262PS/128 Pan-European/Eastern, SAA5263PS/137

Pan-European.

handbook, full pagewidth

MGL133

1998 Apr 22 14

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Fig.11 SAA5261PS/108 Arabic/English/French, SAA5262PS/126 Arabic/English/French.

handbook, full pagewidth

MGL131

The character sets for the languages Yugoslavian, Cyrillic, Greek/Turkish, Thai, Arabic/Hebrew, Pan-European,
Arabic/English/French and Iranian are available on request.

Fig.12 SAA5261PS/110 Iranian, SAA5262PS/120 Iranian.

dbook, full pagewidth

MGL413

1998 Apr 22 15

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 134).

Note

1. This maximum value has an absolute maximum of 6.5 V independent of V

DDD

.

QUALITY AND RELIABILITY

This device will meet Philips Semiconductors general quality specification for business group

“Consumer Integrated

Circuits SNW-FQ-611-Part E”

. The principal requirements are shown in Tables 6 to 9.

Group A
Table 6 Acceptance tests per lot; note 1

Note

1. ppm = fraction of defective devices, in parts per million.

Group B
Table 7 Processability tests (by package family); note 1

Note

1. LTPD = Lot Tolerance Percent Defective.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DDD

digital supply voltages −0.3 +6.5 V

V

DDA

analog supply voltage −0.3 +6.5 V

V

I

input voltage (any input) note 1 −0.3 V

DDD(M)

+ 0.5 V

V

O

output voltage (any output) note 1 −0.3 V

DDD(M)

+ 0.5 V

I

O

output current (each output) −±10 mA

I

I/OK

DC input or output diode current −±20 mA

T

amb

operating ambient temperature −20 +70 °C

T

stg

storage temperature −55 +125 °C

TEST REQUIREMENTS

Mechanical cumulative target: <80 ppm
Electrical cumulative target: <80 ppm

TEST REQUIREMENTS

Solderability <7% LTPD
Mechanical <15% LTPD
Solder heat resistance <15% LTPD

1998 Apr 22 16

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Group C
Table 8 Reliability tests (by package family); note 1

Note

1. FPM = fraction of devices failing at test conditions, in Failures Per Million.

Table 9 Reliability tests (by device type)

CHARACTERISTICS

V

DDD(M)

=5V±10%; VSS=0V; T

amb

= −20 to +70°C; unless otherwise specified.

TEST CONDITIONS REQUIREMENTS

Operational life 168 hours at Tj= 150 °C <1000 FPM at Tj=70°C
Humidity life temperature, humidity, bias 1000 hours,

T

amb

=85°C, 85% RH (or equivalent

test)

<2000 FPM

Temperature cycling
performance

T

stg(min)

to T

stg(max)

<2000 FPM

TEST CONDITIONS REQUIREMENTS

ESD and latch-up ESD human body model 100 pF, 1.5 kΩ <2000 V

ESD machine model 200 pF, 0 Ω <200 V
latch-up 100 mA, 1.5V

DDD

(absolute maximum)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V

DDD(M)

microcontroller supply
voltage

referenced to V

SSD

4.5 5.0 5.5 V

V

DDA

analog supply voltage referenced to V

SSD

4.5 5.0 5.5 V

V

DDD(T)

teletext supply
voltage

referenced to V

SSD

4.5 5.0 5.5 V

I

DDD(M)

microcontroller supply
current

− 20 35 mA

I

DDA

analog supply current − 35 50 mA

I

DDD(T)

teletext supply
current

− 50 80 mA

Digital inputs

P

IN RESET

V

IL

LOW-level input
voltage

−0.3 − 0.2V

DDD(M)

− 0.1 V

V

IH

HIGH-level input
voltage

0.7V

DDD(M)

− V

DDD(M)

+ 0.3 V

I

LI

input leakage current Vi= 0 to V

DDD(M)

−10 − +10 µA

C

i

input capacitance −−4pF

1998 Apr 22 17

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

PINS HSYNC AND VSYNC
V

th(f)

switching threshold
falling

0.2V

DDD(M)

−− V

V

th(r)

switching threshold
rising

−−0.8V

DDD(M)

V

V

hys

hysteresis voltage − 0.33V

DDD(M)

− V

C

i

input capacitance −−4pF

Digital outputs

P

INS R, G AND B: note 1

V

OL

LOW-level output
voltage

IOL=2mA 0 − 0.2 V

V

OH

HIGH-level output
voltage

IOH= −2mA V

RGBREF

− 0.3 V

RGBREF

V

RGBREF

+ 0.4 V

Z

O

 output impedance −−150 Ω

C

L

load capacitance −−50 pF

I

O

DC output current −−−4mA

t

o(r)

output rise time between 10 and

90%; CL=50pF

−−20 ns

t

o(f)

output fall time between 90 and

10%; CL=50pF

−−20 ns

PIN VDS
V

OL

LOW-level output
voltage

IOL= 1.6 mA 0 − 0.2 V

V

OH

HIGH-level output
voltage

IOH= −1.6 mA V

DDD(M)

− 0.3 − V

DDD(M)

+ 0.4 V

C

L

load capacitance −−50 pF

t

o(r)

output rise time between 10 and

90%; CL=50pF

−−20 ns

t

o(f)

output fall time between 90 and

10%; CL=50pF

−−20 ns

PINS R, G, B AND VDS
t

d(skew)

skew delay between
any two pins

−−20 ns

PIN COR (OPEN-DRAIN OUTPUT)
V

OH

HIGH-level pull-up
output voltage

−−V

DDD(M)

V

V

OL

LOW-level output
voltage

IOL=2mA 0 − 0.5 V

I

OL

LOW-level output
current

−−2mA

C

L

load capacitance −−25 pF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Apr 22 18

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

PIN FRAME
V

OH

HIGH-level output
voltage

IOL=8mA 0 − 0.5 V

V

OL

LOW-level output
voltage

IOL= −8mA V

DDD(M)

− 0.5 − V

DDD(M)

V

I

OL

LOW-level output
current

−8 − +8 mA

C

L

load capacitance −−100 pF

Digital inputs/outputs

P

INS V0 TO V7

V

IL

LOW-level input
voltage

−0.3 − 0.2V

DDD(M)

− 0.1 V

V

IH

HIGH-level input
voltage

3.0 − V

DDD(M)

+ 0.3 V

C

i

input capacitance −−4pF

V

OL

LOW-level output
voltage

IOL=10mA 0 − 0.45 V

C

L

load capacitance −−50 pF
PINS SCL AND SDA (PINS 14, 15, 49 AND 50)
V

IL

LOW-level input

voltage

−0.3 − +1.5 V

V

IH

HIGH-level input

voltage

3.0 − V

DDD(M)

+ 0.3 V

C

i

input capacitance −−5pF
V

OL

LOW-level output

voltage

IOL=3mA 0 − 0.5 V

C

L

load capacitance −−400 pF
t

o(f)

output fall time between 3 and 1 V −−200 ns

Digital inputs

P

INS VSMODE, HSMODE, PDI, SA, FP, PUINL, DISDSR, DIS8/30, DISLCBD, ME8/30T AND E/W

V

IL

LOW-level input

voltage

−0.3 − 0.2V

DDD(M)

− 0.1 V

V

IH

HIGH-level input

voltage

0.2V

DDD(M)

+ 0.9 − V

DDD(M)

+ 0.3 V

C

i

input capacitance −−4pF
C

L

load capacitance −−50 pF

Digital outputs

P

INS PL AND PON

V

OL

LOW-level output

voltage

IOL=10mA 0 − 0.45 V

C

L

load capacitance −−50 pF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Apr 22 19

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Analog inputs

PINS CVBS0 AND CVBS1
V

sync

sync voltage

amplitude

0.1 0.3 0.6 V

V

vid(p-p)

video input voltage

amplitude

(peak-to-peak value)

0.7 1.0 1.4 V

Z

source

source impedance −−250 Ω
V

IH

HIGH-level input

voltage

3.0 − V

DDD(M)

+ 0.3 V

Z

i

 input impedance 2.5 5.0 − kΩ

C

i

input capacitance −−10 pF
PIN I

ref

R

VSS

resistor to ground − 27 − kΩ
RGBREF: note 1
V

i

input voltage −0.3 − V

DDD(M)

V

I

I

DC input current −−12 mA

Analog input/output

P

IN BLACK

C

BLACK

storage capacitor to

ground

− 100 − nF

V

BLACK

black level voltage

for nominal sync

amplitude

1.8 2.15 2.5 V

I

LI

input leakage current −10 − +10 µA

Crystal oscillator

P

IN XTALI

V

IL

LOW-level input

voltage

−0.3 − 0.2V

DDD(M)

− 0.1 V

V

IH

HIGH-level input

voltage

0.7V

DDD(M)

− V

DDD(M)

+ 0.3 V

C

i

input capacitance −−10 pF
PIN XTALO
C

o

output capacitance −−10 pF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Apr 22 20

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Notes

1. All RGB current is sourced from the RGBREF pin. The maximum effective series resistance between RGBREF and
the R, G and B pins is 150 Ω.

2. Crystal order number 4322 143 05561.

TIMING CHARACTERISTICS

Notes

1. This parameter is determined by the user software. It must comply with the I

2

C-bus specification.

2. This value gives the auto-clock pulse length which meets the I2C-bus specification for the special crystal frequency.
Alternative, the SCL pulse must be timed by software.

3. The rise time is determined by the external bus line capacitance and pull-up resistor. It must be less than 1 µs.

4. The maximum capacitance on bus lines SDA and SCL is 400 pF.

C

RYSTAL SPECIFICATION: note 2

f

xtal

nominal frequency − 12 − MHz

C

L

load capacitance − 32 − pF

C1 series capacitance T

amb

=25°C − 18.5 − fF

C0 parallel capacitance T

amb

=25°C − 4.9 − pF

R

res

resonance resistance T

amb

=25°C − 35 −Ω

T

xtal

temperature range −20 +25 +70 °C

X

j

adjustment tolerance T

amb

=25°C −−±50 × 10

−6

X

d

drift −−±30 × 10

−6

SYMBOL PARAMETER INPUT OUTPUT I2C-BUS SPECIFICATION
SCL timing

t

HD;STA

START condition hold time ≥4.0 µs note 1 ≥4.0 µs

t

LOW

SCL LOW time ≥4.7 µs note 1 ≥4.7 µs

t

HIGH

SCL HIGH time ≥4.0 µs ≥4.0 µs; note 2 ≥4.0 µs

t

r(SCL)

SCL rise time ≤1.0 µs note 3 ≤1.0 µs

t

f(SCL)

SCL fall time ≤0.3 µs ≤0.3 µs; note 4 ≤0.3 µs

SDA timing

t

SU;DAT1

data set-up time ≥250 ns note 1 ≥250 ns

t

HD;DAT

data hold time ≥0 ns note 1 ≥0ns

t

SU;STA

repeated START set-up time ≥4.7 µs note 1 ≥4.7 µs

t

SU;STO

STOP condition set-up time ≥4.0 µs note 1 ≥4.0 µs

t

BUF

bus free time ≥4.7 µs note 1 ≥4.7 µs

t

r(SDA)

SDA rise time ≤1.0 µs note 3 ≤1.0 µs

t

f(SDA)

SDA fall time ≤0.3 µs ≤0.3 µs; note 4 ≤0.3 µs

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Apr 22 21

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

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handbook, full pagewidth

t

rD

t

fD

t

rC

t

fC

t

HD;STA

t

LOWtHIGHtSU;DAT1

t

HD;DAT

t

SU;DAT2

t

SU;DAT3

0.7V

DD

0.3V

DD

t

SU;STO

t

BUF

t

SU;STA

SDA

(input / output)

SCL

(input / output)

START condition

repeated START condition

STOP condition

START or repeated START condition

0.7V

DD

0.3V

DD

MLC104

Fig.13 I2C-bus interface timing.

1998 Apr 22 22

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

CLOCK GENERATOR

The oscillator circuit is a single-stage inverting amplifier in a Pierce oscillator configuration. The circuitry between pins
XTALI and XTALO is basically an inverter biased to the transfer point. A crystal must be used as the feedback element
to complete the oscillator circuitry. It is operated in parallel resonance. XTALI is the high gain amplifier input and XTALO
is the output.

To drive the device externally XTALI is driven from an external source and XTALO is left open-circuit.

Fig.14 Oscillator circuit.

(1) The values of C1 and C2 depend on the crystal specification:

C1 = C2 = 2C

L

.

handbook, halfpage

MGL415

XTALO

40

41

42

XTALI

OSCGND

C1

(1)

C2

(1)

Fig.15 Oscillator circuit driven from external

source.

handbook, halfpage

MGL416

XTALO

42

41

40

XTALI

OSCGND

external clock

not connected

not connected

1998 Apr 22 23

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

EMC GUIDELINES

Optimization of circuit return paths and minimisation of
common mode noise will be assisted by using a
double-sided PCB with a low inductance ground plane.

On a single-sided PCB a local ground plane under the
whole IC should be present, as shown in Fig.16. This
should be connected by the widest possible connection
back to the PCB ground connection and bulk electrolytic
decoupling capacitor. It should preferably not connect to
other grounds on the way and no wire links should be
present in this connection. The use of wire links increases
ground bounce by introducing inductance into the ground.

The supply pins can be decoupled at the pin to the ground
plane under the IC. This is easily accomplished using
surface mount capacitors, which are more effective than
leaded components at high frequency. Using a device
socket will unfortunately add to the area and inductance of
the external bypass loop.

A ferrite bead or inductor with resistive characteristics at
high frequency may be utilized in the supply line close to
the decoupling capacitor to provide a high impedance.
To prevent pollution by conduction onto signal lines (which
may then radiate) signals connected to the +5 V supply via
a pull up resistor should not be connected to the IC side of
the ferrite component.

OSCGND should be connected only to the crystal load
capacitors and not the local or circuit ground.

Keep physical connection distances to associated active
devices short.

Route output traces with close proximity mutually coupled
ground return paths.

Fig.16 Power supply and ground connections for SOT247-1.

handbook, full pagewidth

electrolytic decoupling capacitor (2.2 µF)

ferrite components

SM decoupling capacitors (22 to 100 nF)

under-IC GND plane

IC(SAA5290)

MGL414

V

SSD

V

SSA

V

DDD(M)

V

DDD(T)

V

DDA

GND

+5 V

other
GND
connections

under-IC GND plane
GND connection
note: no wire links

1998 Apr 22 24

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

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APPLICATION INFORMATION

handbook, full pagewidth

2
3
4
5
6
7

8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24

26

25

29

27

28

1

4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7
kΩ

4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7
kΩ

4.7kΩ4.7

kΩ

4.7
kΩ

4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7
kΩ

51
50
49

48
47
46

45
44

43
42

8

A0
A1
A2
V

SS

V

DD

PTC

PCF8582P

SCL
SDA

7
6
5

1
2
3
4

41
40
39
38
37
36
35
34
33
32
31
30

52

SAA526xPS

V

DDD(M)

V

DDD(M)

V

SSD1

V

SSD2

V

SSA

V

SSD2

V

SSA

100 nF

100 nF

100 nF

CVBS1

FRAME

MGL419

COR

PON

B

G

R

VDS

HSYNC

VSYNC

CVBS2

100 nF

27 kΩ

1 kΩ

4.7 kΩ

1 kΩ

220 Ω

220 Ω

2.2 µF

12 MHz

22 pF 22 pF

56 kΩ

3.3 nF

V

DDA

V

DDD(T)

V

DDD(M)

V

DDD(M)

V

SSD

V

SSD1

V

SSD

V

DDD(M)

V

DDD(M)

V

SSD2

V

SSD2

V

SSD2

SDA2
SCL2

Fig.17 Application diagram.

1998 Apr 22 25

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

PACKAGE OUTLINE

UNIT b

1

cEe M

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

DIMENSIONS (mm are the original dimensions)

SOT247-1

90-01-22
95-03-11

b

max.

w

M

E

e

1

1.3

0.8

0.53

0.40

0.32

0.23

47.9

47.1

14.0

13.7

3.2

2.8

0.181.778 15.24

15.80

15.24

17.15

15.90

1.73

5.08 0.51 4.0

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

D

A

2

Z

52

1

27

26

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

(1) (1)

D

(1)

Z

e

A

max.

12

A

min.

A

max.

SDIP52: plastic shrink dual in-line package; 52 leads (600 mil)

SOT247-1

1998 Apr 22 26

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1998 Apr 22 27

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
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Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

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Uruguay: see South America
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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

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For all other countries apply to: Philips Semiconductors,
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Printed in The Netherlands 545104/00/01/pp28 Date of release: 1998 Apr 22 Document order number: 9397 750 03442