Datasheet SAA4981-V1, SAA4981T-V1 Datasheet (Philips)

DATA SH EET

Preliminary specification
Supersedes data of May 1994
File under Integrated Circuits, IC02

1995 Oct 05

INTEGRATED CIRCUITS

SAA4981

Monolithic integrated 16 : 9
compressor

1995 Oct 05 2

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

FEATURES

• Fixed horizontal compression by a factor of4⁄3 for most
video standards

• Three fixed screen positions (left, centre and right)

• 5 MHz bandwidth

• Bypass function

• Inputs for luminance and chrominance of side panels

• Standard video inputs and outputs (Y, (B−Y) and (R−Y))

• Horizontal and vertical sync signals are not processed

• Pre filters and post filters on chip.

GENERAL DESCRIPTION

The integrated 16 : 9 compressor is an IC which
compresses the active part of a video line by a factor of

4

⁄

3

from, for example, 52 µsto39µs. This is necessary to
display 4:3 video software on a 16 : 9 tube in the correct
proportion. The capacitively coupled video inputs are Y,
(B−Y) and (R−Y).

The synchronisation input HREF is a line frequency
reference signal. The bandwidth of the IC is up to 5 MHz
and the signal delay is realized with SC Line Memories
(Switched Capacitors Line Memories). The output of the
16 : 9 compressor also has the format Y, (B−Y) and (R−Y)
and provides the following two possibilities:

1. Bypass function (the input signal is not compressed)

2. Compressed video by a factor of

4

⁄3 with three different

fixed screen positions (left, centre and right). The
luminance and chrominance of the side panels are
determined by the external signals YSIDE, BYSIDE
and RYSIDE.

The horizontal compression is a time discrete and
amplitude continuous signal processing. This provides pre
and post filters which are realized on-chip. The internal
clock generation is achieved with a 54 MHz horizontal PLL
which is synchronized to the positive edge of the HREF
signal. The function of the IC is controlled by the three
control signals CTRL1, CTRL2 and CTRL3.

QUICK REFERENCE DATA

Voltages for video signals are peak-to-peak values for 75% colour bars. All voltages are referenced to
V

EEA=VEED

=0V.

ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CCA

analog supply voltage 4.75 5.0 5.5 V

V

CCD

digital supply voltage 4.75 5.0 5.5 V

V

iY(p-p)

Y input voltage (peak-to-peak value) − 0.32 0.45 V

V

iU(p-p)

(B−Y) input voltage (peak-to-peak value) − 1.33 1.9 V

V

iV(p-p)

(R−Y) input voltage (peak-to-peak value) − 1.05 1.5 V

V

iHREF

input HREF top pulse 3.0 − 6.5 V

V

oY(p-p)

YOUT output voltage (peak-to-peak value) − 0.32 0.5 V

V

oU(p-p)

(B−Y)OUT output voltage (peak-to-peak value) − 1.33 2.1 V

V

oV(p-p)

(R−Y)OUT output voltage (peak-to-peak value) − 1.05 1.7 V

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

SAA4981 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
SAA4981T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

1995 Oct 05 3

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

BLOCK DIAGRAM

handbook, full pagewidth

3

3

SC LINE MEMORY

SC LINE MEMORY

MUX

SC LINE

MEMORIES

6.7 MHz

LOW-PASS FILTER

5 MHz

LOW-PASS FILTER

CLAMP

MUX Y

SC LINE MEMORY

SC LINE MEMORY

MUX

SC LINE

MEMORIES

6.7 MHz

LOW-PASS FILTER

5 MHz

LOW-PASS FILTER

CLAMP

MUX BY

SC LINE MEMORY

SC LINE MEMORY

MUX

SC LINE

MEMORIES

6.7 MHz

LOW-PASS FILTER

5 MHz

LOW-PASS FILTER

HORIZONTAL
SEPARATION

54 MHz

PLL

CLAMP

MUX RY

C1 C2 C3

C1 C2 C3

C1 C2 C3

YSIDE

BYSIDE

RYSIDE

CONTROLLER

CLAMP REFERENCE

TEST CTRL2

CTRL1 CTRL3

C

LMY

C

LMBY

C

LMRY

BGREF

CLAOUT

C1
C2
C3

YOUT

(B-Y)OUT

(R-Y)OUT

18

17

16

YIN

(B-Y)IN

(R-Y)IN

HREF

6

21

22

23

11 1 2 3 24 5 15 14 1310912

20 19 8 7 4

V

CCA

V

EEA

V

CCD

V

EED

SUB

SAA4981

MHA277

Fig.1 Block diagram.

1995 Oct 05 4

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

PINNING

SYMBOL PIN DESCRIPTION

C

LMY

1 decoupling capacitor for Y

reference voltage

C

LMBY

2 decoupling capacitor for BY

reference voltage

C

LMRY

3 decoupling capacitor for RY

reference voltage
SUB 4 substrate connection (see Fig.5)
CLAOUT 5 internal clamping reference voltage

output
HREF 6 horizontal reference input
V

EED

7 ground for digital section

V

CCD

8 positive digital supply voltage
CTRL1 9 control input 1
CTRL2 10 control input 2
CTRL3 11 control input 3
TEST 12 test mode activation
RYSIDE 13 side panel input for RY
BYSIDE 14 side panel input for BY
YSIDE 15 side panel input for Y
(R−Y)OUT 16 output signal for (R−Y)
(B−Y)OUT 17 output signal for (B−Y)
YOUT 18 output signal for Y
V

EEA

19 ground for analog section

V

CCA

20 positive analog supply voltage
(R−Y)IN 21 input signal for (R−Y)
(B−Y)IN 22 input signal for (B−Y)
YIN 23 input signal for Y
BGREF 24 decoupling capacitor for internal

reference voltage

Fig.2 Pin configuration.

handbook, halfpage

SAA4981

MHA276

1
2
3
4
5
6
7
8

9
10
11
12

24
23
22
21
20
19
18
17
16
15
14
13

C

LMY

C

LMBY

C

LMRY

SUB

CLAOUT

HREF
V

EED

V

CCD

CTRL1

CTRL3

CTRL2

TEST

BGREF
YIN
(B-Y)IN
(R-Y)IN
V

CCA

V

EEA

YOUT
(B−Y)OUT
(R−Y)OUT

BYSIDE

YSIDE

RYSIDE

1995 Oct 05 5

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

FUNCTIONAL DESCRIPTION
Applicable video standards

The integrated 16 : 9 compressor can be used for the
following video standards; B, C, D, G, H, I, K, K1, L,
M and N. standards D, I, K, K1 and L will show a reduced
video bandwidth above 5 MHz.

Clamping circuit

The clamping circuits clamp the video input signals Y,
(B−Y) and (R−Y) to the DC level of the clamp reference
signal fed from the clamp reference circuit. This is
necessary to ensure that the input signals are in the
correct input voltage range for the 5 MHz low-pass filters
and the SC line memories.

Internal pre filters

Before the signals are sampled in the time discrete and
amplitude continuous area, low-pass filtering is necessary
to avoid any aliasing. Even if the inputs have already been
low-pass filtered further filtering is advantageous for the
electromagnetic compatibility (EMC). The same transfer
function is used for all three low-pass filters because of the
same bandwidth for the luminance and chrominance
signals (up to 5 MHz).

SC line memories

After the low-pass filters the input signals are fed to the SC
line memories. The signals are sampled at a clock
frequency of 13.5 MHz. One video line later the signals are
read with a clock frequency of 18 MHz in the compression
mode. The result of the different clock frequencies is a
horizontal compression by a factor of

4

⁄3. The clocks and

the horizontal starting pulses for the SC line memories are
fed from the controller.

Two line memories are required for each signal path
because in the compression mode, in one video line the
signals are sampled to the SC line memories with

13.5 MHz and one video line later the signals are read with
18 MHz. In the bypass mode, via the SC line memories, in
one video line the signals are sampled with 13.5 MHz and
one video line later the signals are read with 13.5 MHz.
The SC line memories are suitable for signals with a
bandwidth up to 5 MHz. With a multiplexer (MUX) behind
the SC line memories, the sampled video signal is
connected to the internal post filters.

Output multiplexer MUX Y, MUX (B−Y) and MUX (R−Y)

The output multiplexers are controlled via C1 and C2 fed
from the controller. The multiplexers are used to connect
one of the four input signals to the output and, also, enable
fast switching.

The input signals of the multiplexers for one component
[Y, (B−Y) or (R−Y)] are as follows:

• The output signal of the post filter

• The uncompressed signal after the input clamping

• The clamping reference signal

• The signal for the side panel determined by YSIDE,

BYSIDE and RYSIDE.

The horizontal separation circuit

The 54 MHz horizontal PLL is locked to the positive edge
of the digital HREF signal, which is generated in the
horizontal separation circuit. It is also possible to use the
positive edge of the burst key of a sandcastle signal.

54 MHz horizontal PLL

The 13.5 MHz clock frequency for the sampling clock and
the 18 MHz clock frequency for the reading clock are
generated in the 54 MHz horizontal PLL. The 13.5 MHz
clock and the 18 MHz clock are line locked.

Clamp reference

Reference voltages are generated In the clamp reference
block. These DC signals are used in the clamping circuits
as input signals for the output multiplexers and as
reference voltages for the SC line memories.

Four external capacitors at the pins C

LMY

, C

LMBY

, C

LMRY

and BGREF respectively are necessary to provide
smoothing for the reference voltages. A black level
reference signal is available at CLAOUT.

1995 Oct 05 6

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Controller

The controller generates the clocks and the horizontal start
signals for the SC line memories and, also, the control
signals for the output multiplexers. The timing for the start
reading signal for three different screen positions (left,
centre and right) and the control signals for the
multiplexers (C1 and C2) is fixed. For the uncompressed
signals a bypass via the SC line memories and a bypass
not via the SC line memories is available. When the
signals do not pass the line memories, the frequency
response is not affected by the si-function. The
compression and bypass mode via the line memories is
delayed by one line with respect to the bypass mode not
via the line memory.

The 16 : 9 compressor is controlled via the control signals
CTRL1, CTRL2 and CTRL3 (see Table 1). The test input
must be LOW level.

Table 1 Functions of the control signals

Internal post filters

The output signals of the SC line memories have to be
filtered with three 6.7 MHz low-pass filters to eliminate the
high frequencies caused by the time discrete signal
processing. The cut-off frequency of 6.7 MHz is necessary
because, as a result of the

3

⁄4 compression factor, the

frequencies are shifted to a higher frequency band with the
inverse compression factor (e.g. 5 MHz→ compression→

6.67 MHz). Due to the common bandwidth requirements
for all three outputs of the SC line memories the same
transfer function for the filters can be used.

Remark: These filters do not provide an si-correction. This
means that an input signal with a frequency of 5 MHz will
be damped by 2.1 dB at the output if the signal passes an
SC line memory.

CTRL1 CTRL2 CTRL3 FUNCTION

LOW LOW LOW bypass (through the line

memories)

LOW HIGH LOW compression, left position
HIGH LOW LOW compression, centre position
HIGH HIGH LOW compression, right position

LOW LOW HIGH bypass (not through the line

memories)

Signals for the side panels

The luminance and chrominance of the side panels is
determined by the external signals YSIDE, BYSIDE and
RYSIDE. This external generated side panel signal can be
referenced to the internal black level reference signal via
the output CLAOUT (pin 5).

Horizontal timing (see Fig.3)

The horizontal timing refers to the positive edge of the
input HREF signal.

The following timing parameters are valid for a horizontal
frequency of 15.625 kHz.

Input clamping typically starts at t

A

= 1.55 µs and ends at

tB= 3.78 µs.

1995 Oct 05 7

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Fig.3 Horizontal timing.

(1) Nominal timing for a 52 µs active video signal to generate a centred compressed video signal.
(2) Worst case picture position for a 52 µs active video signal to generate no visible blanking between side panels and compressed video.

handbook, full pagewidth

HREF

sampled video

compressed video

(centre position)

side

panel

side

panel

side

panel

compressed video

(left position)

bypassed video

bypassed video

(bypass via the Line Memories)

(full bypass not through the Line Memories)

side

panel

64 µs

1.5 µs

1.5 µs

49 µs (used for compression)

52 µs

36.75 µs

6.3 µs

(1)

(2)

(1)

(2)

(2)

(2)

compressed video

(right position)

MHA278

1995 Oct 05 8

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Fig.4 Receiver for 16 : 9, 50 Hz and 15.625 kHz with 16 : 9 compressor.

handbook, full pagewidth

COLOUR DECODER

TDA4650 OR TDA4655/7

AND TDA4665

PICTURE

SIGNAL

IMPROVEMENT

TDA4670/1

16:9

COMPRESSOR

SAA4981

VIDEO

PROCESSOR

TDA4680/7

TDA4780

SYNC

TDA2579B

sync

ASC

R
G
B

31

1

13

sandcastle

CTRL SIDE

CVBS

Y/C

3 3 3

−(B−Y)

Y

−(R−Y)

−(B−Y)

Y

−(R−Y)

−(B−Y)OUT

YOUT

−(R−Y)OUT

MHA279

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

Notes

1. Equivalent to discharging a 200 pF capacitor via a 0 Ω series resistor.

2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

QUALITY SPECIFICATION

In accordance with

UZW-B0/FQ-0601

. ESD classification A.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

n

voltage on any pin (except pin 6 HREF) V

EEA

− 0.5 V

CCA

+ 0.5 V

V

EED

− 0.5 V

CCD

+ 0.5 V

V

6

input voltage at pin 6 −0.5 +6.5 V

P

tot

total power dissipation − 0.5 W

T

stg

storage temperature −25 +150 °C

T

amb

operating ambient temperature −20 +70 °C

V

es

electrostatic handling for all pins note 1 −500 +500 V

note 2 −4000 +4000 V

1995 Oct 05 9

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

CHARACTERISTICS

V

CCA=VCCD

=5V; T

amb

=25°C; f

HREF

= 15.625 kHz; substrate connected to V

EED

; YSIDE, BYSIDE and RYSIDE are

connected to CLAOUT; all voltages are referenced to V

EEA

= 0 V; input signal EBU colour bar 100/0/75/0
(CCIR recommended 471-1), Y = 0.32 V (p-p), (B−Y) = 1.33 V (p-p), (R−Y) = 1.05 V (p-p); source impedance
Zis= 300 Ω; coupling capacitor Ck= 2.2 nF; output loads connected to ground RL=1MΩ, CL= 20 pF; measured in
Fig.5; test input pin 12 has to be connected to V

EED

; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins 20, 19, 8, 7 and 4); note 1

V

CCA

analog supply voltage 4.75 5.0 5.5 V

I

CCA

analog supply current 35 50 65 mA

V

CCD

digital supply voltage 4.75 5 5.5 V

I

CCD

digital supply current 1 9 14 mA

Video inputs (pins 23, 22 and 21)

Y
V

iY(p-p)

input voltage (peak-to-peak value) active video − 0.32 0.45 V

C

I(Y)

input capacitance −−10 pF

I

LI(Y)

input leakage current between clamping −−0.1 µA

R

iY(cl)

input resistance during clamping − 25kΩ
(B−Y)
V

i(B-Y)(p-p)

input voltage (peak-to-peak value) active video − 1.33 1.9 V
C

I(B-Y)

input capacitance −−10 pF
I

LI(B-Y)

input leakage current between clamping −−0.1 µA
R

I(B-Y)(cl)

input resistance during clamping − 25kΩ
(R−Y)
V

i(R−Y)(p-p)

input voltage (peak-to-peak value) active video − 1.05 1.5 V
C

I(R−Y)

input capacitance −−10 pF
I

LI(R−Y)(cl)

input leakage current between clamping −−0.1 µA
R

I(R−Y)(cl)

input resistance during clamping − 25kΩ

HREF input (pin 6)

V

i(top)

input voltage of the top pulse 3.0 − 6.5 V
I

LI(HREF)

input leakage current −−10 µA
C

I(HREF)

input capacitance −−10 pF
V

slice

slicing level below top pulse 0.5 0.75 1.0 V
f

i

input frequency 14.0 15.6 17.2 kHz
t

W

pulse width 1 −−µs
S

HREF

steepness 0.5 V under top 400 −−mV/ns

Side panel inputs (pins 15, 14 and 13)

V

i(side)

input voltage 0.5 − 2.5 V
C

I(side)

input capacitance −−10 pF
I

LI(side)

input leakage current −−0.1 µA

1995 Oct 05 10

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Control inputs/outputs (pins 9, 10 and 11)

V

IH

HIGH level input voltage 3.5 −−V
V

IL

LOW level input voltage −−1.5 V
C

Ictr

input capacitance −−10 pF
I

LIctr

input leakage current −−1µA

Clamping reference output (pin 5)

V

o5

output voltage 1.3 1.45 1.6 V
R

L

load resistor 10 −−kΩ
C

L

load capacitor −−30 pF

External capacitors (pins 1, 2 and 3)

C

DL

value for capacitor − 100 − nF
V

oCDL

output voltage 1.3 1.45 1.6 V

External capacitor (pin 24)

C

BGREF

value for capacitor − 100 − nF
V

oBGREF

output voltage 1.1 1.25 1.4 V

Video output signals (pins 18, 17 and 16)

YOUT
R

O(Y)

output resistance −−100 Ω
V

oY(p-p)

output voltage (peak-to-peak value) − 0.32 0.5 V
S/N signal-to-noise ratio 0.32 V (p-p)/V

eff

noise;
unweighted;
fi= 200 kHz to 5 MHz

52 −−dB

FPN(p-p) fixed pattern noise peak-to-peak

referenced to 0.32 V (p-p) video

f

clk

< 5 MHz 42 −−dB

α

ctY

crosstalk between different inputs fi= 1 MHz 40 −−dB

|t

d

| delay between different outputs −−30 ns

t

d

jitter in output signal referenced to
HREF input signal

−−10 ns

Bypass not via the SC line memories

G

Y1

frequency response f

ripple

= 0 to 4 MHz −0.5 − +0.5 dB

G

Y2

frequency response attenuation at 5 MHz

compared to 1 MHz

0 −−2dB

Bypass via the SC line memories;

note 2

G

Y3

YOUT/YIN at input frequency fi= 1 MHz −1.1 − +0.9 dB

G

Y4

YOUT/YIN at input frequency fi= 2 MHz −1.3 − +0.7 dB

G

Y5

YOUT/YIN at input frequency fi= 3 MHz −1.7 − +0.3 dB

G

Y6

YOUT/YIN at input frequency fi= 4 MHz −2.3 −−0.3 dB

G

Y7

YOUT/YIN at input frequency fi= 5 MHz −3.1 −−1.1 dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1995 Oct 05 11

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Compressed video;

note 2

G

Y8

YOUT/YIN at input frequency fi= 1 MHz; fo= 1.3 MHz −1 − +1 dB

G

Y9

YOUT/YIN at input frequency fi= 2 MHz; fo= 2.7 MHz −1 − +1 dB

G

Y10

YOUT/YIN at input frequency fi= 3 MHz; fo= 4 MHz −2 − 0dB

G

Y11

YOUT/YIN at input frequency fi= 3.75 MHz; fo= 5 MHz −3 −−1dB

G

Y12

YOUT/YIN at input frequency fi= 4 MHz; fo= 5.3 MHz −4 −−1dB

G

Y13

YOUT/YIN at input frequency fi= 5 MHz; fo= 6.67 MHz −6 −−1dB

A

Ypre

pre filter stop-band characteristic,
damping factor for input signals

fi> 10 MHz 20 −−dB
f

i

> 20 MHz 32 −−dB

f

i

> 100 MHz 42 −−dB

A

Ypost

post filter stop-band characteristic,
damping factor for input signals

fi> 14 MHz 20 −−dB
f

i

> 20 MHz 32 −−dB

f

i

> 100 MHz 40 −−dB
(B−Y)OUT
R

O(U)

output resistance −−100 Ω

V

oU(p-p)

output voltage (peak-to-peak value) − 1.33 2.1 V

S/N signal-to-noise ratio 1.33 V (p-p)/V

eff

noise;
unweighted;
fi= 200 kHz to 5 MHz

54 −−dB

FPN(p-p) fixed pattern noise peak-to-peak

referenced to 1.33 V (p-p) video

f

clk

< 5 MHz 42 −−dB

α

ctU

crosstalk between different inputs fi= 1 MHz 40 −−dB

|t

d

| delay between different outputs −−30 ns

t

d

jitter in output signal to input HREF
signal

−−10 ns

Bypass not via the SC line memories

G

U1

frequency response f

ripple

= 0 to 4 MHz −0.5 − +0.5 dB

G

U2

frequency response attenuation at 5 MHz

compared to 1 MHz

0 −−2dB

Bypass via the SC line memories;

note 2

G

U3

(B−Y)OUT/(B−Y)IN at input frequency fi= 1 MHz −1.1 − +0.9 dB

G

U4

(B−Y)OUT/(B−Y)IN at input frequency fi= 2 MHz −1.3 − +0.7 dB

G

U5

(B−Y)OUT/(B−Y)IN at input frequency fi= 3 MHz −1.7 − +0.3 dB

G

U6

(B−Y)OUT/(B−Y)IN at input frequency fi= 4 MHz −2.3 −−0.3 dB

G

U7

(B−Y)OUT/(B−Y)IN at input frequency fi= 5 MHz −3.1 −−1.1 dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1995 Oct 05 12

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Compressed video;

note 2

G

U8

(B−Y)OUT/(B−Y)IN at input frequency fi= 1 MHz; fo= 1.3 MHz −1 − +1 dB

G

U9

(B−Y)OUT/(B−Y)IN at input frequency fi= 2 MHz; fo= 2.7 MHz −1 − +1 dB

G

U10

(B−Y)OUT/(B−Y)IN at input frequency fi= 3 MHz; fo= 4 MHz −2 − 0dB

G

U11

(B−Y)OUT/(B−Y)IN at input frequency fi= 3.75 MHz; fo= 5 MHz −3 −−1dB

G

U12

(B−Y)OUT/(B−Y)IN at input frequency fi= 4 MHz; fo= 5.3 MHz −4 −−1dB

G

U13

(B−Y)OUT/(B−Y)IN at input frequency fi= 5 MHz; fo= 6.67 MHz −6 −−1dB

A

Upre

pre filter stop-band characteristic,
damping factor for input signals

fi> 10 MHz 20 −−dB
f

i

> 20 MHz 32 −−dB

f

i

> 100 MHz 42 −−dB

A

Upost

post filter stop-band characteristic,
damping factor for input signals

fi> 14 MHz 20 −−dB
f

i

> 20 MHz 32 −−dB

f

i

> 100 MHz 40 −−dB
(R−Y)OUT
R

O(V)

output resistance −−100 Ω

V

oV

output voltage (peak-to-peak value) − 1.05 1.7 V

S/N signal-to-noise ratio 1.05 V (p-p)/V

eff

noise;
unweighted;
fi= 200 kHz to 5 MHz

52 −−dB

FPN(p-p) fixed pattern noise peak-to-peak

referenced to 1.05 V (p-p) video

f

clock

< 5 MHz 40 −−dB

α

ctV

crosstalk between different inputs fi= 1 MHz 40 −−dB

|t

d

| delay between different outputs −−30 ns

t

d

jitter in output signal to input HREF
signal

−−10 ns

Bypass not via the SC line memories

G

V1

frequency response f

ripple

= 0 to 4 MHz −0.5 − +0.5 dB

G

V2

frequency response attenuation at 5 MHz

compared to 1 MHz

0 −−2dB

Bypass via the SC line memories;

note 2

G

V3

(R−Y)OUT/(R−Y)IN at input frequency fi= 1 MHz −1.1 − +0.9 dB

G

V4

(R−Y)OUT/(R−Y)IN at input frequency fi= 2 MHz −1.3 − +0.7 dB

G

V5

(R−Y)OUT/(R−Y)IN at input frequency fi= 3 MHz −1.7 − +0.3 dB

G

V6

(R−Y)OUT/(R−Y)IN at input frequency fi= 4 MHz −2.3 −−0.3 dB

G

V7

(R−Y)OUT/(R−Y)IN at input frequency fi= 5 MHz −3.1 −−1.1 dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1995 Oct 05 13

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

Notes

1. ∆V1= V

CCA

− V

CCD

≤300 mV; ∆V2= V

EED

− V

EEA

≤300 mV with V

EED

= SUB (latch-up prevention).

2. This frequency response includes the si-attenuation as a result of the time discrete signal processing. An
si-correction is not performed.

Compressed video;

note 2

G

V8

(R−Y)OUT/(R−Y)IN at input frequency fi= 1 MHz; fo= 1.3 MHz −1 − +1 dB

G

V9

(R−Y)OUT/(R−Y)IN at input frequency fi= 2 MHz; fo= 2.7 MHz −1 − +1 dB

G

V10

(R−Y)OUT/(R−Y)IN at input frequency fi= 3 MHz; fo= 4 MHz −2 − 0dB

G

V11

(R−Y)OUT/(R−Y)IN at input frequency fi= 3.75 MHz; fo= 5 MHz −3 −−1dB

G

V12

(R−Y)OUT/(R−Y)IN at input frequency fi= 4 MHz; fo= 5.3 MHz −4 −−1dB

G

V13

(R−Y)OUT/(R−Y)IN at input frequency fi= 5 MHz; fo= 6.67 MHz −6 −−1dB

A

Vpre

pre filter stop-band characteristic,
damping factor for input signals

fi> 10 MHz 20 −−dB
f

i

> 20 MHz 32 −−dB

f

i

> 100 MHz 42 −−dB

A

Vpost

post filter stop-band characteristic,
damping factor for input signals

fi> 14 MHz 20 −−dB
f

i

> 20 MHz 32 −−dB

f

i

> 100 MHz 40 −−dB

Video outputs YOUT, (B−Y)OUT and (R−Y)OUT

R

ATIO OF OUTPUT AMPLITUDES FOR EQUAL INPUT SIGNALS FOR Y, (B−Y) AND (R−Y)

V

oY/VoU

YOUT/(B−Y)OUT VI= 0.32 V (p-p); fi≤ 1 MHz −0.4 − +0.4 dB

V

oY/VoV

YOUT/(R−Y)OUT VI= 0.32 V (p-p); fi≤ 1 MHz −0.4 − +0.4 dB

V

oU/VoV

(B−Y)OUT/(R−Y)OUT VI= 1.33 V (p-p) −0.4 − +0.4 dB

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1995 Oct 05 14

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

APPLICATION INFORMATION

Fig.5 Application diagram.

(1) Connected to CLAOUT for black side panels.
(2) Substrate (pin 4) has to be connected to V

EED

. V

EEA

and V

EED

. Substrates have to be separated as much as possible.

ok, full pagewidth

SAA4981

100

nF

100

nF

100nF100

nF

2.2
nF

2.2
nF

2.2
nF

video signal

inputs

video signal

outputs

ferrit

pearl

ferrit

pearl

47 µF

10 nF
47 µF

10 nF
47 µF

47 µF

10 nF

10 nF

10 nF

2.2

Ω

2.2 Ω

5.6 Ω15 Ω

CLAOUT

(1)

(2)

control inputs

see Table 1

clamp reference

voltage output

line reference

input

+ 5 V

+ 5 V

V

EED

V

EEAVEEAVEEA

V

EEA

V

EED

V

EED

V

EEA

V

EEA

24 23 22 21 20 19 18 17 16 15 14 13

1234567 89101112

MHA280

1995 Oct 05 15

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

PACKAGE OUTLINES

UNIT

A

max.

1 2

b

1

cD E e M

H

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT101-1

92-11-17
95-01-23

A

min.

A

max.

b

w

M

E

e

1

1.7

1.3

0.53

0.38

0.32

0.23

32.0

31.4

14.1

13.7

3.9

3.4

0.252.54 15.24

15.80

15.24

17.15

15.90

2.25.1 0.51 4.0

0.066

0.051

0.021

0.015

0.013

0.009

1.26

1.24

0.56

0.54

0.15

0.13

0.010.10 0.60

0.62

0.60

0.68

0.63

0.0870.20 0.020 0.16

051G02 MO-015AD

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

e

D

A

2

Z

24

1

13

12

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

Z

max.

(1)

(1)(1)

DIP24: plastic dual in-line package; 24 leads (600 mil)

SOT101-1

1995 Oct 05 16

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

UNIT

A

max.

A1A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

15.6

15.2

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT137-1

X

12

24

w

M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

c

L

v

M

A

13

(A )

3

A

y

0.25

075E05 MS-013AD

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.61

0.60

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

e

1

0 5 10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

95-01-24
97-05-22

1995 Oct 05 17

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WA VE

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1995 Oct 05 18

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

1995 Oct 05 19

Philips Semiconductors Preliminary specification

Monolithic integrated 16 : 9 compressor SAA4981

NOTES

Philips Semiconductors – a worldwide company

Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)

BUENOS AIRES, Tel. [phone], Fax. [phone]

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]

Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]

Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,

Tel. [phone], Fax. [phone]

Brazil: Rua do Rocio 220 - 5

th

floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil.
P.O. Box 7383 (01064-970),
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:

Tel. [phone], Fax. [phone]

Chile: Av. Santa Maria 0760, SANTIAGO,

Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,

77621 BOGOTA, Tel. [phone],
Fax. [phone]

Denmark: Prags Boulevard 80, PB 1919, DK-2300

COPENHAGEN S, Tel. [phone], Fax. [phone]

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]

France: 4 Rue du Port-aux-Vins, BP317,

92156 SURESNES Cedex,
Tel. [phone], Fax. [phone]

Germany: P.O. Box 10 63 23, 20043 HAMBURG,

Tel. [phone], Fax. [phone].

Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. [phone] 911, Fax. [phone]

India: Philips INDIA Ltd, Shivsagar Estate, A Block,

Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. [phone], Fax. [phone]

Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,

P.O. Box 4252, JAKARTA 12950,
Tel. [phone], Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS S.r.l.,

Piazza IV Novembre 3, 20124 MILANO,
Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37 , Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong,

Yongsan-ku, SEOUL, Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,

SELANGOR, Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Tel. [phone], Fax. [phone]

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]

Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. [phone],
Fax. [phone]

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. [phone], Fax. [phone]

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,

Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. [phone], Fax. [phone]

Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. [phone], Fax. [phone]

United States:811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. [phone], Fax. [phone]

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. [phone], Fax. [phone]

Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,

International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. [phone]

SCD44 © Philips Electronics N.V. 1995 Oct 05

All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.

Printed in The Netherlands

533061/1500/02/pp20 Date of release: 1995 Oct 05
Document order number: 9397 750 00346