Datasheet SAA4981T, SAA4981 Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
SAA4981
Monolithic integrated 16 : 9 compressor
Preliminary specification Supersedes data of May 1994 File under Integrated Circuits, IC02
1995 Oct 05
Page 2
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
FEATURES
Fixed horizontal compression by a factor of4⁄3 for most video standards
Three fixed screen positions (left, centre and right)
5 MHz bandwidth
Bypass function
Inputs for luminance and chrominance of side panels
Standard video inputs and outputs (Y, (B−Y) and (R−Y))
Horizontal and vertical sync signals are not processed
Pre filters and post filters on chip.
The synchronisation input HREF is a line frequency reference signal. The bandwidth of the IC is up to 5 MHz and the signal delay is realized with SC Line Memories (Switched Capacitors Line Memories). The output of the 16 : 9 compressor also has the format Y, (BY) and (RY) and provides the following two possibilities:
1. Bypass function (the input signal is not compressed)
2. Compressed video by a factor of
4
⁄3 with three different
fixed screen positions (left, centre and right). The luminance and chrominance of the side panels are determined by the external signals YSIDE, BYSIDE and RYSIDE.
The horizontal compression is a time discrete and
GENERAL DESCRIPTION
The integrated 16 : 9 compressor is an IC which compresses the active part of a video line by a factor of from, for example, 52 µsto39µs. This is necessary to display 4:3 video software on a 16 : 9 tube in the correct proportion. The capacitively coupled video inputs are Y,
amplitude continuous signal processing. This provides pre and post filters which are realized on-chip. The internal clock generation is achieved with a 54 MHz horizontal PLL
4
3
which is synchronized to the positive edge of the HREF signal. The function of the IC is controlled by the three control signals CTRL1, CTRL2 and CTRL3.
(BY) and (RY).
QUICK REFERENCE DATA
Voltages for video signals are peak-to-peak values for 75% colour bars. All voltages are referenced to V
EEA=VEED
=0V.
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
CCA
V
CCD
V
iY(p-p)
V
iU(p-p)
V
iV(p-p)
V
iHREF
V
oY(p-p)
V
oU(p-p)
V
oV(p-p)
analog supply voltage 4.75 5.0 5.5 V digital supply voltage 4.75 5.0 5.5 V Y input voltage (peak-to-peak value) 0.32 0.45 V (BY) input voltage (peak-to-peak value) 1.33 1.9 V (RY) input voltage (peak-to-peak value) 1.05 1.5 V input HREF top pulse 3.0 6.5 V YOUT output voltage (peak-to-peak value) 0.32 0.5 V (BY)OUT output voltage (peak-to-peak value) 1.33 2.1 V (RY)OUT output voltage (peak-to-peak value) 1.05 1.7 V
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
SAA4981 DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 SAA4981T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
1995 Oct 05 2
Page 3
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
BLOCK DIAGRAM
V
V
SUB
EED
CCD
YOUT
18
MUX Y
6.7 MHz
LOW-PASS FILTER
MUX
SC LINE
MEMORIES
C1 C2 C3
SAA4981
(B-Y)OUT
17
MUX BY
6.7 MHz
LOW-PASS FILTER
MUX
SC LINE
MEMORIES
(R-Y)OUT
16
MUX RY
C1 C2 C3
6.7 MHz
LOW-PASS FILTER
MUX
SC LINE
MEMORIES
C1 C2 C3
3
CLAMP REFERENCE
MHA277
RYSIDE
BYSIDE
YSIDE
CLAOUT
BGREF
LMRY
C
LMBY
C
LMY
C
handbook, full pagewidth
V
V
EEA
CCA
20 19 8 7 4
SC LINE MEMORY
SC LINE MEMORY
5 MHz
LOW-PASS FILTER
CLAMP
23
YIN
SC LINE MEMORY
SC LINE MEMORY
5 MHz
LOW-PASS FILTER
CLAMP
22
(B-Y)IN
1995 Oct 05 3
SC LINE MEMORY
SC LINE MEMORY
5 MHz
LOW-PASS FILTER
CLAMP
21
(R-Y)IN
3
C1
HORIZONTAL
SEPARATION
6
HREF
C2
C3
CONTROLLER
PLL
54 MHz
Fig.1 Block diagram.
11 1 2 3 24 5 15 14 1310912
CTRL1 CTRL3
TEST CTRL2
Page 4
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
PINNING
SYMBOL PIN DESCRIPTION
C
LMY
C
LMBY
C
LMRY
SUB 4 substrate connection (see Fig.5) CLAOUT 5 internal clamping reference voltage
HREF 6 horizontal reference input V
EED
V
CCD
CTRL1 9 control input 1 CTRL2 10 control input 2 CTRL3 11 control input 3 TEST 12 test mode activation RYSIDE 13 side panel input for RY BYSIDE 14 side panel input for BY YSIDE 15 side panel input for Y (RY)OUT 16 output signal for (RY) (BY)OUT 17 output signal for (BY) YOUT 18 output signal for Y V
EEA
V
CCA
(RY)IN 21 input signal for (RY) (BY)IN 22 input signal for (BY) YIN 23 input signal for Y BGREF 24 decoupling capacitor for internal
1 decoupling capacitor for Y
reference voltage
2 decoupling capacitor for BY
reference voltage
3 decoupling capacitor for RY
reference voltage
output
7 ground for digital section 8 positive digital supply voltage
19 ground for analog section 20 positive analog supply voltage
reference voltage
handbook, halfpage
1
C
LMY LMBY LMRY
SUB
HREF
2 3 4 5 6
C C
CLAOUT
SAA4981
7
V
EED
8
V
CCD
TEST
9 10 11 12
CTRL1 CTRL2 CTRL3
Fig.2 Pin configuration.
MHA276
24 23 22 21 20 19 18 17 16 15 14 13
BGREF YIN (B-Y)IN (R-Y)IN V
CCA
V
EEA
YOUT (BY)OUT (RY)OUT YSIDE BYSIDE RYSIDE
1995 Oct 05 4
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
FUNCTIONAL DESCRIPTION Applicable video standards
The integrated 16 : 9 compressor can be used for the following video standards; B, C, D, G, H, I, K, K1, L, M and N. standards D, I, K, K1 and L will show a reduced video bandwidth above 5 MHz.
Clamping circuit
The clamping circuits clamp the video input signals Y, (BY) and (RY) to the DC level of the clamp reference signal fed from the clamp reference circuit. This is necessary to ensure that the input signals are in the correct input voltage range for the 5 MHz low-pass filters and the SC line memories.
Internal pre filters
Before the signals are sampled in the time discrete and amplitude continuous area, low-pass filtering is necessary to avoid any aliasing. Even if the inputs have already been low-pass filtered further filtering is advantageous for the electromagnetic compatibility (EMC). The same transfer function is used for all three low-pass filters because of the same bandwidth for the luminance and chrominance signals (up to 5 MHz).
SC line memories
After the low-pass filters the input signals are fed to the SC line memories. The signals are sampled at a clock frequency of 13.5 MHz. One video line later the signals are read with a clock frequency of 18 MHz in the compression mode. The result of the different clock frequencies is a
4
horizontal compression by a factor of
⁄3. The clocks and
the horizontal starting pulses for the SC line memories are fed from the controller.
Two line memories are required for each signal path because in the compression mode, in one video line the signals are sampled to the SC line memories with
13.5 MHz and one video line later the signals are read with 18 MHz. In the bypass mode, via the SC line memories, in one video line the signals are sampled with 13.5 MHz and one video line later the signals are read with 13.5 MHz. The SC line memories are suitable for signals with a bandwidth up to 5 MHz. With a multiplexer (MUX) behind the SC line memories, the sampled video signal is connected to the internal post filters.
Output multiplexer MUX Y, MUX (BY) and MUX (RY)
The output multiplexers are controlled via C1 and C2 fed from the controller. The multiplexers are used to connect one of the four input signals to the output and, also, enable fast switching.
The input signals of the multiplexers for one component [Y, (BY) or (RY)] are as follows:
The output signal of the post filter
The uncompressed signal after the input clamping
The clamping reference signal
The signal for the side panel determined by YSIDE,
BYSIDE and RYSIDE.
The horizontal separation circuit
The 54 MHz horizontal PLL is locked to the positive edge of the digital HREF signal, which is generated in the horizontal separation circuit. It is also possible to use the positive edge of the burst key of a sandcastle signal.
54 MHz horizontal PLL
The 13.5 MHz clock frequency for the sampling clock and the 18 MHz clock frequency for the reading clock are generated in the 54 MHz horizontal PLL. The 13.5 MHz clock and the 18 MHz clock are line locked.
Clamp reference
Reference voltages are generated In the clamp reference block. These DC signals are used in the clamping circuits as input signals for the output multiplexers and as reference voltages for the SC line memories.
Four external capacitors at the pins C
LMY
, C
LMBY
, C
LMRY
and BGREF respectively are necessary to provide smoothing for the reference voltages. A black level reference signal is available at CLAOUT.
1995 Oct 05 5
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
Controller
The controller generates the clocks and the horizontal start signals for the SC line memories and, also, the control signals for the output multiplexers. The timing for the start reading signal for three different screen positions (left, centre and right) and the control signals for the multiplexers (C1 and C2) is fixed. For the uncompressed signals a bypass via the SC line memories and a bypass not via the SC line memories is available. When the signals do not pass the line memories, the frequency response is not affected by the si-function. The compression and bypass mode via the line memories is delayed by one line with respect to the bypass mode not via the line memory.
The 16 : 9 compressor is controlled via the control signals CTRL1, CTRL2 and CTRL3 (see Table 1). The test input must be LOW level.
Table 1 Functions of the control signals
CTRL1 CTRL2 CTRL3 FUNCTION
LOW LOW LOW bypass (through the line
memories)
LOW HIGH LOW compression, left position HIGH LOW LOW compression, centre position HIGH HIGH LOW compression, right position
LOW LOW HIGH bypass (not through the line
memories)
Signals for the side panels
The luminance and chrominance of the side panels is determined by the external signals YSIDE, BYSIDE and RYSIDE. This external generated side panel signal can be referenced to the internal black level reference signal via the output CLAOUT (pin 5).
Horizontal timing (see Fig.3)
The horizontal timing refers to the positive edge of the input HREF signal.
The following timing parameters are valid for a horizontal frequency of 15.625 kHz.
Input clamping typically starts at t
= 1.55 µs and ends at
A
tB= 3.78 µs.
Internal post filters
The output signals of the SC line memories have to be filtered with three 6.7 MHz low-pass filters to eliminate the high frequencies caused by the time discrete signal processing. The cut-off frequency of 6.7 MHz is necessary because, as a result of the
3
⁄4 compression factor, the
frequencies are shifted to a higher frequency band with the inverse compression factor (e.g. 5 MHz compression
6.67 MHz). Due to the common bandwidth requirements for all three outputs of the SC line memories the same transfer function for the filters can be used.
Remark: These filters do not provide an si-correction. This means that an input signal with a frequency of 5 MHz will be damped by 2.1 dB at the output if the signal passes an SC line memory.
1995 Oct 05 6
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
handbook, full pagewidth
6.3 µs
HREF
1.5 µs
1.5 µs
49 µs (used for compression)
side
panel
side
panel
compressed video
(left position)
64 µs
sampled video
52 µs
36.75 µs
compressed video
(centre position)
(2)
(1)
side
panel
compressed video
(right position)
side
panel
(2)
bypassed video
(bypass via the Line Memories)
(2)
(2)
bypassed video
(full bypass not through the Line Memories)
(1) Nominal timing for a 52 µs active video signal to generate a centred compressed video signal. (2) Worst case picture position for a 52 µs active video signal to generate no visible blanking between side panels and compressed video.
(1)
MHA278
Fig.3 Horizontal timing.
1995 Oct 05 7
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
handbook, full pagewidth
CVBS
Y/C
COLOUR DECODER
TDA4650 OR TDA4655/7
AND TDA4665
sync
TDA2579B
ASC
SYNC
Y
(BY)
(RY)
3 3 3
1
PICTURE
SIGNAL
IMPROVEMENT
TDA4670/1
sandcastle
Y
(BY)
(RY)
16:9
COMPRESSOR
SAA4981
31
CTRL SIDE
YOUT
(BY)OUT
(RY)OUT
VIDEO
PROCESSOR
TDA4680/7
TDA4780
13
MHA279
Fig.4 Receiver for 16 : 9, 50 Hz and 15.625 kHz with 16 : 9 compressor.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
n
V
6
P
tot
T
stg
T
amb
V
es
voltage on any pin (except pin 6 HREF) V
input voltage at pin 6 0.5 +6.5 V total power dissipation 0.5 W storage temperature 25 +150 °C operating ambient temperature 20 +70 °C electrostatic handling for all pins note 1 500 +500 V
V
EEA EED
0.5 V
0.5 V
CCA CCD
+ 0.5 V + 0.5 V
note 2 4000 +4000 V
R G B
Notes
1. Equivalent to discharging a 200 pF capacitor via a 0 series resistor.
2. Equivalent to discharging a 100 pF capacitor via a 1.5 k series resistor.
QUALITY SPECIFICATION
In accordance with
UZW-B0/FQ-0601
. ESD classification A.
1995 Oct 05 8
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
CHARACTERISTICS
V
CCA=VCCD
connected to CLAOUT; all voltages are referenced to V (CCIR recommended 471-1), Y = 0.32 V (p-p), (BY) = 1.33 V (p-p), (RY) = 1.05 V (p-p); source impedance Zis= 300 ; coupling capacitor Ck= 2.2 nF; output loads connected to ground RL=1MΩ, CL= 20 pF; measured in Fig.5; test input pin 12 has to be connected to V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply (pins 20, 19, 8, 7 and 4); note 1
V
CCA
I
CCA
V
CCD
I
CCD
Video inputs (pins 23, 22 and 21)
Y V
iY(p-p)
C
I(Y)
I
LI(Y)
R
iY(cl)
(BY) V
i(B-Y)(p-p)
C
I(B-Y)
I
LI(B-Y)
R
I(B-Y)(cl)
(RY) V
i(RY)(p-p)
C
I(RY)
I
LI(RY)(cl)
R
I(RY)(cl)
HREF input (pin 6)
V
i(top)
I
LI(HREF)
C
I(HREF)
V
slice
f
i
t
W
S
HREF
Side panel inputs (pins 15, 14 and 13)
V
i(side)
C
I(side)
I
LI(side)
=5V; T
amb
=25°C; f
= 15.625 kHz; substrate connected to V
HREF
= 0 V; input signal EBU colour bar 100/0/75/0
EEA
; unless otherwise specified.
EED
; YSIDE, BYSIDE and RYSIDE are
EED
analog supply voltage 4.75 5.0 5.5 V analog supply current 35 50 65 mA digital supply voltage 4.75 5 5.5 V digital supply current 1 9 14 mA
input voltage (peak-to-peak value) active video 0.32 0.45 V input capacitance −−10 pF input leakage current between clamping −−0.1 µA input resistance during clamping 25k
input voltage (peak-to-peak value) active video 1.33 1.9 V input capacitance −−10 pF input leakage current between clamping −−0.1 µA input resistance during clamping 25k
input voltage (peak-to-peak value) active video 1.05 1.5 V input capacitance −−10 pF input leakage current between clamping −−0.1 µA input resistance during clamping 25k
input voltage of the top pulse 3.0 6.5 V input leakage current −−10 µA input capacitance −−10 pF slicing level below top pulse 0.5 0.75 1.0 V input frequency 14.0 15.6 17.2 kHz pulse width 1 −−µs steepness 0.5 V under top 400 −−mV/ns
input voltage 0.5 2.5 V input capacitance −−10 pF input leakage current −−0.1 µA
1995 Oct 05 9
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Control inputs/outputs (pins 9, 10 and 11)
V
IH
V
IL
C
Ictr
I
LIctr
Clamping reference output (pin 5)
V
o5
R
L
C
L
External capacitors (pins 1, 2 and 3)
C
DL
V
oCDL
External capacitor (pin 24)
C
BGREF
V
oBGREF
Video output signals (pins 18, 17 and 16)
HIGH level input voltage 3.5 −−V LOW level input voltage −−1.5 V input capacitance −−10 pF input leakage current −−1µA
output voltage 1.3 1.45 1.6 V load resistor 10 −−k load capacitor −−30 pF
value for capacitor 100 nF output voltage 1.3 1.45 1.6 V
value for capacitor 100 nF output voltage 1.1 1.25 1.4 V
YOUT R
O(Y)
V
oY(p-p)
S/N signal-to-noise ratio 0.32 V (p-p)/V
output resistance −−100 output voltage (peak-to-peak value) 0.32 0.5 V
noise;
eff
52 −−dB unweighted; fi= 200 kHz to 5 MHz
FPN(p-p) fixed pattern noise peak-to-peak
f
< 5 MHz 42 −−dB
clk
referenced to 0.32 V (p-p) video
α
ctY
| delay between different outputs −−30 ns
|t
d
t
d
crosstalk between different inputs fi= 1 MHz 40 −−dB
jitter in output signal referenced to
−−10 ns
HREF input signal
Bypass not via the SC line memories
G
Y1
G
Y2
frequency response f
= 0 to 4 MHz 0.5 +0.5 dB
ripple
frequency response attenuation at 5 MHz
0 −−2dB compared to 1 MHz
Bypass via the SC line memories;
G
Y3
G
Y4
G
Y5
G
Y6
G
Y7
YOUT/YIN at input frequency fi= 1 MHz 1.1 +0.9 dB YOUT/YIN at input frequency fi= 2 MHz 1.3 +0.7 dB YOUT/YIN at input frequency fi= 3 MHz 1.7 +0.3 dB YOUT/YIN at input frequency fi= 4 MHz 2.3 −−0.3 dB YOUT/YIN at input frequency fi= 5 MHz 3.1 −−1.1 dB
note 2
1995 Oct 05 10
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Compressed video;
G
Y8
G
Y9
G
Y10
G
Y11
G
Y12
G
Y13
A
Ypre
A
Ypost
note 2
YOUT/YIN at input frequency fi= 1 MHz; fo= 1.3 MHz 1 +1 dB YOUT/YIN at input frequency fi= 2 MHz; fo= 2.7 MHz 1 +1 dB YOUT/YIN at input frequency fi= 3 MHz; fo= 4 MHz 2 0dB YOUT/YIN at input frequency fi= 3.75 MHz; fo= 5 MHz 3 −−1dB YOUT/YIN at input frequency fi= 4 MHz; fo= 5.3 MHz 4 −−1dB YOUT/YIN at input frequency fi= 5 MHz; fo= 6.67 MHz 6 −−1dB pre filter stop-band characteristic,
damping factor for input signals
post filter stop-band characteristic, damping factor for input signals
fi> 10 MHz 20 −−dB
> 20 MHz 32 −−dB
f
i
> 100 MHz 42 −−dB
f
i
fi> 14 MHz 20 −−dB
> 20 MHz 32 −−dB
f
i
> 100 MHz 40 −−dB
f
i
(BY)OUT R
O(U)
V
oU(p-p)
S/N signal-to-noise ratio 1.33 V (p-p)/V
output resistance −−100 output voltage (peak-to-peak value) 1.33 2.1 V
noise;
eff
54 −−dB unweighted; fi= 200 kHz to 5 MHz
FPN(p-p) fixed pattern noise peak-to-peak
< 5 MHz 42 −−dB
f
clk
referenced to 1.33 V (p-p) video
α
ctU
| delay between different outputs −−30 ns
|t
d
t
d
crosstalk between different inputs fi= 1 MHz 40 −−dB
jitter in output signal to input HREF
−−10 ns
signal
Bypass not via the SC line memories
G
U1
G
U2
frequency response f
= 0 to 4 MHz 0.5 +0.5 dB
ripple
frequency response attenuation at 5 MHz
0 −−2dB compared to 1 MHz
Bypass via the SC line memories;
G
U3
G
U4
G
U5
G
U6
G
U7
(BY)OUT/(BY)IN at input frequency fi= 1 MHz 1.1 +0.9 dB (BY)OUT/(BY)IN at input frequency fi= 2 MHz 1.3 +0.7 dB (BY)OUT/(BY)IN at input frequency fi= 3 MHz 1.7 +0.3 dB (BY)OUT/(BY)IN at input frequency fi= 4 MHz 2.3 −−0.3 dB (BY)OUT/(BY)IN at input frequency fi= 5 MHz 3.1 −−1.1 dB
note 2
1995 Oct 05 11
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Compressed video;
G
U8
G
U9
G
U10
G
U11
G
U12
G
U13
A
Upre
A
Upost
note 2
(BY)OUT/(BY)IN at input frequency fi= 1 MHz; fo= 1.3 MHz 1 +1 dB (BY)OUT/(BY)IN at input frequency fi= 2 MHz; fo= 2.7 MHz 1 +1 dB (BY)OUT/(BY)IN at input frequency fi= 3 MHz; fo= 4 MHz 2 0dB (BY)OUT/(BY)IN at input frequency fi= 3.75 MHz; fo= 5 MHz 3 −−1dB (BY)OUT/(BY)IN at input frequency fi= 4 MHz; fo= 5.3 MHz 4 −−1dB (BY)OUT/(BY)IN at input frequency fi= 5 MHz; fo= 6.67 MHz 6 −−1dB pre filter stop-band characteristic,
damping factor for input signals
post filter stop-band characteristic, damping factor for input signals
fi> 10 MHz 20 −−dB
> 20 MHz 32 −−dB
f
i
> 100 MHz 42 −−dB
f
i
fi> 14 MHz 20 −−dB
> 20 MHz 32 −−dB
f
i
> 100 MHz 40 −−dB
f
i
(RY)OUT R
O(V)
V
oV
S/N signal-to-noise ratio 1.05 V (p-p)/V
output resistance −−100 output voltage (peak-to-peak value) 1.05 1.7 V
noise;
eff
52 −−dB unweighted; fi= 200 kHz to 5 MHz
FPN(p-p) fixed pattern noise peak-to-peak
< 5 MHz 40 −−dB
f
clock
referenced to 1.05 V (p-p) video
α
ctV
| delay between different outputs −−30 ns
|t
d
t
d
crosstalk between different inputs fi= 1 MHz 40 −−dB
jitter in output signal to input HREF
−−10 ns
signal
Bypass not via the SC line memories
G
V1
G
V2
frequency response f
= 0 to 4 MHz 0.5 +0.5 dB
ripple
frequency response attenuation at 5 MHz
0 −−2dB compared to 1 MHz
Bypass via the SC line memories;
G
V3
G
V4
G
V5
G
V6
G
V7
(RY)OUT/(RY)IN at input frequency fi= 1 MHz 1.1 +0.9 dB (RY)OUT/(RY)IN at input frequency fi= 2 MHz 1.3 +0.7 dB (RY)OUT/(RY)IN at input frequency fi= 3 MHz 1.7 +0.3 dB (RY)OUT/(RY)IN at input frequency fi= 4 MHz 2.3 −−0.3 dB (RY)OUT/(RY)IN at input frequency fi= 5 MHz 3.1 −−1.1 dB
note 2
1995 Oct 05 12
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Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Compressed video;
G
V8
G
V9
G
V10
G
V11
G
V12
G
V13
A
Vpre
A
Vpost
note 2
(RY)OUT/(RY)IN at input frequency fi= 1 MHz; fo= 1.3 MHz 1 +1 dB (RY)OUT/(RY)IN at input frequency fi= 2 MHz; fo= 2.7 MHz 1 +1 dB (RY)OUT/(RY)IN at input frequency fi= 3 MHz; fo= 4 MHz 2 0dB (RY)OUT/(RY)IN at input frequency fi= 3.75 MHz; fo= 5 MHz 3 −−1dB (RY)OUT/(RY)IN at input frequency fi= 4 MHz; fo= 5.3 MHz 4 −−1dB (RY)OUT/(RY)IN at input frequency fi= 5 MHz; fo= 6.67 MHz 6 −−1dB pre filter stop-band characteristic,
damping factor for input signals
post filter stop-band characteristic, damping factor for input signals
fi> 10 MHz 20 −−dB
> 20 MHz 32 −−dB
f
i
> 100 MHz 42 −−dB
f
i
fi> 14 MHz 20 −−dB
> 20 MHz 32 −−dB
f
i
> 100 MHz 40 −−dB
f
i
Video outputs YOUT, (BY)OUT and (RY)OUT
R
ATIO OF OUTPUT AMPLITUDES FOR EQUAL INPUT SIGNALS FOR Y, (BY) AND (RY)
V
oY/VoU
V
oY/VoV
V
oU/VoV
YOUT/(BY)OUT VI= 0.32 V (p-p); fi≤ 1 MHz −0.4 +0.4 dB YOUT/(RY)OUT VI= 0.32 V (p-p); fi≤ 1 MHz −0.4 +0.4 dB (BY)OUT/(RY)OUT VI= 1.33 V (p-p) 0.4 +0.4 dB
Notes
1. V1= V
CCA
V
≤300 mV; ∆V2= V
CCD
EED
V
≤300 mV with V
EEA
= SUB (latch-up prevention).
EED
2. This frequency response includes the si-attenuation as a result of the time discrete signal processing. An si-correction is not performed.
1995 Oct 05 13
Page 14
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
APPLICATION INFORMATION
ok, full pagewidth
+ 5 V
47 µF
ferrit
pearl
video signal
2.2 nF
inputs
V
EEA
100
2.2
nF
nF
24 23 22 21 20 19 18 17 16 15 14 13
2.2 nF
2.2
10 nF 47 µF
10 nF 47 µF
10 nF
V
EEA
video signal
outputs
CLAOUT
SAA4981
1234567 89101112
100nF100
100
nF
V
EEAVEEAVEEA
(2)
nF
V
EED
clamp reference
voltage output
V
EED
line reference
input
V
10 nF
10 nF
47 µF
EEA
+ 5 V
2.2
5.6 15 ferrit
pearl
control inputs
see Table 1
MHA280
(1)
V
EED
(1) Connected to CLAOUT for black side panels. (2) Substrate (pin 4) has to be connected to V
EED
. V
EEA
and V
. Substrates have to be separated as much as possible.
EED
Fig.5 Application diagram.
1995 Oct 05 14
Page 15
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
PACKAGE OUTLINES
DIP24: plastic dual in-line package; 24 leads (600 mil)
D
seating plane
L
Z
24
pin 1 index
e
b
SOT101-1
M
E
A
2
A
A
1
w M
b
1
13
E
c
(e )
1
M
H
1
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT101-1
1 2
min.
max.
1.7
1.3
0.066
0.051
IEC JEDEC EIAJ
051G02 MO-015AD
b
b
1
0.53
0.38
0.021
0.015
0.32
0.23
0.013
0.009
REFERENCES
cD E e M
32.0
31.4
1.26
1.24
1995 Oct 05 15
12
14.1
13.7
0.56
0.54
(1)(1)
e
L
3.9
3.4
EUROPEAN
PROJECTION
M
15.80
15.24
0.62
0.60
E
17.15
15.90
0.68
0.63
1
0.15
0.13
H
ISSUE DATE
w
0.252.54 15.24
0.010.10 0.60
92-11-17 95-01-23
Z
max.
2.25.1 0.51 4.0
0.0870.20 0.020 0.16
(1)
Page 16
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
SO24: plastic small outline package; 24 leads; body width 7.5 mm
D
c
y
Z
24
pin 1 index
1
e
13
12
w
b
p
M
SOT137-1
E
H
E
Q
A
2
A
1
L
p
L
detail X
(A )
A
X
v
M
A
A
3
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
mm
inches
A
max.
2.65
0.10
A1A2A
0.30
2.45
0.10
2.25
0.012
0.096
0.004
0.089
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
(1)E(1) (1)
cD
15.6
7.6
7.4
0.30
0.29
1.27
0.050
15.2
0.61
0.60
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT137-1
IEC JEDEC EIAJ
075E05 MS-013AD
REFERENCES
1995 Oct 05 16
eHELLpQ
10.65
10.00
0.42
0.39
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.25 0.1
0.01
0.01
EUROPEAN
ywv θ
Z
0.9
0.4
0.035
0.004
0.016
ISSUE DATE
92-11-17 95-01-24
o
8
o
0
Page 17
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
DIP
OLDERING BY DIPPING OR BY WA VE
S
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
EPAIRING SOLDERED JOINTS
R Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING Reflow soldering techniques are suitable for all SO
packages.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
AVE SOLDERING
W Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
1995 Oct 05 17
Page 18
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Oct 05 18
Page 19
Philips Semiconductors Preliminary specification
Monolithic integrated 16 : 9 compressor SAA4981
NOTES
1995 Oct 05 19
Page 20
Philips Semiconductors – a worldwide company
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BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
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Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
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Tel. 9-5(800)234-7381, Fax. (708)296-8556
th
floor, Suite 51,
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040)2783749, Fax. (040)2788399
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Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546
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Tel. (03)301 6312, Fax. (03)301 42 43
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Tel. (0)8-632 2000, Fax. (0)8-632 2745
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Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
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Tel. (0212)279 27 70, Fax. (0212)282 67 07
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Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825
SCD44 © Philips Electronics N.V. 1995 Oct 05
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/02/pp20 Date of release: 1995 Oct 05 Document order number: 9397 750 00346
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