Datasheet SAA4974H-V1 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated Circuits, IC02

1998 Apr 21

INTEGRATED CIRCUITS

SAA4974H

Besic without ADC

1998 Apr 21 2

Philips Semiconductors Product specification

Besic without ADC SAA4974H

CONTENTS

1 FEATURES
2 GENERAL DESCRIPTION
3 QUICK REFERENCE DATA
4 ORDERING INFORMATION
5 BLOCK DIAGRAM
6 PINNING INFORMATION

6.1 Pinning

6.2 Pin description
7 FUNCTIONAL DESCRIPTION

7.1 Digital processing at 2fH level

7.1.1 4:1:1 to 4:2:2 up-conversion

7.1.2 DCTI

7.1.3 Y-peaking

7.1.4 Y-delay

7.1.5 Sidepanels and blanking

7.2 Digital-to-analog conversion

7.3 Microprocessor

7.3.1 I2C-bus

7.3.2 SNERT-bus

7.3.3 I/O-ports

7.3.4 Watchdog timer

7.4 Memory controller

7.4.1 WE

7.4.2 RSTW

7.4.3 RE

7.4.4 IE2

7.4.5 HDFL

7.4.6 VDFL

7.4.7 BLND

7.5 Clock and sync interfacing

7.6 4:1:1 digital input interfacing

7.7 Test mode operation

7.8 I2C-bus control registers
8 LIMITING VALUES
9 THERMAL CHARACTERISTICS
10 CHARACTERISTICS
11 APPLICATION
12 PACKAGE OUTLINE
13 SOLDERING

13.1 Introduction

13.2 Reflow soldering

13.3 Wave soldering

13.4 Repairing soldered joints
14 DEFINITIONS
15 LIFE SUPPORT APPLICATIONS
16 PURCHASE OF PHILIPS I2C COMPONENTS

1998 Apr 21 3

Philips Semiconductors Product specification

Besic without ADC SAA4974H

1 FEATURES

• Field rate up-conversion (50 to 100 Hz or 60 to 120 Hz)

• 4:1:1 digital input

• Digital Colour Transient Improvement (DCTI)

• Digital luminance peaking

• Triple 10-bit Digital-to-Analog Converter (DAC)

• Memory controller

• Embedded microprocessor

• 16 kbyte ROM

• 256 byte RAM

• I

2

C-bus interface

• Synchronous No parity Eight bit Reception and
Transmission (SNERT) interface.

2 GENERAL DESCRIPTION

The SAA4974H is a video processing IC providing a digital
YUV 4:1:1 input interface, analog YUV output, video
enhancing features, memory controlling and an embedded
80C51 microprocessor core. It is applicable especially for
field rate up-conversion (50 to 100 Hz or 60 to 120 Hz) in
cooperation with a 2.9 Mbit field memory. It is designed for
applications together with:

SAA7111A, VPC3200 (video decoder)
SAA4955/56TJ, TMS4C2972/73 (serial field memories)
SAA4990H (PROZONIC)
SAA4991WP (MELZONIC).

3 QUICK REFERENCE DATA

4 ORDERING INFORMATION

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DDA(1,2)

analog supply voltage 3.15 3.3 3.45 V

V

DDD(1,2,3)

digital supply voltage 3.0 3.3 3.6 V

V

DDIO(1,2,3)

I/O supply voltage 4.5 5.0 5.5 V

I

DDA(1,2)

analog supply current − 25 40 mA

I

DDD(1,2,3)

digital supply current − 50 70 mA

I

DDIO(1,2,3)

I/O supply current − 10 20 mA

P

tot

total power dissipation −−0.5 W

T

amb

operating ambient temperature −20 − +70 °C

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

SAA4974H QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm);

body 14 × 20 × 2.8 mm

SOT318-2

1998 Apr 21 4

Philips Semiconductors Product specification

Besic without ADC SAA4974H

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5 BLOCK DIAGRAM

o

ok, full pagewidth

MGM687

SAA4974H

VARIABLE

Y-DELAY

REFORMATTER

UP-CONVERSION

4 : 1 : 1

TO

4 : 2 : 2

Y-PEAKING

DCTI

UP-CONVERSION

4 : 2 : 2

TO

4 : 4 : 4

BLANKING

SIDEPANELS

OVERLAY

RAM

MICROPROCESSOR

I2C­BUS

SNERT-

BUS

I/O

PORT

ROM

YOUT

79

UOUT

76

VOUT

74

4

8

CONTROL

INTERFACE

MEMORY CONTROL

(DISPLAY)

3 to 7
5

10 2

P1.5

to

P1.1

SNRST

13

SNCL

12

SNDA

68 9

HRD

71

HDFL

72

VDFL

66

BLND

63RE64

IE2

70

LLD

CONTROL

INTERFACE

MEMORY CONTROL

(ACQUISITION)

24

RSTW

32

WE

47

SWC

33

LLA

22HA20

VA

TEST

CONTROL

BLOCK

15

30

TMS

49

TRST

ANATEST

59 to 62

UVI7 to UVI4

51 to 58

YI7 to YI0

SCL

1

SDA

RST

TRIPLE

10-BIT DAC

Fig.1 Block diagram.

1998 Apr 21 5

Philips Semiconductors Product specification

Besic without ADC SAA4974H

6 PINNING INFORMATION

6.1 Pinning

Fig.2 Pin configuration.

handbook, full pagewidth

SAA4974H

MGM688

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15
16
17
18
19
20

60
59
58
57
56

64
63
62
61

55
54
53
52
51
50
49
48
47
46
45
44
43
42
41

UVI6
UVI7
YI0
YI1
YI2

IE2
RE
UVI4

UVI5

YI3
YI4
YI5
YI6

YI7

V

SSD3

V

SSIO2
SWC
V

DDIO2
n.c.

n.c.
n.c.
n.c.
n.c.

P1.3
P1.2
P1.1

V

DDD1

RST

SDA

SCL
P1.5
P1.4

SNRST
V

DDD2
SNDA

SNCL

V

SSD1

TMS

V

SSIO1

n.c.

V

DDIO1

n.c.

VA

V

SSD2

HA

n.c.

RSTW

21
22
23
24

25

26

27

28

29

30

31

n.c.

n.c.

n.c.

n.c.

32

33

34

35

36

37

38

39

40

n.c.

n.c.

ANATEST

WE

LLA

n.c.

n.c.

n.c.

n.c.

n.c.

n.c.

n.c.

V

DDA2

YOUT

V

SSA3

V

SSA2

UOUT

V

DDA1

VOUT

V

SSA1

VDFL

HDFL

LLD

V

DDD3

HRD

V

DDIO3

BLND

V

SSIO3

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

TRST

1998 Apr 21 6

Philips Semiconductors Product specification

Besic without ADC SAA4974H

6.2 Pin description
Table 1 SOT318-2 package

SYMBOL PIN DESCRIPTION

SDA 1 I

2

C-bus serial data (P 1.7)

SCL 2 I

2

C-bus serial clock (P 1.6)
P1.5 3 Port 1 data input/output signal 5
P1.4 4 Port 1 data input/output signal 4
P1.3 5 Port 1 data input/output signal 3
P1.2 6 Port 1 data input/output signal 2
P1.1 7 Port 1 data input/output signal 1
V

DDD1

8 digital supply voltage 1 (3.3 V)
RST 9 microprocessor reset input
SNRST 10 SNERT restart (port 1.0)
V

DDD2

11 digital supply voltage 2 (3.3 V)
SNDA 12 SNERT data
SNCL 13 SNERT clock
V

SSD1

14 digital ground 1
TMS 15 test mode select
V

SSIO1

16 I/O ground 1
n.c. 17 not connected
V

DDIO1

18 I/O supply voltage 1 (5 V)
n.c. 19 not connected
VA 20 vertical synchronization input, acquisition part
V

SSD2

21 digital ground 2
HA 22 digital horizontal reference input
n.c. 23 not connected
RSTW 24 reset write signal output, memory 1
n.c. 25 not connected
n.c. 26 not connected
n.c. 27 not connected
n.c. 28 not connected
n.c. 29 not connected
ANATEST 30 analog test input
n.c. 31 not connected
WE 32 write enable signal output, memory 1
LLA 33 acquisition clock input
n.c. 34 not connected
n.c. 35 not connected
n.c. 36 not connected
n.c. 37 not connected
n.c. 38 not connected

1998 Apr 21 7

Philips Semiconductors Product specification

Besic without ADC SAA4974H

n.c. 39 not connected
n.c. 40 not connected
n.c. 41 not connected
n.c. 42 not connected
n.c. 43 not connected
n.c. 44 not connected
n.c. 45 not connected
V

DDIO2

46 I/O supply voltage 2 (5 V)
SWC 47 serial write clock output
V

SSIO2

48 I/O ground 2
TRST 49 test reset, LOW active
V

SSD3

50 digital ground 3
YI7 51 Y digital input bit 7 (MSB)
YI6 52 Y digital input bit 6
YI5 53 Y digital input bit 5
YI4 54 Y digital input bit 4
YI3 55 Y digital input bit 3
YI2 56 Y digital input bit 2
YI1 57 Y digital input bit 1
YI0 58 Y digital input bit 0
UVI7 59 U digital input bit 1
UVI6 60 U digital input bit 0
UVI5 61 V digital input bit 1
UVI4 62 V digital input bit 0
RE 63 read enable signal output, memory 1
IE2 64 input enable signal output, memory 2
V

SSIO3

65 I/O ground 3
BLND 66 horizontal blanking signal output, display part
V

DDIO3

67 I/O supply voltage 3 (5 V)
HRD 68 horizontal reference signal output, deflection part
V

DDD3

69 digital supply voltage 3 (3.3 V)
LLD 70 display clock input
HDFL 71 horizontal synchronization signal output, deflection part
VDFL 72 vertical synchronization signal output, deflection part
V

SSA1

73 analog ground 1
VOUT 74 V analog output
V

DDA1

75 analog supply voltage 1 (3.3 V)
UOUT 76 U analog output
V

SSA2

77 analog ground 2

SYMBOL PIN DESCRIPTION

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Philips Semiconductors Product specification

Besic without ADC SAA4974H

V

SSA3

78 analog ground 3
YOUT 79 Y analog output
V

DDA2

80 analog supply voltage 2 (3.3 V)

SYMBOL PIN DESCRIPTION

7 FUNCTIONAL DESCRIPTION

7.1 Digital processing at 2f

H

level

7.1.1 4:1:1

TO 4:2:2UP-CONVERSION

An up-converter to 4:2:2 is applied with a linear
interpolation filter for creation of the extra samples. These
are combined with the original samples from the 4 :1:1
stream.

7.1.2 DCTI
The Digital Colour Transient Improvement (DCTI) is

intended for U and V signals originating from a 4:1:1
source. Horizontal transients are detected and enhanced
without overshoots by differentiating, make absolute and
again differentiating the U and V signals separately. This
results in a 4:4:4 UandV bandwidth. To prevent third
harmonic distortion, typical for this processing, a so called
over the hill protection prevents peak signals to become
distorted.

Via I

2

C-bus it is possible to control: gain width (see Fig.4),
threshold (i.e. immunity against noise), selection of simple
or improved first differentiating filter (see Fig.3), limit for
pixel shift range (see Fig.5), common or separate
processing of U and V signals, hill protection mode (i.e. no
discolourations in narrow colour gaps), low-pass filtering
for U and V signals (see Fig.6) and a so called super hill
mode, which avoids discolourations in transients within a
colour component.

1998 Apr 21 9

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Fig.3 DCTI first differentiating filter; transfer function with variation of control signal dcti_ddx_sel.

(1) dcti_ddx_sel = 1.
(2) dcti_ddx_sel = 0.

handbook, halfpage

0 0.25

1

0

0.2

MGM689

signal

amplitude

f/f

s

0.4

0.6

0.8

0.05 0.1 0.15 0.2

(2)(1)

Fig.4 DCTI with variation of gain setting (limit = 1).

handbook, full pagewidth

MGM690

digital
signal

amplitude

samples

(1)

(5)

(4)

(3)

(2)

500

−100

−200

300

400

−300

200

−400

100

0

−500

(1) Input signal.
(2) Gain = 1.
(3) Gain = 3.
(4) Gain = 5.
(5) Gain = 7.

1998 Apr 21 10

Philips Semiconductors Product specification

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Fig.5 DCTI with variation of limit setting (gain = 7).

handbook, full pagewidth

MGM691

digital
signal

amplitude

samples

(1)

(4)

(3)

(2)

500

−100

−200

300

400

−300

200

−400

100

0

−500

(1) Input signal.
(2) Limit = 1.
(3) Limit = 2.
(4) Limit = 3.

Fig.6 DCTI post-filter transfer function.

handbook, halfpage

0 0.5

1.2

0

0.4

0.8

MGM692

0.1 0.2 0.3 0.4

signal

amplitude

f/f

s

1998 Apr 21 11

Philips Semiconductors Product specification

Besic without ADC SAA4974H

7.1.3 Y-PEAKING
A linear peaking is applied, which amplifies the luminance

signal in the middle and the upper ranges of the
bandwidth.

The filtering is an addition of:

• The original signal

• The original signal band-passed with centre

frequency =1⁄4f

s

• The original signal high-passed with maximum gain at
frequency =1⁄2fs.

The band-passed and high-passed signals are weighted
with factors 0,

1

⁄8,1⁄4 and1⁄2. The impulse response

becomes [−α, −β, 1 + 2α +2β,−β, −α], where α is the
band-pass weighting factor and β the high-pass weighting
factor.

Coring is added to obtain no gain for low amplitudes in the
(high-pass + band-pass) signal, which is then considered
to be noise. Coring levels can be programmed as 0 (off),
+1/−2, +3/−4 and +7/−8 LSB at 8-bit word.

Fig.7 Peaking transfer function with variation of β

(α =1⁄8).

(1) β =1⁄2.
(2) β =1⁄4.
(3) β =1⁄8.
(4) β =0.

handbook, halfpage

0

0

2

4

6

8

10

12

1/4f

s

1/2f

s

MGE097

IH_PeakingI

(dB)

(1)

(2)

(3)

(4)

Fig.8 Peaking transfer function with variation of β

(α =1⁄4).

(1) β =1⁄2.
(2) β =1⁄4.
(3) β =1⁄8.
(4) β =0.

handbook, halfpage

0

0

2

4

6

8

10

12

1/4f

s

1/2f

s

MGE098

IH_PeakingI

(dB)

(1)

(2)
(3)

(4)

1998 Apr 21 12

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Fig.9 Peaking transfer function with variation of β

(α =1⁄2).

(1) β =1⁄2.
(2) β =1⁄4.
(3) β =1⁄8.
(4) β =0.

handbook, halfpage

0

0

2

4

6

8

10

12

14

16

1/4f

s

1/2f

s

MGE099

IH_PeakingI

(dB)

(1)

(2)
(3)

(4)

Fig.10 Peaking transfer function with variation of β

(α = 0).

(1) β =1⁄2.
(2) β =1⁄4.
(3) β =1⁄8.

handbook, halfpage

0

0

2

4

6

8

10

12

1/4f

s

1/2f

s

MGE100

IH_PeakingI

(dB)

(1)

(2)

(3)

7.1.4 Y-DELAY

The Y samples can be shifted onto 8 positions with
reference to the UV samples. This shift is meant to account
for a possible difference in delay previous to the
SAA4974H. The zero delay setting is suitable for the
nominal case of aligned input data according to the
interface format standard. The other settings provide one
to seven samples less delay in Y.

7.1.5 S

IDEPANELS AND BLANKING

Sidepanels are generated by switching Y and the 4 MSB
of U and V to certain programmable values. The start and
stop values for the sidepanels with reference to the rising
edge of the HRD signal are programmable in a resolution
of 4 LLD clock cycles. In addition a fine shift of 0 to 3 LLD
clock cycles of both values can be achieved.

Blanking is done by switching Y to value 64 at 10-bit word
and UV to value 0 (in twos complement). Blanking is
controlled by a composite signal HVBDA, existing of a
horizontal part HBDA and a vertical part VBDA. Set and
reset value of the horizontal control signal HBDA are
programmable with reference to the rising edge of the
HRD signal, set and reset value of the vertical control

signal VBDA are programmable with reference to the
rising edge of the VA signal.

The range of the Y output signal can be selected between
9 and 10 bits. In case of 9 bits for the nominal signal there
is room left for under and overshoot (adding up to a total of
10 bits). In case of selecting all 10 bits of the luminance
Digital-to-Analog Converter (DAC) for the nominal signal
any under or overshoot will be clipped. In case of selecting
9 bits of the luminance DAC for the nominal signal under
or overshoots are limited within a programmable range
(see Fig.12).

7.2 Digital-to-analog conversion

Three identical 10-bit DACs are used to map the 4 : 4 : 4
data to analog levels.

7.3 Microprocessor

The SAA4974H contains an embedded
80C51 microprocessor core including 256 byte RAM and
16 kbyte ROM. The microprocessor runs on a 16 MHz
clock, generated by dividing the 32 MHz display clock by a
factor of 2. For controlling internal registers a host
interface, consisting of a parallel address and data bus, is

1998 Apr 21 13

Philips Semiconductors Product specification

Besic without ADC SAA4974H

built in, that can be addressed as internal AUXRAM via
MOVX type of instruction.

7.3.1 I

2

C-BUS

The I2C-bus interface in the SAA4974H is used in a slave
receive and transmit mode for communication with in
general a central system microprocessor.
The standardized bus frequencies of both 100 kHz and
400 kHz can be dealt with.

The I2C-bus slave address of the SAA4974H is
0110100R/W.

For a detailed description of the transmission protocol
refer to brochure

“I2C-bus and how to use it”

(order number

9398 393 40011) and to Application Note

“I2C-bus register

specification of the SAA4974H”

(AN97042).

7.3.2 SNERT-

BUS

A SNERT interface is built in, which operates in a master
receive and transmit mode for communication with
peripheral circuits as SAA4990H or SAA4991WP.
The SNERT interface replaces the standard UART
interface. In contrary to the 8051 UART interface there are
additional special function registers and there is no byte
separation time between address and data.

The SNERT interface transforms the parallel data from the
microprocessor into 1 Mbaud SNERT data.
The SNERT-bus consists of three signals: SNCL used as
serial clock signal, generated by the SNERT interface;
SNDA used as bidirectional data line, and SNRST used as
reset signal, generated by the microprocessor to indicate
the start of a transmission.

The read or write operation must be set by the
microprocessor. In case of writing to the bus, 2 bytes are
loaded by the microprocessor: one for the address, the
other for the data. In case of reading from the bus, one
byte is loaded by the microprocessor for the address, the
received byte is the data from the addressed SNERT
location.

7.3.3 I/O-

PORTS

A parallel 8-bit I/O-port (P1) is available, where P1.0 is
used as SNERT reset signal (SNRST), P1.1 to P1.5 can
be used for application specific control signals, and
P1.6 and P1.7 are used as I2C-bus signals (SCL and
SDA).

7.3.4 W

ATCHDOG TIMER

The microprocessor contains an internal Watchdog timer,
which can be activated by setting the corresponding
special function register PCON.4. Only a synchronous
reset will clear this bit. To prevent a system reset the
watchdog timer must be reloaded in time. The Watchdog
timer is incremented every 0.75 ms. The time interval
between the timer’s reloading and the occurrence of a
reset depends on the reloaded 8-bit value.

7.4 Memory controller

The memory controller provides all necessary acquisition
clock related write signals (WE and RSTW) and display
clock related read signals (RE and IE2) to control one or
two-field memory concepts. Furthermore the drive signals
(HDFL and VDFL) for the horizontal and vertical deflection
power stages are generated. Also a horizontal blanking
pulse BLND is generated which can be used for peripheral
circuits as SAA4990H. The memory controller is
connected to the microprocessor via the host interface.
Start and stop values for all pulses, referring to the
corresponding horizontal or vertical reference signal, are
programmable under control of the internal software.
To allow an user access to these control signals via
I

2

C-bus a range of subaddresses is reserved; for a
detailed description of this user interface refer to
Application Note

“I2C-bus register specification of the

SAA4974H”

(AN97042).

7.4.1 WE
The write enable signal for field memory 1 is a composite

signal consisting of a horizontal and a vertical part.
The horizontal position with reference to the rising edge of
the HA signal and the vertical position with reference to the
rising edge of the VA signal are programmable.

7.4.2 RSTW
Reset write signal for field memory 1; this signal is derived

from the positive edge of the VA input signal and has a
pulse width of 64 µs.

7.4.3 RE
The read enable signal for field memory 1 is a composite

signal consisting of a horizontal and a vertical part.
The horizontal position with reference to the rising edge of
the HA signal and the vertical position with reference to the
rising edge of the VA signal are programmable.

1998 Apr 21 14

Philips Semiconductors Product specification

Besic without ADC SAA4974H

7.4.4 IE2
Input enable signal for field memory 2, can be directly set

or reset by the microprocessor.

7.4.5 HDFL
Horizontal deflection signal for driving an deflection circuit;

this signal has a cycle time of 32 µs and a pulse width of
76 LLD clock cycles.

7.4.6 VDFL
Vertical deflection signal for driving a deflection circuit; this

signal has a cycle time of 10 ms; start and stop value with
reference to the rising edge of the VA signal is
programmable in steps of 16 µs.

7.4.7 BLND
Horizontal blanking signal for peripheral circuits e.g.

SAA4990H, start and stop values with reference to the
rising edge of HRD are programmable.

7.5 Clock and sync interfacing

The line locked acquisition clock LLA and the line locked
display clock LLD must be provided by the application.
Also an acquisition clock synchronous line frequent signal
must be provided by the application at pin HA. A vertical
50 or 60 Hz synchronization signal has to be applied on
pin VA.

Typically the circuit operates as a two clock system, i.e.
LLA has to be supplied with a 16 MHz clock and LLD with
a 32 MHz clock. The circuit can also operate as a one
clock system, i.e. a 32 MHz line locked display clock has
to be provided to both pins LLA and LLD. In this case the
internal horizontal pixel counter is reset by the rising edge
of the HA input, and the corresponding control signal
en_hdsp_rst has to be set via the I

2

C-bus.

A display clock synchronous line frequent signal is put out
at pin HRD providing a duty factor of 50%. The rising edge
of HRD is also the reference for display related control
signals as BLND, RE, HDAV and HBDA.

The acquisition clock is buffered internally and put out as
serial write clock (SWC) for supplying the field memory.

7.6 4:1:1 digital input interfacing
Digital input bus format

The start position, when the first phase of the 4 :1:1 YUV
dataword is expected on the input bus, can be defined by
the internal control signal HDAV. The luminance input
signal is expected in 8-bit straight binary format, whereas
U and V input signals are expected in twos complement
format. U and V input signals are inverted if the
corresponding control bit uv_inv is set via the I

2

C-bus.

7.7 Test mode operation

The SAA4974H provides a test mode function which
should be avoided to be entered by the customer. If the
TRST input is driven to HIGH, different test modes can be
selected by applying HIGH to the TMS input for a defined
number of LLD clock cycles. Also the ANATEST input is
only active during test mode operation. To exit the test
mode TMS and TRST must be driven LOW.

4:1:1 FORMAT

INPUT

PIN

Y07 Y17 Y27 Y37 YI7
Y06 Y16 Y26 Y36 YI6
Y05 Y15 Y25 Y35 YI5
Y04 Y14 Y24 Y34 YI4
Y03 Y13 Y23 Y33 YI3
Y02 Y12 Y22 Y32 YI2
Y01 Y11 Y21 Y31 YI1
Y00 Y10 Y20 Y30 YI0
U07 U05 U03 U01 UVI7
U06 U04 U02 U00 UVI6
V07 V05 V03 V01 UVI5
V06 V04 V02 V00 UVI4

1998 Apr 21 15

Philips Semiconductors Product specification

Besic without ADC SAA4974H

7.8 I2C-bus control registers

Note

1. Detailed information about the software dependent I

2

C-bus registers can be found in Application Note

“I2C-bus

register specification of the SAA4974H”

(AN97042).

ADDRESS BIT NAME DESCRIPTION

Subaddress 00H to 35H: reserved; note 1
Subaddress 36H and 37H (DCTI)

36H 0 to 2 dcti_gain DCTI gain: 0, 1, 2, 3, 4, 5, 6 and 7

3 to 6 dcti_threshold DCTI threshold: 0 and 1 to 15
7 dcti_ddx_sel DCTI selection of first differentiating filter; see Fig.3

37H 0 and 1 dcti_limit DCTI limit for pixel shift range: 0, 1, 2 and 3

2 dcti_separate DCTI separate processing of U and V signals; 0 = off and 1 = on
3 dcti_protection DCTI over the hill protection; 0 = off and 1 = on
4 dcti_filteron DCTI post-filter; 0 = off and 1 = on
5 dcti_superhill DCTI super hill mode; 0 = off and 1 = on
6 and 7 − reserved

Subaddress 3AH and 3BH (sidepanels overlay)

3AH 0 to 3 overlay_u sidepanels overlay U (4 MSB)

4 to 7 overlay_v sidepanels overlay V (4 MSB)

3BH 0 to 7 overlay_y sidepanels overlay Y (8 MSB)

Subaddress 3CH (peaking)

3CH 0 and 1 peak_α peaking settings α: 0,

1

⁄8,1⁄4 and1⁄

2

2 and 3 peak_β peaking settings β: 0,1⁄8,1⁄4 and1⁄

2

4 and 5 peak_limit peaking limiter settings in display mode = 0:

(256/767, 171/852, 86/937 and 0/1023)

6 and 7 peak_coring peaking coring settings: 0, +1/−2, +3/−4 and +7/−8 LSB at 8-bit word

Subaddress 3DH to 3FH (sidepanel position)

3DH 0 to 7 sidepanel_start sidepanel start position (8 MSB) with reference to the rising edge of

HRD signal

3EH 0 to 7 sidepanel_stop sidepanel stop position (8 MSB) with reference to the rising edge of

HRD signal

3FH 0 and 1 sidepanel_fdel fine delay of sidepanel signal in LLD clock cycles: (0, 1, 2 and 3)

2 display_mode display mode (display mode = 0: 9-bit for the nominal output signal,

black level 288 and white level 767; display mode = 1: 10-bit for the nominal

output signal, black level 64 and white level 1023)
3 uv_inv inverts UV input signals: 0 = no inversion, 1 = inversion
4 to 6 ydelay_out variable Y-delay in LLD clock cycles: −7, −6, −5, −4, −3, −2, −1 and 0
7 en_hdsp_rst enable hdsp reset: 0 = disable and 1 = enable

1998 Apr 21 16

Philips Semiconductors Product specification

Besic without ADC SAA4974H

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

9 THERMAL CHARACTERISTICS

SYMBOL PARAMETER MIN. MAX. UNIT

V

DDA(1,2)

analog supply voltage −0.5 +3.45 V

V

DDD(1,2,3)

digital supply voltage −0.5 +3.6 V

V

DDIO(1,2,3)

digital I/O supply voltage −0.5 +5.5 V

V

i

input voltage for all I/O pins −0.5 +5.5 V

T

stg

storage temperature −20 +150 °C

T

amb

operating ambient temperature −20 +70 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 53 K/W

1998 Apr 21 17

Philips Semiconductors Product specification

Besic without ADC SAA4974H

10 CHARACTERISTICS

V

DDD

= 3.0 to 3.6 V; V

DDA

= 3.15 to 3.45 V; T

amb

=0to70°C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DDA(1,2)

analog supply voltage 3.15 3.3 3.45 V

V

DDD(1,2,3)

digital supply voltage 3.0 3.3 3.6 V

V

DDIO(1,2,3)

I/O supply voltage 4.5 5.0 5.5 V

I

DDA(1,2)

analog supply current − 25 40 mA

I

DDD(1,2,3)

digital supply current − 50 70 mA

I

DDIO(1,2,3)

I/O supply current − 10 20 mA

Dissipation

P

tot

total power dissipation −−0.5 W

Luminance output signal (display_mode = 0: Y black level digital 288, white level digital 767;
display_mode = 1: Y black level digital 64, white level digital 1023); see Fig.12

V

o(p-p)

Y output level
(peak-to-peak value)

ZL=2kΩ 1.28 1.34 1.40 V

R

o

output resistance − 50 100 Ω

R

L

resistive load 1 2 − kΩ

C

L

capacitive load −−25 pF

SVR supply voltage rejection note 1 34 −− dB

α

ct

crosstalk attenuation between
outputs

0 to 10 MHz 40 −− dB

S/N signal-to-noise ratio nominal amplitude;

0to10MHz

46 −− dB

Colour difference output signals (U and V digital range 0 to 1023)

V

o(p-p)

U output level
(peak-to-peak value)

ZL=2kΩ 1.28 1.34 1.40 V

V output level
(peak-to-peak value)

Z

L

=2kΩ 1.28 1.34 1.40 V

G

m(U-V)

gain matching U to V − 13 %

R

o

output resistance − 50 100 Ω

R

L

resistive load 1 2 − kΩ

C

L

capacitive load −−25 pF

SVR supply voltage rejection note 1 34 −− dB

α

ct

crosstalk attenuation between
outputs

0 to 10 MHz 40 −− dB

S/N signal-to-noise ratio nominal amplitude;

0to10MHz

46 −− dB

Output transfer function (sample rate 32 MHz/10 bits)

INL integral non linearity −2 − +2 LSB
DNL differential non linearity −1 − +1 LSB

1998 Apr 21 18

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Digital output signals: WE and RSTW (CL= 15 pF); timing referred to SWC clock

V

OH

HIGH-level output voltage IOH= −2.0 mA 2.4 −− V

V

OL

LOW-level output voltage IOL= 1.6 mA −−0.4 V

t

d(o)

output delay time see Fig.11 −−20 ns

t

h(o)

output hold time see Fig.11 4 −− ns

Digital output signal: SWC (C

L

= 15 pF); timing referred to LLA clock

V

OH

HIGH-level output voltage IOH= −2.0 mA 2.4 −− V

V

OL

LOW-level output voltage IOL= 1.6 mA −−0.4 V

t

d(o)

output delay time see Fig.11 3 − 12 ns

Digital output signals: IE2, BLND, RE, HDFL and VDFL (C

L

= 15 pF); timing referred to LLD clock

V

OH

HIGH-level output voltage IOH= −2.0 mA 2.4 −− V

V

OL

LOW-level output voltage IOL= 1.6 mA −−0.4 V

t

d(o)

output delay time see Fig.11 −−20 ns

t

h(o)

output hold time see Fig.11 4 −− ns

Digital output signal: HRD

V

OH

HIGH-level output voltage IOH= −2.0 mA 2.4 −− V

V

OL

LOW-level output voltage IOL= 1.6 mA −−0.4 V

Digital input/output signals: P1.1 to P1.5 and SNRST

V

OH

HIGH-level output voltage IOH= −0.06 mA 2.4 −− V

V

OL

LOW-level output voltage IOL= 1.6 mA 0 − 0.45 V

V

IH

HIGH-level input voltage 2.0 − 5.5 V

V

IL

LOW-level input voltage 0 − 0.8 V

Digital input signals: YI and UVI; timing referred to LLD clock

V

IH

HIGH-level input voltage 2.0 − 5.5 V

V

IL

LOW-level input voltage −−0.8 V

t

su(i)

input set-up time see Fig.11 4 −− ns

t

h(i)

input hold time see Fig.11 3 −− ns

Digital input signal: HA; timing referred to LLA clock

V

IH

HIGH-level input voltage 2.0 − 5.5 V

V

IL

LOW-level input voltage −−0.8 V

t

su(i)

input set-up time see Fig.11 7 −− ns

t

h(i)

input hold time see Fig.11 4 −− ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Apr 21 19

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Digital input signals: TRST, TMS, RST and VA

V

IH

HIGH-level input voltage 2.0 − 5.5 V

V

IL

LOW-level input voltage −−0.8 V

Digital input clock signal: LLA

f

LLA

sample clock frequency 14 16 34 MHz

δ

clk

clock duty factor 40 50 60 %

V

IH

HIGH-level input voltage 2.4 −− V

V

IL

LOW-level input voltage −−0.6 V

t

r

clock rise time see Fig.11 −−5ns

t

f

clock fall time see Fig.11 −−5ns

Digital input clock signal: LLD

f

LLD

sample clock frequency 30 32 34 MHz

δ

clk

clock duty factor 40 50 60 %

V

IH

HIGH-level input voltage 2.4 −− V

V

IL

LOW-level input voltage −−0.6 V

t

r

clock rise time see Fig.11 −−5ns

t

f

clock fall time see Fig.11 −−5ns

I

2

C-bus signal: SDA and SCL; note 2

V

IH

HIGH-level input voltage 0.7V

DDIO

−− V

V

IL

LOW-level input voltage −−0.3V

DDIO

V

V

OL

LOW-level output voltage 3 mA sink current −−0.4 V

f

SCL

SCL clock frequency −−400 kHz

t

HD;STA

hold time START condition 0.6 −− µs

t

LOW

SCL LOW time 1.3 −− µs

t

HIGH

SCL HIGH time 0.6 −− µs

t

SU;DAT

data set-up time 100 −− ns

t

SU;DAT1

data set-up time (before
repeated START condition)

0.6 −− µs

t

SU;DAT2

data set-up time (before STOP
condition)

0.6 −− µs

t

SU;STA

set-up time repeated START 0.6 −− µs

t

SU;STO

set-up time STOP condition 0.6 −− µs

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1998 Apr 21 20

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Notes

1. Supply voltage ripple rejection, measured over a frequency range from 20 Hz to 50 kHz. This includes1⁄2fV, fV, 2fV,
fH and 2fH which are major load frequencies: SVR is relative variation of the full scale analog input for a supply
variation of 0.25 V.

2. The AC characteristics are in accordance with the I2C-bus specification for fast mode (clock frequency maximum
400 kHz). Information about the I2C-bus can be found in brochure

“I2C-bus and how to use it”

(order number

9398 393 40011).

3. More information about the SNERT-bus protocol can be found in Application Note

“The SNERT-bus specification”

(AN95127).

SNERT-bus: SNDA and SNCL; note 3
V

OH

HIGH-level output voltage IOH= −2.0 mA 2.4 −− V

V

OL

LOW-level output voltage IOL= 1.6 mA −−0.4 V

V

IH

HIGH-level input voltage 2.0 − 5.5 V

V

IL

LOW-level input voltage −−0.8 V

t

su(i)

input set-up time 700 −− ns

t

h(i)

input hold time 0 −− ns

t

cycle

SNCL cycle time − 1 −µs

t

h(o)

output hold time 50 −− ns

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Fig.11 Timing diagram.

handbook, full pagewidth

MGM597

CLOCK

2.4 V

1.5 V

0.6 V

2.0 V

0.8 V

2.4 V

0.4 V

INPUT

DATA

OUTPUT

DATA

t

h(o)

t

d(o)

t

r

t

f

t

su(i)

t

h(i)

1998 Apr 21 21

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Fig.12 Luminance levels.

handbook, full pagewidth

black 16

white 255

8-BIT INPUT 10-BIT OUTPUT

display_mode = 1 display_mode = 0

00

64

1023 1023

0

256

288

767

1.34 V

peak_limit = 3

peak_limit = 2

peak_limit = 1

peak_limit = 0

MGM693

852

171
86

937

11 APPLICATION

The SAA4974H supports two different up-converter
concepts. The simple one is shown in Fig.13. In this
application only one field memory SAA4955TJ is needed
for a 100 Hz conversion based on a field repetition
algorithm (AABB mode). The concept can be upgraded by
a noise reduction based on a motion adaptive field
recursive filter if the SAA4956TJ is used instead of the
SAA4955TJ.

The SAA4974H supports a dual-clock system.
The acquisition clock is taken from the digital front-end.
The display control is based on a clock generated by an
external H-PLL. By this structure the stability of the display
is enhanced compared to a one-clock system if an
unstable source like a VCR is used as an input.
For low-cost applications it is possible to run the IC as a
one-clock system.

The second system supported by the SAA4974H is shown
in Fig.14. This concept needs two field memories
(SAA4955TJ) and the signal processing IC MELZONIC
(SAA4991WP). The SAA4991WP allows a vector based
motion estimation and compensation for a display of
100 Hz pictures in high-end TV sets which is free of motion
artefacts. It additionally provides a variable vertical zoom
function, noise and cross colour reduction. Furthermore a
multi-PIP feature is supported making use of the field
memories.

1998 Apr 21 22

Philips Semiconductors Product specification

Besic without ADC SAA4974H

Fig.13 Application diagram 1.

(1) Alternatively SAA4956TJ.

handbook, full pagewidth

MGM694

DISPLAY

PLL

SAA4955TJ

(1)

SAA4974H

LLA

19, 22

+3.3 V

20, 21, 23

+5 V

8, 11, 69,

75, 80

+3.3 V

18, 46, 67

14 to 16,

21, 30,

48 to 50,

65, 73,

77, 78

1, 2, 39, 40

n.c.

17, 19, 23,

25 to 29,

31, 34 to 45

+5 V

9

3
4
5
6
7
8
9
10
11
12
13

10, 12, 13

3 to 7

64, 66

1
2

71
72

n.c.
n.c.
n.c.

79
76
74

YOUT
UOUT
VOUT

SDA
SCL

SRC

HDFL
VDFL

70

15
16

17, 18

38
37
36
35
34
33
32
31
30
29
28
27

HA

VA

UVIN7 to UVIN4

YIN7 to YIN0

24

14

24

47

32

33

51
52
53
54
55
56
57
58
59
60
61

25

62

26

63

RSTW

SWC

WE

HRD

RE

20
22

68

10 µF

8.2 kΩ

1998 Apr 21 23

Philips Semiconductors Product specification

Besic without ADC SAA4974H

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

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Fig.14 Application diagram 2.

handbook, full pagewidth

MGM695

DISPLAY

PLL

SAA4991WP

SAA4974H

LLA

1, 2, 39, 40

2, 3, 5, 6, 7,

22, 26, 27, 39,

47, 60, 63,

79 to 84

1, 4, 20, 42,

46, 65, 78

+5 V

8, 11, 69,

75, 80

+3.3 V

18, 46, 67

14 to 16,

21, 30,

48 to 50,

65, 73,

77, 78

n.c.

n.c.

17, 19,

23, 31,
25 to 29,
34 to 45

+5 V

9

41
40
38
37
36
35
34

79
76
74

1
2

71
72

YOUT
UOUT
VOUT

10
3 to 7
64, 66

n.c.
n.c.
n.c.

SDA
SCL

SRC

HDFL
VDFL

70

48
49
50
51
52
53
54
55
56
57
58
59

HA

VA

61

24

47

32

33

51
52
53
54
55
56
57
58
59
60
61
62
63

RSTW

SWC

WE

HRD

RE

44
43

8 to 10

12
13

SNCL

SNDA

SAA4955TJ

FM1

19, 22

+3.3 V

20, 21, 23

+5 V

3
4
5
6
7
8
9
10

11
12
13

15
16

17, 18

38
37
36
35
34
33
32
31
30
29
28
27
24

14

25
26

RE1

WE2

1, 2, 39, 40

64
66
67
68
69
70
71
72
73
74

76

33
32
31
30

28

29

11

75

77

SAA4955TJ

FM2

19, 22

62 45

+3.3 V

20, 21, 23

+5 V

3
4
5
6
7
8
9
10
11
12
13

15
16

17, 18

38
37
36
35
34
33
32
31
30
29
28
27

D11

D10

D9
D8
D7
D6
D5
D4
D3
D2
D1
D0

D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0

24

25
24
23
21
19
18
17
16
15
14
13
12

14

25
26

RE2

20
22

68

10 µF

8.2 kΩ

UVIN7 to

UVIN4

YIN7 to

YIN0

1998 Apr 21 24

Philips Semiconductors Product specification

Besic without ADC SAA4974H

12 PACKAGE OUTLINE

UNIT A1A2A3b

p

cE

(1)

eH

E

LL

p

Zywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

0.25

0.05

2.90

2.65

0.25

0.45

0.30

0.25

0.14

14.1

13.9

0.8 1.95

18.2

17.6

1.2

0.8

7
0

o
o

0.20.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.6

SOT318-2

D

(1) (1)(1)

20.1

19.9

H

D

24.2

23.6

E

Z

1.0

0.6

D

b

p

e

θ

E

A

1

A

L

p

detail X

L

(A )

3

B

24

c

b

p

E

H

A

2

D

Z

D

A

Z

E

e

v M

A

1

80

65

64 41

40

25

pin 1 index

X

y

D

H

v M

B

w M

w M

95-02-04
97-08-01

0 5 10 mm

scale

QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm

SOT318-2

A

max.

3.2

1998 Apr 21 25

Philips Semiconductors Product specification

Besic without ADC SAA4974H

13 SOLDERING

13.1 Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

13.2 Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For details,
refer to the Drypack information in the

“Data Handbook
IC26; Integrated Circuit Packages; Section: Packing
Methods”

.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 °C.

13.3 Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

CAUTION

Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.

If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

13.4 Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Apr 21 26

Philips Semiconductors Product specification

Besic without ADC SAA4974H

14 DEFINITIONS

15 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

16 PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1998 Apr 21 27

Philips Semiconductors Product specification

Besic without ADC SAA4974H

NOTES

Internet: http://www.semiconductors.philips.com

Philips Semiconductors – a worldwide company

© Philips Electronics N.V. 1998 SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Printed in The Netherlands 545104/00/01/pp28 Date of release: 1998 Apr 21 Document order number: 9397 750 03018