Preliminary specification
File under Integrated Circuits, IC02
March 1991
Page 2
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
FEATURES
• Adaptive sync slicer with buffered composite sync
output VCS
• Adaptive data slicer
• Data rate clock regenerator
• Field selection and line 16 decoding
• Startcode and biphase check
• Data valid output
• Storage of data line information in a 40 bit register bank
• I2C-bus transmission
GENERAL DESCRIPTION
The SAA4700T is a bipolar integrated circuit designed for
use in dataline receivers and incorporates a dataline slicer
and decoder. The slicer extracts the dataline signal from
the video signal and regenerates the data clock. It also
provides signals for the decoder in order to decode the
binary data that is transmitted in line 16 of every first field
of the composite video signal (video programming signal
and video recording programming by Teletext, VPS and
VPT systems). The decoded information out of words 5
and 11 to 14 is accessed via the built-in I2C-bus interface.
This information then can be used for programming a
video cassette recorder in order to start and stop a
recording of a television program at the correct aligned
time, regardless of a delay or extension in the transmission
time of the required program.
QUICK REFERENCE DATA
SYMBOLPARAMETERMIN.TYP.MAX.UNIT
V
P
I
P
V
i CVBS
supply voltage (pins 17 and 18)4.555.5V
total supply current−1823mA
CVBS input signal sync-to-white
0.511.4V
(peak-to-peak value)
T
amb
operating ambient temperature0−+70°C
ORDERING AND PACKAGE INFORMATION
EXTENDED
TYPE NUMBER
PINSPIN POSITIONMATERIALCODE
PACKAGE
SAA4700T20mini-packplasticSOT163A
Note
1. SOT163-1; 1996 November 13.
March 19912
(1)
Page 3
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
handbook, full pagewidth
4.7 nF
CVBS
470 pF
1 nF
4.7
kΩ
75 kΩ
(2%)
to V
P
4.7 nF
22
nF
2
SYNC
SEPARATOR
SAA4700T
1
15
19
DATA
SLICER
REGENERATOR
PLL WITH
5 MHz VCO AND
PHASE DETECTOR
CSO
0.1
µF
5612138
FIELD SELECTOR
LINE 16 DECODER
line 16
data
CLOCK
VCS
163417 1811
(test line 16)
INPUT
CONTROLLER
TIME BASE
DAV
OUTPUT
CONTROLLER
data
4
6
REFERENCE
POWER-ON RESET
I2C-BUS
CONTROL
5
40 BIT DATA
REGISTER
40 BIT
DATA LATCH
MULTIPLEXER
VOLTAGES
8
AD = LOW
external
reset
9
SCL
10
SDA
7
n.c.
14
n.c.
20
n.c.
8.2 kΩ
clock pulse
Fig.1 Block diagram and test circuit.
FUNCTIONAL DESCRIPTION
Dataline 16
The information in dataline 16 consists of fifteen 8-bit
words; the total information content is shown in Table 1;
and the organization of transmitted bytes is shown in
Table 2.
Out of the fifteen possible 8-bit words the SAA4700T
extracts words 5 and 11 to 14. The contents of these words
2
can be read via the built-in I
C-bus interface. The circuit is
fully transparent, thus each bit is transferred without
modification with only the sequence of words being
changed. Words 11 to 14 are transmitted first followed by
word 5.
By evaluating the sliced sync signal the circuit can identify
the beginning of dataline 16 in the first field. The dataline
decoder stage releases the start code detector. When a
0.1 µF
+5 V
MGH128
V
P
correct start code is detected (for timing of start code
detection see Fig.3) words 5 and 11 to 14 are decoded,
checked for biphase errors and stored in a register bank. If
no biphase error has occurred, the contents of the register
bank are transferred to a second register bank by the data
valid control signal. If the system has been addressed, this
transfer will be delayed until the next start or stop condition
of the I2C-bus has been received.
The last bit of correct information on the dataline remains
available until it is read via the I2C-bus. Once the stored
information has been read it is considered to be no longer
valid and the internal new data flag is reset. Subsequently,
if the circuit is addressed, the only VPS data that will be
sent back is “FFF to F”. The same conditions apply after
power-up when no data can be read out. New data is
available after reception of another error-free dataline 16.
March 19913
Page 4
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
PINNING
SYMBOLPINDESCRIPTION
CVBS1video signal input (CVBS from TV)
SYNC2sync amplitude input (CVBS from TV)
GND13analog ground (0 V)
GND24digital ground (0 V)
C
black
5capacitor for black level
CSO6composite sync output
n.c.7not connected
AD8address set input
2
SCL9I
SDA10I
C-bus clock line
2
C-bus data line
RS11reset input active LOW
TP12test point for line 16 decoder
DAV13data available output active LOW
n.c.14not connected
R
osc
15oscillator resistor for frequency
adjustment
CP16test point clock pulse
V
P1
V
P2
C
ph
17+5 V supply voltage (digital part)
18+5 V supply voltage (analog part)
19capacitor of phase detector
n.c.20not connected
PIN CONFIGURATION
handbook, halfpage
CVBS
SYNC
GND1
GND2
C
black
CSO
SCL
SDA
n.c.
AD
1
2
3
4
5
6
7
8
9
10
Fig.2 Pin configuration.
SAA4700T
MBH797
n.c.
20
C
19
ph
V
18
P2
V
17
P1
CP
16
R
15
osc
n.c.
14
DAV
13
TP
12
RS
11
External reset
The circuit provides an internal power-on reset. When
using this facility pin 11 should be connected to VP or, if
external reset (RESET = LOW) is to be used pin 11 should
be prepared by connecting pin 11 via a 10 kΩ pull-up
resistor to VP.
Reset forces the following:
• I2C-bus not to acknowledge
• DAV output to go HIGH (pin 13)
• I2C-bus transfer register to “FFF”
March 19914
CVBS input
The CVBS signal is applied to the sync separator (pin 2)
via a decoupling capacitor and to the data slicer (pin 1) via
an RC high-pass filter. To enable proper storage of the
sync value in the decoupling capacitor, the sync generator
output resistance should not exceed 1 kΩ.
Black level
The capacitor connected to pin 5 stores the black level
value for the adaptive sync slicer.
Page 5
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
Composite sync output (CSO)
A composite sync output signal for customer application is
provided (pin 6).
DAV output
The data available output pin 13 is set LOW after an error
free data line 16 is received. DAV returnes to HIGH after
the beginning of the next first field. If no valid data is
available DAV remains HIGH.
A short duration pulse of 1 µs (Fig.5) is inserted at the
beginning of dataline 16; it will ensure that a HIGH-to-LOW
transmission occurs which can then be used for triggering.
Table 1 Information per word in dataline 16
WORD NUMBERCONTENT
1run in
2start code
3program source identification (binary coded)
4program source identification (ASCII sequential)
5sound and VTR control information
6program/test picture identification
7internal information exchange
8
9
10messages/commands
11
12
13
14
15reserve
address assignment of signal distribution
VTR control / information
5 MHz VCO and phase detector
The resistor connected between pin 15 and V
determines the current into the voltage controlled
oscillator. The RC network connected to pin 19 acts as a
low-pass filter for the phase detector.
Power supply
To prevent crosscoupling the circuit is provided with
separate ground and supply pins for analog and digital
parts (pins 3, 4, 17 and 18).
P2
March 19915
Page 6
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
Table 2 VTR control information of dataline 16
VTR CONTROL INFORMATION
Word
number
Bit numberX X X X X X X XX X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X
Label binary
Word 5:AD
Bit1 Bit2 Status
002-channelSpecial system code
01Mono
Fig.4 Timing diagram of dataline 16; modulation depth 71.4%.
March 19917
48 µs
0.5 V ±5%
MEH098
Page 8
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
handbook, full pagewidth
DAV output
start code
latch pulse
word 11
latch pulse
word 14
latch pulse
CVBS
input
line 16
pulse
word 5
12.5 µs
1 µs
word 1
word 2
word 3
word 4
word 5
64 µs
word 6
word 7
48 µs
word 8
word 9
word 10
word 11
word 12
word 13
word 14
word 15
MEH096
Fig.5 Timing diagram of the data available output and word latch pulses.
March 19918
Page 9
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
Ground pins 3 and 4 as well as supply pins 17 and 18 tied together.
SYMBOLPARAMETERMIN.MAX.UNIT
V
P1
V
P2
T
stg
T
amb
THERMAL RESISTANCE
SYMBOLPARAMETERMIN.MAX.UNIT
R
th j-a
CHARACTERISTICS
V
P1=VP2
=5V; T
unless otherwise specified.
supply voltage (pin 17)−0.56.0V
supply voltage (pin 18)−0.56.0V
storage temperature range−20125°C
operating ambient temperature range0+70°C
from junction to ambient in free air−130K/W
=25°C; CVBS signal according to VPS and VPT standard and measurements taken in Fig.1,
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
, V
V
P1
P2
I
P
supply voltages (pins 17 and 18)4.555.5V
total supply currentI17+ I
18
−1823mA
CVBS and sync inputs (pins 1 and 2)
V
i CVBS
CVBS input signal (peak-to-peak value)sync-to-white
0.511.4V
note 1; Fig.4
V
i data
data input signal
line 16; Fig.4250500700mV
(peak-to-peak value, pin 1)
V
i sync
sync input signal
100−600mV
(peak-to-peak value, pin 2)
R
S
source resistance−−1kΩ
Composite sync output (pin 6)
V
OL
V
OH
I
OL
I
OH
t
d
DAV output (pin 13)
V
OL
V
OH
I
OL
I
OH
output voltage LOW−−0.4V
output voltage HIGH2.4−−V
output current LOW−−200µA
output current HIGH−−−500µA
sync separator delay time−0.3−µs
note 2
output voltage LOW−−0.4V
output voltage HIGH2.4−−V
output current LOW−−500µA
output current HIGH−0.011µA
March 19919
Page 10
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
SCL and SDA (pins 9 and 10)
V
IL
V
IH
I
I
C
I
V
O ACK
t
r
t
f
t
p L
t
p H
SCLclock frequency−−100kHz
AD set input (pin 8)
V
IL
V
IH
RESET input (pin 11)
V
IL
V
IH
I
IL
I
IH
Notes
1. With standard sync and data amplitude of 68% to 75% black-white.
2. If the open collector output DAV is used, a pull-up resistor to VP1 is necessary.
input voltage LOW−−1.5V
input voltage HIGH3−−V
input current0.9V
P
−−±10µA
input capacitance−−10pF
output voltage during acknowledge
IOL= 3 mA−−0.4V
on pin 10
rise time−−1µs
fall time−−0.3µs
pulse duration LOW4.7−−µs
pulse duration HIGH4.0−−µs
note 2
input voltage LOWaddress 23H0−0.4V
input voltage HIGHaddress 21H2.4−V
P
V
note 2
input voltage LOWreset active−−0.4V
input voltage HIGHreset non-active2.4−−V
input current LOW−−−10µA
input current HIGH−0.011µA
March 199110
Page 11
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
handbook, full pagewidth
I2C-BUS FORMAT
V
CVBS
P
+5 V
75 kΩ
(2%)
DAV
n.c.
13
7910
8
0.1
µF
n.c.
CSOSCLSDA
470
pF
4.7
nF
4.7
nF
0.1 µF
SAA4700T
22
nF
8.2 kΩ
n.c.
201918171615141211
123456
1 nF
4.7 kΩ
Fig.6 Application circuit.
MEH136
SSLAVE ADDRESSADATAADATAADATAADATAADATAP
S=start condition
SLA VE ADDRESS=0010 0001 or 0010 0011 for set input AD = HIGH respectively LOW on pin 8
(the circuit is only a slave transmitter)
A=acknowledge, generated by the slave or the master
DATA=five data bytes, see words in Table 1
P=stop condition respectively non-acknowledge by the microcontroller
2
Remarks to I
C-bus transmission
• the MSB of each word is transmitted first
• there is no restriction on the number of words to be transmitted, but if more than five words are requested, the following
content will be “FF” continuously.
• Normally every dataline transmission has to be ended with STOP condition by non-acknowledge of the controller.
March 199111
Page 12
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
pin 1 index
1
e
11
A
2
10
w M
b
p
SOT163-1
E
H
E
Q
A
1
L
p
L
detail X
(A )
A
X
v M
A
A
3
θ
0510 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT163-1
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
A
1
A3b
2
2.45
0.25
2.25
0.096
0.01
0.089
IEC JEDEC EIAJ
075E04 MS-013AC
0.49
0.36
0.019
0.014
p
0.32
0.23
0.013
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
13.0
7.6
7.4
0.30
0.29
1.27
0.050
12.6
0.51
0.49
REFERENCES
March 199112
eHELLpQ
10.65
10.00
0.419
0.394
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.250.1
0.01
0.01
EUROPEAN
ywvθ
Z
0.9
0.4
8
0.004
ISSUE DATE
0.035
0.016
95-01-24
97-05-22
0
o
o
Page 13
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
March 199113
Page 14
Philips SemiconductorsPreliminary specification
VPS dataline processorSAA4700T
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2
PURCHASE OF PHILIPS I
C COMPONENTS
2
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
March 199114
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