Datasheet SAA3049AP, SAA3049AT Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA3049A

Infrared remote control decoder

Product specification
Supersedes data of 1996 Apr 15
File under Integrated Circuits, IC02

1996 Sep 13

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

FEATURES

• Decodes 64 remote control commands with a maximum
of 32 subaddresses

• Accepts RECS80 codes with pulse position modulation
(SAA3004, SAA3007, SAA3008) or RC5 codes with
bi-phase transmission (SAA3006, SAA3010)

• Suitable for low voltage and low SAA3049A supply
current applications

• Adding circuitry for binary decoding allows a maximum
of 2048 commands to be used, for example 1-of-16
decoder (HEF4515).

ORDERING INFORMATION

TYPE

NUMBER

SAA3049AP DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
SAA3049AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

NAME DESCRIPTION VERSION

GENERAL DESCRIPTION

The main function of the SAA3049A is to check and
convert the received coded data (RECS80/RC5) into
latched binary outputs. The device address can be
hard-wired for a particular address, allowing several
devices in one location. Alternatively, received data with
any address can be accepted; the received data and
address are then outputs.

PACKAGE

1996 Sep 13 2

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

SYSTEM DIAGRAM

handbook, full pagewidth

Remote control transmitters (see individual data sheet for full specification):
SAA3004: V
SAA3007: V
SAA3008: V
SAA3006: V
SAA3010: V

V

Batt

REMOTE

CONTROL

TRANSMITTER

SAA3004
SAA3007
SAA3008

or
SAA3006
SAA3010

= 4to 11 V (max.); 7 × 64 = 448 commands (RECS80 code).

Batt

= 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code).

Batt

= 2 to 6.5 V (max.); 20 × 64 = 1280 commands (RECS80 code).

Batt

= 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code).

Batt

= 2 to 7 V (max.); 32 × 64 = 2048 commands (RC5 code).

Batt

CQW89A

CQY89A

IR

BPW50

PREAMPLIFIER

+5 V

IR

V

CC

REMOTE
CONTROL
DECODER

IN

SAA3049A

command acknowledge

CA

4 MHz

bits

A
B
C
D
E
F

T0
A0 (S0)

A1 (S1)
A2 (S2)
A3 (S3)
A4

MGE374

data

toggle

address

Fig.1 System diagram.

1996 Sep 13 3

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

PINNING

SYMBOL PIN DESCRIPTION

A 1 data output
B 2 data output
C 3 data output
D 4 data output
E 5 data output
F 6 data output
A0 (S0) 7 data/address output/input
A1 (S1) 8 data/address output/input
IN 9 digital input
GND 10 ground
MODE 11 RC5/RECS80 mode selection
XTAL1 12 crystal oscillator
XTAL2 13 crystal oscillator
RESET 14 reset input
A4 15 address output/input
A3 (S3) 16 address output/input
A2 (S2) 17 address output/input
T0 18 T0 bit
CRI 19 command received indicator
V

CC

20 supply voltage

handbook, halfpage

1

A

2

B

3

C

4

D

5

E

SAA3049A

6

F

GND

7
8
9

IN

10

MGD347

A0 (S0)
A1 (S1)

Fig.2 Pin configuration.

20
19
18
17
16
15
14
13
12
11

V

CC

CRI
T0
A2 (S2)
A3 (S3)
A4
RESET
XTAL2
XTAL1
MODE

1996 Sep 13 4

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

I

I

I

I

O

P

tot

P

o

I

DD

I

SS

T

amb

T

stg

supply voltage −0.5 +7 V
input voltage any pin −0.5 VCC+ 0.5 V
DC input current any pin −−10 mA
DC output current any pin − 10 mA
total power dissipation − 125 mW
power dissipation per output − 30 mW
positive supply current −50 +50 mA
negative supply current −100 +50 mA
operating ambient temperature −40 +85 °C
storage temperature −65 +150 °C

HANDLING

Inputs and outputs are protected against electrostatic charge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see

“Handling MOS Devices”

).

1996 Sep 13 5

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

CHARACTERISTICS

V

= 2.5 to 5.5 V; T

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

CC

I

CC

Input signals (pin 9)

V

IH

V

IL

Mode selection (pin 11)

V

IH

V

IL

Command received indicator and mode control (pin 19); note 1
V

IH

V

IL

Crystal oscillator

f

osc

Outputs

= −40 to +85 °C; unless otherwise specified.

amb

supply voltage 2.5 − 5.5 V
supply current VDD=3V,

f

= 4 MHz

xtal

HIGH level input voltage 0.7V
LOW level input voltage 0 − 0.3V

HIGH level input voltage 0.7V
LOW level input voltage 0 − 0.3V

HIGH level input voltage 0.7V
LOW level input voltage 0 − 0.3V

− 0.3 0.7 mA

CC

CC

CC

− V

− V

− V

CC

CC

CC

CC

CC

CC

V
V

V
V

V
V

oscillator frequency note 2 − 4 − MHz

PEN-DRAIN WITHOUT INTERNAL PULL-UP RESISTOR; note 3

O
I

OL(sink)

LOW level output sink current VCC=5V;

−1.6 −12 − mA

VOL= 0.4 V

Notes

1. With pin 19 = HIGH, then pins 7, 8, 15, 16 and 17 are address inputs.
With pin 19 = LOW, then pins 7, 8, 15, 16, and 17 are 4 or 5 address received outputs.

a) In Figs 5, 6 and 7 this HIGH/LOW switching is dependent on whether the transistor on pin 19 is fed via a series

resistor or not. In both applications pin 19, which toggles several times (see Fig.4) while a valid command is
acknowledged, can be used to activate (flash) an LED indicator.

2. A quartz crystal with a frequency of 4 MHz is recommended for the standard transmitter application.

3. Application as output requires connection of an external pull-up resistor.

1996 Sep 13 6

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

Reset

The circuit is shown in Figs 5, 6 and 7. The alternative reset circuit shown in Fig.3 protects against short term power
supply transients by generating a reset.

The reset pin should either be connected to external reset circuitry as proposed or connected to VSS. If connected to VSS,
a reset pulse will be generated by the on-chip Power-on reset circuit at typically 1.3 V (±500 mV accuracy).

handbook, full pagewidth

V

CC

390 Ω

zener diode

3.6 V

1 kΩ

Fig.3 Proposed improved reset circuit.

Infrared signal input (pin 9)

This pin is sensitive to a negative-going edge.

Command received indicator (pin 19)

handbook, halfpage

signal at

pin 19

≈15 ms

≈120 ms

MGE376

1.8 kΩ
1N4148

BC548

20

1 µF

1N4148

SAA3049A

14

68 kΩ

MGE375

APPLICATION INFORMATION

In Fig.5, the circuit shown is for use with transmitters
SAA3004, SAA3007 or SAA3008; pin 11 is HIGH for
RECS80 code.

In Fig.6, the circuit shown is for use with transmitter types
SAA3006 or SAA3010; pin 11 is LOW for RC5 code.

In Fig.7, the decoder is set for the required subaddress by
holding the address pins HIGH or LOW. Pin 11 is HIGH for
use with transmitter types SAA3004, SAA3007 or
SAA3008 (RECS80 code). Pin 11 is LOW for use with
transmitter types SAA3006 or SAA3010 (RC5 code).
The remote control decoder is for up to 32 subaddresses
with 6 + 1-bit parallel outputs (RC5 code).

Fig.4 Output diagram of command acknowledge.

1996 Sep 13 7

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

T0-bit

V

CC

(+5 V)

68 kΩ

1N4148

1 µF

address

S2-bit

outputs

(1)

S3-bit

5.6

33

MGE377

outputs

address

S1-bit

S0-bit

IN

input

4 MHz

FEDCBA

range (2)

subaddress

SAA3049A

.

CC

kΩ

kΩ

20 19 18 17 16 15 14 13 12 11

12345678910

data outputs

command

acknowledge

handbook, full pagewidth

D1

220 Ω

CQW24

5.6 kΩ

BC548

BC548

1996 Sep 13 8

Fig.5 Remote control decoder with latched 11 (10) -bit parallel outputs [10 (9) -bits inverted].

when LOW (subaddress 8 to 20) pin 15 is connected to ground

when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to V

(1) Only for subaddress 8 to 20.

(2) subaddress range:

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

T0-bit

V

CC

(+5 V)

68 kΩ

1N4148

1 µF

A2-bit

outputs

address

A3-bit

A4-bit

kΩ

5.6

33

kΩ

4 MHz

20 19 18 17 16 15 14 13 12 11

SAA3049A

12345678910

MGE378

outputs

address

A1-bit

A0-bit

IN

input

FEDCBA

data outputs

command

acknowledge

handbook, full pagewidth

D1

220 Ω

CQW24

5.6 kΩ

BC548

BC548

1996 Sep 13 9

Fig.6 Remote control decoder with latched 12 -bit parallel outputs (11 bits inverted).

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

(A4) (2)

S2 (A2)

S3 (A3)

S1 (A1)

H or L (1)

set subaddresses

H selects RECS80 code

L selects RC5 CODE

mode

1N4148

68 kΩ

S0 (A0)

for address see

data sheets of

transmitter ICs

MGE379

IN

input

4 MHz

1 µF

CC

V

(+5 V)

D1

command

handbook, full pagewidth

220 Ω

acknowledge

CQW24

5.6

33

kΩ

kΩ

5.6 kΩ

BC548

68 kΩ

BC548

20 19 18 17 16 15 14 13 12 11

SAA3049A

12345678910

FEDCBA

T0

data outputs

(1) Address inputs:

.

CC

.

CC

Fig.7 Remote control decoder for up to 20 subaddresses with 6 + 1-bit parallel outputs (RECS80 code).

when LOW (subaddress 8 to 20) pin 15 is connected to ground

when LOW address input pin is connected to ground

when HIGH address input pin is connected via pull-up resistor to V

when HIGH (subaddress 1 to 7) pin 15 is connected via pull-up resistor to V

(2) subaddress range RECS80 code:

1996 Sep 13 10

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

PACKAGE OUTLINES

DIP20: plastic dual in-line package; 20 leads (300 mil)

D

seating plane

L

Z

20

pin 1 index

e

b

SOT146-1

M

E

A

2

A

A

1

w M

b

1

11

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A 

A 

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE
VERSION

SOT146-1

1 2

min.

max.

1.73

1.30

0.068

0.051

IEC JEDEC EIAJ

  SC603

b

b

1

0.53

0.38

0.021

0.015

0.014

0.009

REFERENCES

cD E e M

0.36

0.23

(1) (1)

26.92

26.54

1.060

1.045

1996 Sep 13 11

6.40

6.22

0.25

0.24

10

(1)

M

e

L

1

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

H

E

10.0

0.2542.54 7.62

8.3

0.39

0.010.10 0.30

0.33

ISSUE DATE

w

92-11-17
95-05-24

Z

max.

2.04.2 0.51 3.2

0.0780.17 0.020 0.13

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

pin 1 index

1

e

11

A

2

10

w M

b

p

SOT163-1

E

H

E

Q

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT163-1

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

A

1

A3b

2

2.45

0.25

2.25

0.096

0.01

0.089

IEC JEDEC EIAJ

075E04 MS-013AC

p

0.49

0.36

0.019

0.014

0.32

0.23

0.013

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

13.0

7.6

7.4

0.30

0.29

1.27

0.050

12.6

0.51

0.49

REFERENCES

1996 Sep 13 12

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

92-11-17
95-01-24

o

8

o

0

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WA VE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt.
Dwell times vary between 50 and 300 seconds depending
on heating method. Typical reflow temperatures range
from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 Sep 13 13

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Sep 13 14

Philips Semiconductors Product specification

Infrared remote control decoder SAA3049A

NOTES

1996 Sep 13 15

Philips Semiconductors – a worldwide company

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Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
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Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
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South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
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Spain: Balmes 22, 08007 BARCELONA,
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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
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Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/25/02/pp16 Date of release: 1996 Sep 13 Document order number: 9397 750 01145