Datasheet SAA3004P, SAA3004T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA3004

Remote control transmitter

Product specification
File under Integrated Circuits, IC02

August 1982

Philips Semiconductors Product specification

Remote control transmitter SAA3004

GENERAL DESCRIPTION

The SAA3004 transmitter IC is designed for infrared remote control systems. It has a total of 448 commands which are
divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press button,
a slider switch or hard wired.

The SAA3004 generates the pattern for driving the output stage. These patterns are pulse distance coded. The pulses
are infrared flashes or modulated. The transmission mode is defined in conjunction with the sub-system address.
Modulated pulses allow receivers with narrow-band preamplifiers for improved noise rejection to be used. Flashed pulses
require a wide-band preamplifier within the receiver.

The SAA3004 has the following features:

• Flashed or modulated transmission

• 7 sub-system addresses

• Up to 64 commands per sub-system address

• High-current remote output at V

• Low number of additional components

• Key release detection by toggle bits

• Very low stand−by current (< 2 µA)

• Operational current < 2 mA at 6 V supply

• Wide supply voltage range (4 to 11 V)

• Ceramic resonator controlled frequency (typ. 450 kHz)

• Encapsulation: 20-lead plastic DIL or 20-lead plastic mini-pack (SO-20)

= 6 V (−IOH= 40 mA)

DD

PACKAGE OUTLINES

SAA3004P: 20-lead DIL; plastic (SOT146); SOT146-1; 1996 December 11.
SAA3004T: 20-lead mini-pack; plastic (SO20; SOT163A); SOT163-1; 1996 December 11.

August 1982 2

Philips Semiconductors Product specification

Remote control transmitter SAA3004

Fig.1 Transmitter with SAA3004.

INPUTS AND OUTPUTS
Key matrix inputs and outputs (DRV0N to DRV6N and SEN0N to SEN6N)

The transmitter keyboard is arranged as a scanned matrix. The matrix consists of 7 driver outputs and 7 sense inputs as
shown in Fig.1. The driver outputs DRV0N to DRV6N are open drain N-channel transistors and they are conductive in
the stand-by mode. The 7 sense inputs (SEN0N to SEN6N) enable the generation of 56 command codes.
With 2 external diodes all 64 commands are addressable. The sense inputs have P-channel pull-up transistors, so that
they are HIGH until they are pulled LOW by connecting them to an output via a key depression to initiate a code
transmission.

Address mode input (ADRM)
The sub-system address and the transmission mode are defined by connecting the ADRM input to one or more driver

outputs (DRV0N to DRV6N) of the key matrix. If more than one driver is connected to ADRM, they must be decoupled
by a diode. This allows the definition of seven sub-system addresses as shown in Table 3. If driver DRV6N is connected
to ADRM the data output format of REMO is modulated or if not connected, flashed.

The ADRM input has switched pull-up and pull-down loads. In the stand-by mode only the pull−down device is active.
Whether ADRM is open (sub-system address 0, flashed mode) or connected to the driver outputs, this input is LOW and
will not cause unwanted dissipation. When the transmitter becomes active by pressing a key, the pull−down device is
switched off and the pull-up device is switched on, so that the applied driver signals are sensed for the decoding of the
sub-system address and the mode of transmission.

The arrangement of the sub-system address coding is such that only the driver DRVnN with the highest number (n)
defines the sub-system address, e.g. if driver DRV2N and DRV4N are connected to ADRM, only DRV4N will define the
sub-system address. This option can be used in transmitters for more than one sub-system address. The transmitter may

August 1982 3

Philips Semiconductors Product specification

Remote control transmitter SAA3004

be hard-wired for sub-system address 2 by connecting DRV1N to ADRM. If now DRV3N is added to ADRM by a key or
a switch, the transmitted sub-system address changes to 4.

A change of the sub-system address will not start a transmission.

Remote control signal output (REMO)
The REMO signal output stage is a push-pull type. In the HIGH state a bipolar emitter−follower allows a high output

current. The timing of the data output format is listed in Tables 1 and 2.
The information is defined by the distance t

modulated pulses (see Fig.3).
The format of the output data is given in Figs 2 and 3. In the flashed transmission mode the data word starts with two

toggle bits T1 and T0, followed by three bits for defining the sub-system address S2, S1 and S0, and six bits F, E, D, C,
B and A, which are defined by the selected key.

In the modulated transmission mode the first toggle bit T1 is replaced by a constant reference time bit (REF). This can
be used as a reference time for the decoding sequence.

The toggle bits function as an indication for the decoder that the next instruction has to be considered as a new
command.

The codes for the sub−system address and the selected key are given in Tables 3 and 4.

Oscillator input/output (OSCI and OSCO)
The external components must be connected to these pins when using an oscillator with a ceramic resonator.

The oscillator frequency may vary between 400 kHz and 500 kHz as defined by the resonator.

FUNCTIONAL DESCRIPTION
Keyboard operation

In the stand-by mode all drivers (DRV0N to DRV6N) are on. Whenever a key is pressed, one or more of the sense inputs
(SENnN) are tied to ground. This will start the power-up sequence. First the oscillator is activated and after the debounce
time t

Within the first scan cycle the transmission mode, the applied sub-system address and the selected command code are
sensed and loaded into an internal data latch. In contradiction to the command code the sub-system address is sensed
only within the
transmitted sub-system address is not altered.

(see Fig.4) the output drivers (DRV0N to DRV6N) become active successively.

DB

first

scan cycle. If the applied sub-system address is changed while the command key is pressed, the

between the leading edges of the flashed pulses or the first edge of the

b

In a multiple key-stroke sequence (see Fig.5) the command code is always altered in accordance with the sensed key.

Multiple key-stroke protection

The keyboard is protected against multiple key-strokes. If more than one key is pressed at the same time, the circuit will
not generate a new output at REMO (see Fig.5). In case of a multiple key-stroke the scan repetition rate is increased to
detect the release of a key as soon as possible.

There are two restrictions caused by the special structure of the keyboard matrix:

• The keys switching to ground (code numbers 7, 15, 23, 31, 39, 47, 55 and 63) and the keys connected to SEN5N and
SEN6N are not covered completely by the multiple key protection. If one sense input is switched to ground, further
keys on the same sense line are ignored.

• SEN5N and SEN6N are not protected against multiple key-stroke on the same driver line, because this condition has
been used for the definition of additional codes (code numbers 56 to 63).

August 1982 4

Philips Semiconductors Product specification

Remote control transmitter SAA3004

Output sequence (data format)

The output operation will start when the selected code is found. A burst of pulses, including the latched address and
command codes, is generated at the output REMO as long as a key is pressed. The format of the output pulse train is
given in Figs 2 and 3. The operation is terminated by releasing the key or if more than one key is pressed at the same
time. Once a sequence is started, the transmitted words will always be completed after the key is released.

The toggle bits T0 and T1 are incremented if the key is released for a minimum time t

(see Fig.4).

REL

The toggle bits remain unchanged within a multiple key-stroke sequence.

REF = reference time; T0 and T1 = toggle bits; S0, S1 and S2 = system address; A, B, C, D, E and F = command bits
(a) flashed mode: transmission with 2 toggle bits and 3 address bits, followed by 6 command bits (pulses are flashed).
(b) modulated mode: transmission with reference time, 1 toggle bit and 3 address bits, followed by 6 command bits (pulses are modulated).

Fig.2 Data format of REMO output; .

(1) Flashed pulse.
(2) Modulated pulse (tPW= (5 ×tM) + tMH.

Fig.3 REMO output waveform.

August 1982 5

August 1982 6

Philips Semiconductors Product specification

Remote control transmitter SAA3004

Fig.4 Single key-stroke sequence.

Debounce time: tDB= 4 to 9 × T
Start time: tST= 5 to 10 × To.
Minimum release time: t
Word distance: t

W.

REL

O.

= TO.

Fig.5 Multiple key-stroke sequence.

Scan rate multiple key-stroke: tSM= 6 to 10 × TO.
For tDB, tST and tWsee Fig.4.

Philips Semiconductors Product specification

Remote control transmitter SAA3004

Table 1 Pulse train/timing

mode T

O

ms

t
µs

p

t

M

µs

t
µs

ML

t
µs

MH

t
ms

flashed 2,53 8,8 −−−121
modulated 2,53 − 26,4 17,6 8,8 121

f

OSC

t

P

t

M

t

ML

t

MH

T

O

t

W

Table 2 Pulse train separation (t

code t
logic “0” 2 × T

logic “1” 3 × T
reference time 3 × T

455 kHz t
4 × t

OSC

12 × t

OSC

8 × t

OSC

4 × t

OSC

1152 × t
55 296 × t

OSC

)

b

OSC

b

o
o
o

toggle bit time 2 × Toor 3 × T

= 2,2 µs

OSC

flashed pulse width
modulation period
modulation period LOW
modulation period HIGH
basic unit of pulse distance
word distance

o

W

August 1982 7

Philips Semiconductors Product specification

Remote control transmitter SAA3004

Table 3 Transmission mode and sub-system address selection
The sub-system address and the transmission mode are defined by connecting the ADRM input to one or more driver

outputs (DRV0N to DRV6N) of the key matrix. If more than one driver is connected to ADRM, they must be decoupled
by a diode.

mode sub-system

address

#S2S1S00123456

F 0111
L 1000 o
A 2001 Xo
S 3010 XXo
H 4011 XXXo
E 5100 XXXXo

D 6101 XXXXXo
M
O 0111 o
D 1000 o o
U 2001 Xo o

L 3010 XXo o

A 4011 XXXo o

T 5100 XXXXo o

E 6101 XXXXXoo
D

Notes

1. o = connected to ADRM

2. blank = not connected to ADRM

3. X = don’t care

driver DRVnN

for n =

August 1982 8

Philips Semiconductors Product specification

Remote control transmitter SAA3004

Table 4 Key codes

matrix
drive

DRV0N SEN0N 000000 0
DRV1N SEN0N 000001 1
DRV2N SEN0N 000010 2
DRV3N SEN0N 000011 3
DRV4N SEN0N 000100 4
DRV5N SEN0N 000101 5
DRV6N SEN0N 000110 6
V

SS

note 1 SEN1N 0 0 1 note 2 8 to 15
note 1 SEN2N 0 1 0 note 2 16 to 23
note 1 SEN3N 0 1 1 note 2 24 to 31
note 1 SEN4N 1 0 0 note 2 32 to 39
note 1 SEN5N 1 0 1 note 2 40 to 47
note 1 SEN6N 1 1 0 note 2 48 to 55

note 1

Notes

1. The complete matrix drive as shown above for SEN0N is also applicable for the matrix sense inputs SEN1N to
SEN6N and the combined SEN5N/SEN6N.

2. The C, B and A codes are identical to SEN0N as given above.

matrix
sense

SEN0N 000111 7

SEN5N

and

SEN6N

FEDCBA

1 1 1 note 2 56 to 63

code matrix

position

August 1982 9

Philips Semiconductors Product specification

Remote control transmitter SAA3004

PINNING

1 REMO remote data output
2 SEN6N
3 SEN5N
4 SEN4N

Fig.6 Pinning diagram.

5 SEN3N
6 SEN2N
7 SEN1N
8 SEN0N
9 ADRM address mode control input
10 V

SS

11 OSCI oscillator input
12 OSCO oscillator output
13 DRV0N
14 DRV1N
15 DRV2N
16 DRV3N
17 DRV4N
18 DRV5N
19 DRV6N
20 V

DD

key matrix sense inputs

ground

key matrix drive outputs

positive supply

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage range V
Input voltage range V
Output voltage range V

DD
I
O

−0,5 to +15 V

−0,5 to VDD+0,5 V

−0,5 to VDD+0,5 V

D.C. current into any input or output ± I max. 10 mA
Peak REMO output current

during 10 µs; duty factor = 1% −I

(REMO)M

max. 300 mA

Power dissipation per package

for T
Storage temperature range T
Operating ambient temperature range T

= −20 to +70 °CP

amb

tot
stg
amb

max. 200 mW

−55 to +150 °C

−20 to +70 °C

August 1982 10

Philips Semiconductors Product specification

Remote control transmitter SAA3004

CHARACTERISTICS

V

= 0 V; T

SS

= 25 °C; unless otherwise specified

amb

PARAMETER V

(V) SYMBOL MIN. TYP. MAX. UNIT

DD

Supply voltage

T

= 0 to +70 °C − V

amb

Supply current; active

f

= 455 kHz;

OSC

REMO output unloaded

6
9

Supply current; inactive

(stand-by mode)

T

= 25 °C

amb

6
9

Oscillator frequency

(ceramic resonator) 4 to 11 f

Keyboard matrix

Inputs SEN0N to SEN6N
Input voltage LOW 4 to 11 V
Input voltage HIGH 4 to 11 V
Input current 4 −I

V

= 0 V 11 −I

I

Input leakage current

VI= V

DD

11 I
Outputs DRV0N to DRV6N
Output voltage “ON”

I

= 0,1 mA

O

IO= 1,0 mA

4

11
Output current “OFF”

VO= 11 V 11 I

Control input ADRM

Input voltage LOW − V
Input voltage HIGH − V
Input current (switched P- and

N-channel pull-up/pull-down)
Pull-up active 4 I

stand-by voltage: 0 V 11 I

Pull-down active 4 I

stand-by voltage: V

DD

11 I

I

DD

I

DD

I

DD

I

DD

OSC

I

V
V

O

IL
IL
IH
IH

DD

IL
IH

I
I

OL
OL

IL
IH

4 − 11 V

−

−

−

−

1
3

−

−

−

−

2
2

mA
mA

µA
µA

400 − 500 kHz

−−0,2 × V

0,8 × V

DD

−−V

DD

V

10 − 100 µA
30 − 300 µA

−−1µA

−

−

−

−

0,3
0,5

V
V

−−10 µA

−−0,8 × V

0,2 × V

DD

−−V

DD

V

10 − 100 µA
30 − 300 µA
10 − 100 µA
30 − 300 µA

August 1982 11

Philips Semiconductors Product specification

Remote control transmitter SAA3004

PARAMETER V

(V) SYMBOL MIN. TYP. MAX. UNIT

DD

Data output REMO

Output voltage HIGH 6 V

−I

= 40 mA 9 V

OH

Output voltage LOW 6 V

I

= 0,3 mA 9 V

OL

Oscillator

Input current

OSCI at V

DD

6I
Output voltage HIGH

−IOL= 0,1 mA 6 V

Output voltage LOW

IOH= 0,1 mA 6 V

OH
OH
OL
OL

I

OH

OL

3 −−V
6 −−V

−−0,2 V

−−0,1 V

0,8 − 2,7 µA

−−V

−06 V

DD

−−0,6 V

August 1982 12

Philips Semiconductors Product specification

Remote control transmitter SAA3004

PACKAGE OUTLINE

DIP20: plastic dual in-line package; 20 leads (300 mil)

D

seating plane

L

Z

20

pin 1 index

e

b

SOT146-1

M

E

A

2

A

A

1

w M

b

1

11

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE

VERSION

SOT146-1

1 2

min.

max.

1.73

1.30

0.068

0.051

IEC JEDEC EIAJ

b

b

1

0.53

0.38

0.021

0.015

0.36

0.23

0.014

0.009

REFERENCES

cD E e M

(1) (1)

26.92

26.54

1.060

1.045

SC603

August 1982 13

6.40

6.22

0.25

0.24

10

(1)

M

e

L

1

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

H

E

10.0

0.2542.54 7.62

8.3

0.39

0.010.10 0.30

0.33

ISSUE DATE

w

92-11-17
95-05-24

Z

max.

2.04.2 0.51 3.2

0.0780.17 0.020 0.13

Philips Semiconductors Product specification

Remote control transmitter SAA3004

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

pin 1 index

1

e

11

A

2

10

w M

b

p

SOT163-1

E

H

E

Q

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT163-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E04 MS-013AC

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

13.0

7.6

7.4

0.30

0.29

1.27

0.050

12.6

0.51

0.49

REFERENCES

August 1982 14

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

Remote control transmitter SAA3004

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WA VE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

August 1982 15

Philips Semiconductors Product specification

Remote control transmitter SAA3004

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

August 1982 16