Datasheet SAA1310, SAA1310T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA1310

Control interface for VHS video
recorders

Product specification
File under Integrated Circuits, IC02

April 1995

Philips Semiconductors Product specification

Control interface for VHS video

SAA1310

recorders

FEATURES

• Full support of VISS and VASS mode (VHS
Index/Address Search System)

• Read, write and overwrite of Tape Control/head signal
(CTL)

• Power-ON and power-failure indicator

• 4 general purpose comparators for interface between

sensors and microprocessor

• 2 comparators have a 100 mA output driver

• PAL and NTSC compatible

ORDERING INFORMATION

EXTENDED

TYPE NUMBER

SAA1310 18 DIL plastic SOT102
SAA1310T 20 SO plastic SOT163A

PINS PIN POSITION MATERIAL CODE

GENERAL DESCRIPTION

The SAA1310 provides an interface between the tape
control head in the VHS deck-electronics.
The circuit also includes an interface between sensors in
the deck mechanics and the microprocessor.

PACKAGE

(1)

(2)

Note

1. SOT102-1; 1996 December 02.

2. SOT163-1; 1996 December 02.

April 1995 2

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

handbook, full pagewidth

write/read

input

control head data

output

capstan reverse

input

write

current

18

(20)

WRITE

AMPLIFIER

10

(11)

16

(18)

control head

input/output

control head

feedback

reference voltage

output

comparator 1

non - inverting input

comparator 2

non - inverting input

comparator 3

inverting input

(2)

(1)

(3)

(6)

(7)

(8)

2

1

3

5

6

7

AMPLIFIER

DETECTOR

V

P

FILTER

V

ref

comparator 1

comparator 2

comparator 3

V

ref

POWER-ON AND

POWER-FAILURE

DETECTOR

SAA1310

(SAA1310T)

17

(19)

(4)

15

(17)

14

(15)

13

(14)

4

power on/failure

output

power on/failure

capacitor

comparator 1

output

comparator 2

output

comparator 3

output

comparator 4

inverting input

Pin numbers in parenthesis refer to the SAA1310T.

8

(9)

comparator 4

9 (10)

P

12 (13)

Fig.1 Block diagram.

April 1995 3

11

(12)

MEA082 - 1

GNDV

comparator 4

output

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

PIN CONFIGURATION

book, halfpage

CTL FB
CTL I/O

CPO/FAIL

V

ref

CIN1
CIN2
CIN3
CIN4

V

P

1
2
3
4
5
6
7
8
9

SAA1310

MEA083

18

CAPREV

17

PO/FAIL OUT
CTL DATA

16
15

COUT1

14

COUT2

13

COUT3
GND

12
11

COUT4
WRITE/READ

10

a. SAA1310.

Fig.2 Pin configurations.

PINNING (pins in parenthesis refer to SAA1310T)

handbook, halfpage

CPO/FAIL

CTL FB
CTL I/O

1
2
3

V

ref

4

n.c. n.c.

5

V

P

SAA1310T

6
7
8
9

10

MEA084

CIN1
CIN2
CIN3
CIN4

b. SAA1310T.

20

CAPREV
PO/FAIL OUT

19

CTL DATA

18
17

COUT1

16

COUT2

15

COUT3

14

GND

13

COUT4

12

WRITE/READ

11

SYMBOL PIN DESCRIPTION

CTL FB 1 (1) control head feedback
CTL I/O 2 (2) control head input/output
V

ref

3 (3) reference voltage output
CPO/FAIL 4 (4) power on/failure capacitor
CIN1 5 (6) comparator 1 input
CIN2 6 (7) comparator 2 input
CIN3 7 (8) comparator 3 input
CIN4 8 (9) comparator 4 input
V

P

WRITE/

READ 10 (11) write/read input

9 (10) supply voltage

COUT4 11 (12) comparator 4 output
GND 12 (13) ground
COUT3 13 (14) comparator 3 output
COUT2 14 (15) comparator 2 output
COUT1 15 (17) comparator 1 input
CTL DATA 16 (18) control head data output
PO/FAIL OUT 17 (19) power on/failure output
CAPREV 18 (20) capstan reverse input

April 1995 4

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

I/VO

V

O

T

stg

T

amb

THERMAL RESISTANCE

R

th

R

th

supply voltage range 0 6.0 V
voltage on all pins except pins 11 (12) and 13 (14) 0 V

V

P

output voltage on pins 11 (12) and 13 (14) 0 18 V
storage temperature range −65 +150 °C
ambient temperature range 0 +70 °C

SYMBOL PARAMETER TYP. MAX. UNIT

thermal resistance (SAA1310) 75 − K/W
thermal resistance (SAA1310T) 90 − K/W

April 1995 5

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)

=5V;T

V

P

specified

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

P

d

Supply pin 9 (10)

V

P

I

P

CTL I/O pin 2 (2)

READ MODE PIN 10 (11) < 0.5 V
V

I

B bandwidth low-pass filter − 3 − kHz
I

b

WRITE MODE PIN 10 (11) > 3.5 V
V

O

V

O

=25°C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise

amb

power dissipation note 1 − 85 − mW

supply voltage 4.5 5.0 5.5 V
supply current read mode 10 15 20 mA

write mode; duty factor = 50% 13 18 24 mA

input voltage (peak-to- f = 500 Hz 0.35 −− mV
peak value) f = 30 kHz; non-linear operation −−200 mV

input bias current read mode − 0.1 −µA

output voltage LOW I

= 3 mA; −−0.4 V

CTL I/O

pin CTL DATA = HIGH

output voltage HIGH I

= − 3 mA; 4.6 −− V

CTL I/O

pin CTL DATA = LOW

WRITE/READ pin 10 (11)

V

I

I

I

V

pin 3 (3); note 2

ref

V

O

I

tot

R

O

input voltage read mode −−0.5 V

input current read mode −−1.5 −µA

output voltage 2.4 2.5 2.6 V
total current including write current −4 −+4mA
output resistance − 0.4 0.6 Ω

CAPREV pin 18 (20)

V

IH

V

IL

I

IH

I

IH

input voltage HIGH 2.0 −− V
input voltage LOW −−0.8 V
input current HIGH V
input current LOW V

write mode; analog 1.6 − 3.3 V

write mode − 0.1 −µA

CAPREV
CAPREV

=5V −−10 µA
=0V −10 −− µA

April 1995 6

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

CTL DATA pin 16 (18)

WRITE MODE
V

IH

V

IL

I

IH

I

IL

READ MODE
V

OL

V

OH

CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3

V

O

V

OL

V

OH

t

d

V

TL1

V

TL2

I

O

I

O

V

O(min.)

V

O(max.)

High output current type comparators

CIN3 and CIN4 pins 7 (8) and 8 (9)
V

hys

V

IL

V

IH

I

IL

I

IH

COUT3 and COUT4 pins 13 (14) and 11 (12)
V

OL

±I

OL

t

tr

T

j

input voltage HIGH 2.0 −− V
input voltage LOW −−0.8 V
input current HIGH V
input current LOW V

CTL DATA
CTL DATA

=5V −−10 µA
=0V −10 −− µA

output voltage LOW IOL= 0.5 mA −−0.4 V
output voltage HIGH IOH= − 50 µA 2.4 −− V

operating voltage range at decreasing V

P

1.5 − 5.5 V
output voltage LOW IOL=1mA −−0.4 V
output voltage HIGH IOH=1mA VP−0.9 −− V
delay time C

CAPREV

=68nF − 50 − ms
threshold level 1 4.5 − 4.8 V
threshold level 2 − 3.5 − V
source current pin 4 −−3−µA
sink current pin 4 − 300 −µA
minimum output voltage − 20 − mV
maximum output voltage − 2.1 − V

input hysteresis − 10 − mV
input voltage LOW −−V
input voltage HIGH V

+ 10 mV −− V

ref

− 10 mV V

ref

input current LOW CIN3 = CIN4 = 0 V −1 −− µA
input current HIGH CIN3 = CIN4 = V

P

−−+1µA

output voltage LOW IOL= 100 mA −−1.0 V

I

=2mA −−0.4 V

OL

leakage current output voltage HIGH;

−−1µA

COUT3 = COUT4 = 17 V
transient time note 3 − 0.5 −µs
thermal protection − 130 −°C

April 1995 7

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

Low output current type comparators

CIN1 AND CIN2 pins 5 (6) and 6 (7)
V

hys

V

IL

V

IH

I

I

COUT1 AND COUT2 pins 15 (17) and 14 (15)
V

OL

V

OH

t

tr

Notes to the characteristics

1. Without the sink current of the comparators; in write mode.

2. Minimum value of capacitor connected to this pin is 4.7 µF.

3. Vi= 100 mV p-p. Inputs connected to V

4. Vi= 100 mV p-p. Inputs connected to V

input hysteresis − 10 − mV
input voltage LOW −−V
input voltage HIGH V

+ 10 mV −− V

ref

− 10 mV V

ref

input current CIN1 = CIN2 = 0 V −1 −− µA

CIN1 = CIN2 = V

P

− − +1 µ A

output voltage HIGH IOH= −100 µA 4.5 −− V
output voltage LOW IOL=2mA −−1V
transient time note 4 − 0.5 −µs

via a 10 kΩ resistor; outputs connected to VPvia a 250 Ω resistor.

ref

via a 10 kΩ resistor; outputs connected to VPvia a 2.5 kΩ resistor.

ref

April 1995 8

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

V

P

t

d

100

V

TL1

V

TL2

1.5 V

t

V

17 (19)

t

d

t

d

t

d

100

t

d

MEA085

t

Fig.3 Power-ON and power-failure detector.

April 1995 9

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

APPLICATION INFORAMTION

10

write

current

I

(11)

WRITE

AMPLIFIER

IV

W

R

I

16

(18)

−−+

FILTER

AMPLIFIER

18

(20)

I

DETECTOR

1

2

(1)

(2)

P

V

3

(3)

ref

V

V

17

(19)

DETECTOR

POWER-ON AND

POWER-FAILURE

ref

V

I

4

(4)

15

(17)

SAA1310

comparator 1

+

5

(6)

I

V

14

(15)

(SAA1310T)

comparator 2

+

6

(7)

V

I

V

13

(14)

11

(12)

I

V

12(13)

9(10)

MEA086 - 1

GND

P

V

Fig.4 Test circuit diagram.

comparator 3

−

+

7

(8)

comparator 4

−

−

+

8

(9)

I

I

10 µF

650 Ω

82 nF

i

V

handbook, full pagewidth

April 1995 10

IV

IV

IV

IV

Pin numbers in parenthesis refer to the SAA1310T.

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

handbook, full pagewidth

CTL head

1

47 µF

4.7 nF

47

V

I

V

I

V

I

µF

V

I

(1)

2

(2)

3

(3)

4

(4)

68
nF

5

(6)

SAA1310

(SAA1310T)

6

(7)

V

I

7

(8)

8

(9)

18

(20)

17

(19)

16

(18)

15

(17)

14

(15)

13

(14)

12

(13)

11

(12)

CAPREV

PO/FAIL OUT

CTL DATA

COUT1

COUT2

COUT3

COUT4

(10)

9

Pin numbers in parenthesis refer to the SAA1310T.

+5 V

47
µF

Fig.5 Application diagram.

April 1995 11

10

(11)

47 kΩ

100

nF

WRITE/READ

MEA087

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

PACKAGE OUTLINES

DIP18: plastic dual in-line package; 18 leads (300 mil)

D

seating plane

L

Z

18

pin 1 index

e

b

SOT102-1

M

E

A

2

A

A

1

w M

b

1

b

2

10

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT102-1

12

min.

max.

IEC JEDEC EIAJ

b

1.40

1.14

0.055

0.044

b

1

0.53

0.38

0.021

0.015

b

cD E e M

2

0.32

1.40

0.23

1.14

0.013

0.055

0.009

0.044

REFERENCES

21.8

21.4

0.86

0.84

April 1995 12

9

(1) (1)

6.48

6.20

0.26

0.24

L

e

1

M

3.9

8.25

3.4

7.80

0.15

0.32

0.13

0.31

EUROPEAN

PROJECTION

E

0.37

0.33

H

9.5

8.3

w

max.

0.2542.54 7.62

0.854.7 0.51 3.7

0.010.10 0.30

0.0330.19 0.020 0.15

ISSUE DATE

93-10-14
95-01-23

(1)

Z

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

pin 1 index

1

e

11

A

2

10

w M

b

p

SOT163-1

E

H

E

Q

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT163-1

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

A2A

1

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E04 MS-013AC

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

13.0

7.6

7.4

0.30

0.29

1.27

0.050

12.6

0.51

0.49

REFERENCES

April 1995 13

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

April 1995 14

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

April 1995 15