Datasheet SAA1310-N2 Datasheet (Philips)

DATA SH EET

Product specification
File under Integrated Circuits, IC02

April 1995

INTEGRATED CIRCUITS

SAA1310

Control interface for VHS video
recorders

April 1995 2

Philips Semiconductors Product specification

Control interface for VHS video
recorders

SAA1310

FEATURES

• Full support of VISS and VASS mode (VHS
Index/Address Search System)

• Read, write and overwrite of Tape Control/head signal
(CTL)

• Power-ON and power-failure indicator

• 4 general purpose comparators for interface between

sensors and microprocessor

• 2 comparators have a 100 mA output driver

• PAL and NTSC compatible

GENERAL DESCRIPTION

The SAA1310 provides an interface between the tape
control head in the VHS deck-electronics.
The circuit also includes an interface between sensors in
the deck mechanics and the microprocessor.

ORDERING INFORMATION

Note

1. SOT102-1; 1996 December 02.

2. SOT163-1; 1996 December 02.

EXTENDED

TYPE NUMBER

PACKAGE

PINS PIN POSITION MATERIAL CODE

SAA1310 18 DIL plastic SOT102

(1)

SAA1310T 20 SO plastic SOT163A

(2)

April 1995 3

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

Pin numbers in parenthesis refer to the SAA1310T.

Fig.1 Block diagram.

handbook, full pagewidth

comparator 1

comparator 2

comparator 3

comparator 4

SAA1310

(SAA1310T)

V

ref

POWER-ON AND

POWER-FAILURE

DETECTOR

AMPLIFIER

FILTER

DETECTOR

WRITE

AMPLIFIER

V

ref

write

current

V

P

GNDV

P

comparator 1

non - inverting input

comparator 1

output

comparator 2

non - inverting input

comparator 2

output

comparator 3

inverting input

comparator 3

output

comparator 4

inverting input

comparator 4

output

power on/failure

output

power on/failure

capacitor

write/read

input

control head data

output

reference voltage

output

control head

input/output

control head

feedback

1

(1)

4

(4)

18

(20)

17

(19)

16

(18)

15

(17)

14

(15)

13

(14)

11

(12)

10

(11)

2

(2)

3

(3)

5

(6)

6

(7)

7

(8)

12 (13)

8

(9)

9 (10)

capstan reverse

input

MEA082 - 1

April 1995 4

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

PIN CONFIGURATION

PINNING (pins in parenthesis refer to SAA1310T)

SYMBOL PIN DESCRIPTION

CTL FB 1 (1) control head feedback
CTL I/O 2 (2) control head input/output
V

ref

3 (3) reference voltage output
CPO/FAIL 4 (4) power on/failure capacitor
CIN1 5 (6) comparator 1 input
CIN2 6 (7) comparator 2 input
CIN3 7 (8) comparator 3 input
CIN4 8 (9) comparator 4 input
V

P

9 (10) supply voltage
WRITE/

READ 10 (11) write/read input
COUT4 11 (12) comparator 4 output
GND 12 (13) ground
COUT3 13 (14) comparator 3 output
COUT2 14 (15) comparator 2 output
COUT1 15 (17) comparator 1 input
CTL DATA 16 (18) control head data output
PO/FAIL OUT 17 (19) power on/failure output
CAPREV 18 (20) capstan reverse input

book, halfpage

MEA083

1
2
3
4
5
6
7
8
9

18
17
16
15
14
13
12
11
10

CAPREV
PO/FAIL OUT
CTL DATA

COUT1

GND

COUT2
COUT3

COUT4

CTL FB
CTL I/O

V

ref

CPO/FAIL

V

P

CIN1
CIN2
CIN3
CIN4

SAA1310

WRITE/READ

handbook, halfpage

MEA084

1
2
3
4
5
6
7
8
9

10

20
19
18
17
16
15
14
13
12
11

CAPREV
PO/FAIL OUT
CTL DATA

COUT1

CTL FB
CTL I/O

V

ref

CPO/FAIL

SAA1310T

V

P

CIN1
CIN2
CIN3
CIN4

GND

COUT2
COUT3

COUT4
WRITE/READ

n.c. n.c.

Fig.2 Pin configurations.

a. SAA1310.

b. SAA1310T.

April 1995 5

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)

In accordance with the Absolute Maximum System (IEC 134)

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage range 0 6.0 V

V

I/VO

voltage on all pins except pins 11 (12) and 13 (14) 0 V

P

V

V

O

output voltage on pins 11 (12) and 13 (14) 0 18 V

T

stg

storage temperature range −65 +150 °C

T

amb

ambient temperature range 0 +70 °C

SYMBOL PARAMETER TYP. MAX. UNIT

R

th

thermal resistance (SAA1310) 75 − K/W

R

th

thermal resistance (SAA1310T) 90 − K/W

April 1995 6

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)

V

P

=5V;T

amb

=25°C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise

specified

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

P

d

power dissipation note 1 − 85 − mW

Supply pin 9 (10)

V

P

supply voltage 4.5 5.0 5.5 V

I

P

supply current read mode 10 15 20 mA

write mode; duty factor = 50% 13 18 24 mA

CTL I/O pin 2 (2)

READ MODE PIN 10 (11) < 0.5 V
V

I

input voltage (peak-to- f = 500 Hz 0.35 −− mV

peak value) f = 30 kHz; non-linear operation −−200 mV
B bandwidth low-pass filter − 3 − kHz
I

b

input bias current read mode − 0.1 −µA
WRITE MODE PIN 10 (11) > 3.5 V
V

O

output voltage LOW I

CTL I/O

= 3 mA; −−0.4 V

pin CTL DATA = HIGH

V

O

output voltage HIGH I

CTL I/O

= − 3 mA; 4.6 −− V

pin CTL DATA = LOW

WRITE/

READ pin 10 (11)

V

I

input voltage read mode −−0.5 V

write mode; analog 1.6 − 3.3 V

I

I

input current read mode −−1.5 −µA

write mode − 0.1 −µA

V

ref

pin 3 (3); note 2

V

O

output voltage 2.4 2.5 2.6 V
I

tot

total current including write current −4 −+4mA
R

O

output resistance − 0.4 0.6 Ω

CAPREV pin 18 (20)

V

IH

input voltage HIGH 2.0 −− V
V

IL

input voltage LOW −−0.8 V
I

IH

input current HIGH V

CAPREV

=5V −−10 µA

I

IH

input current LOW V

CAPREV

=0V −10 −− µA

April 1995 7

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

CTL DATA pin 16 (18)

WRITE MODE
V

IH

input voltage HIGH 2.0 −− V
V

IL

input voltage LOW −−0.8 V
I

IH

input current HIGH V

CTL DATA

=5V −−10 µA

I

IL

input current LOW V

CTL DATA

=0V −10 −− µA
READ MODE
V

OL

output voltage LOW IOL= 0.5 mA −−0.4 V

V

OH

output voltage HIGH IOH= − 50 µA 2.4 −− V

CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3

V

O

operating voltage range at decreasing V

P

1.5 − 5.5 V

V

OL

output voltage LOW IOL=1mA −−0.4 V

V

OH

output voltage HIGH IOH=1mA VP−0.9 −− V

t

d

delay time C

CAPREV

=68nF − 50 − ms

V

TL1

threshold level 1 4.5 − 4.8 V

V

TL2

threshold level 2 − 3.5 − V

I

O

source current pin 4 −−3−µA

I

O

sink current pin 4 − 300 −µA

V

O(min.)

minimum output voltage − 20 − mV

V

O(max.)

maximum output voltage − 2.1 − V

High output current type comparators

CIN3 and CIN4 pins 7 (8) and 8 (9)
V

hys

input hysteresis − 10 − mV

V

IL

input voltage LOW −−V

ref

− 10 mV V

V

IH

input voltage HIGH V

ref

+ 10 mV −− V

I

IL

input current LOW CIN3 = CIN4 = 0 V −1 −− µA

I

IH

input current HIGH CIN3 = CIN4 = V

P

−−+1µA
COUT3 and COUT4 pins 13 (14) and 11 (12)
V

OL

output voltage LOW IOL= 100 mA −−1.0 V

I

OL

=2mA −−0.4 V

±I

OL

leakage current output voltage HIGH;

COUT3 = COUT4 = 17 V

−−1µA

t

tr

transient time note 3 − 0.5 −µs

T

j

thermal protection − 130 −°C

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

April 1995 8

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

Notes to the characteristics

1. Without the sink current of the comparators; in write mode.

2. Minimum value of capacitor connected to this pin is 4.7 µF.

3. Vi= 100 mV p-p. Inputs connected to V

ref

via a 10 kΩ resistor; outputs connected to VPvia a 250 Ω resistor.

4. Vi= 100 mV p-p. Inputs connected to V

ref

via a 10 kΩ resistor; outputs connected to VPvia a 2.5 kΩ resistor.

Low output current type comparators

CIN1 AND CIN2 pins 5 (6) and 6 (7)
V

hys

input hysteresis − 10 − mV

V

IL

input voltage LOW −−V

ref

− 10 mV V

V

IH

input voltage HIGH V

ref

+ 10 mV −− V

I

I

input current CIN1 = CIN2 = 0 V −1 −− µA

CIN1 = CIN2 = V

P

− − +1 µ A
COUT1 AND COUT2 pins 15 (17) and 14 (15)
V

OL

output voltage HIGH IOH= −100 µA 4.5 −− V

V

OH

output voltage LOW IOL=2mA −−1V

t

tr

transient time note 4 − 0.5 −µs

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

April 1995 9

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

MEA085

100

100

t

d

t

d

t

d

t

d

t

d

t

V

P

V

17 (19)

t

V

TL1

V

TL2

1.5 V

Fig.3 Power-ON and power-failure detector.

April 1995 10

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

APPLICATION INFORAMTION

Fig.4 Test circuit diagram.

Pin numbers in parenthesis refer to the SAA1310T.

handbook, full pagewidth

MEA086 - 1

13

(14)

AMPLIFIER

FILTER

DETECTOR

1

(1)

2

(2)

V

P

comparator 1

comparator 2

comparator 3

comparator 4

SAA1310

(SAA1310T)

WRITE

AMPLIFIER

write

current

GND

4

(4)

18

(20)

16

(18)

15

(17)

14

(15)

11

(12)

10

(11)

3

(3)

5

(6)

6

(7)

7

(8)

12(13)

8

(9)

9(10)

V

ref

POWER-ON AND

POWER-FAILURE

DETECTOR

V

P

17

(19)

−−+

+

−

+

−

+

−

+

IV

IV

IV

IV

V

I

V

I

I

82 nF

10 µF

650 Ω

V

i

I

R

W

I

V

I

V

I

V

IV

I

I

V

ref

April 1995 11

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

handbook, full pagewidth

47
µF

4.7 nF

68
nF

47
µF

100

nF

47 kΩ

+5 V

SAA1310

(SAA1310T)

1

(1)

2

(2)

3

(3)

4

(4)

5

(6)

6

(7)

7

(8)

18

(20)

17

(19)

16

(18)

15

(17)

14

(15)

13

(14)

12

(13)

V

I

CTL head

47 µF

8

(9)

11

(12)

10

(11)

9

(10)

V

I

V

I

V

I

V

I

COUT4

COUT1

COUT2

COUT3

CAPREV

PO/FAIL OUT

CTL DATA

WRITE/READ

MEA087

Pin numbers in parenthesis refer to the SAA1310T.

Fig.5 Application diagram.

April 1995 12

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

PACKAGE OUTLINES

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

SOT102-1

93-10-14
95-01-23

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

0.2542.54 7.62

8.25

7.80

9.5

8.3

0.854.7 0.51 3.7

inches

0.055

0.044

0.021

0.015

0.013

0.009

1.40

1.14

0.055

0.044

0.86

0.84

0.26

0.24

0.15

0.13

0.010.10 0.30

0.32

0.31

0.37

0.33

0.0330.19 0.020 0.15

M

H

c

(e )

1

M

E

A

L

seating plane

A

1

w M

b

1

b

2

e

D

A

2

Z

18

1

10

9

b

E

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

DIP18: plastic dual in-line package; 18 leads (300 mil)

SOT102-1

April 1995 13

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

UNIT

A

max.

A

1

A2A

3

b

p

cD

(1)E(1) (1)

eHELLpQ

Z

ywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT163-1

10

20

w M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

April 1995 14

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

April 1995 15

Philips Semiconductors Product specification

Control interface for VHS video recorders SAA1310

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.