Datasheet SAA1300 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA1300

Tuner switching circuit

Product specification
File under Integrated Circuits, IC12

June 1987

Philips Semiconductors Product specification

Tuner switching circuit SAA1300

The SAA1300 is for switching on and off the supply lines
of various circuit parts via an I2C bus signal. Furthermore,
it can be used to supply current for switching diodes in
radio and television tuners. It contains 5 output stages,
which are capable of supplying up to 85 mA in the ON state
or sinking up to −100 µA in the OFF state.

Current limiting and short-circuit protection are included.
The output stages are driven by a shift register/latch
combination which is loaded via data from the I2C bus. A
power-on reset of the latches ensures the OFF state of the
output stages (OUT 2 to OUT 5) without data reception
from the I
connection of up to three circuits on the same I2C bus
lines; one of the outputs (OUT 1, pin 7) can also be used
as an input to select the device via a simple internal A/D
converter.

2

C bus. A subaddressing system allows the

Fig.1 Block diagram.

PACKAGE OUTLINE

9-lead SIL; plastic (SOT142); SOT142-1; 1996 September 05.

June 1987 2

Philips Semiconductors Product specification

Tuner switching circuit SAA1300

PINNING

PIN NO. SYMBOL FUNCTION

1 GND ground
2V

P

3 OUT 5
4 OUT 4
5 OUT 3
6 OUT 2
7 OUT 1 output and subaddressing input
8 SDA serial data line
9 SCL serial clock line

2

C BUS INFORMATION

I

Address, first byte

positive supply

outputs

2

I

C bus

0 1 0 0 0 A B 0 where,

A B FUNCTION CONDITION

0 0 general address OUT 1 = output
0 1 OUT 1 = input address accepted if V
1 0 OUT 1 = input address accepted if V
1 1 OUT 1 = input address accepted if V

OUT 1
OUT 1
OUT 1

= V
= V
= V

OUT L
OUT H
OUT M

(LOW)

(HIGH)

(MEDIUM)

Data, second byte
OUT 5, OUT 4, OUT 3, OUT 2, OUT 1, X, X, X
The I/O output stage (OUT 1) is switched as an input stage after a power-on reset. It depends on the contents of the first

data transmission whether the output stage is switched as an output or remains as an input.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage V

Input voltage range at SDA, SCL V
Input voltage range at OUT 1 V
Output voltage range at OUT 1 to OUT 5 V
Input current at SDA, SCL I
Input current at OUT 1 I
Total power dissipation P
Storage temperature range T
Operating ambient temperature ranges T

P
I
I

O
I
I

tot

stg

amb

max. 13,2 V

−0,5 to + 6,0 V

−0,5 to + 12,5 V

−0,5 to + 12,5 V

max. 20 mA
max. 20 mA
max. 825 mW

−40 to + 125 °C

−20 to + 80 °C

June 1987 3

Philips Semiconductors Product specification

Tuner switching circuit SAA1300

CHARACTERISTICS

V

= 8 V; T

P

Supply (pin 2)

Supply voltage range V
Supply current

5 outputs LOW I

5 outputs HIGH I
Power on reset level output stage in “OFF” condition V
Maximum power dissipation

Inputs SDA, SCL (pins 8 and 9)

Input voltage HIGH V
Input voltage LOW V
Input current HIGH −I
Input current LOW I
Acknowledge sink current I
Maximum input frequency f

Outputs OUT 1 to OUT 5 (pins 3 to 7)

Maximum output current; source: “ON” I
Maximum output current; source: “ON”

T

amb

Output voltage HIGH

at I

Oso

Output current; sink “OFF” I
Output voltage LOW

at I

Osi

Output voltage MEDIUM

at IO= 10 mA V

OUT 1 used as subaddressing input

Input voltage HIGH (code 1 0) V
Input voltage MEDIUM (code 1 1) V
Input voltage LOW (code 0 1) V

= 24 °C; unless otherwise specified

amb

PARAMETER SYMBOL MIN. TYP. MAX. UNIT

P

PL
PH

PR

(1)

= 80 °CI

= 85 mA V

= −100 µAV

P

max

IH
IL

IH
IH
ACK
i max

Oso

Oso

OH

Osi

OL

OM

OUT 1H
OUT 1M
OUT 1L

4812V

5 1015mA
30 50 70 mA

− 3,5 3,8 V

− 650 − mW

3,0 − 5,5 V
0 − 1,5 V

−−10 µA

−−0,4 µA

2,5 −−mA
100 −−kHz

+85 − +150 mA

60 −−mA

Vp−2 −−V

−100 −300 −µA

−−100 mV

VP−0,5 −−V

0,72 VP− V

P

V
0,39 VP− 0,61 VPV
0 − 0,28 VPV

Note

1. Outputs must not be driven simultaneously at maximum source current.

June 1987 4

Philips Semiconductors Product specification

Tuner switching circuit SAA1300

PACKAGE OUTLINE

SIL9MP: plastic single in-line medium power package; 9 leads

D

D

1

D

2

pin 1 index

SOT142-1

A

2

A

3

A

E

seating plane

19

Z

b

DIMENSIONS (mm are the original dimensions)

A

UNIT A A

12

mm

11

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT142-1

max.

3.7

2

3

1.8

1.4

IEC JEDEC EIAJ

e

2

b

0.67

0.50

b

1

2

1.40

1.14

bcD

1.40

1.14

b

b

1

0 5 10 mm

scale

(1)

D

21.8

21.4

21.4

20.7

0.48

0.38

REFERENCES

Q

1.75

1.55

c

Q

(1)

Z

w

max.

1.0

0.25

ISSUE DATE

95-02-09
97-12-16

L

w M

(1)

E

6.48

6.20

eL

3.9

2.54

3.4

EUROPEAN

PROJECTION

D

1

2

18.6

18.2

June 1987 5

Philips Semiconductors Product specification

Tuner switching circuit SAA1300

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

June 1987 6