Datasheet RF-W65QI35DS-EF-N-Y Specification

TG-201709280751NP

Specification

规格书

Customer Name :

客户名称

Customer P/N :

客户品号

Refond P/N : RF-WXXQI35DS-EF-N-Y

公司型号

Sending Date:

供货日期

□Technical Reference 技术参考 □Sample 样品 ■Mass Product 量产供货

Customer approval

客户审核

Refond approval

瑞丰审核

Approval

核准

Audit

确认

Confirmation

制作

Approval

核准

Audit

确认

Confirmation

制作

□Qualified □Disqualified

接受 不接受

Date ：

日期：

Address: 1-8th Floor, Building #1,10th Industrial Zone, Tian Liao Community, Gong Ming Area, Guang Ming

New District, Shenzhen, China.

地址： 深圳市光明新区公明办事处田寮社区第十工业区 1 栋一至八楼

Tel/电话：[phone] Fax/传真： [phone] Web/网址： www.refond.com

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TG-201709280751NP

RF-WXXQI35DS-EF-N-Y

Features 特征

 PLCC-2 Package.垂直型表贴封装
 Extremely wide viewing angle.发光角度大
 Suitable for all SMT assembly and solder process.适用于所有的SMT组装和焊接工艺
 Available on tape and reel.适用于载带及卷轴
 Moisture sensitivity level: 3.防潮等级：3
 Package:4000pcs/reel.包装：4000颗/卷



RoHS compliant.RoHS认证

Description 描述

 The White LED which was fabricated using a blue chip and phosphors

白光LED由芯片激发荧光粉后，混光形成。

Applications 应用

 Optical indicator.光学指示
 Indoor display.室内显示

 Landscape lighting,lamp belt. 景观照明，灯带等
 General use.其他适合的应用

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A

C

0.94

2.80

0.75

2.80

2.80

2.16

0.10

2.06

2.10

1.80

A

C

Polartity

A:anode
C:cathode

2.101.10

0.50

2.10

3.50

View

Soldering Patterns

Package Dimension 封装尺寸

TG-201709280751NP

NOTES:

1>.All dimensions units are millimeters. 所有尺寸标注单位为毫米.
2>.All dimensions tolerances are 0.2mm unless otherwise noted. 除特别标注外，所有尺寸公差为±0.2 毫米.

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Item
项目

Symbol

符号

Test Condition

测试条件

Value

Unit
单位

Min.

Max.

Typ.

Forward Voltage

Rank F2

Vf

IF=60mA

2.7

2.8

2.9

V

Rank G1

2.8

2.9

V

Rank G2

2.9

3.0

V

Rank H1

3.0

3.1

V

Rank H2

3.1

3.2

V

Rank I1

3.2

3.3

V

RF-W22QI35DS-EF-N-Y

（2100-2310K）

Rank ODA

ø

IF=60mA

11.7

13.0

13.7
lm

Rank PAA

13.0

14.4

lm

Rank PBA

14.4

16.0

lm

RF-W27QI35DS-EF-N-Y

（2568-2753K）

Rank P03

ø

IF=60mA

12.0

14.0

15.2
lm

Rank P04

14.0

16.0

lm

Rank PCH

16.0

18.0

lm

RF-W30QI35DS-EF-N-Y

（2826-3070K）

Rank P03

ø

IF=60mA

12.0

15.0

16.4
lm

Rank P04

15.0

18.0

lm

Rank PCH

18.0

20.0

lm

RF-W40QI35DS-EF-N-Y

（3850-4250K）

Rank P04

ø

IF=60mA

14.0

16.0

18.1

lm

Rank PCH

16.0

18.0

lm

Rank PED

18.0

20.0

lm

Rank PED

20.0

22.0

lm

RF-W65QI35DS-EF-N-Y

（5800-6490K）

Rank PCH

ø

IF=60mA

16.0

18.0

18.8
lm

Rank PED

18.0

20.0

lm

Rank QED

20.0

22.0

lm

Reverse Current

IR

VR=5V

---

10

---

uA

Viewing Angle

2Θ1/2

IF=60mA

---

---

120

Deg

Color Rendering Index

Ra

IF=60mA

95

---

---

---

Thermal Resistance

Rth(j-s)

IF=60mA

---

---

55

℃/W

Electrical / Optical Characteristics at Ts=25°C 电性与光学特性

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TG-201709280751NP

Parameter（参数）

Symbol（符号）

Rating（值）

Units（单位）

Power Dissipation（功耗）

Pd

231

mW

Forward Current（正向电流）

IF

70

mA

Peak Forward Current（峰值电流）

IFP

120

mA

Reverse Voltage（反向电压）

VR

5

V

Electrostatic Discharge(HBM)（静电）

ESD

2000

V

Operating Temperature（操作温度）

Topr

-40 ~ +85

℃

Storage Temperature（储存温度）

Tstg

-40 ~ +100

℃

Junction Temperature（结温）

Tj

95

℃

Absolute Maximum Ratings at Ts=25°C 绝对最大值

Note:

1. 1/10 Duty cycle, 0.1ms pulse width. 脉宽0.1ms,周期1/10.

2. The above forward voltage measurement allowance tolerance is 0.1V. 以上所示电压测量误差0.1V.

3. The below color coordinates measurement allowance tolerance is 0.003. 以下所示坐标测量误差0.003.

4. the above luminous flux measurement allowance tolerance ±10%.

5. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 使用
功率不能超过规定的最大值.

6. All measurements were made under the standardized environment of us. 所有测试都是基于我们现有的标准
测试平台.

7.When the LEDs are in operation the maximum current should be decided after measuring the package
temperature，junction temperature should not exceed the maximum rate.LED 使用的最大电流需要根据散热条

件确定，结温不能超过最大值

上述光通量的测试允许公差为±10%.

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The Chromaticity Diagram

TG-201709280751NP

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TG-201709280751NP

Note:备注

All the parameters and standards in the
specification are based on Refond standard
test platform.

规格书中所有参数和标准都是基于瑞丰的标
准测试平台。

0

20

40

60

80

2.7 2.8 2.9 3.0 3.1 3.2 3.3

Forward Current

(mA)

Forward Voltage (v)

0

0.4

0.8

1.2

1.6

10 20 30 40 50 60 70 80

Relative Intensity

Forward Current (mA)

0.4

0.6

0.8

1

1.2

15 25 35 45 55 65 75 85 95

Relative Luminous

Flux

Ts(℃)

2.8

2.9

3.0

3.1

3.2

3.3

15 25 35 45 55 65 75 85 95

Forward Voltage

(v)

Ts(℃)

0

20

40

60

80

15 25 35 45 55 65 75 85 95

Forward current

（mA)

Ts（℃）

0

0.2

0.4

0.6

0.8

1

1.2

-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90

Relative Luminous

Intensity

Angel(°)

0

0.2

0.4

0.6

0.8

1

1.2

380 430 480 530 580 630 680 730 780

Relative Emission

Intensity

Wavelength [nm]

2700K

3000K

4000K

6500K

Typical Optical Characteristics Curves 典型光学特性曲线

Fig.1-Forward Voltage Vs. Forward Current Fig.2-Forward Current Vs. Relative Intensity

伏安特性曲线 正向电流与相对光强特性曲线

Fig.3-Pin Temperature Vs. Relative Intensity Fig.4-Pin Temperature Vs. Forward Current

引脚温度与相对光强特性曲线 引脚温度与正向电流特性曲

Fig.5-Forward Voltage Vs. Pin Temperature Fig.6-Radiation diagram

电压与引脚温度特性曲线 辐射特性曲线

Fig.7- Spectrum Distribution

光谱分布特性曲线

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TG-201709280751NP

Polarity
Mark

FEED DIRECTION

Top
Tape

Front

Back

Front

Back

Packaging Specifications包装规格

 Carrier Tape Dimensions载带尺寸

 Reel Dimension卷盘尺寸

Note:备注

The tolerances unless mentioned ±0.1mm. Unit : mm注：未注

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公差为

±

0.1毫米

，尺寸单位：毫米。

 Label Form Specification 标签规格

PART NO.

Part Number 品名

SPEC

SpecNumber 规格

LOT NO.

Lot Number 批次号

BIN CODE

Bin Code 色区

Ф

Luminous flux 流明

X/Y

Chromaticity Bin 色度

VF

Forward Voltage 正向电压

QTY

Packing Quantity数量

DATE

Made Date 生产日期

PART NO.

SPEC NO.

LOT NO.

BIN CODE

：

Ф：

XY

：

VF ： QTY:

DATE:



Moisture Resistant Packing Process

防潮包装过程



Cardboard Box

纸箱

TG-201709280751NP

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Test Items

项目

Ref.Standard

参考标准

Test Condition

测试条件

Time

时间

Quantity

数量

Ac/Re

接收/拒收

Reflow

回流焊

JESD22-B106

Temp:260℃max

T=10 sec

2times.

10Pcs.

0/1

Thermal Shock

冷热冲击

JESD22-A106

-40℃ 15min
↑↓10sec

100℃ 15min

300Cycles.

10Pcs.

0/1

High Temperature Storage

高温保存

JESD22-A103

Temp.:100℃

1000Hrs.

10Pcs.

0/1

Low Temperature Storage

低温保存

JESD22-A119

Temp.:-40℃

1000Hrs.

10Pcs.

0/1

Life Test

常温老化

JESD22-A108

Ta=25℃

IF=60mA

1000Hrs.

10Pcs.

0/1

High Temperature

High Humidity Life Test

高温高湿老化

JESD22-A101

60℃/ 90%RH

IF=60mA

1000Hrs.

10Pcs.

0/1

Test Items

项目

Symbol

符号

Test Condition

测试条件

Criteria For Judgement

判定标准

Applicable project

适用项目

Forward Voltage

正向电压

Vf

IF=60mA

≤±10%

Reflow
Temperature Cycle
High and Low Temperature
Storage
Life Test

Luminous Flux

光通量

ø

IF=60mA

Maintenance≥90%

光通维持率

Lamp bead light test

灯珠点亮测试

/

IF=60mA

No open circuit, shortcircuit or

flicke

无开路,短路，闪变

High Temperature
High Humidity Life Test

Reliability Test Items And Conditions 可靠性测试项目及条件

Criteria For Judging Damage失效判定标准

U.S.L: Upper standard level 规格上限 L.S.L: Lower standard level 规格下限

1>.The Reliability tests are based on us existing test platform. 信赖性测试基于现有的测试平台。
2>.The technical information shown in the data sheets are limited to the typical characteristics and circuit
examples of the referenced products. It does not constitute the warranting of industrial property nor the granting
of any license. 以上技术数据仅为产品的典型值，只作为参考，不作为任何应用条件及应用方式的保证.

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SMT ReflowSoldering Instructions SMT回流焊说明

平均升温速度（Tsmax至Tp）

最高 3 °C/ 秒

预热：最低温度 (Tsmin)

150 °C

预热：最高温度 (Tsmax)

200 °C

预热：时间（tsmin至tsmax）

60 - 120 秒

限时维持高温：温度 (TL)

217 °C

限时维持高温：时间 (tL)

最多60 秒

峰值 / 分类温度 (Tp)

260 °C

限时峰值分类温度:时间（tp）

最多10 秒

与实际峰值温度 (tp) 低 5 °C 以内的保持时间

最多30 秒

降温速度

最高 6 °C/ 秒

25 °C 升至峰值温度所需时间

最多 8 分钟

TG-201709280751NP

1.Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after
first, LEDs will be damaged. 回流焊次数不可以超两次，两次回流焊时间间隔如果超过24小时，LED可能由于吸湿而损坏

2.When soldering , do not put stress on the LEDs during heating当焊接时，不要在材料受热时用力压胶体表面。

 SolderingIron 烙铁焊接

1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds

当手工焊接时，烙铁的温度必须小于300℃，时间不可超过3秒。

2.The hand solder should be done only one time.手工焊接只可焊接一次。

 Repairing 修补

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,a double-head soldering iron
should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or will not be
damaged by repairing. LED回流焊后不应该修复，当必须修复时，必须使用双头烙铁，而且事先应确认此种方式会不会损坏

LED本身的特性。

 Cautions 注意事项

1.The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The

pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong

pressure on the encapsulated part. So when usethe picking up nozzle, the pressure on the silicone resin should be proper.

LED封装胶为硅胶，表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在按压器件，当使用吸嘴时，胶

体表面的压力应是恰当的。

2.Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. Do

not rapidly cool device after soldering. 回流焊之后冷却过程中，不要对材料实加外力，也不要有震动，回流焊后，不要采

用激剧冷却的方式。

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Handling Precautions 使用注意事项

1>.LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage
material. This is provided for informational purposes only and is not a warranty or endorsement.LED工作环境及与

LED适配的材料中，硫元素及化合物成份不可超过100PPM，单一的溴元素含量要求小于900PPM，单一氯元素含
量要求小于900PPM，溴元素与氯元素总含量必须小于1500PPM（检测含量为与LED直接接触面上元素含量）。

2>.VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate
silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a
significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in
the construction of fixtures can help prevent these issues. Refond advises against the use of any chemicals or
materials that have been found or are suspected to have an adverse affect on device performance or reliability.
To verify compatibility, Refond recommends that all chemicals and materials be tested in the specific application
and environment for which they are intended to be used. Attaching LEDs, do not use adhesives that outgas
organic vapor. 应用套件中的挥发性物质会渗透到LED内部，可能对LED性能或者可靠性不利，在通电情况下会加

剧影响。因此客户需提前验证，避免套件材料或其他组装原物料存在未经验证的挥发性物质，针对特定的用途和使

用环境，瑞丰建议对所有的物质和材料进行相容性的测试。

3>.Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or
Handle the silicone lens surface, it may damage the internal circuitry.

通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路。

4>.In designing a circuit,the current through each LED must be exceed the absolute maximum rating specified for
each LED.In the meanwhile,resistors for protection should be applied,otherwise slight voltage shift will cause big
current change,burn out may happen. The driving circuit must be designed to allow forward voltage only when it is
ON or OFF.If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.设计电路时，

通过LED的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压变化将会引起较大电流变化，可
能导致产品损毁。电路设计必须保证只有在开启或者关闭的时候出现正向电压的变化，不要施加反压，否则会损坏LED。

5>.Thermal Design is paramount importance because heat generation may result in the Characteristics decline,such
as brightness decreased,Color change and so on.Please consider the heat generation of the LEDs when making the
system design.LED容易因为自身的发热和环境的温度改变而改变，温度升高会降低LED发光效率，影响发光颜色，所

以在设计时应充分考虑散热问题。

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Conditions

种类

Temperature

温度

Humidity

湿度

Time

时间

Storage

储存

Before Opening Aluminum Bag

拆包前

≤30℃

≤75%

Within 1 Year from Delivery Date

一年内

After Opening Aluminum Bag

拆包后

≤30℃

≤60%

24hours

24小时

Baking

烘烤

60±5℃

-

≥24hours

大于24小时

6>.Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust，
requiring special care during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. Refond
suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents
do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause
damage to the LED. 与其他封装胶相比，硅胶通常较软，表面易吸附脏物，应用时应特别注意，当对产品洁净度要求

较高时，应当采用恰当的清洗方式，我们推荐用异丙醇作清洗剂，如需要用到其他清洗剂，必须保证不会破坏封装体，

超声清洗可能会对LED带来损害，不推荐这种清洗方式。
7>. Storage 储存

If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking
treatment should be performed after unpacking and based on the following condition: (60±5)℃ for above 24
hours。

如果干燥剂或包装失效，或者产品不符合以上有效储存条件，需拆包后进行烘烤，烘烤条件: 60±5℃，大于 24 小时。

If the package is flatulence or damaged, please notify the sales staff to assist。
如果包装袋胀气或者破损，请通知销售人员协助处理。

8>.Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over
Stress (EOS). LED为半导体器件，对静电敏感，生产和使用时需要做好防护。

9>.There should be Revalidated when there is any change on the use condition(like fixture type, raw material,Radiating

change ) after the approval.产品承认后，如需变更使用环境条件（如：转换产品种类和结构），必须重新验证。

10>.When you have special quality requirement for the product, please kindly contact to our sales.对产品有特殊

质量要求时，请提前咨询瑞丰的销售人员以取得相关信息。

11>.When using LED, clients shall pay attention to the defined specs and using environment requires.Refond will
give no quality guarantee on the situation: if using in conditions that out of specs or over reference conditions
which without verifying,客户在应用LED时，需参考此规格书参数及使用环境要求，未经验证情况下超出参数或标准

条件使用，瑞丰不作任何品质担保。

12>.The customer shall not disassemble or analyze the LEDs without having consent from Refond. When
defective LEDs are found, the customer shall inform Refond in writing directly before disassembling or analysis.

在取得瑞丰的同意前，客户不应对产品进行拆解分析，如发现失效产品，请直接书面通知瑞丰。

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13>.Other points for attention, please refer to our LED user manual.

其它注意事项请参照瑞丰 LED 使用手册。

Declare申明

This specification is written both in English and in Chinese and the latter is formal.
此规格书以中英文方式书写，若有冲突以中文版本为准.
Both the customers and Refond will agree on official specifications of supplied products before a
customer’s volume production.

在量产供货前，瑞丰需与客户签署一份正式的产品规格书并各自备份。

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