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NDP7050L / NDB7050L
N-Channel Logic Level Enhancement Mode Field Effect Transistor
General Description Features
March 1996
These logic level N-Channel enhancement mode power field
effect transistors are produced using Fairchild's proprietary,
high cell density, DMOS technology. This very high density
process has been especially tailored to minimize on-state
resistance, provide superior switching performance, and
withstand high energy pulses in the avalanche and
commutation modes. These devices are particularly suited for
low voltage applications such as automotive, DC/DC
converters, PWM motor controls, and other battery powered
circuits where fast switching, low in-line power loss, and
resistance to transients are needed.
75A, 50V, R
= 0.015Ω @ VGS = 5V
DS(ON)
Low drive requirements allowing operation directly from logic
drivers. V
GS(TH)
< 2.0V.
Critical DC electrical parameters specified at elevated
temperature.
Rugged internal source-drain diode can eliminate the need
for an external Zener diode transient suppressor.
175°C maximum junction temperature rating.
High density cell design for extremely low R
DS(ON)
.
TO-220 and TO-263 (D2PAK) package for both through hole
and surface mount applications.
________________________________________________________________________________
D
G
S
Absolute Maximum Ratings T
= 25°C unless otherwise noted
C
Symbol Parameter NDP7050L NDB7050L Units
V
DSS
V
DGR
V
GSS
I
D
Drain-Source Voltage 50 V
Drain-Gate Voltage (RGS < 1 MΩ )
50 V
Gate-Source Voltage - Continuous ± 20 V
- Nonrepetitive (tP < 50 µs)
± 40
Drain Current - Continuous 75 A
- Pulsed 225
P
D
Total Power Dissipation @ TC = 25°C
150 W
Derate above 25°C 1 W/°C
TJ,T
Operating and Storage Temperature Range -65 to 175 °C
STG
© 1997 Fairchild Semiconductor Corporation
NDP7050L.SAM
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Electrical Characteristics (T
= 25°C unless otherwise noted)
C
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE AVALANCHE RATINGS (Note 1)
W
I
AR
Single Pulse Drain-Source Avalanche
DSS
Energy
VDD = 25 V, ID = 75 A 550 mJ
Maximum Drain-Source Avalanche Current 75 A
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
DSS
Zero Gate Voltage Drain Current
VGS = 0 V, ID = 250 µA
VDS = 50 V, V
GS
= 0 V
TJ = 125°C
Gate - Body Leakage, Forward
VGS = 20 V, VDS = 0 V
Gate - Body Leakage, Reverse VGS = -20 V, VDS = 0 V -100 nA
50 V
250 µA
1 mA
100 nA
ON CHARACTERISTICS (Note 1)
V
R
I
g
D(on)
FS
GS(th)
DS(ON)
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
TJ = 125°C
Static Drain-Source On-Resistance VGS = 5 V, ID = 37.5 A 0.01 0.015
TJ = 125°C
On-State Drain Current
VGS = 5 V, VDS = 10 V
Forward Transconductance VDS = 10 V, ID = 37.5 A 15 67 S
1 1.3 2 V
0.65 0.8 1.5
Ω
0.016 0.024
75 A
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 1100 1600 pF
Reverse Transfer Capacitance 310 800 pF
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
4200 4000 pF
SWITCHING CHARACTERISTICS (Note 1)
t
t
t
t
Q
Q
Q
D(on)
r
D(off)
f
g
gs
gd
Turn - On Delay Time VDD = 30 V, ID = 75 A,
Turn - On Rise Time 460 600 nS
VGS = 5 V, R
GEN
= 10Ω
23 40 nS
RGS = 10 Ω
Turn - Off Delay Time 100 150 nS
Turn - Off Fall Time 270 400 nS
Total Gate Charge
Gate-Source Charge 13 nC
VDS = 48 V,
ID = 75 A, VGS = 5 V
86 115 nC
Gate-Drain Charge 62 nC
NDP7050L.SAM
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Electrical Characteristics (T
= 25°C unless otherwise noted)
C
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE DIODE CHARACTERISTICS
I
ISM
V
t
I
S
SD
rr
rr
Maximum Continuos Drain-Source Diode Forward Current 75 A
Maximum Pulsed Drain-Source Diode Forward Current 225 A
Drain-Source Diode Forward Voltage VGS = 0 V, IS = 37.5 A (Note 1) 0.92 1.3 V
TJ = 125°C
Reverse Recovery Time VGS = 0 V, IF = 60A,
Reverse Recovery Current 4.6 10 A
dIF/dt = 100 A/µs
0.85 1.2
108 150 ns
THERMAL CHARACTERISTICS
R
θ
R
θ
Note:
1. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.
Thermal Resistance, Junction-to-Case 1 ° C/W
JC
Thermal Resistance, Junction-to-Ambient 62.5 ° C/W
JA
NDP7050L.SAM
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Typical Electrical Characteristics
120
100
D
I , DRAIN-SOURCE CURRENT (A)
V = 10V
GS
5.0
80
60
40
20
4.5
0
0 0.5 1 1.5 2 2.5 3
6.0
4.0
3.5
3.0
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1. On-Region Characteristics
2
I = 40A
1.75
1.5
1.25
DS(ON)
0.75
DRAIN-SOURCE ON-RESISTANCE
0.5
D
V = 10V
GS
1
-50 -25 0 25 50 75 100 125 150 175
T , JUNCTION TEMPERATURE (°C)
J
2.5
2
1.8
1.6
1.4
1.2
DS(on)
R , NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
0.8
0.6
V = 3.0V
GS
3.5
4.0
4.5
1
0 20 40 60 80 100 120
I , DRAIN CURRENT (A)
D
5.0
Figure 2. On-Resistance Variation with Gate
Voltage and Drain Current
2
V = 5V
GS
1.8
1.6
1.4
1.2
1
DS(on)
R , NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
0.8
0.6
0 20 40 60 80 100 120
T = 125°C
J
25°C
I , DRAIN CURRENT (A)
D
-55°C
6.0
10
Figure 3. On-Resistance Variation
with Temperature
80
V = 10V
DS
60
T = -55°C
J
125°C
Figure 4. On-Resistance Variation with Drain
Current and Temperature
1.4
1.2
25°C
1
40
0.8
D
I , DRAIN CURRENT (A)
20
0
0 1 2 3 4
V , GATE TO SOURCE VOLTAGE (V)
GS
GS(th)
0.6
GATE-SOURCE THRESHOLD VOLTAGE
0.4
-50 -25 0 25 50 75 100 125 150 175
T , JUNCTION TEMPERATURE (°C)
J
Figure 5. Transfer Characteristics Figure 6. Gate Threshold Variation with
Temperature
V = V
GS DS
I = 250µA
D
NDP7050L.SAM
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Typical Electrical Characteristics (continued)
1.15
I = 250µA
D
1.1
1.05
1
DSS
0.95
DRAIN-SOURCE BREAKDOWN VOLTAGE
0.9
-50 -25 0 25 50 75 100 125 150 175
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Breakdown Voltage Variation with
Temperature
7000
5000
2000
1000
CAPACITANCE (pF)
f = 1 MHz
500
V = 0V
300
200
GS
1 2 3 5 10 20 30 50
V , DRAIN TO SOURCE VOLTAGE (V)
DS
C
iss
80
50
V = 0V
GS
10
T = 125°C
J
1
0.1
0.01
S
I , REVERSE DRAIN CURRENT (A)
0.001
0.2 0.4 0.6 0.8 1 1.2 1.4
25°C
V , BODY DIODE FORWARD VOLTAGE (V)
SD
-55°C
Figure 8. Body Diode Forward Voltage
Variation with Current and Temperature
10
I = 75A
D
8
C
oss
C
rss
6
4
2
GS
V , GATE-SOURCE VOLTAGE (V)
0
0 40 80 120 160
Q , GATE CHARGE (nC)
g
V = 12V
DS
48V
24V
Figure 9. Capacitance Characteristics Figure 10. Gate Charge Characteristics
t t
on off
r
90%
10%
50%
10%
PULSE WIDTH
t
d(off)
V
GEN
R
GEN
V
DD
t
d(on)
V
IN
G
R
GS
R
L
D
V
OUT
V
OUT
DUT
V
IN
S
Figure 11. Switching Test Circuit Figure 12. Switching Waveforms
50%
90%
90%
10%
t t
f
INVERTED
NDP7050L.SAM
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Typical Electrical Characteristics (continued)
100
V =10V
DS
80
60
40
20
FS
g , TRANSCONDUCTANCE (SIEMENS)
0
0 10 20 30 40 50 60
I , DRAIN CURRENT (A)
D
T = -55°C
J
25°C
125°C
Figure 13. Transconductance Variation with Drain
300
200
DS(ON)
R Limit
100
50
20
10
V = 10V
5
D
I , DRAIN CURRENT (A)
2
1
GS
SINGLE PULSE
o
R = 1 C/W
JC
θ
T = 25 °C
C
1 2 3 5 10 20 30 50 100
V , DRAIN-SOURCE VOLTAGE (V))
DS
100µs
1ms
10ms
100ms
DC
Figure 14. Maximum Safe Operating Area
10µs
Current and Temperature
1
0.5
0.3
0.2
0.1
0.05
0.03
r(t), NORMALIZED EFFECTIVE
0.02
TRANSIENT THERMAL RESISTANCE
0.01
0.01 0.05 0.1 0.5 1 5 10 50 100 500 1000
D = 0.5
0.2
0.1
0.05
0.02
0.01
Single Pulse
t ,TIME (ms)
1
R (t) = r(t) * R
JC
θ
R = 1.0 °C/W
JC
θ
P(pk)
t
1
t
2
T - T = P * R (t)
J
C
Duty Cycle, D = t /t
θ
JC
1 2
JC
θ
Figure 15. Transient Thermal Response Curve
NDP7050L.SAM