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NDS331N
N-Channel Logic Level Enhancement Mode Field Effect Transistor
General Description Features
July 1996
These N-Channel logic level enhancement mode power field
effect transistors are produced using Fairchild's proprietary,
high cell density, DMOS technology. This very high density
process is especially tailored to minimize on-state resistance.
These devices are particularly suited for low voltage
applications in notebook computers, portable phones, PCMCIA
cards, and other battery powered circuits where fast
switching, and low in-line power loss are needed in a very
small outline surface mount package.
1.3 A, 20 V. R
R
= 0.21 Ω @ VGS= 2.7 V
DS(ON)
= 0.16 Ω @ VGS= 4.5 V.
DS(ON)
Industry standard outline SOT-23 surface mount package
using poprietary SuperSOTTM-3 design for superior thermal
and electrical capabilities.
High density cell design for extremely low R
DS(ON)
.
Exceptional on-resistance and maximum DC current
capability.
_______________________________________________________________________________
D
G
S
Absolute Maximum Ratings T
= 25°C unless otherwise noted
A
Symbol Parameter NDS331N Units
V
DSS
V
GSS
I
D
Drain-Source Voltage 20 V
Gate-Source Voltage - Continuous 8 V
Maximum Drain Current - Continuous (Note 1a) 1.3 A
- Pulsed 10
P
D
TJ,T
Maximum Power Dissipation (Note 1a) 0.5 W
(Note 1b) 0.46
Operating and Storage Temperature Range -55 to 150 °C
STG
THERMAL CHARACTERISTICS
R
JA
θ
R
JC
θ
© 1997 Fairchild Semiconductor Corporation
Thermal Resistance, Junction-to-Ambient
(Note 1a)
Thermal Resistance, Junction-to-Case (Note 1) 75 °C/W
250 °C/W
NDS331N Rev.E
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ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
I
GSSR
DSS
Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 20 V
Zero Gate Voltage Drain Current
Gate - Body Leakage, Forward
Gate - Body Leakage, Reverse
VDS = 16 V, VGS= 0 V
TJ =125°C
VGS = 8 V, VDS = 0 V
VGS = -8 V, VDS= 0 V
1 µA
10 µA
100 nA
-100 nA
ON CHARACTERISTICS (Note 2)
V
GS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
0.5 0.7 1 V
TJ =125°C 0.3 0.53 0.8
R
DS(ON)
Static Drain-Source On-Resistance
VGS = 2.7 V, ID = 1.3 A
0.15 0.21
Ω
TJ =125°C 0.24 0.4
0.11 0.16
4
I
D(ON)
g
VGS = 4.5 V, ID = 1.5 A
On-State Drain Current VGS = 2.7 V, VDS = 5 V 3 A
VGS = 4.5 V, VDS = 5 V
FS
Forward Transconductance VDS = 5 V, I
= 1.3 A, 3.5 S
D
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 85 pF
VDS = 10 V, VGS = 0 V,
f = 1.0 MHz
Reverse Transfer Capacitance 28 pF
162 pF
SWITCHING CHARACTERISTICS (Note 2)
t
t
t
t
Q
Q
Q
D(on)
r
D(off)
f
Turn - On Delay Time
Turn - On Rise Time 25 40 ns
VDD = 5 V, ID = 1 A,
VGS = 5 V, R
Gen
= 6 Ω
Turn - Off Delay Time 10 20 ns
Turn - Off Fall Time 5 20 ns
g
gs
gd
Total Gate Charge
Gate-Source Charge 0.3 nC
Gate-Drain Charge 1 nC
VDS = 5 V, ID = 1.3 A,
VGS = 4.5 V
5 20 ns
3.5 5 nC
NDS331N Rev.E
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Electrical Characteristics (T
= 25°C unless otherwise noted)
A
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
I
SM
V
SD
Notes:
1. R
design while R
P
Typical R
a. 250
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
Maximum Continuous Drain-Source Diode Forward Current 0.42 A
Maximum Pulsed Drain-Source Diode Forward Current 10 A
Drain-Source Diode Forward Voltage VGS = 0 V, IS = 0.42 A (Note 2) 0.8 1.2 V
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
JA
θ
D
is determined by the user's board design.
CA
θ
−
T
J
(t)
=
R
θJ A
using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
JA
θ
b. 270oC/W when mounted on a 0.001 in2 pad of 2oz copper.
1a
−
T
T
T
A
(t)
o
A
2
J
=
C/W when mounted on a 0.02 in2 pad of 2oz copper.
= I
(t) × R
DS(ON ) T
R
θ
J C
D
+R
(t)
θ
CA
J
1b
is guaranteed by
JC
θ
NDS331N Rev.E
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D
D
Typical Electrical Characteristics
4
V =4.5V
GS
3.0
3
2
2.7
2.5
2.0
1.5
1
D
I , DRAIN-SOURCE CURRENT (A)
0
0 1 2 3
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1. On-Region Characteristics.
1.8
I = 1.3A
D
1.6
V = 2.7V
GS
1.4
1.2
DS(ON)
1
R , NORMALIZED
0.8
DRAIN-SOURCE ON-RESISTANCE
0.6
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
Figure 3. On-Resistance Variation
with Temperature.
1.75
1.5
V = 2.0V
GS
1.25
2.5
1
DS(on)
R , NORMALIZED
0.75
DRAIN-SOURCE ON-RESISTANCE
0.5
0 0.5 1 1.5 2 2.5 3
2.7
3.0
I , DRAIN CURRENT (A)
3.5
Figure 2. On-Resistance Variation
with Drain Current and Gate Voltage.
1.75
V = 2.7 V
GS
1.5
1.25
1
DS(on)
R , NORMALIZED
0.75
DRAIN-SOURCE ON-RESISTANCE
0.5
0 0.5 1 1.5 2 2.5 3
T = 125°C
J
25°C
-55°C
I , DRAIN CURRENT (A)
Figure 4. On-Resistance Variation
with Drain Current and Temperature.
4.5
4
V = 5.0V
DS
3
2
1
D
I , DRAIN CURRENT (A)
0
0 0.5 1 1.5 2 2.5 3
V , GATE TO SOURCE VOLTAGE (V)
GS
T = -55°C
J
25°C
125°C
Figure 5. Transfer Characteristics.
1.3
1.2
1.1
1
0.9
th
0.8
V , NORMALIZED
0.7
0.6
GATE-SOURCE THRESHOLD VOLTAGE
0.5
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
V = V
DS GS
I = 250µA
D
Figure 6. Gate Threshold Variation
with Temperature.
NDS331N Rev.E
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Typical Electrical Characteristics (continued)
DS
1.12
I = 250µA
D
1.08
1.04
1
DSS
BV , NORMALIZED
0.96
DRAIN-SOURCE BREAKDOWN VOLTAGE
0.92
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Breakdown Voltage Variation with
Temperature.
600
400
200
100
50
CAPACITANCE (pF)
f = 1 MHz
20
V = 0V
GS
10
0.1 0.2 0.5 1 2 5 10 20
V , DRAIN TO SOURCE VOLTAGE (V)
C
C
C
iss
oss
rss
1
V = 0V
GS
0.1
0.01
0.001
S
I , REVERSE DRAIN CURRENT (A)
0.0001
0 0.2 0.4 0.6 0.8 1 1.2
T = 125°C
J
25°C
-55°C
V , BODY DIODE FORWARD VOLTAGE (V)
SD
Figure 8. Body Diode Forward Voltage Variation with
Source Current and Temperature.
5
I = 1.3A
D
4
3
2
1
GS
V , GATE-SOURCE VOLTAGE (V)
0
0 1 2 3 4 5
Q , GATE CHARGE (nC)
g
V = 5V
DS
10V
15V
Figure 9. Capacitance Characteristics.
V
DD
V
IN
D
V
GS
R
GEN
G
S
Figure 11. Switching Test Circuit.
Figure 10. Gate Charge Characteristics.
t t
on off
t
V
d(on)
OUT
R
L
V
OUT
DUT
r
90%
10%
t
d(off)
90%
10%
tt
f
INVERTED
90%
V
IN
50%
50%
10%
PULSE WIDTH
Figure 12. Switching Waveforms.
NDS331N Rev.E
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Typical Electrical Characteristics (continued)
8
V = 5.0V
DS
T = -55°C
6
J
25°C
4
2
FS
g , TRANSCONDUCTANCE (SIEMENS)
0
0 1 2 3 4
I , DRAIN CURRENT (A)
D
125°C
Figure 13. Transconductance Variation with Drain
Current and Temperature.
1
0.8
0.6
1a
1b
0.4
0.2
STEADY-STATE POWER DISSIPATION (W)
0
0 0.1 0.2 0.3 0.4
2oz COPPER MOUNTING PAD AREA (in )
4.5"x5" FR-4 Board
o
T = 25 C
A
Still Air
2
20
10
3
RDS(ON) LIMIT
1
100ms
1s
0.3
0.1
D
I , DRAIN CURRENT (A)
0.03
0.01
V = 2.7V
GS
SINGLE PULSE
R =See Note1b
JA
θ
T = 25°C
A
0.1 0.2 0.5 1 2 5 10 20 30
V , DRAIN-SOURCE VOLTAGE (V)
DS
10s
DC
Figure 14. Maximum Safe Operating Area.
1.8
1.6
1.4
1a
1.2
1b
D
I , STEADY-STATE DRAIN CURRENT (A)
1
0 0.1 0.2 0.3 0.4
2oz COPPER MOUNTING PAD AREA (in )
4.5"x5" FR-4 Board
T = 25 C
A
Still Air
V = 2.7V
GS
100us
10ms
o
2
Figue 15. SuperSOT
Steady-State Power Dissipation. versus Copper
TM _
3 Maximum
Figure 16. Maximum Steady-State Drain
Current versus Copper Mounting Pad. Area
Mounting Pad Area.
1
D = 0.5
0.5
R (t) = r(t) * R
JA
0.2
0.2
0.1
0.1
0.05
0.05
0.02
0.02
0.01
0.01
0.005
r(t), NORMALIZED EFFECTIVE
0.002
TRANSIENT THERMAL RESISTANCE
0.001
0.0001 0.001 0.01 0.1 1 10 100 300
Single Pulse
t , TIME (sec)
1
θ
R = See Note 1b
θJA
P(pk)
t
1
t
2
T - T = P * R (t)
J
A
Duty Cycle, D = t /t
JA
θ
θ
JA
1
2
Figure 17. Transient Thermal Response Curve.
Note : Thermal characterization performed using the conditions described in note 1b. Transient thermal
response will change depending on the circuit board design.
NDS331N Rev.E
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TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E2CMOS
EnSigna
TM
TM
FACT™
FACT Quiet Series™
STAR*POWER is used under license
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or
In Design
First Production
Full Production
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H4
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