2N7000/2N7002/NDF7000A/NDS7002A
N-Channel Enhancement Mode Field Effect Transistor
2N7000/2N7002/NDF7000A/NDS7002A N-Channel Enhancement Mode Field Effect Transistor
General Description
These n-channel enhancement mode field effect transistors
are produced using National’s very high cell density third
generation DMOS technology. These products have been
designed to minimize on-state resistance provide rugged
and reliable performance and fast switching. They can be
used, with a minimum of effort, in most applications requiring up to 400 mA DC and can deliver pulsed currents up to
Features
Y
Efficient high density cell design approaching
(3 million/in
Y
Voltage controlled small signal switch
Y
Rugged
Y
High saturation current
Y
Low RDS(ON)
2
)
2A. This product is particularly suited to low voltage, low
current applications, such as small servo motor controls,
power MOSFET gate drivers, and other switching applications.
TL/G/11378– 2
TO-92
7000 Series
TL/G/11378– 1
TO-236 AB
(SOT-23)
TL/G/11378– 3
7002 Series
Absolute Maximum Ratings
SymbolParameter2N70002N7002NDF7000ANDS7002AUnits
V
DSS
V
DGR
V
GSS
I
D
P
D
TJ,T
T
L
Drain-Source Voltage60V
Drain-Gate Voltage (R
Gate-Source Voltage
s
1MX)60V
GS
g
40V
Drain CurrentÐContinuous200115400280mA
ÐPulsed50080020001500mA
Total Power Dissipation@T
e
25§C400200625300mW
A
Derating above 25§C3.21.652.4mW/§C
Operating and Storage Temperature Range
STG
Maximum Lead Temperature for Soldering
Purposes, (/16* from Case for 10 Seconds
b
55 to 150
300
b
65 to 150
C
§
C
§
C
1995 National Semiconductor CorporationRRD-B30M115/Printed in U. S. A.
TL/G/11378
Page 2
2N7000
e
T
Electrical Characteristics
SymbolParameterConditionsMinTypMaxUnits
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
ON CHARACTERISTICS*
V
GS(th)
r
DS(ON)
V
DS(ON)
I
D(ON)
g
FS
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
SWITCHING CHARACTERISTICS*
t
on
t
off
BODY-DRAIN DIODE RATINGS
I
S
I
SM*
V
SD*
THERMAL CHARACTERISTICS
R
iJA
R
iJC
*Pulse Test: Pulse Widths300 ms, Duty Cycles2.0%.
Drain-Source Breakdown VoltageV
DSS
Zero Gate Voltage Drain CurrentV
Gate-Body Leakage, ForwardV
Gate Threshold VoltageV
Static Drain-SourceV
On-Resistance
Drain-Source On-VoltageV
On-State Drain CurrentV
Forward TransconductanceV
Input CapacitanceV
Output Capacitance1125pF
Reverse Transfer Capacitance45pF
Turn-On TimeV
Turn-Off Time
Maximum Continuous Drain-Source Diode Forward Current200mA
Maximum Pulsed Drain-Source Diode Forward Current500mA
Drain-Source Diode Forward VoltageV
Thermal Resistance, Junction to Ambient312.5§C/W
Thermal Resistance, Junction to Case40
25§C unless otherwise noted
C
e
0V, I
GS
DS
GS
DS
GS
GS
V
GS
GS
DS
DS
DD
R
G
GS
e
eb
e
e
e
e
e
e
e
e
e
e
48V, V
15V, V
VGS,I
10V, I
10V, I
4.5V, I
4.5V, V
10V, I
25V, V
15V, I
25X,R
0V, I
D
S
e
10 mA60V
e
0V1mA
GS
e
T
125§C1mA
C
e
0V
DS
e
1 mA0.82.13V
D
e
0.5A1.25X
D
e
125§C1.99X
T
C
e
0.5A0.62.5V
D
e
75 mA0.140.4V
D
e
10V75600mA
DS
e
200 mA100320ms
D
e
0V, fe1.0 MHz2060pF
GS
e
0.5V, V
D
e
25X
L
e
200 mA1.5V
e
10V,10ns
GS
b
10nA
10ns
C/W
§
2
Page 3
2N7002
e
T
Electrical Characteristics
SymbolParameterConditionsMinTypMaxUnits
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
I
GSSR
ON CHARACTERISTICS*
V
GS(th)
r
DS(ON)
V
DS(ON)
I
D(ON)
g
FS
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
SWITCHING CHARACTERISTICS*
t
ON
t
OFF
BODY-DRAIN DIODE RATINGS
I
S
I
SM
VSD*Drain-Source Diode Forward VoltageV
THERMAL CHARACTERISTICS
R
iJA
*Pulse Test: Pulse Widths300 ms, Duty Cycles2.0%.
Drain-Source Breakdown VoltageV
DSS
Zero Gate Voltage Drain CurrentV
Gate-Body Leakage, ForwardV
Gate-Body Leakage, ReverseV
Gate Threshold VoltageV
Static Drain-SourceV
On-Resistance
Drain-Source On-VoltageV
On-State Drain CurrentV
Forward TransconductanceV
Input CapacitanceV
Output Capacitance1125pF
Reverse Transfer Capacitance45pF
Turn-On TimeV
Turn-Off Time
Maximum Continuous Drain-Source Diode Forward Current115mA
Maximum Pulsed Drain-Source Diode Forward Current800mA
Thermal Resistance, Junction to Ambient625§C/W
25§C unless otherwise noted
C
e
e
0V, I
GS
DS
GS
GS
DS
GS
V
GS
GS
V
GS
GS
DS
DS
DD
R
GEN
GS
D
e
60V, V
GS
e
20V100nA
eb
20V
e
VGS,I
D
e
10V, I
D
e
e
5V, I
D
e
10V, I
D
e
e
5V, I
D
e
10V, V
DS
t
2V
DS(ON),ID
e
25V, V
GS
e
30V, I
D
e
25X,R
e
e
0V, I
S
10 mA60V
e
0V1mA
e
T
125§C500mA
C
b
100nA
e
250 mA12.12.5V
e
0.5A1.27.5X
e
T
125§C213.5X
C
50 mA1.77.5X
e
T
125§C2.813.5X
C
e
0.5A0.63.75V
50 mA0.091.5V
t
2V
DS(ON)
e
200 mA80320ms
e
0V, fe1.0 MHz2050pF
e
200 mA, V
e
L
150X
e
10V,20ns
GS
5002700mA
20ns
115 mA1.5V
3
Page 4
NDF7000A
e
T
Electrical Characteristics
SymbolParameterConditionsMinTypMaxUnits
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
ON CHARACTERISTICS*
V
GS(th)
r
DS(ON)
V
DS(ON)
I
D(ON)
g
FS
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
SWITCHING CHARACTERISTICS*
t
on
t
off
BODY-DRAIN DIODE RATINGS
I
S
I
SM
VSD*Drain-Source Diode Forward VoltageV
THERMAL CHARACTERISTICS
R
iJA
*Pulse Test: Pulse Widths300 ms, Duty Cycles2.0%.
Drain-Source Breakdown VoltageV
DSS
Zero Gate Voltage Drain CurrentV
Gate-Body Leakage, ForwardV
Gate Threshold VoltageV
Static Drain-SourceV
On-Resistance
Drain-Source On-VoltageV
On-State Drain CurrentV
Forward TransconductanceV
Input CapacitanceV
Output Capacitance1125pF
Reverse Transfer Capacitance45pF
Turn-On TimeV
Turn-Off Time
Maximum Continuous Drain-Source Diode Forward Current400mA
Maximum Pulsed Drain-Source Diode Forward Current2000mA
Thermal Resistance, Junction to Ambient200§C/W
25§C unless otherwise noted
C
e
0V, I
GS
DS
GS
DS
GS
GS
V
GS
GS
DS
DS
DD
R
G
GS
e
eb
e
e
e
e
e
t
e
e
e
e
48V, V
15V
VGS,I
10V, I
10V, I
4.5V, I
4.5V, V
2V
DS(ON),ID
25V, V
15V, I
25X,R
0V, I
D
S
e
10 mA60V
e
0V1mA
GS
e
T
125§C1mA
C
b
10nA
e
1 mA0.82.13V
D
e
0.5A1.22X
D
e
125§C23.5X
T
C
e
500 mA0.61V
D
e
75 mA0.140.225V
D
t
2V
DS
DS(ON)
e
200 mA100320ms
e
0V, fe1.0 MHz2060pF
GS
e
500 mA, V
D
e
25X
L
e
400 mA0.881.2V
GS
e
400600mA
10V,10ns
10ns
4
Page 5
NDS7002A
e
T
Electrical Characteristics
SymbolParameterConditionsMinTypMaxUnits
OFF CHARACTERISTICS
BV
I
DSS
I
GSSF
I
GSSR
ON CHARACTERISTICS*
V
GS(th)
r
DS(ON)
V
DS(ON)
I
D(ON)
g
FS
DYNAMIC CHARACTERISTICS
C
iss
C
oss
C
rss
SWITCHING CHARACTERISTICS*
t
ON
t
OFF
BODY-DRAIN DIODE RATINGS
I
S
I
SM
VSD*Drain-Source Diode Forward VoltageV
THERMAL CHARACTERISTICS
R
iJA
*Pulse Test: Pulse Widths300 ms, Duty Cycles2.0%.
Drain-Source Breakdown VoltageV
DSS
Zero Gate Voltage Drain CurrentV
Gate-Body Leakage, ForwardV
Gate-Body Leakage, ReverseV
Gate Threshold VoltageV
Static Drain-SourceV
On-Resistance
Drain-Source On-VoltageV
On-State Drain CurrentV
Forward TransconductanceV
Input CapacitanceV
Output Capacitance1125pF
Reverse Transfer Capacitance45pF
Turn-On TimeV
Turn-Off Time
Maximum Continuous Drain-Source Diode Forward Current280mA
Maximum Pulsed Drain-Source Diode Forward Current1500mA
Thermal Resistance, Junction to Ambient417§C/W
25§C unless otherwise noted
C
e
e
0V, I
GS
DS
GS
GS
DS
GS
V
GS
GS
V
GS
GS
DS
DS
DD
R
G
GS
D
e
60V, V
GS
e
20V100nA
eb
20V
e
VGS,I
D
e
10V, I
D
e
e
5V, I
D
e
10V, I
D
e
5.0V, I
D
e
10V, V
DS
t
2V
DS(ON),ID
e
25V, V
GS
e
30V, I
25X,R
e
0V, I
D
L
e
S
e
10 mA60V
e
0V1mA
e
T
125§C500mA
C
b
100nA
e
250 mA12.12.5V
e
0.5A1.22X
e
T
125§C23.5X
C
50 mA1.73X
e
T
125§C2.85X
C
e
500 mA0.61V
e
50 mA0.090.15V
t
2V
DS(ON)
e
200 mA80320ms
e
0V, fe1.0 MHz2050pF
e
200 mA, V
e
150X
e
10V,20ns
GS
5002700mA
20ns
400 mA0.881.2V
5
Page 6
Typical Electrical Characteristics
2N7000/2N7002/NDF7000A/NDS7002A
FIGURE 1. On-Region Characteristics
FIGURE 3. Transfer Characteristics
TL/G/11378– 4
TL/G/11378– 6
FIGURE 2. r
with Drain Current and Gate Voltage
DS(ON)
Variation
FIGURE 4. Breakdown Voltage
Variation with Temperature
TL/G/11378– 5
TL/G/11378– 7
FIGURE 5. Gate Threshold Variation with Temperature
TL/G/11378– 8
FIGURE 6. On-Resistance Variation with Temperature
Note 1: Meets all JEDEC dimensional requirements for TO-236AB.
Note 2: Controlling dimension: millimeters.
Note 3: Available also in TO-236AA. Contact your local National Semiconductor representative for delivery and ordering information.
Note 4: Tape and reel is the standard packaging method for TO-236.
TL/G/11378– 21
TO-236AB (SOT-23) (Notes 3, 4)
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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CorporationEuropeHong Kong Ltd.Japan Ltd.
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Tel: 1(800) 272-9959Deutsch Tel: (
2N7000/2N7002/NDF7000A/NDS7002A N-Channel Enhancement Mode Field Effect Transistor
Fax: 1(800) 737-7018English Tel: (
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.