The 74F676 contains 16 flip-flops with provision for synchronous
parallel or serial entry and serial output. When the mode (M) input is
High, information present on the parallel data (D0–D15) inputs is
entered on the falling edge of the clock pulse (CP
When M is Low, data is shifted out of the most significant bit position
while information present on the serial (SI) input shifts into the least
significant bit position. A High signal on the chip select (CS
prevents both parallel and serial operations.
The 16 bit shift register operates in one of three modes, as indicated
in the shift register Function Table.
Hold: A High signal on the Chip Select (CS
and data is stored in the 16 registers.
Serial load: Data present on the SI pin shifts into the register on the
falling edge of CP
. Data enters the Q0 position and shifts toward
Q15 on successive clocks finally appearing on the SO pin.
Parallel load: Data present on D0–D15 is entered into the register
on the falling edge of CP
. The SO output represents the Q15 register
output.
To prevent false clocking, CP
transition of CS
.
must be Low during a Low-to-High
) input signal.
) input
) input prevents clocking
PIN CONFIGURATION
CS
CP
2D15
3
NC
4
SI
5
M
SO
6
7
D0
D1
8
D2
9
D3
1015
D4
11
GND
1213
TYPETYPICAL f
MAX
74F676110MHz48mA
V
241
CC
23
22
D14
21
D13
20
D12
19
D11
18
D10
17
D9
16
D8
D7
14
D6
D5
SF01209
TYPICAL SUPPL Y
CURRENT
(TOTAL)
ORDERING INFORMATION
COMMERCIAL RANGE
DESCRIPTION
24-Pin Plastic Slim
DIP (300mil)
24-Pin Plastic SOLN74F676DSOT137-1
VCC = 5V ±10%,
T
= 0°C to +70°C
amb
N74F676NSOT222-1
PKG DWG #
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINSDESCRIPTION
74F(U.L.)
HIGH/LOW
D0–D15Parallel data inputs1.0/1.020µA/0.6mA
SISerial data input1.0/1.020µA/0.6mA
CSChip Select input (active Low)1.0/1.020µA/0.6mA
CPClock Pulse input (active falling edge)1.0/1.020µA/0.6mA
MMode select input1.0/1.020µA/0.6mA
SOSerial data output50/331mA/20mA
NOTE: One (1.0) FAST Unit Load is defined as: 20µA in the High state and 0.6mA in the Low state.
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOL
V
V
I
IN
V
I
OUT
T
T
CC
IN
OUT
amb
stg
Supply voltage–0.5 to +7.0V
Input voltage–0.5 to +7.0V
Input current–30 to +5.0mA
Voltage applied to output in High output state–0.5 to +V
Current applied to output in Low output state40mA
Operating free-air temperature range0 to +70°C
Storage temperature–65 to +150°C
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
SYMBOLPARAMETERTEST CONDITIONS
p
p
V
IK
I
I
I
IH
I
IL
I
OS
I
CC
Input clamp voltageVCC = MIN, II = I
Input current at maximum input voltageVCC = MAX, VI = 7.0V100µA
High-level input currentVCC = MAX, VI = 2.7V20µA
Low-level input currentVCC = MAX, VI = 0.5V–0.6mA
Short-circuit output current
NO TAG
Supply current (total)VCC = MAX4872mA
VCC = MIN, VIL = MAX,
VIH = MIN, I
OH
= MAX
VCC = MIN, VIL = MAX,
VIH = MIN, I
OL
= MAX
VCC = MAX–60–150mA
±10%V
±5%V
±10%V
±5%V
IK
CC
CC
MIN
2.5V
CC
2.73.4V
CC
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value under the recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, T
3. Not more than one output should be shorted at a time. For testing I
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 10-98
Document order number:397-750-05173
yyyy mmm dd
10
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