•Simultaneous and Independent Read and Write operations
•Expandable to almost any word size and bit length
•3-State outputs
DESCRIPTION
The 74F670 is a 16-bit 3-State Register File organized as 4 words of
4 bits each. Separate Read and Write Address and Enable inputs
are available, permitting simultaneous writing into one word location
and reading from another location. The 4-bit word to be stored is
presented to four data inputs.
The Write address inputs (WA and WB) determine the location of the
stored word. The Write Address inputs should only be changed
when the Write Enable input (WE
operation. When the WE
is Low, the data is entered into the
addressed location.
The addressed location remains transparent to the data while the
WE
is Low. Data supplied at the inputs will be read out in true
(non-inverting) form from the 3-State outputs. Data and address
inputs are inhibited when the WE is High. Direct acquisition of data
stored in any of the four registers is made possible by individual
Read Address inputs (RA, RB). The addressed word appears at the
four outputs when the Read Enable (RE
the high impedance “off” state when the RE
outputs to be tied together to increase the word capacity to very
large numbers.
Up to 128 devices can be stacked to increase the word size to 512
locations by tying the 3-State outputs together. Since the limiting
factor for expansion is the output High current, further stacking is
possible by tying pullup reisistors to the outputs to increase the I
current available. Design of the Read Enable signals for the stacked
devices must ensure that there is no overlap in the Low levels which
cause more than one output to be active at the same time. Parallel
expansion to generate n-bit words is accomplished by driving the
Enable and address inputs of each device in parallel.
) is High for conventional
) is Low. Data outputs are in
is High. This permits
OH
PIN CONFIGURATION
1
D1
2
D2
3
D3
4
RB
5
RA
Q3
6
7
Q2
GND
8
TYPICAL
TYPE
PROPAGATION
DELAY
74F6706.5ns50mA
V
16
CC
15
D0
14
WA
13
WB
12
WE
11
RE
10
Q0
Q1
9
SF01178
TYPICAL
SUPPLY CURRENT
(TOTAL)
ORDERING INFORMATION
COMMERCIAL RANGE
DESCRIPTION
16-pin plastic DIPN74F670NSOT38-4
16-pin plastic SOLN74F670DSOT162-1
VCC = 5V ±10%,
T
= 0°C to +70°C
amb
PKG DWG #
INPUT AND OUTPUT LOADING AND FAN-OUT TABLE
PINSDESCRIPTION
74F(U.L.)
HIGH/LOW
D0 - D3Data inputs1.0/1.020µA/0.6mA
WA, WBWrite address inputs1.0/1.020µA/0.6mA
RA, RBRead address inputs1.0/1.020µA/0.6mA
WEWrite Enable inputs1.0/1.020mA/0.6mA
RERead Enable inputs1.0/1.020mA/0.6mA
Q0–Q3Data output150/403.0mA/24mA
NOTE:
One (1.0) FAST Unit Load is defined as: 20µA in the High state and 0.6mA in the Low state.
H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance “off” state
* = The selection of “internal latches” by Read Address
(RA and RB) are not constrained by WE
OUTPUT
Qn
or RE operation.
LOGIC SYMBOL (IEEE/IEC)
14
13
5
4
12
11
15
1
2
3
RAM 4X4
0
0
1A
3
1
0
0
2A
3
1
C4 [WRITE]
EN [READ]
1A, 4D
10
2A
9
7
6
SF01180
WRITE MODE FUNCTION TABLE
INPUTS
WEDn
LLL
LHH
HXNCData latched
H = High voltage level
L = Low voltage level
NC= No change
X = Don’t care
* = The write address (WA and WB) to the “internal latches”
must be stabled while WE
INTERNAL
LATCHES*
is Low for conventional operation.
1990 Jul 12
3
Page 4
Philips Semiconductors Product specification
74F6704 x 4 register file (3-State)
LOGIC DIAGRAM
11
RE
5
RA
4
RB
12
WE
13
WB
14
WA
6
Q
E
D
3
D3
Q
E
D
Q
E
D
Q
E
D
Q3
2
D2
1
D1
15
D0
V
=Pin 16
CC
GND=Pin 8
7
9
10
SF01181
Q2
Q1
Q0
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
Q
E
D
1990 Jul 12
4
Page 5
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
NO TAG
VOHHigh-level output voltage
V
VOLLow-level output voltage
V
74F6704 x 4 register file (3-State)
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)
SYMBOLPARAMETERRATINGUNIT
V
CC
V
IN
I
IN
V
OUT
I
OUT
T
amb
T
stg
RECOMMENDED OPERATING CONDITIONS
V
CC
V
IH
V
IL
I
IK
I
OH
I
OL
T
amb
Supply voltage–0.5 to +7.0V
Input voltage–0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in High output state–0.5 to V
CC
V
Current applied to output in Low output state48mA
Operating free-air temperature range0 to +70°C
Storage temperature–65 to +150°C
mA
Low-level output current24mA
Operating free-air temperature range070°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
LIMITS
SYMBOLPARAMETERTEST CONDITIONS
VCC = MIN, VIL = MAX
VIH = MIN, IOH = MAX
VCC = MIN, VIL = MAX
VIH = MIN, IOL = MAX
IK
VCC = MAX, V
VCC = MAX, V
= 2.7V50µA
O
= 0.5V–50µA
O
VCC = MAX–60–150mA
VCC = MAX
V
I
I
I
IH
I
IL
I
OZH
I
OZL
I
OS
I
CC
p
p
IK
Input clamp voltageVCC = MIN, II = I
Input current at maximum input voltageVCC = MAX, VI = 7.0V100µA
High-level input currentVCC = MAX, VI = 2.7V20µA
Low-level input currentVCC = MAX, VI = 0.5V–0.6mA
Off state output current,
High-level voltage applied
Off state output current,
Low-level voltage applied
Short-circuit output current
Supply current (total)
NO TAG
I
CCH
I
CCL
I
CCZ
±10%V
±5%V
±10%V
±5%V
CC
CC
CC
CC
MIN
2.4
2.73.4
TYP
NO TAG
MAX
0.350.50
0.350.50
–0.73–1.2V
5070mA
5070mA
5580mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V
3. Not more than one output should be shorted at a time. For testing I
= 5V, T
CC
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
amb
= 25°C.
, the use of high-speed test apparatus and/or sample-and-hold
OS
UNIT
1990 Jul 12
5
Page 6
Philips Semiconductors Product specification
TEST
V
0V
V
10%
,
CONDITION
C
L
50pF,
C
L
50pF,
74F6704 x 4 register file (3-State)
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
tests should be performed last.
OS
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
SYMBOLPARAMETER
= +25°C
amb
= +5.
CC
C
= 50pF,
=
R
= 500Ω
L
T
= 0°C to +70°C
amb
= +5.0V ±
CC
C
= 50pF
=
RL = 500Ω
UNIT
MINTYPMAXMINMAX
t
t
t
t
t
t
t
t
t
t
PLH
PHL
PLH
PHL
PLH
PHL
PZH
PZL
PHZ
PLZ
Propagation delay
RA, RB to Qn
Propagation delay
WE
to Qn
Propagation delay
Dn to Qn
RE Enable time
Qn to High or Low level
RE Disable time
Qn to High or Low level
Waveform 3, 4
Waveform 1, 2
Waveform 1, 2
Waveform 5
Waveform 6
Waveform 5
Waveform 6
3.5
4.0
5.0
6.5
3.5
6.0
3.0
4.5
2.0
3.0
5.5
5.5
7.0
8.5
6.0
8.0
7.0
6.5
3.0
5.0
9.0
8.5
10.0
11.5
8.5
11.0
12.0
9.0
6.5
8.5
3.0
3.5
4.5
6.0
3.0
5.5
2.5
4.0
1.5
3.0
10.0
9.9
11.0
12.5
9.5
12.5
13.0
10.0
7.5
8.5
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
AC SETUP REQUIREMENTS
LIMITS
T
= +25°CT
SYMBOLPARAMETERTEST CONDITION
amb
VCC = +5.0VVCC = +5.0V ± 10%
CL = 50pF, RL = 500ΩCL = 50pF, RL = 500Ω
MINTYPMAXMINMAX
ts(H)
ts(L)
th(H)
t
(L)
h
ts(H)
ts(L)
th(H)
th(L)
Setup time, High or Low
Dn to positive going WE
Hold time, High or Low
Dn to positive going WE
Setup time, High or Low
WA, WB to negative going WE
Hold time, High or Low
WA, WB to negative going WE
1
1
Waveform 3, 4
Waveform 3, 4
Waveform 3, 4
Waveform 3, 4
1.5
6.0
0
1.0
0
0
0
0
tw(L)WE Pulse width, LowWaveform 3, 46.58.5ns
NOTES:
1. Write Address (WA, WB) setup time will protect the data written into the previous address. If protection of data in the previous address is not
required, setup time for Write Address to WE
time for Write Address to WE
will result in data being written into that location.
can be ignored. Any address selection sustained for the final 7ns of the WE pulse during hold
= 0°C to +70°C
amb
1.5
7.0
0
1.0
0
0
0
0
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
1990 Jul 12
6
Page 7
Philips Semiconductors Product specification
74F6704 x 4 register file (3-State)
AC WAVEFORMS
For all waveforms, VM=1.5V.
The shaded areas indicate when the input is permitted to change for predictable output performance.
V
Dn
WE
Qn
M
t
PLH
V
M
Waveform 1. Propagation Delay, Write Enable
and Data to Outptus
WA, WB
Dn
WE
V
M
t
s
V
t
tw(L)
V
M
V
t
PHL
M
V
M
t
PLH
V
M
V
M
SF01183
Dn
V
M
t
PHL
V
M
WE
Qn
SF01182
Waveform 2. Propagation Delay, Write Enable
and Data to Outputs
V
M
t
h
V
M
M
t
s
h
V
M
RA, RB
Qn
Qn
t
PHL
t
PLH
V
M
V
V
V
M
V
M
M
M
t
PLH
V
M
t
PHL
V
M
SF01184
Waveform 3. Setup and Hold Times for Write Address to Write
Enable and Data to Write Enable
Qn
RE
V
M
t
PZH
V
M
t
PHZ
V
M
VOH -0.3V
0V
SF01186
Waveform 5. 3-State Output Enable Time to High Level and
Output Disable Time from High Level
SF01185
Waveform 4. Propagation Delays for Read Address to Output
RE
Qn
V
M
t
PZL
V
V
M
t
PLZ
M
+0.3V
V
OL
SF01187
Waveform 6. 3-State Output Enable Time to Low Level and
Output Disable Time from Low Level
1990 Jul 12
7
Page 8
Philips Semiconductors Product specification
74F6704 x 4 register file (3-State)
TEST CIRCUIT AND WAVEFORM
V
V
PULSE
GENERATOR
IN
R
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
t
PLZ
PZL
closed
closed
All otheropen
T
D.U.T.
CC
V
OUT
7.0V
R
L
C
R
L
L
NEGATIVE
PULSE
POSITIVE
PULSE
90%
10%
V
M
10%
t
THL (tf
t
TLH (tr
90%
V
M
Input Pulse Definition
t
w
V
M
10%
)
)
t
)
TLH (tr
t
)
THL (tf
90%
V
M
t
w
90%
10%
AMP (V)
0V
AMP (V)
0V
DEFINITIONS:
= Load resistor;
R
L
see AC electrical characteristics for value.
C
= Load capacitance includes jig and probe capacitance;
SO16: plastic small outline package; 16 leads; body width 7.5 mmSOT162-1
1990 Jul 12
10
Page 11
Philips SemiconductorsProduct specification
74F670Register file
NOTES
1990 Jul 12
11
Page 12
Philips SemiconductorsProduct specification
74F670Register file
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 10-98
Document order number:9397-750-05172
yyyy mmm dd
12
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